XC7SH14GV [NXP]

High-speed Si-gate CMOS device, inverting buffer function with Schmitt trigger action; 高速硅栅CMOS器件,带施密特触发器的动作反相缓冲器功能
XC7SH14GV
型号: XC7SH14GV
厂家: NXP    NXP
描述:

High-speed Si-gate CMOS device, inverting buffer function with Schmitt trigger action
高速硅栅CMOS器件,带施密特触发器的动作反相缓冲器功能

栅极 触发器 逻辑集成电路 光电二极管
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中文:  中文翻译
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XC7SH14  
Inverting Schmitt trigger  
Rev. 01 — 1 September 2009  
Product data sheet  
1. General description  
XC7SH14 is a high-speed Si-gate CMOS device. It provides an inverting buffer function  
with Schmitt trigger action. This device is capable of transforming slowly changing input  
signals into sharply defined, jitter-free output signals.  
2. Features  
I Symmetrical output impedance  
I High noise immunity  
I ESD protection:  
N HBM JESD22-A114E: exceeds 2000 V  
N MM JESD22-A115-A: exceeds 200 V  
N CDM JESD22-C101C: exceeds 1000 V  
I Low power dissipation  
I Balanced propagation delays  
I SOT353-1 and SOT753 package options  
I Specified from 40 °C to +125 °C  
3. Applications  
I Wave and pulse shapers  
I Astable multivibrators  
I Monostable multivibrators  
4. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
XC7SH14GW  
XC7SH14GV  
40 °C to +125 °C  
TSSOP5  
plastic thin shrink small outline package; 5 leads;  
body width 1.25 mm  
SOT353-1  
40 °C to +125 °C  
SC-74A  
plastic surface-mounted package; 5 leads  
SOT753  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
5. Marking  
Table 2.  
Marking codes  
Type number  
XC7SH14GW  
XC7SH14GV  
Marking code[1]  
fF  
f14  
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.  
6. Functional diagram  
A
Y
4
2
A
Y
2
4
mna023  
mna024  
mna025  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
Fig 3. Logic diagram  
7. Pinning information  
7.1 Pinning  
XC7SH14  
1
2
3
5
4
n.c.  
A
V
Y
CC  
GND  
001aak131  
Fig 4. Pin configuration SOT353-1 and SOT753  
7.2 Pin description  
Table 3.  
Symbol  
n.c.  
Pin description  
Pin  
1
Description  
not connected  
data input  
A
2
GND  
Y
3
ground (0 V)  
data output  
4
VCC  
5
supply voltage  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
2 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
8. Functional description  
Table 4.  
Function table  
H = HIGH voltage level; L = LOW voltage level  
Input  
Output  
A
L
Y
H
L
H
9. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
0.5  
0.5  
20  
-
Max  
+7.0  
+7.0  
-
Unit  
V
supply voltage  
input voltage  
V
IIK  
input clamping current  
output clamping current  
output current  
VI < 0.5 V  
mA  
mA  
mA  
mA  
mA  
°C  
[1]  
IOK  
VO < 0.5 V or VO > VCC + 0.5 V  
0.5 V < VO < VCC + 0.5 V  
±20  
±25  
75  
IO  
-
ICC  
supply current  
-
IGND  
Tstg  
Ptot  
ground current  
75  
65  
-
-
storage temperature  
total power dissipation  
+150  
250  
[2]  
Tamb = 40 °C to +125 °C  
mW  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.  
10. Recommended operating conditions  
Table 6.  
Recommended operating conditions  
Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter Conditions  
Min  
2.0  
0
Typ  
5.0  
-
Max  
5.5  
Unit  
VCC  
VI  
supply voltage  
input voltage  
V
5.5  
V
VO  
output voltage  
ambient temperature  
0
-
VCC  
+125  
V
Tamb  
40  
+25  
°C  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
3 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
11. Static characteristics  
Table 7.  
