MSM64164C [OKI]
4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver; 4 -bit微控制器内建RC振荡型A / D转换器和LCD驱动器
| 型号： | MSM64164C |
| 厂家： | 
OKI ELECTRONIC COMPONETS |
| 描述： | 4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver |
| 文件： | 总41页 (文件大小：297K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
E2E0035-38-94
This version: Sep. 1998
Previous version: Apr. 1998
¡ Semiconductor
MSM64164C
4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver
GENERAL DESCRIPTION
The MSM64164C is a low power 4-bit microcontroller that employs Oki's original CPU core nX-
4/20.
The MSM64164C is best suitable for applications such as low power, high precision thermome-
ters and hygrometers.
The MSM64P164 is a one-time-programmable ROM-version product having one-time PROM
(OTP) as internal program memory.
The MSM64P164 is used to evaluate the software development.
The MSM64P164 differs from the MSM64164C in the polarity of the power supply.
FEATURES
• Operating range
Operating frequencies
Operating voltage
:
:
32.768 kHz, 400 kHz
1.25 to 1.7 V (1.5 V spec.)
2.0 to 3.5 V (3 V spec.)
2.2 to 3.5 V (3 V spec., 1/2 duty)
–40 to +85°C
Operating temperature
:
• Memory space
Internal program memory
Internal data memory
• Minimum instruction execution time
:
:
:
4064 bytes
256 nibbles
7.5 ms @ 400 kHz
91.6 ms @ 32.768 kHz
2 channels
• RC oscillation type A/D converter
:
Time dividing 2-channel method
Synchronous 8-bit transfer
34 outputs; duty ratio switchable by software
120 segments (max)
93 segments (max)
64 segments (max)
1 output (4 output modes selectable)
2 channels
• Serial port
• LCD driver
(1) At 1/4 duty and 1/3 bias
(2) At 1/3 duty and 1/3 bias
(3) At 1/2 duty and 1/2 bias
• Buzzer driver
:
:
:
:
:
:
:
• Capture circuit
• Watchdog timer
• Clock
:
32.768 kHz crystal oscillator and 400 kHz RC
oscillator (with an external resistor)
32.768 kHz/400 kHz (switchable by software)
32.768 kHz
CPU clock
:
:
:
Time base clock
• Power supply voltage
• I/O port
1.5 V/3 V (selectable by mask option)
Input-output port
Input port
Output port
:
:
:
3 ports ¥ 4 bits
1 port ¥ 4 bits
1 port ¥ 4 bits
(8 out of the 34 LCD driver outputs can be used
as output-only ports by mask option.)
1/41
¡ Semiconductor
MSM64164C
• Interrupt sources
External interrupt
Internal interrupt
• Package options:
:
:
2 sources
8 sources
80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64164C-¥¥¥GS-BK)
80-pin plastic QFP (QFP80-P-1414-0.65-K) : (Product name : MSM64164C-¥¥¥GS-K)
80-pin plastic TQFP (TQFP80-P-1212-0.50-K) : (Product name : MSM64164C-¥¥¥TS-K)
Chip
: (Product name : MSM64164C-¥¥¥)
¥¥¥ indicates a code number.
• OTP version
The MSM64P164 has one-time PROM (OTP) as internal program memory and is used to
evaluate the software development.
The MSM64P164 differs from the MSM64164C in the polarity of the power supply and
operating voltage.
Refer to the "MSM64P164 User's Manual" for details.
