MSM514260CSL-60JS [OKI]
Fast Page DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-40;
| 型号： | MSM514260CSL-60JS |
| 厂家： | 
OKI ELECTRONIC COMPONETS |
| 描述： | Fast Page DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-40 动态存储器 光电二极管 |
| 文件： | 总16页 (文件大小：263K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
E2G0026-17-41
This version: Jan. 1998
Previous version: May 1997
¡ Semiconductor
MSM514260C/CSL
262,144-Word ¥ 16-Bit DYNAMIC RAM : FAST PAGE MODE TYPE
DESCRIPTION
The MSM514260C/CSL is a 262,144-word ¥ 16-bit dynamic RAM fabricated in Oki's silicon-gate
CMOS technology. The MSM514260C/CSL achieves high integration, high-speed operation, and
low-power consumption because Oki manufactures the device in a quadruple-layer polysilicon/
single-layer metal CMOS process. The MSM514260C/CSL is available in a 40-pin plastic SOJ or 44/
40-pin plastic TSOP. The MSM514260CSL (the self-refresh version) is specially designed for lower-
power applications.
FEATURES
• 262,144-word ¥ 16-bit configuration
• Single 5 V power supply, ±10% tolerance
• Input
: TTL compatible, low input capacitance
• Output : TTL compatible, 3-state
• Refresh : 512 cycles/8 ms, 512 cycles/128 ms (SL version)
• Fast page mode, read modify write capability
• CAS before RAS refresh, hidden refresh, RAS-only refresh capability
• CAS before RAS self-refresh capability (SL version)
• Package options:
40-pin 400 mil plastic SOJ
(SOJ40-P-400-1.27)
(Product : MSM514260C/CSL-xxJS)
44/40-pin 400 mil plastic TSOP
(TSOPII44/40-P-400-0.80-K) (Product : MSM514260C/CSL-xxTS-K)
xx indicates speed rank.
PRODUCT FAMILY
Access Time (Max.)
tRAC tAA tCAC tOEA
Power Dissipation
Operating (Max.) Standby (Max.)
935 mW
Cycle Time
(Min.)
Family
MSM514260C/CSL-50 50 ns 25 ns 15 ns 15 ns
MSM514260C/CSL-60 60 ns 30 ns 15 ns 15 ns
MSM514260C/CSL-70 70 ns 35 ns 20 ns 20 ns
90 ns
110 ns
130 ns
5.5 mW/
825 mW
1.1 mW (SL version)
770 mW
1/16
¡ Semiconductor
MSM514260C/CSL
PIN CONFIGURATION (TOP VIEW)
V
1
2
3
4
5
6
7
8
9
40 V
SS
V
1
2
3
4
5
6
7
8
9
44 V
SS
CC
CC
DQ1
DQ2
DQ3
DQ4
43 DQ16
42 DQ15
41 DQ14
40 DQ13
DQ1
DQ2
DQ3
DQ4
39 DQ16
38 DQ15
37 DQ14
36 DQ13
V
39 V
SS
CC
V
35
V
DQ5
DQ6
DQ7
38 DQ12
37 DQ11
36 DQ10
35 DQ9
CC
SS
DQ5
DQ6
DQ7
34 DQ12
33 DQ11
32 DQ10
31 DQ9
30 NC
DQ8 10
DQ8 10
NC 11
NC 12
WE 13
RAS 14
NC 15
A0 16
A1 17
A2 18
A3 19
NC 13
NC 14
WE 15
RAS 16
NC 17
A0 18
A1 19
A2 20
A3 21
32 NC
31 LCAS
30 UCAS
29 OE
28 A8
27 A7
26 A6
25 A5
24 A4
29 LCAS
28 UCAS
27 OE
26 A8
25 A7
24 A6
V
22
23 V
SS
CC
23 A5
22 A4
44/40-Pin Plastic TSOP
(K Type)
V
20
21 V
SS
CC
40-Pin Plastic SOJ
Pin Name
A0 - A8
RAS
Function
Address Input
Row Address Strobe
Lower Byte Column Address Strobe
Upper Byte Column Address Strobe
Data Input / Data Output
Output Enable
LCAS
UCAS
DQ1 - DQ16
OE
WE
Write Enable
VCC
Power Supply (5 V)
Ground (0 V)
VSS
NC
No Connection
Note: The same power supply voltage must be provided to every V pin, and the same GND
CC
voltage level must be provided to every V pin.
