Z0103MN,135 [NXP]
Logic level four-quadrant triac; 逻辑电平四象限三端双向可控硅型号: | Z0103MN,135 |
厂家: | NXP |
描述: | Logic level four-quadrant triac |
文件: | 总12页 (文件大小:178K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Z0103MN
Logic level four-quadrant triac
Rev. 03 — 5 August 2009
Product data sheet
1. Product profile
1.1 General description
Passivated sensitive gate 4-Q triac in a SOT223 surface-mountable plastic package
1.2 Features and benefits
Direct interfacing to logic level ICs
High blocking voltage of 600V
Sensitive gate in four quadrants
Surface-mountable package
Direct interfacing to low power gate
drive circuits
1.3 Applications
General purpose low power motor
Industrial process control
control
Low power AC Fan controllers
Home appliances
1.4 Quick reference data
Table 1.
Quick reference
Symbol Parameter
Conditions
Min
Typ
Max Unit
VDRM
repetitive peak
off-state voltage
-
-
600
V
IT(RMS)
RMS on-state
current
half sine wave; Tsp ≤ 89 °C;
see Figure 1 and 4
-
-
1
A
Static characteristics
IGT gate trigger current
VD = 12 V; Tj = 25 °C;
T2+ G-; see Figure 6
-
-
-
-
-
-
-
-
3
3
3
5
mA
mA
mA
mA
VD = 12 V; Tj = 25 °C;
T2- G-
VD = 12 V; Tj = 25 °C;
T2+ G+
VD = 12 V; Tj = 25 °C;
T2- G+
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
2. Pinning information
Table 2.
Pinning information
Pin
1
Symbol Description
Simplified outline
Graphic symbol
T1
T2
G
main terminal 1
main terminal 2
gate
4
T2
T1
G
2
3
sym051
4
T2
main terminal 2
1
2
3
SOT223
(SC-73)
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
Z0103MN
SC-73
plastic surface-mounted package with increased heatsink; 4 leads
SOT223
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
2 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDRM
repetitive peak off-state
voltage
-
600
V
IT(RMS)
dIT/dt
RMS on-state current
half sine wave; Tsp ≤ 89 °C; see Figure 1 and 4
-
1
A
rate of rise of on-state IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs; T2+ G-
current
-
50
50
20
50
1
A/µs
A/µs
A/µs
A/µs
A
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs; T2+ G+
-
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs; T2- G+
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs; T2- G-
peak gate current
-
-
IGM
PGM
Tstg
Tj
-
peak gate power
-
2
W
storage temperature
-40
150
125
8.5
8
°C
junction temperature
-
-
-
°C
ITSM
non-repetitive peak
on-state current
full sine wave; tp = 16.7 ms; Tj(init) = 25 °C
A
full sine wave; tp = 20 ms; Tj(init) = 25 °C;
see Figure 2 and 3
A
I2t
I2t for fusing
tp = 10 ms; sine-wave pulse
-
-
0.32
0.1
A2s
W
PG(AV)
average gate power
003aac259
2.0
conduction form
Ptot
(W)
angle
(degrees)
factor
a
1.6
1.2
0.8
0.4
0.0
30
60
90
120
180
4
α= 180°
2.8
2.2
1.9
1.57
α
120°
90°
60°
30°
0
0.2
0.4
0.6
0.8
1
1.2
IT(RMS) (A)
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
3 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
003aad318
10
ITSM
(A)
8
6
4
2
I
I
TSM
t
T
1/f
= 25 °C max
T
j(init)
0
1
10
102
103
number of cycles
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
003aad319
103
I
I
T
TSM
t
ITSM
(A)
t
102
p
T
= 25 °C max
j(init)
(1)
(2)
10
1
10−5
10−4
10−3
10−2
10−1
tp (s)
Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
4 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
003aad391
1.2
IT(RMS)
(A)
0.8
0.4
0
−50
0
50
100
150
sp (°C)
T
Fig 4. Maximum permissible RMS on-state current as a function of solder point temperature; typical values.
5. Thermal characteristics
Table 5.