2/41
¡ Semiconductor
MSM64164C
BLOCK DIAGRAM
CPU CORE: nX-4/20
BSR
TR1
PCH
TR2
TR0
(4)
ROM
PCM PCL
4064B
A11 to A8
A7 to A0
ALU
HALT
MIEF
C
(4)
(4)
B
A
H
L
X
Y
RAM
256N
DB7 to DB0
ROMR
(8)
SP
TIMING
CONTROLLER
(8)
OSC2
OSC1
XT
2CLK
RSTG
TBC
INTC
WDT
XT
VSS
INT
P4.3
P4.2
P4.1
P4.0
RESET
PORT4
VSS
INT
PORT3
VSS
TST1
TST2
5
INT
TST
VR
P3.3
P3.2
P3.1
P3.0
INT
SIOP
VSSL
INT
PORT2
VSS
P2.3
P2.2
P2.1
P2.0
L0
L1
INT
LCD
CAPR
L33
P1.3
P1.2
P1.1
P1.0
VSS
VSS1
VSS2
VSS3
C1
PORT1
VSS
BIAS
INT
P0.3
P0.2
P0.1
P0.0
C2
PORT ADDRESS
DB7 to DB0
PORT0
VDD
VSS
INT
BD
ADC
3/41
¡ Semiconductor
MSM64164C
PIN CONFIGURATION (TOP VIEW)
64
63
62
61
1
L0
L1
L2
L33/P6.3
2
L32/P6.2
L31/P6.1
L30/P6.0
3
4
L3
5
60 L29/P5.3
59
L4
L5
6
L28/P5.2
7
58 L27/P5.1
L6
57
8
L26/P5.0
L7
9
L8
56 L25
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
55
L24
54 L23
L9
L10
L11
L12
L13
L14
L15
L16
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2
53
L22
52
L21
51 L20
50
49
48
47
L19
L18
L17
C2
46 C1
45
VSS3
44
43
42
41
VSS2
VSS
VSS1
RT1
(QFP80-P-1420-0.80-BK)
80-Pin Plastic QFP
Note: Becausepin32andpin67areinternallyconnectedwitheachother, V canbesupplied
DD
from either pin 32 or pin 67.
4/41
¡ Semiconductor
MSM64164C
PIN CONFIGURATION (TOP VIEW) (continued)
1
60 L31/P6.1
59
L2
L3
L4
2
3
L30/P6.0
58 L29/P5.3
57
4
L5
L28/P5.2
5
56 L27/P5.1
L6
6
55
L26/P5.0
L7
7
L8
54 L25
53
8
L9
L24
52
9
L23
L10
L11
L12
L13
L14
L15
L16
P2.0
P2.1
P2.2
P2.3
P3.0
10
11
12
13
14
15
16
17
18
19
20
51 L22
50
L21
L20
L19
L18
49
48
47
46 L17
45
C2
C1
VSS3
VSS2
VSS
44
43
42
41
(QFP80-P-1414-0.65-K)
80-Pin Plastic QFP
5/41
¡ Semiconductor
MSM64164C
PIN CONFIGURATION (TOP VIEW) (continued)
1
60 L31/P6.1
L2
2
3
59
L3
L4
L30/P6.0
58 L29/P5.3
57
4
L5
L28/P5.2
5
56 L27/P5.1
L6
6
55
L26/P5.0
L7
7
L8
54 L25
53
8
L9
L24
52
9
L23
L10
L11
L12
L13
L14
L15
L16
P2.0
P2.1
P2.2
P2.3
P3.0
10
11
12
13
14
15
16
17
18
19
20
51 L22
50
L21
L20
L19
L18
49
48
47
46 L17
45
C2
C1
VSS3
VSS2
VSS
44
43
42
41
(TQFP80-P-1212-0.50-K)
80-Pin Plastic TQFP
6/41
¡ Semiconductor
MSM64164C
PAD CONFIGURATION
Pad Layout
Y
X
Chip Size
: 5.39 mm ¥ 4.48 mm
: 350 mm (typ.)
: Chip center
: 100 mm ¥ 100 mm
: 120 mm ¥ 120 mm
: 180 mm
Chip Thickness
Coordinate Origin
Pad Hole Size
Pad Size
Minimum Pad Pitch
Note: The chip substrate voltage is V
.
DD
7/41
¡ Semiconductor
MSM64164C
Pad Coordinates
Pad No.
1
Pad Name
L0
X (µm)
–2545
–2314
–2083
–1852
–1621
–1390
–1159
–928
–697
–466
–235
0
Y (µm)
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–2090
–1880
–1670
–1460
–1250
–1040
–830
Pad No.