SS
2/16
¡ Semiconductor
MSM514260C/CSL
BLOCK DIAGRAM
WE
OE
Timing
Generator
RAS
I/O
Controller
LCAS
UCAS
Output
8
8
8
8
Buffers
I/O
Controller
DQ1
-
DQ8
Column
Address
Buffers
Input
Buffers
Column Decoders
9
9
9
I/O
Selector
Internal
Address
Counter
Sense Amplifiers
16
16
Refresh
A0 - A8
Control Clock
Input
8
8
8
8
Buffers
Row
Address
Buffers
Row
Memory
Cells
9
DQ9
-
DQ16
Deco-
Word
Drivers
ders
Output
Buffers
VCC
On Chip
V
Generator
BB
VSS
FUNCTION TABLE
Input Pin
DQ Pin
Function Mode
RAS
LCAS
UCAS
WE
*
*
H
H
H
L
OE
*
*
DQ1 - DQ8
High-Z
High-Z
DOUT
DQ9 - DQ16
High-Z
High-Z
High-Z
DOUT
Standby
Refresh
H
L
L
L
L
L
L
L
L
*
H
L
H
L
L
H
L
L
*
H
H
L
L
H
L
L
L
Lower Byte Read
Upper Byte Read
Word Read
L
High-Z
DOUT
L
DOUT
L
H
H
H
H
DIN
Don't Care
DIN
Lower Byte Write
Upper Byte Write
Word Write
—
L
Don't Care
DIN
L
DIN
H
High-Z
High-Z
*: "H" or "L"
3/16
¡ Semiconductor
MSM514260C/CSL
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter
Voltage on Any Pin Relative to VSS
Short Circuit Output Current
Power Dissipation
Symbol
VT
Rating
–1.0 to 7.0
50
Unit
V
IOS
mA
W
PD*
1
Operating Temperature
Storage Temperature
Topr
Tstg
0 to 70
–55 to 150
°C
°C
*: Ta = 25°C
Recommended Operating Conditions
(Ta = 0°C to 70°C)
Parameter
Symbol
VCC
Min.
4.5
0
Typ.
5.0
0
Max.
Unit
5.5
0
V
V
V
V
Power Supply Voltage
VSS
Input High Voltage
Input Low Voltage
VIH
2.4
–1.0
—
6.5
0.8
VIL
—
Capacitance
(VCC = 5 V 10ꢀ, Ta = 25°C, f = 1 MHꢁ)
Parameter
Symbol
Typ.
Max.
Unit
Input Capacitance (A0 - A8)
CIN1
—
—
—
7
pF
Input Capacitance
(RAS, LCAS, UCAS, WE, OE)
CIN2
CI/O
7
pF
pF
Output Capacitance (DQ1 - DQ16)
10
4/16
¡ Semiconductor
MSM514260C/CSL
DC Characteristics
(VCC = 5 V 10ꢀ, Ta = 0°C to 70°C)
MSM514260 MSM514260 MSM514260
C/CSL-50 C/CSL-60 C/CSL-70
Parameter
Symbol
Condition
Unit Note
Min. Max. Min. Max. Min. Max.
Output High Voltage
Output Low Voltage
VOH IOH = –5.0 mA
VOL IOL = 4.2 mA
0 V £ VI £ 6.5 V;
ILI All other pins not
under test = 0 V
DQ disable
2.4
0
VCC
0.4
2.4
0
VCC
0.4
2.4
0
VCC
0.4
V
V
Input Leakage Current
–10
–10
—
10
10
–10
–10
—
10
10
–10
–10
—
10
10
mA
mA
Output Leakage Current ILO
0 V £ VO £ 5.5 V
Average Power
RAS, CAS cycling,
Supply Current
(Operating)
ICC1
170
150
140 mA 1, 2
2
tRC = Min.
RAS, CAS = VIH
—
—
—
2
1
—
—
—
2
1
—
—
—
Power Supply
mA
1
ICC2 RAS, CAS
≥ VCC –0.2 V
RAS cycling,
ICC3 CAS = VIH,
tRC = Min.
