MSM6411A-XXRS [OKI]
Microcontroller, 4-Bit, MROM, 4.2MHz, CMOS, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16;
| 型号： | MSM6411A-XXRS |
| 厂家： | 
OKI ELECTRONIC COMPONETS |
| 描述： | Microcontroller, 4-Bit, MROM, 4.2MHz, CMOS, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16 时钟 微控制器 光电二极管 外围集成电路 |
| 文件： | 总11页 (文件大小：114K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
E2E0015-38-93
This version: Sep. 1998
Previous version: Mar. 1996
¡ Semiconductor
MSM6411A
High speed and Simple 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM6411A, implemented in complementary metal-oxide semiconductor technology, is a
low-power CMOS 4-bit microcontroller developed for smaller-scale control systems.
FEATURES
• ROM
• RAM
• I/O port
: 1024 words ¥ 8 bits
: 32 words ¥ 4 bits
Input-output port
Input port
• 8-bit serial shift register
: 2 ports ¥ 4 bits
: 1 port ¥ 3 bits
• 2 interrupt sources (1 external, 1 internal)
• 63 instructions
• Power-down features
• Minimum instruction execution time : 952 ns @ 4.2 MHz clock
• Single 5 V power supply
• Package:
16-pin plastic DIP (DIP16-P-300-2.54) : (Product name : MSM6411A-¥¥RS)
¥¥ indicates a code number.
1/11
¡ Semiconductor
MSM6411A
BLOCK DIAGRAM
RAM
32 ¥ 4 bits
INST.
DEC.
ROM
1024 ¥ 8 bits
ACC
ALU
3
0
DEC
DEC
PC
C
SP
L
H
2
0
3
0
9
0
P2
P1
P0
I
SR
O
0
INT.C
T.G
2 1 0
3 2 1 0
3 2 1 0
7
f
INT
SISO
VDD GND
OSC0 OSC1
RESET
SCK
2/11
¡ Semiconductor
MSM6411A
PIN CONFIGURATION (TOP VIEW)
P1.2
P1.3
1
2
3
4
5
6
7
8
VDD
16
15
14
13
12
11
10
9
P1.1
P2.0/INT
P2.1
P1.0
P0.3/SI
P0.2/SO
P0.1/SCK
P0.0
P2.2
OSC1
OSC0
GND
RESET
16-Pin Plastic DIP
PIN DESCRIPTIONS
Pin
10
11
12
13
14
15
1
Symbol
P0.0
Type
Description
During reset
P0.1/SCK
P0.2/SO
P0.3/SI
P1.0
4-bit input-output port. P0.1 to P0.3 are used as both
input-output ports and shift register pins.
I/O
"1"
P1.1
I/O
I
4-bit input-output port.
"1"
P1.2
2
P1.3
3
P2.0/INT
P2.1
3-bit input port with latch. P2.0 is used as both input port Latch is reset.
4
and INT input pin (falling edge trigger input).
("0")
Clocked in
—
5
P2.2
7
OSC0
I
System clock input pin.
System clock output pin. This pin and OSC0 pin make up
the oscillator circuit.
6
OSC1
O
9
16
8
RESET
VDD
I
I
I
Input pin for system reset.
Power supply voltage pin.
Ground pin.
