Z0103MA [NXP]
Triacs; 双向可控硅型号: | Z0103MA |
厂家: | NXP |
描述: | Triacs |
文件: | 总12页 (文件大小:248K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Z0103/07/09 series
Triacs
Rev. 02 — 12 September 2002
Product data
1. Product profile
1.1 Description
Passivated triacs in conventional and surface mounting packages. Intended for use in
applications requiring high bidirectional transient and blocking voltage capability.
Available in a range of gate current sensitivities for optimum performance.
Product availability:
Z0103MA; Z0103NA; Z0107MA; Z0107NA; Z0109MA; Z0109NA in SOT54B
Z0103MN; Z0103NN; Z0107MN; Z0107NN; Z0109MN; Z0109NN in SOT223.
1.2 Features
■ Blocking voltage to 800 V (NA and NN ■ 1 A on-state RMS current.
types)
1.3 Applications
■ Home appliances
■ Fan controllers
■ Small motor control
■ Small loads in industrial process
control.
2. Pinning information
Table 1:
Pin
Pinning - SOT54B (TO-92), SOT223, simplified outline and symbol
Description
Simplified outline
Symbol
1
2
3
1
2
3
4
terminal 2 (T2)
gate (G)
SOT54B
(TO-92)
4
terminal 1 (T1)
terminal 1 (T1)
terminal 2 (T2)
gate (G)
T2
T1
1
2
3
SOT223
G
MSB033
MBL300
1
2
3
terminal 2 (T2)
MSB002 - 1
Top view
SOT54B (TO-92)
SOT223
Z0103/07/09 series
Philips Semiconductors
Triacs
3. Ordering information
3.1 Ordering options
Table 2:
Ordering information
Part Number
Z0103MA
Z0103NA
Z0107MA
Z0107NA
Z0109MA
Z0109NA
Z0103MN
Z0103NN
Z0107MN
Z0107NN
Z0109MN
Z0109NN
Voltage (VDRM
600 V
)
Gate Sensitivity (IGT
)
Package
3 mA
SOT54B (TO-92)
SOT54B (TO-92)
SOT54B (TO-92)
SOT54B (TO-92)
SOT54B (TO-92)
SOT54B (TO-92)
SOT223
800 V
3 mA
600 V
5 mA
800 V
5 mA
600 V
10 mA
10 mA
3 mA
800 V
600 V
800 V
3 mA
SOT223
600 V
5 mA
SOT223
800 V
5 mA
SOT223
600 V
10 mA
10 mA
SOT223
800 V
SOT223
4. Limiting values
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDRM
VRRM
ITSM
repetitive peak off-state voltage
25 °C ≤ Tj ≤ 125 °C
Z0103/07/09MA; Z0103/07/09MN
Z0103/07/09NA; Z0103/07/09NN
repetitive peak reverse voltage
Z0103/07/09MA; Z0103/07/09MN
Z0103/07/09NA; Z0103/07/09NN
-
-
600
800
V
V
25 °C ≤ Tj ≤ 125 °C
-
-
600
800
V
V
non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to surge;
Figure 2 and Figure 3
t = 20 ms
-
-
8
A
A
t = 16.7 ms
8.5
IT(RMS)
RMS on-state current
SOT223
all conduction angles; Figure 4
Tsp = 90 °C
-
1
A
SOT54B (TO-92)
I2t for fusing
Tlead = 50 °C
-
1
A
I2t
t = 10 ms
-
0.35
20
A2s
A/µs
A
dIT/dt
IGM
rate of rise of on-state current
peak gate current
peak gate power
ITM = 1.0 A; IG = 2 x IGT; dIG/dt = 100 mA/µs
tp = 20 µs
-
-
1.0
2.0
0.1
+150
+125
PGM
PG(AV)
Tstg
-
W
average gate power
storage temperature
junction temperature
over any 20 ms period
-
W
−40
−40
°C
°C
Tj
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
2 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
003aaa199
003aaa200
10
TSM
(A)
1.6
I
P
α =
tot
(W)
α
180°
8
6
4
α
1.2
120°
90°
60°
0.8
30°
0.4
0
2
0
2
3
0
0.4
0.8
1.2
1
10
10
10
n
I
(A)
T(RMS)
α = conduction angle
n = number of cycles at f = 50 Hz
Fig 1. Maximum on-state power dissipation as a
function of RMS on-state current; typical
values.