1
Current (Standby)
200
200
200 mA 1, 5
Average Power
Supply Current
—
—
—
—
—
170
5
—
—
—
—
—
150
5
—
—
—
—
—
140 mA 1, 2
(RAS-only Refresh)
RAS = VIH,
Power Supply
ICC5 CAS = VIL,
DQ = enable
5
mA
1
Current (Standby)
Average Power
Supply Current
(CAS before RAS Refresh)
Average Power
Supply Current
(Fast Page Mode)
Average Power
Supply Current
(Battery Backup)
Average Power
Supply Current
(CAS before RAS
Self-Refresh)
RAS cycling,
ICC6
170
170
300
150
150
300
140 mA 1, 2
140 mA 1, 3
CAS before RAS
RAS = VIL,
ICC7 CAS cycling,
tPC = Min.
tRC = 125 ms,
1, 4,
ICC10
300 mA
CAS before RAS,
tRAS £ 1 ms
5
RAS £ 0.2 V,
CAS £ 0.2 V
ICCS
—
200
—
200
—
200 mA 1, 5
Notes: 1. I Max. is specified as I for output open condition.
CC
CC
2. The address can be changed once or less while RAS = V .
IL
3. The address can be changed once or less while CAS = V
4. V – 0.2 V £ V £ 6.5 V, –1.0 V £ V £ 0.2 V.
.
IH
CC
IH
IL
5. SL version.
5/16
¡ Semiconductor
MSM514260C/CSL
AC Characteristics (1/2)
(VCC = 5 V 10ꢀ, Ta = 0°C to 70°C) Note 1, 2, 3
MSM514260 MSM514260 MSM514260
C/CSL-50 C/CSL-60 C/CSL-70
Parameter
Symbol
Unit Note
Min. Max. Min. Max. Min. Max.
Random Read or Write Cycle Time
Read Modify Write Cycle Time
Fast Page Mode Cycle Time
tRC
tRWC
tPC
90
130
35
—
—
—
110
150
40
—
—
—
130
180
45
—
—
—
ns
ns
ns
Fast Page Mode Read Modify Write
Cycle Time
75
—
80
—
95
—
ns
tPRWC
Access Time from RAS
Access Time from CAS
Access Time from Column Address
Access Time from CAS Precharge
tRAC
tCAC
tAA
—
—
—
—
50
15
25
30
—
—
—
—
60
15
30
35
—
—
—
—
70
20
35
40
ns 4, 5, 6
ns
ns
4, 5
4, 6
tCPA
ns 4, 12
Access Time from OE
tOEA
tCLZ
tOFF
tOEZ
tT
tREF
tREF
tRP
—
0
15
—
—
0
15
—
—
0
20
—
ns
ns
4
4
Output Low Impedance Time from CAS
CAS to Data Output Buffer Turn-off Delay Time
OE to Data Output Buffer Turn-off Delay Time
Transition Time
Refresh Period
Refresh Period (SL version)
RAS Precharge Time
0
0
3
—
—
30
15
15
50
8
128
—
0
0
3
—
—
40
15
15
50
8
128
—
0
0
3
—
—
50
15
15
50
8
128
—
ns
ns
ns
ms
ms
ns
7
7
3
15
50 10,000 60 10,000 70 10,000 ns
50 100,000 60 100,000 70 100,000 ns
RAS Pulse Width
tRAS
RAS Pulse Width (Fast Page Mode)
RAS Hold Time
RAS Hold Time referenced to OE
CAS Precharge Time (Fast Page Mode)
tRASP
tRSH
tROH
tCP
15
10
10
—
—
—
15
15
10
—
—
—
20
20
10
—
—
—
ns
ns
ns
14
tCAS
tCSH
tCRP
tRHCP
tRCD
tRAD
tASR
tRAH
tASC
tCAH
tAR
CAS Pulse Width
15 10,000 15 10,000 20 10,000 ns
CAS Hold Time
50
10
30
20
15
0
—
—
—
35
25
—
—
—
—
—
—
—
—
—
60
10
35
20
15
0
—
—
—
45
30
—
—
—
—
—
—
—
—
—
70
10
40
20
15
0
—
—
—
50
35
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CAS to RAS Precharge Time
RAS Hold Time from CAS Precharge
RAS to CAS Delay Time
RAS to Column Address Delay Time
Row Address Set-up Time
12
12
5
6
Row Address Hold Time
10
0
10
0
10
0
Column Address Set-up Time
Column Address Hold Time
Column Address Hold Time from RAS
Column Address to RAS Lead Time
Read Command Set-up Time
Read Command Hold Time
Read Command Hold Time referenced to RAS
11
11
10
40
25
0
10
50
30
0
15
55
35
0
tRAL
tRCS
tRCH
tRRH
11
0
0
0
ns 8, 11
0
0
0
ns
8
6/16
¡ Semiconductor
MSM514260C/CSL
AC Characteristics (2/2)
(VCC = 5 V 10ꢀ, Ta = 0°C to 70°C) Note 1, 2, 3
MSM514260 MSM514260 MSM514260
C/CSL-50 C/CSL-60 C/CSL-70
Parameter
Symbol
Unit Note
Min. Max. Min. Max. Min. Max.
