MSM5052-XXXGS-2K [OKI]
Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller; 内置温度电路和LCD驱动器的4位微控制器
| 型号： | MSM5052-XXXGS-2K |
| 厂家： | 
OKI ELECTRONIC COMPONETS |
| 描述： | Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller |
| 文件： | 总12页 (文件大小：158K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
E2E0008-38-94
This version: Sep. 1998
Previous version: Mar. 1996
¡ Semiconductor
MSM5052
Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM5052 is a low-power microcontroller manufactured in complementary metal-oxide
semiconductor technology. Integrated into a single chip are ROM, RAM, crystal oscillator, voltage
doubler, timer, LCD driver, input port, output port, and thermistor-based temperature measuring
circuit.
Using an on-chip ROM reduces power consumption.
The MSM5052 is widely used in electronic products requiring low-power operation, for
example, thermometer and clinical thermometer.
FEATURES
• Low power consumption
• Internal ROM
• Internal RAM
• I/O port
: 1280 ¥ 14 bits
: 62 ¥ 4 bits
Input port
Output port
: 2 ports ¥ 4 bits
: 1 port ¥ 4 bits
1 port ¥ 1 bit
• 4 ¥ 4 key matrix input is available by using K to K and M to M
• 26 LCD drivers (1/2 duty, 1/2 bias, 52 segments)
1
4
1
4
• 42 instructions
• Minimum instruction execution time
: 122.1 ms (Display instruction cycle: 244.2 ms)
• 1.5 V operating voltage (Built-in LCD drive voltage doubler)
• Buzzer function
• Built-in thermistor-based temperature measuring circuit
• Crystal oscillator
• Package options:
: 32.768 kHz
56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM5052-¥¥¥GS-K)
56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM5052-¥¥¥GS-2K)
80-pin plastic QFP (QFP80-P-1420-0.80-BK): (Product name : MSM5052-¥¥¥GS-BK)
Chip (Chip size 4.77 mm ¥ 4.36 mm)
: (Product name : MSM5052-¥¥¥)
¥¥¥ indicates a code number.
1/12
DIN0
to
DIN3
DATA RAM
DOUT0
to
62 ¥ 4 bits
BUZZER
DRIVER
BD
MPX
ACC
DOUT3
A3 to A0
A6 to A4
MPX
P
C
Z
ALU
OUTPUT
PORT
REGISTER
LD
OUTPUT
PORT
MPX
SEGMENT
M1 to M4
K1 to K4
S1 to S4
DISPLAY
LATCH
and
OUT 1
(M1-M4)
to
SEGMENT
OUT 26
INPUT
PORT
(K1-K4)
DRIVER
COM 1
COM 2
INPUT
PORT
(S1-S4)
DOUT13 to DOUT0
PROGRAM ROM
INSTRUC
-TION
DECODER
PRO-
GRAM
COUN-
TER
A0
to
MPX
1280 ¥ 14 bits
A10
FMT
REGISTER
COUNTER
RC
XT
TIMING
GENERATOR
XT
OSCILLATOR
RESET T1 T2 T3 T4 T5
OSCOSC OSC OSC
TH IN
VDD VSS1VSS2 VCP VCM
R
C
¡ Semiconductor
MSM5052
PIN CONFIGURATION (TOP VIEW)
1
2
NC
SEG4
SEG6
42
41
40
39
38
37
36
35
34
33
32
31
30
29
OSC TH
OSC R
OSC IN
OSC C
K4
3
SEG8
4
SEG9
5
SEG10
SEG12
6
7
K3
SEG13
SEG14
SEG15
SEG18
SEG20
SEG21
SEG22
SEG23
8
K2
9
K1
10
11
12
13
14
LD
M4
M3
M2
M1
NC: No-connection pin
56-Pin Plastic QFP
Note: SEG5, SEG7, SEG11, SEG16, SEG17, SEG19, and SEG26 are not connected to package
pins.
3/12
¡ Semiconductor
MSM5052
PIN CONFIGURATION (TOP VIEW) (continued)
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
1
2
3
4
5
6
7
8
9
64 NC
63 NC
62 OSC TH
61 NC
60 OSC R
59 NC
58 OSC IN
57 NC
56 OSC C
55 K4
SEG12 10
SEG13 11
NC 12
54 NC
53 K3
SEG14 13
SEG15 14
SEG16 15
SEG17 16
SEG18 17
SEG19 18
SEG20 19
SEG21 20
SEG22 21
SEG23 22
SEG24 23
SEG25 24
52 K2
51 NC
50 K1
49 LD
48 M4
47 M3
46 M2
45 NC
44 M1
43 NC
42 NC
41 S4
NC: No-connection pin
80-Pin Plastic QFP
4/12
¡ Semiconductor
MSM5052
PAD CONFIGURATION
Pad Layout
SEG24
SEG25
SEG26
COM2
XT
SEG3
SEG2
SEG1
COM1
NC
XT
T3
T1
T2
T4
T5
VDD
RESET
VCP
VCM
S1
BD
VDD
VSS2
VSS1
S2
S3
S4
M1
M2 M3
M4 LD
K1
K2 K3
K4
OSC OSC OSC OSC
IN TH
C
R
Chip size 4.77 ¥ 4.36 (mm)
5/12
¡ Semiconductor
MSM5052
PIN DESCRIPTIONS
Symbol
Description
VDD
Ground.