—
—
—
GND
3/11
¡ Semiconductor
MSM6411A
INSTRUCTION LIST
Mnemonic
LAI n
LLI n
LHLI nn
LAL
Code
90-9F
80-8F
15nn
21
Byte
1
1
2
1
1
1
1
2
2
2
2
1
1
1
1
1
1
2
1
1
1
1
1
2
1
1
1
1
1
1
1
1
Cycle
Description
1
1
2
1
1
1
1
2
2
2
2
3
3
1
1
1
1
2
1
1
1
1
1
2
1
1
1
1
1
1
1
1
A¨n
L¨n
HL¨nn
A¨L
LLA
2D
L¨A
LAM
38
A¨M
LMA
2F
M¨A
LAMD mm
LMAD mm
LMSR
LSRM
PUSH
POP
10mm
11mm
3E5A
3E52
1C
A¨Md
Md¨A
M(w)¨SR
SR¨M(w)
ST¨C, A, H, L, SP¨SP – 1
C, A, H, L¨ST, SP¨SP + 1
A¨M
1D
X
28
INL
31
L¨L + 1, SKIP IF L = "0"
H¨H + 1, SKIP IF H = "0"
M¨M + 1, SKIP IF M = "0"
INH
32
INM
33
INMD mm
DCL
12mm
35
Md¨Md – 1, SKIP IF Md = "0"
L¨L – 1, SKIP IF L = "F"
H¨H – 1
DCH
36
DCM
ADS
37
M¨M – 1, SKIP IF M = "F"
A¨A + M, SKIP IF Cy = "1"
C, A¨C + A + M
A¨A + n, SKIP IF Cy = "1"
A¨A + 10
02
ADC
03
AIS n
DAS
3E4n
0A
AND
0D
A¨A M
EOR
04
A¨A M
CMA
0B
A¨A
CAM
16
SKIP IF A = M
SC
07
C¨"1"
RC
08
C¨"0"
TC
09
SKIP IF C = "1"
A
RAL
0E
1
1
C¨3¨2¨1¨0¨
4/11
¡ Semiconductor
MSM6411A
INSTRUCTION LIST (continued)
Mnemonic
TAB n2
Code
54-57
58-5B
68-6B
78-7B
3D p0 to 3
3D p4 to 7
3D p8 to B
3E60
Byte
1
Cycle
Description
SKIP IF [A bit n2] = "1"
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
TMB n2
RMB n2
SMB n2
TPBD p•n2
RPBD p•n2
SPBD p•n2
MEI
1
SKIP IF [M bit n2] = "1"
[M bit n2]¨"0"
[M bit n2]¨"1"
SKIP IF [Pp bit n2] = "1"
[Pp bit n2]¨"0"
[Pp bit n2]¨"1"
MEIF¨"1"
1
1
2
2
2
2
MDI
3E61
2
MEIF¨"0"
EICT
3DCB
2
EICTF¨"1"
EIEX
3DC8
2
EIEXF¨"1"
DICT
3DC7
2
EICTF¨"0"
DIEX
3DC4
2
EIEXF¨"0"
TICT
3DC3
2
SKIP IF EICTF = "1"
SKIP IF EIEXF = "1"
SKIP IF IRQEX = "1"
SKIP IF IRQSR = "1"
IRQEX¨"0"
TIEX
3DC0
2
TQEX
3D20
2
TQSR
RQEX
RQSR
ESR
3DD3
2
3D24
2
3DD7
2
IRQSR¨"0"
3DBA
2
SRF¨"1"
DSR
3DB6
2
SRF¨"0"
TSR
3DB2
2
SKIP IF SRF = "1"
PC¨a6
JCP a6
C0 to FF
40 to 43
00 to FF
A0 to A3
00 to FF
IE
1
JP a10
2
2
2
4
PC¨a10
CAL a10
ST¨PC + 2, PC¨a10, SP¨SP - 1
RT
1
2
2
2
1
4
2
2
2
1
PC¨ST, SP¨SP + 1
A¨Pp
IPD p
OPD p
STOP
NOP
3DpD
3DpC
Pp¨A
3DB9
STOP CLOCK
NO OPERATION
00
5/11
¡ Semiconductor
MSM6411A
ABSOLUTE MAXIMUM RATINGS
Parameter
Power Supply Voltage
Input Voltage
Symbol
VDD
Condition
Rating
–0.3 to +7
–0.3 to VDD
–0.3 to VDD
200 max.
Unit
V
VI
Ta = 25°C
V
Output Voltage
VO
V
Ta = 25°C per package
Ta = 25°C per output
—
mW
mW
°C
Power Dissipation
PD
50 max.
Storage Temperature
TSTG
–55 to +150
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Condition
fOSC £ 1 MHz
fOSC £ 4.2 MHz
fOSC £ 0 Hz
—
Range
3 to 6
Unit
V
Power Supply Voltage
VDD
4.5 to 5.5
2 to 6
V
Data-Hold Voltage
VDDH
Top
V
Operating Temperature
–40 to +85
15
°C
MOS load
TTL load
Fan Out
N
—
1
6/11
¡ Semiconductor
MSM6411A
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 5 V 10ꢀ, Ta = –40 to +85°C)
Parameter
"H" Input Voltage
Symbol
VIH
Condition
—
Min.
2.4
3.6
–0.3
4.2
—
Typ.
—
—
—
—
—
—
—
—
—
—
5
Max.