Write Command Set-up Time
Write Command Hold Time
Write Command Hold Time from RAS
Write Command Pulse Width
OE Command Hold Time
tWCS
tWCH
tWCR
tWP
0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
ns 9, 11
10
40
10
15
15
15
0
15
45
15
15
15
15
0
15
50
15
20
20
20
0
ns
ns
ns
ns
ns
ns
11
tOEH
tRWL
tCWL
tDS
Write Command to RAS Lead Time
Write Command to CAS Lead Time
Data-in Set-up Time
13
ns 10, 11
Data-in Hold Time
tDH
10
40
15
35
45
70
50
10
10
15
10
50
15
35
50
80
55
10
10
20
15
55
15
45
60
95
65
10
10
15
ns 10, 11
Data-in Hold Time from RAS
OE to Data-in Delay Time
tDHR
tOED
tCWD
tAWD
tRWD
tCPWD
tRPC
ns
ns
CAS to WE Delay Time
ns
ns
ns
ns
ns
ns
ns
9
9
Column Address to WE Delay Time
RAS to WE Delay Time
9
CAS Precharge WE Delay Time
CAS Active Delay Time from RAS Precharge
9
11
11
12
RAS to CAS Set-up Time (CAS before RAS) tCSR
RAS to CAS Hold Time (CAS before RAS)
tCHR
RAS Pulse Width
tRASS
100
90
—
—
—
100
110
–40
—
—
—
100
130
–50
—
—
—
ms
ns
ns
15
15
15
(CAS before RAS Self-Refresh)
RAS Precharge Time
(CAS before RAS Self-Refresh)
CAS Hold Time
(CAS before RAS Self-Refresh)
tRPS
tCHS
–30
7/16
¡ Semiconductor
MSM514260C/CSL
Notes: 1. A start-up delay of 200 µs is required after power-up, followed by a minimum of eight
initialization cycles (RAS-only refresh or CAS before RAS refresh) before proper device
operation is achieved.
2. The AC characteristics assume t = 5 ns.
T
3. V (Min.) and V (Max.) are reference levels for measuring input timing signals.
IH
IL
Transition times (t ) are measured between V and V .
T
IH
IL
4. This parameter is measured with a load circuit equivalent to 2 TTL loads and 100 pF.
5. Operation within the t (Max.) limit ensures that t (Max.) can be met.
RCD
RAC
t
(Max.) is specified as a reference point only. If t
(Max.) limit, then the access time is controlled by t
is greater than the specified
RCD
RCD
t
.
RCD
CAC
6. Operation within the t
(Max.) limit ensures that t
(Max.) can be met.
is greater than the specified
RAD
RAC
t
(Max.) is specified as a reference point only. If t
RAD
RAD
t
(Max.) limit, then the access time is controlled by t
.
RAD
AA
7. t
(Max.) and t
(Max.) define the time at which the output achieves the open
OFF
OEZ
circuit condition and are not referenced to output voltage levels.
8. t
9. t
or t
must be satisfied for a read cycle.
RCH
RRH
, t
, t
, t
and t
are not restrictive operating parameters. They are
WCS CWD RWD AWD
CPWD
included in the data sheet as electrical characteristics only. If t
≥t
(Min.), then
WCS WCS
the cycle is an early write cycle and the data out will remain open circuit (high
impedance) throughout the entire cycle. If t ≥ t (Min.) , t ≥ t (Min.),
CWD
CWD
RWD
RWD
t
≥ t
(Min.) and t
≥ t
(Min.), then the cycle is a read modify write
AWD
AWD
CPWD
CPWD
cycle and data out will contain data read from the selected cell; if neither of the above
sets of conditions is satisfied, then the condition of the data out (at access time) is
indeterminate.
10. These parameters are referenced to the UCAS and LCAS, leading edges in an early
write cycle, and to the WE leading edge in an OE control write cycle, or a read modify
write cycle.
11. These parameters are determined by the falling edge of either UCAS or LCAS,
whichever is earlier.
