Z0107MN0,135 [NXP]
4Q Triac General purpose low power motor control; 4Q双向可控硅通用低功耗电机控制
| 型号： | Z0107MN0,135 |
| 厂家： | 
NXP |
| 描述： | 4Q Triac General purpose low power motor control |
| 文件： | 总16页 (文件大小：211K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Z0107MN0
T223
SO
4Q Triac
Rev. 01 — 3 January 2011
Product data sheet
1. Product profile
1.1 General description
Planar passivated sensitive gate four quadrant triac in a SOT223 (SC-73)
surface-mountable plastic package intended for applications requiring enhanced immunity
to noise and direct interfacing to logic level ICs and low power gate drivers.
1.2 Features and benefits
Direct interfacing to logic level ICs
Enhanced current surge capability
Enhanced noise immunity
High blocking voltage capability
Sensitive gate triggering in all four
quadrants
Surface-mountable package
1.3 Applications
General purpose low power motor
Industrial process control
control
Low power AC Fan controllers
Home appliances
1.4 Quick reference data
Table 1.
Symbol
VDRM
Quick reference data
Parameter
Conditions
Min Typ Max Unit
repetitive peak
off-state voltage
-
-
600
V
ITSM
non-repetitive peak
on-state current
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; see Figure 4;
see Figure 5
-
-
12.5
A
IT(RMS)
RMS on-state current full sine wave; Tsp ≤ 103 °C;
see Figure 3; see Figure 1;
-
-
1
A
see Figure 2
Z0107MN0
NXP Semiconductors
4Q Triac
Table 1.
Symbol
Static characteristics
Quick reference data …continued
Parameter Conditions
Min Typ Max Unit
IGT
gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; see Figure 9
0.3
0.3
0.3
0.3
-
-
-
-
5
5
5
7
mA
mA
mA
mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; see Figure 9
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; see Figure 9
VD = 12 V; IT = 0.1 A; T2- G+;
Tj = 25 °C; see Figure 9
2. Pinning information
Table 2.
Pinning information
Symbol Description
Pin
1
Simplified outline
Graphic symbol
T1
T2
G
main terminal 1
main terminal 2
gate
4
T2
T1
G
2
3
sym051
4
T2
main terminal 2
1
2
3
SOT223 (SOT223)
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
Z0107MN0
SOT223
plastic surface-mounted package with increased heatsink;
4 leads
SOT223
4. Marking
Table 4.
Marking codes
Type number
Z0107MN0
Marking code[1]
107MN0
[1] % = placeholder for manufacturing site code
Z0107MN0
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Product data sheet
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4Q Triac
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM
Parameter
Conditions
Min
Max
600
1
Unit
V
repetitive peak off-state voltage
RMS on-state current
-
-
IT(RMS)
full sine wave; Tsp ≤ 103 °C; see Figure 3;
A
see Figure 1; see Figure 2
ITSM
non-repetitive peak on-state
current
full sine wave; Tj(init) = 25 °C; tp = 20 ms;
see Figure 4; see Figure 5
-
12.5
A
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms
tp = 10 ms; sine-wave pulse
-
-
-
13.8
0.78
50
A
A2s
I2t
I2t for fusing
dIT/dt
rate of rise of on-state current
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs;
T2+ G+
A/µs
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs;
T2+ G-
-
-
-
50
50
20
A/µs
A/µs
A/µs
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs;
T2- G-
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs;
T2- G+
IGM
peak gate current
peak gate power
-
1
A
PGM
PG(AV)
Tstg
Tj
-
2
W
W
°C
°C
average gate power
storage temperature
junction temperature
over any 20 ms period
-
0.1
150
125
-40
-
003aac269
003aac270
8
1.2
IT(RMS)
(A)
IT(RMS)
(A)
6
0.8
0.4
0
4
2
0
10-2
10-1
1
10
-50
0
50
100
150
sp (°C)
T
surge duration (s)
Fig 1. RMS on-state current as a function of surge
duration; maximum values
Fig 2. RMS on-state current as a function of solder
point temperature; maximum values
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Product data sheet
Rev. 01 — 3 January 2011
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NXP Semiconductors
4Q Triac
003aac259
2.0
conduction form
Ptot
angle
factor
a
(W)
(degrees)
1.6
1.2
0.8
0.4
0.0
30
60
90
120
180
4
α= 180°
2.8
2.2
1.9
1.57
α
120°
90°
60°
30°
0
0.2
0.4
0.6
0.8
1
1.2
IT(RMS) (A)
Fig 3. Total power dissipation as a function of RMS on-state current; maximum values
003aaf449
16
I
TSM
(A)
12
8
4
0
I
I
TSM
t
T
1/f
= 25 °C max
T
j(init)
2
3
1
10
10
10
number of cycles
Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
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Product data sheet
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NXP Semiconductors
4Q Triac
003aaf490
3
10
I
I
TSM
T
I
TSM
(A)
t
t
p
2
10
T
= 25 °C max
j(init)
(1)
(2)
10
1
−5
−4
−3
−2
−1
10
10
10
10
10
t (s)
p
Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values
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Product data sheet
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4Q Triac
6. Thermal characteristics
Table 6.
