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XC7SHU04GW [NXP]

AHC/VHC/H/U/V SERIES, 1-INPUT INVERT GATE, PDSO5, 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5;
XC7SHU04GW
型号： XC7SHU04GW
厂家： NXP    NXP
描述：

AHC/VHC/H/U/V SERIES, 1-INPUT INVERT GATE, PDSO5, 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5

输入元件 光电二极管 逻辑集成电路
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XC7SHU04  
Inverter  
Rev. 01 — 7 September 2009  
Product data sheet  
1. General description  
The XC7SHU04 is a high-speed Si-gate CMOS device. It provides an inverting single  
stage function.  
2. Features  
I Symmetrical output impedance  
I High noise immunity  
I Low power dissipation  
I Balanced propagation delays  
I ESD protection:  
N HBM JESD22-A114E: exceeds 2000 V  
N MM JESD22-A115-A: exceeds 200 V  
N CDM JESD22-C101C: exceeds 1000 V  
I Specified from −40 °C to +125 °C  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range  
−40 °C to +125 °C  
Name  
Description  
Version  
XC7SHU04GW  
XC7SHU04GV  
TSSOP5  
plastic thin shrink small outline package;  
5 leads; body width 1.25 mm  
SOT353-1  
−40 °C to +125 °C  
SC-74A  
plastic surface-mounted package; 5 leads  
SOT753  
 
 
 
XC7SHU04  
NXP Semiconductors  
Inverter  
4. Marking  
Table 2.  
Marking codes  
Type number  
XC7SHU04GW  
XC7SHU04GV  
Marking[1]  
fD  
fU4  
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.  
5. Functional diagram  
A
Y
1
4
2
2
4
A
Y
mna043  
mna044  
mna045  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
Fig 3. Logic diagram  
6. Pinning information  
6.1 Pinning  
XC7SHU04  
1
2
3
5
4
n.c.  
A
V
Y
CC  
GND  
001aak130  
Fig 4. Pin configuration SOT353-1 and SOT753  
6.2 Pin description  
Table 3.  
Symbol  
n.c.  
Pin description  
Pin  
1
Description  
not connected  
data input  
A
2
GND  
Y
3
ground (0 V)  
data output  
4
VCC  
5
supply voltage  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
2 of 14  
 
 
 
 
 
 
XC7SHU04  
NXP Semiconductors  
Inverter  
7. Functional description  
Table 4.  
Function table  
H = HIGH voltage level; L = LOW voltage level  
Input  
Output  
A
L
Y
H
L
H
8. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
−0.5  
−20  
−0.5  
-
Max  
+7.0  
-
Unit  
V
supply voltage  
input clamping current  
input voltage  
VI < −0.5 V  
mA  
V
[1]  
VI  
+7.0  
±20  
±25  
75  
IOK  
output clamping current  
output current  
VO < −0.5 V or VO > VCC + 0.5 V  
−0.5 V < VO < VCC + 0.5 V  
mA  
mA  
mA  
mA  
°C  
IO  
-
ICC  
supply current  
-
IGND  
Tstg  
Ptot  
ground current  
−75  
−65  
-
-
storage temperature  
total power dissipation  
+150  
250  
[2]  
Tamb = −40 °C to +125 °C  
mW  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.  
9. Recommended operating conditions  
Table 6.  
Recommended operating conditions  
Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter Conditions  
Min  
2.0  
0
Typ  
Max  
Unit  
VCC  
VI  
supply voltage  
5.0  
5.5  
V
input voltage  
-
5.5  
V
VO  
output voltage  
0
-
VCC  
+125  
100  
20  
V
Tamb  
∆t/∆V  
ambient temperature  
input transition rise and fall rate VCC = 3.3 V ± 0.3 V  
VCC = 5.0 V ± 0.5 V  
−40  
-
+25  
°C  
ns/V  
ns/V  
-
-
-
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
3 of 14  
 
 
 
 
 