VSS1
VSS2
Power source (–1.5 V).
Power source for LCD driver (–3.0 V). This pin is connected to the VDD pin through a 0.1 mF
capacitor.
V
CP, VCM
Booster capacitor connection pins. VCP pin is connected to the VCM pin through a 0.1 mF capacitor.
Input and output pins of oscillator inverter. A 32.768 kHz crystal is connected to these pins.
Pins to test internal logic. T1, T2, T4, and T5 are pulled down to VSS1. T3 is the output. Test pins
are normally open.
XT, XT
T1 to T5
Pin to clear internal logic, pulled down to VSS1. After power is turned on, the MSM5052
can be reset by this pin.
RESET
BD
Buzzer output.
OSC TH, OSC R, Pins to RC oscillation circuit for temperature detection. These are the fundamental resistor,
OSC C, OSC IN thermistor, and capacitor connection pins.
6/12
¡ Semiconductor
MSM5052
ABSOLUTE MAXIMUM RATINGS
Parameter
Power Supply Voltage
Input Voltage
Symbol
VSS1-VDD
VIN
Condition
Ta = 25°C
Ta = 25°C
—
Rating
–2.0 to +0.3
VSS1 – 0.3 to +0.3
–55 to +125
–20 to +75
Unit
V
V
Storage Temperature
Operating Temperature
TSTG
°C
°C
Top
—
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 0 V, VSS1 = –1.55 V, VSS2 = –3.0 V, C1 = 30 pF, Ta = 25°C)
Parameter
Symbol
Condition
VSS1 pin
Min.
Typ.
Max.
Unit
VSS1 Operating Voltage
VSS1
–1.65
–1.55
–1.25
V
Temperature sampling off
(Refer to measuring circuit)
Temperature sampling on
(Refer to measuring circuit)
Within 10 seconds, VSS1 pin
(Refer to measuring circuit)
VOH1 = –0.2 V
Power Supply Current 1
Power Supply Current 2
Oscillation Start Voltage
IDD1
IDD2
VOSC
—
—
—
3.0 *1
100 *2
—
—
—
mA
mA
V
–1.45
IOH1
IOM1
IOL1
IOH2
IOL2
IOH3
IOL3
IOH4
IOL4
IOH5
IOL5
IIH
—
–4
—
—
—
—
—
—
—
—
—
—
—
—
—
25
–4
+4
Output Current 1
COM
VOM1 = VSS1 0.2 V
VOL1 = –2.8 V
mA
4
—
Output Current 2
SEGMENT
VOH2 = –0.2 V
—
–0.4
—
mA
mA
mA
mA
VOL2 = –2.8 V
0.4
—
Output Current 3
C, R, TH
VOH3 = –0.4 V
–400
—
VOL3 = –1.15 V
400
—
Output Current 4
M1-M4, LD
V
OH4 = –0.4 V
OL4 = –1.15 V
OH5 = –0.4 V
–100
—
V
10
Output Current 5
BD
V
–200
3
–50
—
VOL5 = –1.15 V
VIN = 0 V
Input Current
S1-S4, K1-K4
Built-in CD Capacitance
3
30
mA
IIL
V
IN = –1.55 V
—
–0.2
—
—
CD
—
pF
*1 The typ. value varies depending on the application program.
*2 The typ. value varies depending on the application program and RC thermistor to be used.
7/12
¡ Semiconductor
MSM5052
Measuring circuit
VCP
OSC IN
C2
C4
VCM
OSC C
MSM5052
XT
OSC R
Crystal
32.768 kHz
R1
R2
OSC TH
XT
C1
: 20 pF
C1
C2, C3 : 0.1 mF
C4
R1, R2 : 10 kW
VDD VSS1
VSS2
C3
: 3000 pF
A
V
8/12
¡ Semiconductor
MSM5052
APPLICATION CIRCUIT
LCD
COM2
SEGMENTS
COM1
TH
OSC TH
OSC R
OSC IN
OSC C
M1
M2
M4
LD
HI
Alarm output
LO
R1
Data
Latch
R2
Serial data
C1
MSM5052
BD
XT
VSS1
(CD = 25 pF)
C2
XT
VCP
VCM
VDD
Piezo
32.768 kHz
C3
RESET
R1 : 33 kW
R2 : 20 kW
*1
VSS2 S4 S2 S1
S4
K2 K3 K1
: 40BT-5
40 kW 10ꢀ at 25°C
B = 3550 2ꢀ
TH
C4
*2
C1 : 680 pF
C2 : 5 to 35 pF
C3 : 0.1 mF
C4 : 0.1 mF
C/F S2 S1
1
2
3
4
5
1
2
3
4
5
Thermometer one-second sampling
Thermometer 10-second sampling
The highest temperature alarm
The lowest temperature alarm
Clock
*1 Inner switch or pad on PCB
*2 Bonding option
9/12
¡ Semiconductor
PACKAGE DIMENSIONS
QFP56-P-910-0.65-K
MSM5052
(Unit : mm)
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.36 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
10/12
¡ Semiconductor
MSM5052
(Unit : mm)
QFP56-P-910-0.65-2K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.43 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
11/12
¡ Semiconductor
MSM5052
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Epoxy resin
42 alloy
Solder plating
5 mm or more
Solder plate thickness
Package weight (g)
1.27 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
12/12
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