Static characteristics  
Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
VOH  
HIGH-level  
VI = VT+ or VT  
output voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
VI = VT+ or VT−  
1.9  
2.9  
2.0  
3.0  
4.5  
-
-
-
-
-
-
1.9  
2.9  
-
-
-
-
-
1.9  
2.9  
-
-
-
-
-
V
V
V
V
V
4.4  
4.4  
4.4  
2.58  
3.94  
2.48  
3.8  
2.40  
3.70  
-
VOL  
LOW-level  
output voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
-
0
0
0
-
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
V
V
0.1  
0.1  
0.1  
V
0.36  
0.36  
0.1  
0.44  
0.44  
1.0  
0.55  
0.55  
2.0  
V
-
V
II  
input leakage VI = 5.5 V or GND;  
current CC = 0 V to 5.5 V  
-
µA  
V
ICC  
CI  
supply current VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
-
-
-
1.0  
10  
-
-
10  
10  
-
-
40  
10  
µA  
V
input  
1.5  
pF  
capacitance  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
4 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
11.1 Transfer characteristics  
Table 8.  
Transfer characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 7 and Figure 8.  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min Typ Max  
Min  
-
Max  
2.2  
3.15  
3.85  
-
Min  
-
Max  
2.2  
3.15  
3.85  
-
VT+  
VT−  
VH  
positive-going  
threshold  
voltage  
VCC = 3.0 V  
VCC = 4.5 V  
VCC = 5.5 V  
VCC = 3.0 V  
VCC = 4.5 V  
VCC = 5.5 V  
VCC = 3.0 V  
VCC = 4.5 V  
VCC = 5.5 V  
-
-
-
-
-
-
-
-
-
-
-
2.2  
3.15  
3.85  
-
V
V
V
V
V
V
V
V
V
-
-
-
-
-
negative-going  
threshold  
voltage  
0.9  
1.35  
1.65  
0.3  
0.4  
0.5  
0.9  
1.35  
1.65  
0.3  
0.4  
0.5  
0.9  
1.35  
1.65  
0.25  
0.35  
0.45  
-
-
-
-
-
-
hysteresis  
voltage  
1.2  
1.4  
1.6  
1.2  
1.4  
1.6  
1.2  
1.4  
1.6  
12. Dynamic characteristics  
Table 9.  
Dynamic characteristics  
GND = 0 V. For waveform see Figure 5. For test circuit see Figure 6.  
Symbol Parameter Conditions 25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
[1]  
[2]  
tpd  
propagation A to Y;  
delay  
VCC = 3.0 V to 3.6 V  
CL = 15 pF  
CL = 50 pF  
-
-
4.2 12.8  
6.0 16.3  
1.0  
1.0  
15.0  
18.5  
1.0  
1.0  
16.5  
20.5  
ns  
ns  
[3]  
[4]  
VCC = 4.5 V to 5.5 V  
CL = 15 pF  
-
-
-
3.2  
4.6 10.6  
12  
8.6  
1.0  
1.0  
-
10.0  
12.0  
-
1.0  
1.0  
-
11.0  
13.5  
-
ns  
ns  
pF  
CL = 50 pF  
CPD  
power  
per buffer;  
-
dissipation  
CL = 50 pF; f = 1 MHz;  
capacitance VI = GND to VCC  
[1] tpd is the same as tPLH and tPHL  
.
[2] Typical values are measured at VCC = 3.3 V.  
[3] Typical values are measured at VCC = 5.0 V.  
[4] CPD is used to determine the dynamic power dissipation PD (µW).  
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts.  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
5 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
13. Waveforms  
V
A input  
M
t
t
PHL  
PLH  
Y output  
V
M
mna033  
Measurement points are given in Table 10.  
Fig 5. The input (A) to output (Y) propagation delays  
Table 10. Measurement points  
Type number  
Input  
Output  
VM  
VI  
VM  
0.5 × VCC  
XC7SH14  
GND to VCC  
0.5 × VCC  
V
CC  
V
V
O
I
PULSE  
GENERATOR  
DUT  
C
L
R
T
mna101  
Test data is given in Table 11.  
Definitions for test circuit:  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
Fig 6. Load circuitry for switching times  
Table 11. Test data  
Type  
Input  
VI  
Load  
Test  
tr, tf  
CL  
XC7SH14  
VCC  
3.0 ns  
15 pF, 50 pF  
tPLH, tPHL  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
6 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
13.1 Transfer characteristic waveforms  
V
O
V
T+  
V
V
H
I
V
T  
V
V
H
V
I
O
V
V
T+  
T−  
mna027  
mna026  
Fig 7. Transfer characteristic  
Fig 8. The definitions of VT+, VTand VH  
mna402  
mna401  
1.5  
5
I
CC  
(mA)  
I
CC  
(mA)  
4
1
3
2
1
0
0.5  
0
0
1
2
3
0
1
2
3
4
5
V (V)  
I
V (V)  
I
VCC = 3.0 V.  