XC7SHU04  
NXP Semiconductors  
Inverter  
10. Static characteristics  
Table 7.  
Static characteristics  
Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 °C  
−40 °C to +85 °C −40 °C to +125 °C Unit  
Min Typ Max  
Min  
1.7  
Max  
Min  
1.7  
Max  
VIH  
HIGH-level  
input voltage  
VCC = 2.0 V  
VCC = 3.0 V  
VCC = 5.5 V  
VCC = 2.0 V  
VCC = 3.0 V  
VCC = 5.5 V  
VI = VIH or VIL  
1.7  
2.4  
4.4  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
-
2.4  
2.4  
-
4.4  
4.4  
VIL  
LOW-level  
input voltage  
0.3  
0.6  
1.1  
-
-
-
0.3  
0.6  
1.1  
-
-
-
0.3  
0.6  
1.1  
-
-
VOH  
HIGH-level  
output voltage  
IO = −50 µA; VCC = 2.0 V 1.9  
IO = −50 µA; VCC = 3.0 V 2.9  
IO = −50 µA; VCC = 4.5 V 4.4  
IO = −4.0 mA; VCC = 3.0 V 2.58  
IO = −8.0 mA; VCC = 4.5 V 3.94  
VI = VIH or VIL  
2.0  
3.0  
4.5  
-
-
-
-
-
-
1.9  
2.9  
4.4  
2.48  
3.8  
-
-
-
-
-
1.9  
-
-
-
-
-
V
V
V
V
V
2.9  
4.4  
2.40  
3.70  
-
VOL  
LOW-level  
output voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
0
0
0
-
0.1  
-
-
-
-
-
-
0.1  
-
-
-
-
-
-
0.1  
V
0.1  
0.1  
0.1  
V
0.1  
0.1  
0.1  
V
0.36  
0.36  
0.1  
0.44  
0.44  
1.0  
0.55  
0.55  
2.0  
V
-
V
II  
input leakage VI = 5.5 V or GND;  
current CC = 0 V to 5.5 V  
- -  
µA  
V
ICC  
CI  
supply current VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
- -  
1.0  
10  
-
-
10  
10  
-
-
40  
10  
µA  
V
input  
- 1.5  
pF  
capacitance  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
4 of 14  
 
XC7SHU04  
NXP Semiconductors  
Inverter  
11. Dynamic characteristics  
Table 8.  
Dynamic characteristics  
GND = 0 V. For test circuit see Figure 6.  
Symbol Parameter  
Conditions  
25 °C  
−40 °C to +85 °C −40 °C to +125 °C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
[1]  
[2]  
tpd  
propagation  
delay  
A to Y; see Figure 5  
VCC = 3.0 V to 3.6 V  
CL = 15 pF  
-
-
3.4  
4.9  
7.1  
1.0  
8.5  
1.0  
10.0  
ns  
ns  
CL = 50 pF  
10.6 1.0  
12.0  
1.0  
13.5  
[3]  
[4]  
VCC = 4.5 V to 5.5 V  
CL = 15 pF  
-
-
-
2.6  
3.6  
14  
5.5  
7.0  
-
1.0  
1.0  
6.0  
8.0  
1.0  
1.0  
7.0  
9.0  
ns  
ns  
pF  
CL = 50 pF  
CPD  
power  
per buffer;  
-
-
-
-
dissipation  
capacitance  
VI = GND to VCC  
[1] tpd is the same as tPLH and tPHL  
.
[2] Typical values are measured at VCC = 3.3 V.  
[3] Typical values are measured at VCC = 5.0 V.  
[4] CPD is used to determine the dynamic power dissipation PD (µW).  
PD = CPD × VCC2 × fi + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts.  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
5 of 14  
 
 
 
 
 