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Pad Name
RT1
VSS1
VSS
X (µm)
Y (µm)
1880
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
2090
1775
1551
1327
1103
879
2545
2545
2
L1
3
L2
2314
4
L3
VSS2
VSS3
C1
2083
5
L4
1852
6
L5
1621
7
L6
C2
1390
8
L7
L17
1159
9
L8
L18
928
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
L9
L19
697
L10
L11
L12
L13
L14
L15
L16
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2
P3.3
P4.0
P4.1
P4.2
P4.3
BD
L20
466
L21
235
235
L22
0
466
L23
–235
697
L24
–466
928
L25
–697
1159
1390
1621
1852
2083
2314
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
2545
L26
–928
L27
–1159
–1390
–1621
–1852
–2083
–2314
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
–2545
L28
L29
L30
L31
L32
L33
OSC2
OSC1
VDD
XT
XT
–620
RESET
TST1
TST2
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
655
VSSL
VDD
RT0
CRT0
RS0
CS0
IN0
–431
431
–74
207
200
–207
–431
–655
–879
–1103
–1327
–1551
–1747
410
620
830
1040
IN1
1250
CS1
RS1
1460
1670
8/41
¡ Semiconductor
MSM64164C
PIN DESCRIPTIONS
Basic Functions
Function
Symbol
VDD
Type
—
Description
0 V power supply
Bias output for driving LCD (–1.5 V), or negative power supply at 1.5 V spec.
Bias output for driving LCD (–3.0 V), or negative power supply at 3.0 V spec.
Bias output for driving LCD (–4.5 V).
VSS1
VSS2
VSS3
VSS
—
—
Power
Supply
—
Negative power supply for I/O port interface
—
Negative power supply pin for internal logic (internally generated constant
voltage)
VSSL
—
Pins for connecting a capacitor for generating VSS1, VSS2, and VSS3
.
C1, C2
XT
—
I
32.768 kHz crystal connection pins
XT
O
I
Oscillation
OSC1
External 400 kHz oscillation resistor (ROS) connection pins
OSC2
O
O
I
Output port (P1.0 : high current output)
Input port
P1.0 to P1.3
P0.0 to P0.3
P2.0 to P4.3
BD
Input-output ports
I/O
O
O
Output pin for the buzzer driver
LCD driver pins
Ports
L0 to L25
L26/P5.0 to
L33/P6.3
RT0
LCD driver pins, or output ports by mask option
Resistance temperature sensor connection pin
O
O
O
Resistance/capacitance temperature sensor
connection pin
RC oscillation pins
for A/D converter
(channel 0)
CRT0
Reference resistor connection pin
Reference capacitor connection pin
Input pin for RC oscillator circuit
Resistance temperature sensor connection pin
Reference resistor connection pin
Reference capacitor connection pin
Input pin for RC oscillator circuit
Reset pin
RS0
CS0
O
O
I
(CROSC0)
A/D
Converter
IN0
RC oscillation pins
for A/D converter
(channel 1)
RT1
O
O
O
I
RS1
CS1
(CROSC1)
IN1
Reset
Test
RESET
TST1
TST2
I
I
Input pins for testing
I
9/41
¡ Semiconductor
MSM64164C
Secondary Functions
Function
Symbol
P0.0
P0.1
P0.2
P0.3
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2
P3.3
P4.0
P4.1
P4.2
P4.3
P0.0
P0.1
Type
Description
Secondary functions of P0.0 to P0.3:
I
Level-triggered external interrupt input pins.
The change of input signal level causes an interrupt to occur.
Secondary functions of P2.0 to P2.3, P3.0 to P3.3, and P4.0 to P4.3:
Level-triggered external interrupt input pins.
I
The change of input signal level causes an interrupt to occur.
External
Interrupt
Secondary functions of P0.0 and P0.1:
Capture
Trigger
I
I
Capture circuit trigger input pins.
Secondary functions of P3.3:
P3.3
P4.0
P4.1
P4.2
This pin is assigned the data input of a serial port (SIN).
Secondary functions of P4.0:
O
This pin is assigned the data output of a serial port (SOUT).
Secondary functions of P4.1:
Serial Port
O
This pin is assigned the ready output of a serial port (SPR).
Secondary functions of P4.2:
I/O
This pin is assigned the clock I/O of a serial port (SCLK).
Secondary functions of P4.3:
RC Oscillation
Monitor
This pin is a monitor output (MON) of an RC oscillation clock (OSCCLK) for
an A/D converter and a 400 kHz RC oscillation clock for a system clock.
