XC7SH08 [NXP]

High-speed Si-gate CMOS device, 2-input AND function; 高速硅栅CMOS器件， 2输入与功能


型号：	XC7SH08
厂家：	NXP
描述：	High-speed Si-gate CMOS device, 2-input AND function 高速硅栅CMOS器件， 2输入与功能栅
文件：	总11页 (文件大小：74K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

XC7SH08

2-input AND gate

Rev. 01 — 1 September 2009

Product data sheet

1. General description

XC7SH08 is a high-speed Si-gate CMOS device. It provides a 2-input AND function.

2. Features

I Symmetrical output impedance

I High noise immunity

I Low power dissipation

I Balanced propagation delays

I SOT353-1 and SOT753 package options

I ESD protection:

N HBM JESD22-A114E: exceeds 2000 V

N MM JESD22-A115-A: exceeds 200 V

N CDM JESD22-C101C: exceeds 1000 V

I Speciﬁed from −40 °C to +125 °C

3. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range

−40 °C to +125 °C

Name

Description

Version

XC7SH08GW

XC7SH08GV

TSSOP5

plastic thin shrink small outline package;

5 leads; body width 1.25 mm

SOT353-1

−40 °C to +125 °C

SC-74A

plastic surface-mounted package; 5 leads

SOT753

XC7SH08

NXP Semiconductors

2-input AND gate

4. Marking

Table 2.

Marking codes

Type number

XC7SH08GW

XC7SH08GV

Marking^[1]

f08

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.

5. Functional diagram

mna113

mna114

mna221

Fig 1. Logic symbol

Fig 2. IEC logic symbol

Fig 3. Logic diagram

6. Pinning information

6.1 Pinning

XC7SH08

GND

001aak111

Fig 4. Pin conﬁguration SOT353-1 (TSSOP5) and SOT753 (SC-74A)

6.2 Pin description

Table 3.

Pin description

Symbol

Description

data input

GND

ground (0 V)

data output

supply voltage

V_CC

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

2 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

7. Functional description

Table 4.

Function table

H = HIGH voltage level; L = LOW voltage level

Inputs

Output

8. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_CC

V_I

Parameter

Conditions

Min

−0.5

−20

Max

+7.0

Unit

supply voltage

input voltage

I_IK

input clamping current

output clamping current

output current

V_I< −0.5 V

°C

[1]

I_OK

V_O< −0.5 V or V_O> V_CC+ 0.5 V

−0.5 V < V_O< V_CC+ 0.5 V

±20

±25

I_O

I_CC

supply current

I_GND

T_stg

P_tot

ground current

−75

−65

storage temperature

total power dissipation

+150

250

[2]

T_amb= −40 °C to +125 °C

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of P_totderates linearly with 4.0 mW/K.

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

3 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

9. Recommended operating conditions

Table 6.

Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions

Min

2.0

Typ

Max

5.5

Unit

V_CC

V_I

supply voltage

5.0

input voltage

5.5

V_O

output voltage

V_CC

+125

100

T_amb

∆t/∆V

ambient temperature

input transition rise and fall rate V_CC= 3.3 V ± 0.3 V

V_CC= 5.0 V ± 0.5 V

−40

+25

°C

ns/V

10. Static characteristics

Table 7.

Static characteristics

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter

Conditions

25 °C

−40 °C to +85 °C −40 °C to +125 °C Unit

Min Max Min Max

1.5 1.5

Min Typ Max

V_IH

HIGH-level

V_CC= 2.0 V

1.5

input voltage

V_CC= 3.0 V

2.1

V_CC= 5.5 V

3.85

V_IL

LOW-level

V_CC= 2.0 V

0.5

0.9

1.65

0.5

input voltage

V_CC= 3.0 V

0.9

V_CC= 5.5 V

1.65

V_OH

HIGH-level

V_I= V_IHor V_IL

output voltage

I_O= −50 µA; V_CC= 2.0 V

I_O= −50 µA; V_CC= 3.0 V

I_O= −50 µA; V_CC= 4.5 V

1.9

2.9

4.4

2.0

3.0

4.5

1.9

2.9

4.4

2.48

3.8

1.9

2.9

4.4

I_O= −4.0 mA; V_CC= 3.0 V 2.58

I_O= −8.0 mA; V_CC= 4.5 V 3.94

V_I= V_IHor V_IL

2.40

3.70

V_OL

LOW-level

output voltage

I_O= 50 µA; V_CC= 2.0 V

I_O= 50 µA; V_CC= 3.0 V

I_O= 50 µA; V_CC= 4.5 V

I_O= 4.0 mA; V_CC= 3.0 V

I_O= 8.0 mA; V_CC= 4.5 V

0.1

0.36

0.1

0.44

1.0

0.55

2.0

I_I

input leakage V_I= 5.5 V or GND;

current _CC= 0 V to 5.5 V

µA

I_CC

C_I

supply current V_I= V_CCor GND; I_O= 0 A;

_CC= 5.5 V

1.0

µA

input

1.5

capacitance

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

4 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

11. Dynamic characteristics

Table 8.