XC7SHU04  
NXP Semiconductors  
Inverter  
12. Waveforms  
V
A input  
M
t
t
PHL  
PLH  
Y output  
V
M
mna111  
Measurement points are given in Table 9.  
Fig 5. Input (A) to output (Y) propagation delays  
Table 9.  
Type  
Measurement point  
Input  
Input  
Output  
VI  
VM  
VM  
XC7SHU04  
GND to VCC  
0.5 × VCC  
0.5 × VCC  
V
CC  
V
V
O
I
PULSE  
GENERATOR  
DUT  
C
L
R
T
mna101  
Test data is given in Table 10. Definitions for test circuit:  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
Fig 6. Load circuitry for switching times  
Table 10. Test data  
Type  
Input  
VI  
Load  
Test  
tr, tf  
CL  
XC7SHU04  
VCC  
≤ 3.0 ns  
15 pF, 50 pF  
tPLH, tPHL  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
6 of 14  
 
 
 
XC7SHU04  
NXP Semiconductors  
Inverter  
13. Typical transfer characteristics  
mna397  
mna398  
10  
2.0  
O
1.0  
3.0  
V
V
V
O
I
CC  
O
I
CC  
V
(V)  
1.6  
O
(mA)  
0.8  
(mA)  
(V)  
8
6
4
2
0
1.2  
0.8  
0.4  
0
0.6  
0.4  
0.2  
0
1.5  
I
(drain current)  
D
I
(drain current)  
D
0
0
1
2
3
0.4  
0.8  
1.2  
1.6  
2.0  
0
V (V)  
I
V (V)  
I
Fig 7. VCC = 2.0 V; IO = 0 A  
Fig 8. VCC = 3.0 V; IO = 0 A  
mna399  
6
50  
I
CC  
V
O
(mA)  
40  
V
O
R
bias  
= 560 kΩ  
(V)  
V
CC  
30  
20  
10  
0
3
0.47 µF  
100 µF  
input  
output  
V
I
A
I
I
(drain current)  
O
D
(f = 1 kHz)  
GND  
mna050  
0
0
2
4
6
V (V)  
I
Fig 9. VCC = 5.5 V; IO = 0 A  
Fig 10. Test set-up for measuring forward  
transconductance gfs = ∆IO/∆VI at VO is  
constant  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
7 of 14  
 
XC7SHU04  
NXP Semiconductors  
Inverter  
mna400  
40  
g
fs  
(mA/V)  
30  
20  
10  
0
0
2
4
6
V
(V)  
CC  
Fig 11. Typical forward transconductance gfs as a function of the supply voltage at Tamb = 25 °C  
14. Application information  
Some applications are:  
• Linear amplifier (see Figure 12)  
• In crystal oscillator design (see Figure 13)  
Remark: All values given are typical unless otherwise specified.  
R2  
R1  
V
CC  
R2  
1 µF  
R1  
U04  
U04  
C1  
C2  
Z
L
out  
mna052  
mna053  
Maximum Vo(p-p) = VCC − 1.5 V centered at 0.5 × VCC  
.
C1 = 47 pF (typ.)  
C2 = 22 pF (typ.)  
Gol  
Gv = –  
---------------------------------------  
R1 = 1 MΩ to 10 MΩ (typ.)  
R1  
1 +  
(1 + G )  
------  
ol  
R2 optimum value depends on the frequency and  
required stability against changes in VCC or average  
minimum ICC (ICC is typically 2 mA at VCC = 3 V and  
f = 1 MHz).  
R2  
Gol = open loop gain  
Gv = voltage gain  
R1 ≥ 3 kΩ, R2 ≤ 1 MΩ  
ZL > 10 kΩ; Gol = 20 (typ.)  
Typical unity gain bandwidth product is 5 MHz.  
Fig 12. Used as a linear amplifier  
Fig 13. Crystal oscillator configuration  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
8 of 14  
 
 
 