P4.3
O
10/41
¡ Semiconductor
MSM64164C
MEMORY MAPS
Program Memory
Test program area
0FFFH
0FE0H
32 bytes
Contents of interrupt area
03BH
038H
035H
032H
02FH
02CH
029H
026H
023H
020H
Watchdog interrupt
External interrupt (0)
Serial port interrupt
External interrupt (1)
ADC interrupt
4064 bytes
256 Hz interrupt
32 Hz interrupt
03EH
16 Hz interrupt
1 Hz interrupt
Interrupt area
020H
0.1 Hz interrupt
CZP area
010H
Start address
000H
8 bits
Program Memory Map
Address 000H is the instruction execution start address by the system reset.
The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of
1-byte call instruction.
The start address of interrupt subroutine is assigned to the interrupt address from address 020H
to 03DH.
The user area has 4064 bytes of address 000H to address 0FDF. No program can be stored in the
test program area.
11/41
¡ Semiconductor
MSM64164C
Data Memory
The data memory area consists of 8 banks and each bank has 256 nibbles (256 ¥ 4 bits).
The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0.
7FFH
Data/Stack area (128 nibbles)
BANK7
780H
Data RAM area
(256 nibbles)
700H
6FFH
Contents of 000H to 07FH
07FH
Inaccessible area
SFR area
100H
0FFH
Unused area
BANK 0
080H
07FH
000H
000H
4 bits
Data Memory Map
Half the data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting
from address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call
Instruction and 8 nibbles are used by an interrupt.
The addresses 080H to 0FFH of BANK 0 are not assigned as the data memory, so access to these
addresses has no effect. Moreover, it is impossible to access BANK 1 to BANK 6.
12/41
¡ Semiconductor
MSM64164C
ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.)
(VDD = 0 V)
Parameter
Power Supply Voltage 1
Power Supply Voltage 2
Power Supply Voltage 3
Power Supply Voltage 4
Power Supply Voltage 5
Input Voltage 1
Symbol
VSS1
Condition
Ta = 25°C
Rating
Unit
V
–2.0 to +0.3
VSS2
Ta = 25°C
–4.0 to +0.3
V
VSS3
Ta = 25°C
–5.5 to +0.3
V
VSSL
Ta = 25°C
–2.0 to +0.3
V
VSS
Ta = 25°C
–5.5 to +0.3
V
VIN1
VSS1 Input, Ta = 25°C
VSS Input, Ta = 25°C
VSSL Input, Ta = 25°C
VSS1 Output, Ta = 25°C
VSS2 Output, Ta = 25°C
VSS3 Output, Ta = 25°C
VSS Output, Ta = 25°C
VSSL Output, Ta = 25°C
—
VSS1 – 0.3 to +0.3
VSS – 0.3 to +0.3
VSSL – 0.3 to +0.3
VSS1 – 0.3 to +0.3
VSS2 – 0.3 to +0.3
VSS3 – 0.3 to +0.3
VSS – 0.3 to +0.3
VSSL – 0.3 to +0.3
–55 to +150
V
Input Voltage 2
VIN2
V
Input Voltage 3
VIN3
V
Output Voltage 1
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
TSTG
V
Output Voltage 2
V
Output Voltage 3
V
Output Voltage 4
V
Output Voltage 5
V
Storage Temperature
°C
RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.)
(VDD = 0 V)
Parameter
Symbol
Top
Condition
Range
Unit
°C
V
Operating Temperature
—
—
—
–40 to +85
VSS1
–1.7 to –1.25
–5.25 to VSS1
Operating Voltage
VSS
V
External 400 kHz RC Oscillator
Resistance
ROS
fXT
—
—
250 to 500
30 to 35
kW
Crystal Oscillation Frequency
kHz
13/41
¡ Semiconductor
MSM64164C
ELECTRICAL CHARACTERISTICS (1.5 V Spec.)