VDD
VDD
+0.8
—
Unit
V
*1,*2
*3,*4
"H" Input Voltage
"L" Input Voltage
"H" Output Voltage
"L" Output Voltage
"L" Output Voltage
Input Current
VIH
—
V
VIL
—
V
*1,*5
*1
VOH
VOL
VOL
IIH/IIL
IIH/IIL
IOH
IO = –15 mA
IO = 1.6 mA
IO = 15 mA
VI = VDD/0 V
VI = VDD/0 V
VO = 2.4 V
VO = 0.4 V
V
0.4
V
*5
—
0.4
V
*3
—
15/–15
1/–30
—
mA
mA
mA
mA
Input Current
*2,*4
*1
—
"H" Output Current
"H" Output Current
Input Capacitance
Output Capacitance
Power Supply Current
(In Stop Mode)
–0.1
—
*1
IOH
–1.2
—
CI
—
f = 1 MHz, Ta = 25°C
pF
CO
—
7
—
VDD = 2 V, no load, Ta = 25°C
No load
—
0.2
1
5
mA
mA
IDDS
IDD
—
100
Crystal oscillation,
no load, 4.2 MHz
Power Supply Current
—
6
12
mA
*1 Applied to P0 and P1
*2 Applied to P2
*3 Applied to OSC
0
*4 Applied to RESET
*5 Applied to OSC
1
7/11
¡ Semiconductor
MSM6411A
AC Characteristics
(VDD = 5 V 10ꢀ, Ta = –40 to +85°C)
Parameter
Clock (OSC0) Pulse Width
Cycle Time
Symbol
tfW
Condition
Min.
119
952
120
120
Typ.
—
Max.
—
Unit
ns
—
—
—
—
tCY
—
—
ns
Input Data Setup Time
Input Data Hold Time
Input Data/Input Clock
Pulse Width
tDS
—
—
ns
tDH
—
—
ns
tDW
—
120
—
—
ns
SR Clock Pulse Width
SR Data Setup Time
SR Data Hold Time
Data Delay Time
tSW
tSS
tSH
tDR
tSR
—
—
tfW
120
120
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
—
—
CL = 15 pF
CL = 15 pF
tCY + 300
tCY + 480
PORT Clock SR Data Delay Time
External Clock SR Data Delay
Time
—
tSP
CL = 15 pF
—
—
—
—
360
—
ns
ns
SR Clock Invalid Time
tSINH
2/8 tCY
8/11
¡ Semiconductor
MSM6411A
Timing Diagrams
1MC
tCY
OSC0
tfW tfW
INPUT
DATA
P0, P1, P2
tDS tDH
P0, P1
tDR
P0.2/SO
tSR
P0.1/SCK
tSW tSW
INPUT
DATA
P0.3/SI
tSS tSH
P0.2/SO
tSP
P2.0/INT
tDW
1MC
OSC0
P0.1/SCK inhibit period
during LMSR INST
tSINH
9/11
¡ Semiconductor
MSM6411A
Operating Characteristics
Current (I ) vs. Voltage (V ) for
Current (I ) vs. Voltage (V ) for
OL OL
OH
OH
High State Output
Low State Output
(Ta = 25°C)
(Ta = 25°C)
VDD = 5 V
–1.0
–0.9
–0.8
–0.7
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
20
6 V
18
16
14
12
10
VDD = 6 V
4 V
5 V
8
6
3 V
4 V
3 V
4
2
0
1
2
3
4
5
6
7
8
9 10
0
1 2 3 4 5 6 7 8 9 10
VOH (V)
VOL (V)
Maximum Clock Frequency (f
) vs.
OSC
Supply Current (I ) vs. Supply
DD
Supply Voltage (V
)
Voltage (V
)
DD
DD
(Ta = 25°C, CL = 15 pF)
(Ta = 25°C, no load)
10 m
5 m
10
9
fOSC = 4 MHz
2 MHz
8
7
6
5
4
3
2
1 MHz
500 kHz
1 m
500 m
100 kHz
100 m
50 m
1
10 m
5 m
0
1
2
3
4
5
6
7
8
9 10
VDD (V)
0 Hz
1 m
500 n
MaximumClockFrequency(f ) vs.
OSC
Temperature (Ta)
(CL = 15 pF)
100 n
10
9
0
1 2 3 4 5 6 7 8 9 10
V
DD (V)
8
7
VDD = 5 V
6
5
4
3
2
1
0 –40–20 0 20 40 60 80 100120
Ta (°C)
10/11
¡ Semiconductor
PACKAGE DIMENSIONS
DIP16-P-300-2.54
MSM6411A
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.99 TYP.
11/11
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