Dynamic characteristics

GND = 0 V. For test circuit see Figure 6.

Symbol Parameter

Conditions

25 °C

−40 °C to +85 °C −40 °C to +125 °C Unit

Min Typ Max

Min

Max

Min

Max

[1]

[2]

t_pd

propagation

delay

A and B to Y;

see Figure 5

V_CC= 3.0 V to 3.6 V

C_L= 15 pF

4.6

6.5

8.8

1.0

10.5

1.0

12.0

C_L= 50 pF

12.3 1.0

14.0

1.0

16.0

[3]

[4]

V_CC= 4.5 V to 5.5 V

C_L= 15 pF

3.2

4.6

5.9

7.9

1.0

7.0

9.0

1.0

8.0

C_L= 50 pF

10.5

C_PD

power

per buffer;

dissipation

capacitance

C_L= 50 pF; f = 1 MHz;

V_I= GND to V_CC

[1] t_pdis the same as t_PLHand t_PHL

[2] Typical values are measured at V_CC= 3.3 V.

[3] Typical values are measured at V_CC= 5.0 V.

[4] C_PDis used to determine the dynamic power dissipation P_D(µW).

P_D= C_PD× V_CC²× f_i+ Σ(C_L× V_CC²× f_o) where:

f_i= input frequency in MHz; f_o= output frequency in MHz;

C_L= output load capacitance in pF;

V_CC= supply voltage in Volts

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

5 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

12. Waveforms

A, B input

PLH

PHL

Y output

mna116

Measurement points are given in Table 9.

Fig 5. Input (A and B) to output (Y) propagation delays

Table 9.

Type

Measurement point

Input

Output

V_M

V_I

V_M

XC7SH08

GND to V_CC

0.5 × V_CC

PULSE

GENERATOR

DUT

mna101

Test data is given in Table 10. Deﬁnitions for test circuit:

C_L= Load capacitance including jig and probe capacitance.

R_T= Termination resistance should be equal to output impedance Z_oof the pulse generator.

Fig 6. Load circuitry for switching times

Table 10. Test data

Type

Input

V_I

Load

Test

t_r, t_f

C_L

XC7SH08

V_CC

≤ 3.0 ns

15 pF, 50 pF

t_PLH, t_PHL

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

6 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

13. Package outline

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm

SOT353-1

(A )

w M

detail X

1.5

3 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

UNIT

max.

0.1

1.0

0.8

0.30

0.15

0.25

0.08

2.25

1.85

1.35

1.15

2.25

2.0

0.46

0.21

0.60

0.15

7°

0°

1.1

0.65

1.3

0.15

0.425

0.3

0.1

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

00-09-01

03-02-19

SOT353-1

MO-203

SC-88A

Fig 7. Package outline SOT353-1 (TSSOP5)

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

7 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

Plastic surface-mounted package; 5 leads

SOT753

detail X

M B

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

0.100

0.013

0.40

0.25

1.1

0.9

0.26

0.10

3.1

2.7

1.7

1.3

3.0

2.5

0.6

0.2

0.33

0.23

0.95

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

02-04-16

06-03-16

SOT753

SC-74A

Fig 8. Package outline SOT753 (SC-74A)

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

8 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

14. Abbreviations

Table 11. Abbreviations

Acronym

CDM

DUT

Description

Charged Device Model

Device Under Test

ESD

ElectroStatic Discharge

Human Body Model

Machine Model

HBM

TTL

Transistor-Transistor Logic

15. Revision history

Table 12. Revision history

Document ID

Release date

20090901

Data sheet status

Change notice

Supersedes

XC7SH08_1

Product data sheet

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

9 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

16. Legal information

16.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

16.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

16.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

XC7SH08_1

Product data sheet

Rev. 01 — 1 September 2009

10 of 11

XC7SH08

NXP Semiconductors

2-input AND gate

18. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 1

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

Functional description . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Recommended operating conditions. . . . . . . . 4

Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

16.1

16.2

16.3

16.4

Contact information. . . . . . . . . . . . . . . . . . . . . 10

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 September 2009

Document identifier: XC7SH08_1

XC7SH08 [NXP]

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