DC Characteristics
(VDD = 0 V, VSS1 = VSS = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
+100%
–50%
VSS2 Voltage
VSS2 Ca, Cb, C12 = 0.1 mF
VSS3 Ca, Cb, C12 = 0.1 mF
–3.2
–3.0
–2.8
V
+100%
–50%
VSS3 Voltage
–4.7
–1.5
—
–4.5
–1.3
—
–4.3
–0.6
V
V
V
VSSL Voltage
VSSL
VSTA
—
Oscillation start time:
within 5 seconds
Crystal Oscillation
Start Voltage
–1.45
Crystal Oscillation
Hold Voltage
VHOLD
TSTOP
CG
—
—
—
—
0.1
10
—
—
15
—
15
12
220
—
—
–1.25
1000
20
V
ms
pF
pF
pF
pF
kHz
V
Crystal Oscillation
Stop Detection Time
Internal Crystal
Oscillator Capacitance
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
Internal 400k RC
Oscillator Capacitance
400k RC Oscillation
Frequency
1
CGEX When external CG used
10
30
CD
—
—
10
20
COS
8
16
External resistor ROS = 300 kW
VSS1 = –1.25 to –1.7 V
When VSS1 is between VPOR1
and –1.5 V
fOSC
80
350
0
POR Generation
Voltage
VPOR1
VPOR2
–0.4
–1.5
POR Non-generation
Voltage
No POR when VSS1 is between
VPOR2 and –1.5 V
–1.2
V
Notes: 1. "POR" denotes Power On Reset.
2. "T " indicates that if the crystal oscillator stops over the value of T
, the
STOP
STOP
system reset occurs.
14/41
¡ Semiconductor
MSM64164C
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSS = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
CPU in halt state
(400k RC oscillation halt)
Ta = –40 to +40°C
Ta = +40 to +85°C
—
—
—
—
2
2
5
5
5
mA
mA
mA
mA
Supply Current 1
Supply Current 2
IDD1
IDD2
30
15
40
CPU in operating state Ta = –40 to +40°C
(400k RC oscillation halt)
Ta = +40 to +85°C
CPU in operating state
(400k RC oscillation in operation)
Supply Current 3
Supply Current 4
IDD3
—
40
80
mA
R
OS = 300 kW
Serial transfer,
SCK = 300 kHz,
Ta = –40 to +40°C
Ta = +40 to +85°C
—
—
7
7
25
50
mA
mA
1
f
IDD4
CPU in operating state
(400k RC oscillaiton halt)
CPU in halt state
RT0 = 10 kW
RT0 = 2 kW
—
—
150
600
230
900
mA
mA
(400k RC oscillation
halt), RC oscillator for
A/D converter is in
operating state
Supply Current 5
IDD5
15/41
¡ Semiconductor
MSM64164C
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = VSS = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
IOH1
IOL1
VOH1 = –0.5 V
VOL1 = VSS + 0.5 V
–2.1
1.0
–0.7
3.0
–0.2
9.0
mA
mA
mA
mA
mA
mA
mA
mA
Output Current 1
(P1.0)
IOH1S VSS = –5 V, VOH1S = –0.5 V
IOL1S VSS = –5 V, VOL1 = VSS + 0.5 V
–36
4.0
–12
12
–4.0
36
Output Current 2
(P1.1 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
IOH2
IOL2
VOH2 = –0.5 V
–2.1
0.2
–0.7
0.7
–0.2
2.1
VOL2 = VSS + 0.5 V
IOH2S VSS = –5 V, VOH2S = –0.5 V
IOL2S VSS = –5 V, VOL2 = VSS + 0.5 V
–9.0
1.0
–3.0
3.0
–1.0
9.0
IOH3
IOL3
IOH4
VOH3 = –0.7 V
–1.8
0.2
–0.6
0.6
–0.2
1.8
mA
mA
mA
Output Current 3
(BD)
VOL3 = VSS1 + 0.7 V
VOH4 = –0.1 V
Output Current 4
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
–1.1
–0.6
–0.3
IOL4
IOH5
IOL5
VOL4 = VSS1 + 0.1 V
VOH5 = –0.5 V
0.3
–1.5
0.1
0.6
–0.5
0.5
1.1
–0.1
1.5
mA
mA
mA
mA
mA
Output Current 5
(When L26 to L33 are
VOL5 = VSS + 0.5 V
configured as output IOH5S VSS = –5 V, VOH5S = –0.5 V
ports)
–2.0
–0.7
0.7
–0.2
2.0
2
IOL5S VSS = –5 V, VOL5S = VSS + 0.5 V 0.2
Output Current 6