VCC = 4.5 V.  
Fig 9. Typical transfer characteristics  
Fig 10. Typical transfer characteristics  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
7 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
mna403  
8
I
CC  
(mA)  
6
4
2
0
0
2
4
6
V (V)  
I
VCC = 5.5 V.  
Fig 11. Typical transfer characteristics  
14. Application information  
The slow input rise and fall times cause additional power dissipation, which can be  
calculated using the following formula:  
Padd = fi × (tr × ∆ICC(AV) + tf × ∆ICC(AV)) × VCC where:  
Padd = additional power dissipation (µW);  
fi = input frequency (MHz);  
tr = input rise time (ns); 10 % to 90 %;  
tf = input fall time (ns); 90 % to 10 %;  
ICC(AV) = average additional supply current (µA).  
Average additional ICC differs with positive or negative input transitions, as shown in  
Figure 12.  
For XC7SH14 used in relaxation oscillator circuit, see Figure 13.  
Note to the application information:  
1. All values given are typical unless otherwise specified.  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
8 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
mna036  
200  
I  
CC(AV)  
(µA)  
150  
100  
50  
positive-going  
edge  
negative-going  
edge  
0
0
2.0  
4.0  
6.0  
V
(V)  
CC  
Linear change of VI between 0.1VCC to 0.9VCC  
Fig 12. Average additional ICC  
R
C
mna035  
1
T
1
f =  
--- ------------------------  
0.55 × RC  
Fig 13. Relaxation oscillator using the XC7SH14  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
9 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
15. Package outline  
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm  
SOT353-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
4
A
2
A
(A )  
3
A
1
θ
L
L
p
1
3
e
w M  
b
p
detail X  
e
1
0
1.5  
3 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
A
A
A
b
c
D
E
e
e
1
H
L
L
p
UNIT  
v
w
y
Z
θ
1
2
3
p
E
max.  
0.1  
0
1.0  
0.8  
0.30  
0.15  
0.25  
0.08  
2.25  
1.85  
1.35  
1.15  
2.25  
2.0  
0.46  
0.21  
0.60  
0.15  
7°  
0°  
mm  
1.1  
0.65  
1.3  
0.15  
0.425  
0.3  
0.1  
0.1  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
00-09-01  
03-02-19  
SOT353-1  
MO-203  
SC-88A  
Fig 14. Package outline SOT353-1 (TSSOP5)  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
10 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
Plastic surface-mounted package; 5 leads  
SOT753  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X  
e
b
p
w
M B  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.100  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
02-04-16  
06-03-16  
SOT753  
SC-74A  
Fig 15. Package outline SOT753 (SC-74A)  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
11 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
16. Abbreviations  
Table 12. Abbreviations  
Acronym  
CDM  
DUT  
Description  
Charged Device Model  
Device Under Test  
ESD  
ElectroStatic Discharge  
Human Body Model  
Machine Model  
HBM  
MM  
TTL  
Transistor-Transistor Logic  
17. Revision history  
Table 13. Revision history  
Document ID  
Release date  
20090901  
Data sheet status  
Change notice  
Supersedes  
XC7SH14_1  
Product data sheet  
-
-
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
12 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
18. Legal information  
18.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
18.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
18.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
18.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
19. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
XC7SH14_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 1 September 2009  
13 of 14  
XC7SH14  
NXP Semiconductors  
Inverting Schmitt trigger  
20. Contents  
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2  
8
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Recommended operating conditions. . . . . . . . 3  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4  
Transfer characteristics. . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Transfer characteristic waveforms. . . . . . . . . . . 7  
Application information. . . . . . . . . . . . . . . . . . . 8  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
9
10  
11  
11.1  
12  
13  
13.1  
14  
15  
16  
17  
18  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
18.1  
18.2  
18.3  
18.4  
19  
20  
Contact information. . . . . . . . . . . . . . . . . . . . . 13  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2009.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 1 September 2009  
Document identifier: XC7SH14_1  

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