Fig 2. Maximum permissible non-repetitive peak
on-state current as a function of number of
cycles for sinusoidal currents; typical values.
003aaa207
2
10
003aaa201
1.2
I
TSM
δI /δt limit
I
T
T(RMS)
(A)
(A)
10
1
0.8
SOT223
(T
SOT54B
(T
)
)
sp
lead
0.4
-1
10
0
-4
-3
-2
-5
0
100
T
50
10
10
10
150
, T (°C)
10
t
(s)
s
lead sp
Fig 3. Maximum permissible non-repetitive peak
on-state current as a function of surge duration
for sinusoidal currents; typical values.
Fig 4. Maximum permissible RMS on-state current as
a function of lead temperature and solder point
temperature; typical values.
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
3 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
5. Thermal characteristics
Table 4:
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
Min Typ Max Unit
thermal resistance from junction to solder
point for SOT223
-
-
25
K/W
Figure 5
Rth(j-lead)
Rth(j-a)
thermal resistance from junction to lead for
SOT54B (TO-92)
-
-
60
K/W
Figure 5
thermal resistance from junction to ambient
SOT223
minimum footprint; mounted on a PCB
vertical in free air
-
-
60
-
K/W
K/W
SOT54B (TO-92)
150 -
5.1 Transient thermal impedance
003aaa206
10
a
1
SOT223
-1
10
SOT54B
-2
10
-3
-4
10
10
-5
-4
-3
-2
-1
2
3
10
10
10
10
10
1
10
10
10
t
(s)
p
Zth( j – lead)
a =
for SOT54B (TO-92)
---------------------------
Rth( j – lead)
Zth( j – sp)
a =
for SOT223
----------------------
Rth( j – sp)
Fig 5. Transient thermal impedance from junction to lead and junction to solder point as a function of pulse
duration.
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
4 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
6. Characteristics
Table 5:
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Static characteristics
IGT
gate trigger current
Z0103MA/MN/NA/NN
Z0107MA/MN/NA/NN
Z0109MA/MN/NA/NN
Z0103MA/MN/NA/NN
Z0107MA/MN/NA/NN
Z0109MA/MN/NA/NN
latching current
VD = 12 V; RL = 30 Ω; T2+ G+; T2+ G−; T2− G−;
Figure 9
-
-
-
-
-
-
-
-
-
-
-
-
3
mA
mA
mA
mA
mA
mA
5
10
5
VD = 12 V; RL = 30 Ω; T2− G+; Figure 9
7
10
IL
VD = 12 V; RL = 30 Ω; T2+ G+; T2− G−; T2− G+;
Figure 7
Z0103MA/MN/NA/NN
Z0107MA/MN/NA/NN
Z0109MA/MN/NA/NN
-
-
-
-
-
-
-
-
-
-
-
-
7
mA
mA
mA
mA
mA
mA
10
15
15
20
25
Z0103MA/MN/NA/NN VD = 12 V; RL = 30 Ω; T2+ G−; Figure 7
Z0107MA/MN/NA/NN
Z0109MA/MN/NA/NN
IH
holding current
IT = 50 mA; Figure 8
Z0103MA/MN/NA/NN
Z0107MA/MN/NA/NN
Z0109MA/MN/NA/NN
on-state voltage
-
-
7
mA
mA
mA
V
-
-
10
10
1.6
1.3
-
-
-
VT
Figure 6
-
1.3
VGT
gate trigger voltage
VD = 12 V; RL = 30 Ω; Tj = 25 °C; Figure 11
VD = VDRM; RL = 3.3 kΩ; Tj = 125 °C; Figure 11
-
-
-
-
V
0.2
-
V
ID
off-state leakage current VD = VDRM(max); VR = VRRM(max); Tj = 125 °C
500
µA
Dynamic characteristics
dVD/dt critical rate of rise of
VD = 0.67 VDRM(max); Tj = 110 °C; exponential
off-state voltage
waveform; gate open; Figure 10
Z0103MA/MN/NA/NN
Z0107MA/MN/NA/NN
Z0109MA/MN/NA/NN
10
20
50
-
-
-
-
-
-
V/µs
V/µs
V/µs
dVcom/dt critical rate of change of VD = 400 V; IT = 1 A; Tj = 110 °C;
commutating voltage
Z0103MA/MN/NA/NN
Z0107MA/MN/NA/NN
Z0109MA/MN/NA/NN
dIcom/dt = 0.44 A/ms; gate open
0.5
1
-
-
-
-
-
-
V/µs
V/µs
V/µs
2
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
5 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
003aaa202
003aaa203
8
3
2
I
T
a
(A)
6
125 °C
typ
4
125 °C
max
1
25 °C
max
2
0
0
0
1
2
3
-50
0
50
100
150
V
(V)
T (°C)
T
j
IL
a =
------------------
I
°
L(25 C)
Fig 6. On-state current as a function of on-state
voltage; typical and maximum values.