(OSC2)
IOH6
IOL6
IOH7
VOH6 = –0.5 V
–2.1
0.2
—
–0.7
0.7
—
–0.2
2.1
mA
mA
mA
mA
mA
mA
mA
mA
VOL6 = VSS1 + 0.5 V
VOH7 = –0.2 V
(VDD level)
–4.0
—
IOMH7 VOMH7 = VSS1 + 0.2 V (VSS1 level) 4.0
IOMH7S VOMH7S = VSS1 – 0.2 V (VSS1 level)
IOML7 VOML7 = VSS2 + 0.2 V (VSS2 level) 4.0
IOML7S VOML7S = VSS2 – 0.2 V (VSS2 level)
—
Output Current 7
(L0 to L33)
—
—
–4.0
—
—
—
—
–4.0
—
IOL7
VOL7 = VSS3 + 0.2 V (VSS3 level) 4.0
—
Output Leakage Current
(P1.0 to P1.3)
IOOH
VOH = VDD
—
—
—
0.3
—
mA
mA
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
IOOL
VOL = VSS1
–0.3
16/41
¡ Semiconductor
MSM64164C
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = VSS = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
IIH1
VIH1 = VDD (when pulled down) 5.0
VIL1 = VSS (when pulled up) –60
18
60
mA
IIL1
–18
250
–5.0
660
mA
mA
Input Current 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
IIH1S
VIH1 = VDD, VSS = –5 V (when pulled down) 70
VIL1 = VSS = –5 V (when pulled up) –660
IIL1S
IIH1Z
IIL1Z
IIH2
–250
—
–70
1.0
0
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
V
VIH1 = VDD (in a high impedance state)
0
VIL1 = VSS (in a high impedance state) –1.0
VIH2 = VDD (when pulled down) 5.0
—
18
60
1.0
0
3
Input Current 2
(IN0, IN1)
IIH2Z
IIL2Z
IIL3
VIH2 = VDD (in a high impedance state)
0
—
VIL2 = VSS1 (in a high impedance state) –1.0
—
VIL3 = VSS1 (when pulled up)
–60
0
–22
—
–6.0
1.0
0
Input Current 3
(OSC1)
IIH3Z
IIL3Z
IIH4
VIH3 = VDD (in a high impedance state)
VIL3 = VSS1 (in a high impedance state) –1.0
—
VIH4 = VDD
VIL4 = VSS1
0
—
1.0
Input Current 4
(RESET, TST1, TST2)
IIL4
–1.5
–0.3
–1.5
–1.0
–5.0
–0.3
–1.5
–0.3
–1.5
–0.75 –0.3
VIH1
VIL1
VIH1S
VIL1S
VIH2
VIL2
VIH3
VIL3
—
—
—
—
—
—
—
—
—
—
0
–1.2
0
Input Voltage 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
V
VSS = –5 V
V
V
SS = –5 V
–4.0
0
V
4
—
—
—
—
V
Input Voltage 2
(IN0, IN1, OSC1)
–1.2
0
V
V
Input Voltage 3
(RESET, TST1, TST2)
–1.2
V
17/41
¡ Semiconductor
MSM64164C
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = VSS = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
Hysteresis Width
DVT1
DVT1S VSS = –5 V
—
0.05
0.25
0.1
1.0
0.3
1.5
V
V
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
4
1
Hysteresis Width
(RESET, TST1, TST2)
DVT2
—
—
0.05
—
0.1
—
0.3
5.0
V
Input Pin Capacitance
(P0.0 to P0.3)
(P2.0 to P2.3)
CIN
pF
(P3.0 to P3.3)
(P4.0 to P4.3)
18/41
¡ Semiconductor
MSM64164C
Measuring circuit 1
CS0
RT0
RI0
RT0
CS0
IN0
XT
OSC1
Crystal
32.768 kHz
ROS
XT
C1
C2
OSC2
VSSL
C12
VDD
VSS1
VSS2
VSS3
VSS
Ca, Cb, C12, Cl : 0.1 mF
A
ROS
RT0
CS0
RI0
: 300 kW
: 10 kW/2 kW
: 820 pF
Ca
Cb
Cl
V
V
V
: 10 kW
Measuring circuit 2
(*2)
VIH
A
(*1)
VIL
VDD
VSS1 VSS2 VSS3
VSSL
VSS
19/41
¡ Semiconductor
MSM64164C
Measuring circuit 3
(*3)
A
VDD
VSS1 VSS2 VSS3
VSSL
VSS
Measuring circuit 4
VIH
Waveform
Monitoring
(*3)
VIL
VDD
VSS1 VSS2 VSS3
VSSL
VSS
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
20/41
¡ Semiconductor
MSM64164C
A/D Converter Characteristics
(VDD = 0 V, VSS1 = VSS = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Measur-
ing
Circuit
Min. Typ. Max.