XC7SHU04  
NXP Semiconductors  
Inverter  
Table 11. External components for resonator (f < 1 MHz)  
All values given are typical and must be used as an initial set-up.  
Frequency  
R1  
R2  
C1  
C2  
10 kHz to 15.9 kHz  
16 kHz to 24.9 kHz  
25 kHz to 54.9 kHz  
55 kHz to 129.9 kHz  
130 kHz to 199.9 kHz  
200 kHz to 349.9 kHz  
350 kHz to 600 kHz  
22 MΩ  
22 MΩ  
22 MΩ  
22 MΩ  
22 MΩ  
22 MΩ  
22 MΩ  
220 kΩ  
220 kΩ  
100 kΩ  
100 kΩ  
47 kΩ  
47 kΩ  
47 kΩ  
56 pF  
56 pF  
56 pF  
47 pF  
47 pF  
47 pF  
47 pF  
20 pF  
10 pF  
10 pF  
5 pF  
5 pF  
5 pF  
5 pF  
Table 12. Optimum value for R2  
Frequency  
R2  
Optimum for  
minimum required ICC  
3 kHz  
2.0 kΩ  
8.0 kΩ  
1.0 kΩ  
4.7 kΩ  
0.5 kΩ  
2.0 kΩ  
0.5 kΩ  
1.0 kΩ  
-
minimum influence due to change in VCC  
minimum required ICC  
6 kHz  
minimum influence by VCC  
minimum required ICC  
10 kHz  
14 kHz  
> 14 kHz  
minimum influence by VCC  
minimum required ICC  
minimum influence by VCC  
replace R2 by C3 with a typical value of 35 pF  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
9 of 14  
XC7SHU04  
NXP Semiconductors  
Inverter  
15. Package outline  
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm  
SOT353-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
4
A
2
A
(A )  
3
A
1
θ
L
L
p
1
3
e
w M  
b
p
detail X  
e
1
0
1.5  
3 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
A
A
A
b
c
D
E
e
e
1
H
L
L
p
UNIT  
v
w
y
Z
θ
1
2
3
p
E
max.  
0.1  
0
1.0  
0.8  
0.30  
0.15  
0.25  
0.08  
2.25  
1.85  
1.35  
1.15  
2.25  
2.0  
0.46  
0.21  
0.60  
0.15  
7°  
0°  
mm  
1.1  
0.65  
1.3  
0.15  
0.425  
0.3  
0.1  
0.1  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
00-09-01  
03-02-19  
SOT353-1  
MO-203  
SC-88A  
Fig 14. Package outline SOT353-1 (TSSOP5)  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
10 of 14  
 
XC7SHU04  
NXP Semiconductors  
Inverter  
Plastic surface-mounted package; 5 leads  
SOT753  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X  
e
b
p
w
M B  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.100  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
02-04-16  
06-03-16  
SOT753  
SC-74A  
Fig 15. Package outline SOT753 (SC-74A)  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
11 of 14  
XC7SHU04  
NXP Semiconductors  
Inverter  
16. Abbreviations  
Table 13. Abbreviations  
Acronym  
CDM  
DUT  
Description  
Charged Device Model  
Device Under Test  
ElectroStatic Discharge  
Human Body Model  
Machine Model  
ESD  
HBM  
MM  
17. Revision history  
Table 14. Revision history  
Document ID  
Release date  
20090907  
Data sheet status  
Change notice  
Supersedes  
XC7SHU04_1  
Product data sheet  
-
-
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
12 of 14  
 
 
XC7SHU04  
NXP Semiconductors  
Inverter  
18. Legal information  
18.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
18.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
18.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
18.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
19. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
XC7SHU04_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
13 of 14  
 
 
 
 
 
 
XC7SHU04  
NXP Semiconductors  
Inverter  
20. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2  
7
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Recommended operating conditions. . . . . . . . 3  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Typical transfer characteristics . . . . . . . . . . . . 7  
Application information. . . . . . . . . . . . . . . . . . . 8  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
18.1  
18.2  
18.3  
18.4  
19  
20  
Contact information. . . . . . . . . . . . . . . . . . . . . 13  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2009.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 7 September 2009  
Document identifier: XC7SHU04_1  
 

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