Fig 7. Normalized latching current as a function of
junction temperature; typical values.
003aaa204
003aaa205
3
4
T2+ G+
T2+ G-
T2- G+
T2- G-
a
a
3
2
2
1
0
1
0
-50
0
50
100
150
-50
0
50
100
150
T (°C)
j
T (°C)
j
IH
IGT
a =
a =
-------------------
----------------------
I
I
°
°
H(25 C)
GT (25 C)
Fig 8. Normalized holding current as a function of
junction temperature; typical values.
Fig 9. Normalized gate trigger current as a function of
junction temperature; typical values.
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
6 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
003aaa208
003aaa209
1.6
1.2
1.6
a
a
1.2
0.8
0.8
0.4
0
0.4
0
0
100
150
50
-50
0
50
100
150
T (°C)
T (°C)
j
j
VGT
dVD ⁄ dt
a =
------------------------
a =
----------------------------------
V
dVD(25°C) ⁄ dt
°
GT (25 C)
Fig 10. Normalized critical rate of rise of off-state
voltage as a function of junction temperature;
typical values.
Fig 11. Normalized gate trigger voltage as a function of
junction temperature; typical values.
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
7 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
7. Package outline
Plastic single-ended leaded (through hole) package; 3 leads
SOT54B
c
E
d
A
L
b
1
e
1
2
e
D
3
b
1
L
1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
b
1
max
(1)
UNIT
A
b
c
D
d
E
e
e
L
L
1
1
4.8
4.4
0.45
0.36
0.43
0.33
4.7
4.5
1.7
1.4
3.7
3.4
15.2
12.7
1.55
1.45
mm
2.54
1.27
0.48
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-29
SOT54B
TO-92
Fig 12. SOT54B (TO-92).
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
8 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
Plastic surface mounted package; collector pad for good heat transfer; 4 leads
SOT223
D
B
E
A
X
c
y
H
v
M
A
E
b
1
4
Q
A
A
1
L
1
2
3
p
e
b
p
w
M
B
detail X
1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
1
E
1.8
1.5
0.10 0.80
0.01 0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
7.3
6.7
1.1
0.7
0.95
0.85
mm
4.6
2.3
0.2
0.1
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SC-73
97-02-28
99-09-13
SOT223
Fig 13. SOT223.
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
9 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
8. Revision history
Table 6:
Revision history
CPCN
Rev Date
Description
02 20020912
Product data; supersedes data of 11 April 2002
Table 5 “Characteristics” Addition of dVcom/dt data. Correction to dVD/dt data
01 20020411
-
Product data; initial version (9397 750 09419)
9397 750 10102
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data
Rev. 02 — 12 September 2002
10 of 12
Z0103/07/09 series
Philips Semiconductors
Triacs
9. Data sheet status
Data sheet status[1]
Product status[2]
Definition
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips Semiconductors
reserves the right to change the specification in any manner without notice.
Preliminary data
Product data
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be published at a
later date. Philips Semiconductors reserves the right to change the specification without notice, in order to
improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the right to
make changes at any time in order to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change Notification (CPCN) procedure
SNW-SQ-650A.
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
10. Definitions
11. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
11 of 12
9397 750 10102
Product data
Rev. 02 — 12 September 2002
Z0103/07/09 series
Philips Semiconductors
Triacs
Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Transient thermal impedance . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3
3.1
4
5
5.1
6
7
8
9
10
11
© Koninklijke Philips Electronics N.V. 2002.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 12 September 2002
Document order number: 9397 750 10102
相关型号:
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