Parameter
Symbol
Condition
Unit
RS0, RS1,
RT0,
RT0-1,
RT1
Resistor
for Oscillation
—
—
2.0
1.0
kW
CS0, CT0, CS1 ≥ 740 pF
Input Current
Limiting Resistor
—
RI0, RI1
10
kW
—
5
fOSC1
fOSC2
fOSC3
Kf1
Resistor for oscillation = 2 kW
Resistor for oscillation = 10 kW
Resistor for oscillation = 200 kW
RT0, RT0-1, RT1 = 2 kW
165
41.8
2.55
3.89
0.990
221
52.2
3.04
4.18
1.0
256
60.6
3.53
4.35
1.010
kHz
kHz
kHz
—
Oscillation
Frequency
RS•RT Oscillation
Frequency Ratio
(*)
Kf2
RT0, RT0-1, RT1 = 10 kW
—
Kf3
RT0, RT0-1, RT1 = 200 kW
0.0561 0.0584 0.0637
—
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency
by a reference resistor in the same condition.
fOSCX (RT0–CS0 Oscillation)
fOSCX (RT0-1–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation)
Kfx =
,
,
fOSCX (RS1–CS1 Oscillation)
fOSCX (RS0–CS0 Oscillation)
fOSCX (RS0–CS0 Oscillation)
(x = 1, 2, 3)
21/41
¡ Semiconductor
MSM64164C
Measuring circuit 5
(CROSC1)
(CROSC0)
RT1 RS1 CS1 IN1
IN0 CS0 RS0 CRT0 RT0
RESET
TST1
TST2
P0.0
P0.1
P4.3
Frequency
Measurement
(fOSCX
)
D. U. T.
P0.2
P0.3
VDD
VSSL
VSS
VSS1
Cl
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW
RS0, RS1 = 10 kW
RI0, RI1 = 10 kW
CS0, CT0, CS1 = 820 pF
Cl = 0.1 mF
22/41
¡ Semiconductor
MSM64164C
AC Characteristics (Serial Interface)
(VDD = 0 V, VSS1 = –1.5 V, VSS = –5 V, Ta = –40 to +85°C)
Parameter
Symbol
tf
Condition
Min. Typ. Max. Unit
SCLK Input Fall Time
—
—
—
—
—
—
—
—
—
—
—
1.0
1.0
—
—
—
ms
ms
ms
ms
ms
SCLK Input Rise Time
tr
SCLK Input "L" Level Pulse Width
SCLK Input "H" Level Pulse Width
SCLK Input Cycle Time
0.8
0.8
2.0
—
tCWL
tCWH
tCYC
VSS = –5.25 V to VSS1
tCYC1(O)
SCLK Output Cycle Time
SCLK Output Cycle Time
CPU is operating at 32.768 kHz.
—
—
0.4
—
—
ms
ms
ms
ms
ms
30.5
2.5
—
tCYC2(O) CPU is operating at 400 kHz.
—
tDDR
tDS
SOUT Output Delay Time
SIN Input Setup Time
SIN Input Hold TIme
Cl = 10 pF
—
0.5
0.8
—
—
—
—
tDH
tCYC
SCLK
(P4.2)
0 V
tr
tf
tCWH
tCWL
tDDR
tDDR
SOUT
(P4.0)
0 V
0 V
tDS
tDS
tDH
SIN
(P3.3)
("H" level = –1 V, "L" level = –4 V)
23/41
¡ Semiconductor
MSM64164C
ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.)