12. These parameters are determined by the rising edge of either UCAS or LCAS,
whichever is later.
13. t
should be satisfied by both UCAS and LCAS.
CWL
14. t is determined by the time both UCAS and LCAS are high.
CP
15. Only SL version.
8/16
E2G0096-17-41I
¡ Semiconductor
MSM514260C/CSL
TIMING WAVEFORM
Read Cycle
tRC
tRP
tCRP
tRAS
VIH
VIL
–
–
tAR
RAS
tCSH
tCRP
tRCD
tRSH
tCAS
VIH
VIL
–
–
CAS
tRAD
tASC
tASR
Row
tRAH
tRAL
tCAH
Column
VIH
VIL
–
–
Address
tRCH
tRCS
tRRH
VIH
VIL
–
–
tAA
WE
OE
tROH
tOEA
VIH
VIL
–
–
tOFF
tCAC
tRAC
tOEZ
VOH
VOL
–
–
DQ
Open
Valid Data-out
tCLZ
"H" or "L"
Write Cycle (Early Write)
tRC
tRP
tRAS
VIH
VIL
–
–
tAR
tCRP
RAS
CAS
tCSH
tCRP
tRCD
tRAD
tRAH
tASC
tRSH
tCAS
VIH
VIL
–
–
tRAL
tASR
Row
tCAH
Column
tWCH
VIH
VIL
–
–
Address
tWCS
tCWL
VIH
VIL
–
–
tWP
WE
tRWL
tWCR
VIH
VIL
–
–
OE
tDHR
tDS
tDH
VIH
VIL
–
–
DQ
Open
Valid Data-in
"H" or "L"
9/16
¡ Semiconductor
MSM514260C/CSL
Read Modify Write Cycle
tRWC
tRAS
tRP
VIH
VIL
–
–
tAR
RAS
CAS
tCRP
tCSH
tCRP
tRCD
tRSH
tCAS
VIH
VIL
–
–
tRAH
tASC
tASR
tCAH
Column
VIH
VIL
–
–
Row
Address
tCWL
tRWL
tWP
tCWD
tAWD
tRAD
tRWD
tOEA
VIH
VIL
–
–
tAA
WE
OE
tRCS
VIH
VIL
–
–
tOED
tOEZ
tOEH
tDH
tCAC
tDS
tRAC
VI/OH
–
Valid
Data-out
Valid
Data-in
DQ
–
tCLZ
VI/OL
"H" or "L"
10/16
¡ Semiconductor
MSM514260C/CSL
Fast Page Mode Read Cycle
tRASP
tRP
tAR
tRCD
tRAD
tRAH tASC
tRHCP
VIH
VIL
–
–
RAS
CAS
tCRP
tPC
tRSH
tCAS
tCRP
tCP
tCP
tCAS
tCAS
VIH
VIL
–
–
tRAL
tASC tCAH
tCSH
tCAH
tASR
Row
tASC
tCAH
VIH
VIL
–
–
Column
Column
Column
tRCS
Address
tRCH
tRCS
tRCS
tRCH
tRCH
VIH
VIL
–
–
WE
tAA
tAA
tAA
tRRH
tCPA
tCPA
tOEA
tOEA
tOEA
VIH
VIL
–
–
OE
tOFF
tOEZ
tOFF
tOEZ
tCAC
tCLZ
tCAC
tCLZ
tOFF
tCAC
tRAC
tOEZ
VOH
VOL
–
–
Valid
Data-out
Valid
Data-out
Valid
Data-out
DQ
tCLZ
"H" or "L"
Fast Page Mode Write Cycle (Early Write)
tRASP
tPC
tRP
tCRP
tAR
tRHCP
VIH
VIL
–
–
RAS
CAS
tRSH
tCAS
tRAL
tCRP
tRCD
tCP
tCP
tCAS
tCAS
tCAH
Column
VIH
VIL
–
–
tCSH
tCAH
tASR
Row
tASC
tASC
tASC
tRAH
tCAH
VIH
VIL
–
–
Column
tCWL
tWCH
tWP
Column
Address
tRAD
tWCS
tCWL
tWCH
tWP
tRWL
tCWL
tWCH
tWP
tWCS
tWCS
VIH
VIL
–
–
WE
tWCR
tDS
tDS
tDS
tDH
tDH
tDH
VIH
VIL
–
–
Valid
Data-in
Valid
Data-in
Valid Data-in
tDHR
DQ
Note: OE = "H" or "L"
"H" or "L"
11/16
¡ Semiconductor
MSM514260C/CSL
Fast Page Mode Read Modify Write Cycle
tRASP
VIH
VIL