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance from
junction to solder point
full cycle; see Figure 8
-
-
15
K/W
Rth(j-a)
thermal resistance from
junction to ambient
in free air; printed-circuit board mounted:
minimum footprint; full cycle; see Figure 6
-
-
156
70
-
-
K/W
K/W
in free air; printed-circuit board mounted:
pad area; full cycle; see Figure 7
3.8 min
36
1.5
min
18
4.5
4.6
6.3
60
9
1.5
2.3
min
(3×)
10
1.5
min
4.6
001aab508
7
All dimensions are in mm
15
50
001aab509
All dimensions are in mm
Printed-circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick),
Fig 6. Minimum footprint SOT223
Fig 7. Printed-circuit board pad area SOT223
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Product data sheet
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NXP Semiconductors
4Q Triac
003aac210
102
Zth(j-sp)
(K/W)
10
1
P
10-1
10-2
t
tp
10-1
1
10
10-5
10-4
10-3
10-2
tp (s)
Fig 8. Transient thermal impedance from junction to solder point as a function of pulse width
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Product data sheet
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4Q Triac
7. Characteristics
Table 7.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
IGT gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; see Figure 9
0.3
-
5
mA
mA
mA
mA
mA
mA
mA
mA
mA
V
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; see Figure 9
0.3
-
5
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; see Figure 9
0.3
-
5
VD = 12 V; IT = 0.1 A; T2- G+;
Tj = 25 °C; see Figure 9
0.3
-
7
IL
latching current
VD = 12 V; IG = 0.1 A; T2+ G+;
Tj = 25 °C; see Figure 10
-
-
10
25
10
10
10
1.6
1.3
-
VD = 12 V; IG = 0.1 A; T2+ G-;
Tj = 25 °C; see Figure 10
-
-
VD = 12 V; IG = 0.1 A; T2- G-;
Tj = 25 °C; see Figure 10
-
-
VD = 12 V; IG = 0.1 A; T2- G+;
Tj = 25 °C; see Figure 10
-
-
IH
holding current
VD = 12 V; Tj = 25 °C;
see Figure 14
-
-
VT
VGT
on-state voltage
gate trigger voltage
IT = 1 A; Tj = 25 °C;
see Figure 11
-
1.3
VD = 12 V; IT = 0.1 A;
Tj = 25 °C; see Figure 12
-
-
-
-
V
VD = 600 V; IT = 0.1 A;
Tj = 125 °C
0.2
-
V
ID
off-state current
VD = 600 V; Tj = 125 °C
0.5
mA
Dynamic characteristics
dVD/dt
rate of rise of off-state voltage
VDM = 402 V; Tj = 110 °C; gate
open circuit; exponential
waveform; see Figure 13
100
0.5
-
-
-
-
V/µs
V/µs
dVcom/dt
rate of change of commutating
voltage
VD = 400 V; Tj = 110 °C;
dIcom/dt = 0.44 A/ms; gate
open circuit
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Product data sheet
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4Q Triac
003aaa205
003aaa203
4
3
I
GT
I
L
I
GT(25°C)
I
L(25°C)
3
(1)
(2)
2
(3)
(4)
2
1
0
1
0
−50
−50
0
50
100
150
0
50
100
150
T (°C)
j
T (°C)
j
(1) T2- G+
(2) T2- G-
(3) T2+ G-
(4) T2+ G+
Fig 9. Normalized gate trigger current as a function of
junction temperature
Fig 10. Normalized latching current as a function of
junction temperature
003aac258
003aaa209
1.6
2
IT
(A)
V
GT
V
GT(25°C)
1.6
1.2
0.8
1.2
0.8
0.4
0
(1)
(2)
(3)
0.4
0
0
0.4
0.8
1.2
1.6
2
−50
0
50
100
150
V
T (V)
T (°C)
j
Vo = 1.254 V
Rs = 0.31 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 11. On-state current as a function of on-state
voltage
Fig 12. Normalized gate trigger voltage as a function of
junction temperature
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Product data sheet
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4Q Triac
003aaa208
1.6
1.2
0.8
A
0.4
0
0
50
100
150
T (°C)
j
Fig 13. Normalized critical rate of rise of off-state voltage as a function of junction temperature; typical values
003aaa204
3
I
H
I
H(25°C)
2
1
0
−50
0
50
100
150
T (°C)
j
Fig 14. Normalized holding current as a function of junction temperature
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4Q Triac
8. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
SOT223
D
B
E
A
X
c
y
H
v
M
A
E
b
1
4
Q
A
A
1
L
1
2
3
p
e
b
p
w
M
B
detail X
1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
1
E
1.8
1.5
0.10 0.80
0.01 0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
7.3
6.7
1.1
0.7
0.95
0.85
mm
4.6
2.3
0.2
0.1
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-10
06-03-16
SOT223
SC-73
Fig 15. Package outline SOT223 (SOT223)
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Product data sheet
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4Q Triac
9. Soldering
7
3.85
3.6
3.5
0.3
1.3 1.2
(4×) (4×)
solder lands
solder resist
4
6.1
3.9
7.65
solder paste
occupied area
1
2
3
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
sot223_fr
Fig 16. Reflow soldering footprint for SOT223 (SOT223)
8.9
6.7
1.9
solder lands
4
solder resist
6.2
8.7
occupied area
Dimensions in mm
1
2
3
preferred transport
direction during soldering
1.9
(3×)
2.7
2.7
1.9
(2×)
1.1
sot223_fw
Fig 17. Wave soldering footprint for SOT223 (SOT223)
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Product data sheet
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4Q Triac
10. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
Z0107MN0 v.1
20110103
Product data sheet
-
-
Z0107MN0
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NXP Semiconductors
4Q Triac
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
11.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
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agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
non-automotive qualified products in automotive equipment or applications.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits. . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
Ordering information. . . . . . . . . . . . . . . . . . . . . .2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics . . . . . . . . . . . . . . . . . . .6
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .11
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Revision history. . . . . . . . . . . . . . . . . . . . . . . . .13
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . .14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .14
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .15
11.1
11.2
11.3
11.4
12
Contact information. . . . . . . . . . . . . . . . . . . . . .15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 January 2011
Document identifier: Z0107MN0
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