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance from see Figure 5
junction to solder point
-
-
25
K/W
Rth(j-a)
thermal resistance from
junction to ambient
-
-
150
60
-
-
K/W
K/W
003aad390
102
Zth(j-sp)
(K/W)
10
1
P
10−1
t
tp
10−2
10−5
10−1
1
10
10−4
10−3
10−2
tp (s)
Fig 5. Transient thermal impedance from junction to solder point as a function of pulse duration
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
5 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
6. Characteristics
Table 6.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
IGT gate trigger current
VD = 12 V; Tj = 25 °C; T2+ G-;
see Figure 6
-
-
3
mA
VD = 12 V; Tj = 25 °C; T2- G-
VD = 12 V; Tj = 25 °C; T2+ G+
VD = 12 V; Tj = 25 °C; T2- G+
-
-
-
-
-
-
-
-
3
mA
mA
mA
mA
3
5
IL
latching current
VD = 12 V; Tj = 25 °C; IG = 0.1 A; T2+ G-;
see Figure 7
15
VD = 12 V; Tj = 25 °C; IG = 0.1 A; T2+ G+
VD = 12 V; Tj = 25 °C; IG = 0.1 A; T2- G+
VD = 12 V; Tj = 25 °C; IG = 0.1 A; T2- G-
VD = 12 V; Tj = 25 °C; see Figure 10
IT = 1 A; see Figure 8
-
-
-
-
-
-
-
7
mA
mA
mA
mA
V
-
7
-
7
IH
holding current
-
7
VT
VGT
on-state voltage
gate trigger voltage
1.3
-
1.6
1.3
IT = 0.1 A; VD = 12 V; Tj = 25 °C;
see Figure 9
V
IT = 0.1 A; VD = 600 V; Tj = 125 °C
VD = 600 V; Tj = 125 °C
0.2
-
-
-
-
V
ID
off-state current
0.5
mA
Dynamic characteristics
dVD/dt
rate of rise of off-state VDM = 402 V; Tj = 110 °C; gate open
10
-
-
-
-
V/µs
V/µs
voltage
circuit; see Figure 11
dVcom/dt
rate of rise of
VD = 400 V; Tj = 110 °C;
0.5
commutating voltage
dIcom/dt = 0.44 A/ms; gate open circuit
003aaa205
003aaa203
4
3
I
GT
I
L
I
GT(25°C)
I
L(25°C)
3
(1)
(2)
2
(3)
(4)
2
1
0
1
0
−50
−50
0
50
100
150
0
50
100
150
T (°C)
j
T (°C)
j
Fig 7. Normalized latching current as a function of
junction temperature
Fig 6. Normalized gate trigger current as a function of
junction temperature
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
6 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
003aac258
003aaa209
1.6
2
IT
(A)
V
GT
V
GT(25°C)
1.6
1.2
1.2
0.8
0.4
0
0.8
(1)
(2)
(3)
0.4
0
0
0.4
0.8
1.2
1.6
2
−50
0
50
100
150
V
T (V)
T (°C)
j
Fig 9. Normalized gate trigger voltage as a function of
junction temperature
Fig 8. On-state current as a function of on-state
voltage
003aaa204
3
I
H
I
H(25°C)
2
1
0
−50
0
50
100
150
T (°C)
j
Fig 10. Normalized holding current as a function of junction temperature
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
7 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
003aaa208
1.6
1.2
0.8
A
0.4
0
0
50
100
150
T (°C)
j
Fig 11. Normalized critical rate of rise of off-state voltage as a function of junction temperature;typical values
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
8 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
7. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
SOT223
D
B
E
A
X
c
y
H
v
M
A
E
b
1
4
Q
A
A
1
L
1
2
3
p
e
b
p
w
M
B
detail X
1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
1
E
1.8
1.5
0.10 0.80
0.01 0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
7.3
6.7
1.1
0.7
0.95
0.85
mm
4.6
2.3
0.2
0.1
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-10
06-03-16
SOT223
SC-73
Fig 12. Package outline SOT223 (SC-73)
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
9 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
8. Revision history
Table 7.
Revision history
Document ID
Z0103MN_3
Modifications:
Release date
Data sheet status
Change notice Supersedes
- Z0103_07_09_SERIES-02
20090805
Product data sheet
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Type number Z0103MN separated from data sheet Z0103_07_09_SERIES-02.
Z0103_07_09_SERIES-02
(9397 750 10102)
20020912
Product data
-
Z0103_07_09_SERIES-01
Z0103_07_09_SERIES-01
(9397 750 09419)
20020411
Product data
-
-
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
10 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
9. Legal information
9.1 Data sheet status
Document status [1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
Applications — Applications that are described herein for any of these
9.2 Definitions
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
9.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Z0103MN_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 5 August 2009
11 of 12
Z0103MN
NXP Semiconductors
Logic level four-quadrant triac
11. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits. . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
Ordering information. . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics . . . . . . . . . . . . . . . . . . .5
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . .10
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . .11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .11
9.1
9.2
9.3
9.4
10
Contact information. . . . . . . . . . . . . . . . . . . . . .11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 August 2009
Document identifier: Z0103MN_3
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