tAR
–
–
RAS
CAS
tRP
tCSH
tPRWC
tCAS
tRSH
tCAS
tCRP
tCP
tCP
tRCD
tCAS
VIH
VIL
–
–
tRAD
tRAH
tASC
tCAH
tASC
tRAL
tCAH
tCAH
tASR
tASC
VIH
VIL
–
–
Column
tRWD
Column
tRCS
Column
Address
Row
tRCS
tCPWD
tCPWD
tCWD
tRWL
tCWL
tCWD
tCWD
tRCS
tCWL
tCWL
VIH
VIL
–
–
WE
tAWD
tAWD
tAWD
tROH
tWP
tWP
tDH
tWP
tDH
tDH
tDS
tDS
tDS
tRAC
tCPA
tAA
tCPA
tAA
tAA
tOEA
tOEA
tOEA
tOED
tOED
tOED
VIH
VIL
–
–
OE
tOEZ
tOEZ
tOEZ
tCAC
tCAC
tCAC
VI/OH
–
DQ
Out
In
Out
In
Out
In
–
VI/OL
tCLZ
tCLZ
tCLZ
"H" or "L"
RAS-Only Refresh Cycle
tRC
tRP
tRAS
VIH
VIL
–
–
RAS
CAS
tCRP
tRPC
VIH
VIL
–
–
tASR tRAH
VIH
VIL
–
–
Address
DQ
Row
tOFF
VOH
VOL
–
–
Open
Note: WE, OE = "H" or "L"
"H" or "L"
12/16
¡ Semiconductor
MSM514260C/CSL
CAS before RAS Refresh Cycle
tRC
tRP
tRAS
tRP
VIH
VIL
–
–
RAS
tRPC
tRPC
tCP
tCSR
tCHR
VIH
VIL
–
–
CAS
tOFF
VOH
VOL
–
–
DQ
Open
Note: WE, OE, Address = "H" or "L"
"H" or "L"
Hidden Refresh Read Cycle
tRC
tRC
tRAS
tRAS
tRP
tRP
VIH
VIL
–
–
tAR
tRCD
RAS
tCRP
tRSH
tCHR
VIH
VIL
–
–
tRAD
tASC
tRAH
CAS
tCAH
tASR
VIH
VIL
–
–
Address
Row
Column
tRCS
tRRH
tRAL
VIH
VIL
–
–
tAA
WE
OE
tROH
tOEA
VIH
VIL
–
–
tCAC
tCLZ
tOFF
tRAC
tOEZ
VOH
VOL
–
–
DQ
Valid Data-out
"H" or "L"
13/16
¡ Semiconductor
MSM514260C/CSL
Hidden Refresh Write Cycle
tRC
tRC
tRAS
tRAS
tAR
tRP
tRP
VIH –
RAS
VIL
–
tCRP
tRCD
tCHR
tRSH
VIH –
tRAD
tASC
tRAH
CAS
VIL
–
tCAH
tASR
Row
tRAL
VIH
VIL
–
–
Address
Column
tRWL
tWCH
tWP
tWCS
VIH –
WE
OE
VIL
–
tWCR
VIH –
VIL
–
tDS
tDH
VIH
VIL
–
–
DQ
Valid Data-in
tDHR
"H" or "L"
CAS before RAS Self-Refresh Cycle
tRASS
tRPS
tRP
VIH
VIL
–
–
RAS
CAS
tRPC
tCP
tRPC
tCHS
tCSR
VIH
VIL
–
–
tOFF
VOH
VOL
–
–
DQ
Open
Note: WE, OE, Address = "H" or "L"
"H" or "L"
Only SL version
14/16
¡ Semiconductor
PACKAGE DIMENSIONS
SOJ40-P-400-1.27
MSM514260C/CSL
(Unit : mm)
Mirror finish
Package material
Epoxy resin
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
42 alloy
Solder plating
5 mm or more
1.70 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
15/16
¡ Semiconductor
MSM514260C/CSL
(Unit : mm)
TSOPII44/40-P-400-0.80-K
Mirror finish
Package material
Epoxy resin
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
42 alloy
Solder plating
5 mm or more
0.49 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
16/16
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