(VDD = 0 V)
Parameter
Power Supply Voltage 1
Power Supply Voltage 2
Power Supply Voltage 3
Power Supply Voltage 4
Power Supply Voltage 5
Input Voltage 1
Symbol
VSS1
Condition
Ta = 25°C
Rating
Unit
V
–2.0 to +0.3
VSS2
Ta = 25°C
–4.0 to +0.3
V
VSS3
Ta = 25°C
–5.5 to +0.3
V
VSSL
Ta = 25°C
–4.0 to +0.3
V
VSS
Ta = 25°C
–5.5 to +0.3
V
VIN1
VSS2 Input, Ta = 25°C
VSS Input, Ta = 25°C
VSSL Input, Ta = 25°C
VSS2 Output, Ta = 25°C
VSS3 Output, Ta = 25°C
VSS Output, Ta = 25°C
VSSL Output, Ta = 25°C
—
VSS2 – 0.3 to +0.3
VSS – 0.3 to +0.3
VSSL – 0.3 to +0.3
VSS2 – 0.3 to +0.3
VSS3 – 0.3 to +0.3
VSS – 0.3 to +0.3
VSSL – 0.3 to +0.3
–55 to +150
V
Input Voltage 2
VIN2
V
Input Voltage 3
VIN3
V
Output Voltage 1
VOUT1
VOUT2
VOUT3
VOUT4
TSTG
V
Output Voltage 2
V
Output Voltage 3
V
Output Voltage 4
V
Storage Temperature
°C
RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.)
(VDD = 0 V)
Unit
Parameter
Symbol
Condition
—
Range
Operating Temperature
Top
–40 to +85
°C
Using LCD driver with
"duty 1/2"
–3.5 to –2.2
VSS2
Except using LCD driver
with "duty 1/2"
Operating Voltage
–3.5 to –2.0
–5.25 to
V
VSS
ROS
fXT
—
(0.8•VSS2, –2.0 max.)*
External 400 kHz RC Oscillator
Resistance
—
—
90 to 500
30 to 66
kW
Crystal Oscillation Frequency
kHz
*
Indicates that the value of V is 80% of V
and should not exceed –2.0 V.
SS2
SS
24/41
¡ Semiconductor
MSM64164C
ELECTRICAL CHARACTERISTICS (3.0 V Spec.)
DC Characteristics
(VDD = 0 V, VSS2 = VSS = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
+100%
–50%
VSS1 Voltage
VSS1 Ca, Cb, C12 = 0.1 mF
VSS3 Ca, Cb, C12 = 0.1 mF
–1.7
–1.5
–1.3
V
+100%
–50%
VSS3 Voltage
–4.7
–1.9
—
–4.5
–1.3
—
–4.3
–0.6
–2.0
V
V
V
VSSL Voltage
VSSL
VSTA
—
Oscillation start time:
within 5 seconds
Crystal Oscillation
Start Voltage
Crystal Oscillation
Hold Voltage
VHOLD
TSTOP
CG
—
—
—
—
0.1
10
—
—
15
—
15
12
400
—
—
–2.0
1000
20
V
ms
pF
pF
pF
pF
kHz
V
Crystal Oscillation
Stop Detection Time
Internal Crystal
Oscillator Capacitance
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
Internal 400k RC
Oscillator Capacitance
400k RC Oscillation
Frequency
1
CGEX When external CG used
10
30
CD
—
—
10
20
COS
8.0
300
–0.7
–3.0
16
External resistor ROS = 100 kW
VSS2 = –2.0 to –3.5 V
When VSS2 is between VPOR1
and –3.0 V
fOSC
620
0
POR Generation
Voltage
VPOR1
VPOR2
POR Non-generation
Voltage
No POR when VSS2 is between
VPOR2 and –3.0 V
–2.0
V
Notes: 1. "POR" denotes Power On Reset.
2. "T " indicates that if the crystal oscillator stops over the value of T
, the
STOP
STOP
system reset occurs.
25/41
¡ Semiconductor
MSM64164C
DC Characteristics (continued)
(VDD = 0 V, VSS2 = VSS = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
CPU in halt state
(400k RC oscillation halt)
Ta = –40 to +40°C
Ta = +40 to +85°C
—
—
—
—
1.5
1.5
5.0
5.0
4.5
30
15
40
mA
mA
mA
mA
Supply Current 1
Supply Current 2
Supply Current 3
IDD1
IDD2
IDD3
CPU in operating state Ta = –40 to +40°C
(400k RC oscillation halt)
Ta = +40 to +85°C
CPU in operating state
—
—
—
220
7.0
7.0
450
25
mA
mA
mA
(400k RC oscillation in operation)
Serial transfer,
Ta = –40 to +40°C
fSCK = 300 kHz,
1
Supply Current 4
Supply Current 5
IDD4
CPU in operating state
Ta = +40 to +85°C
50
(400k RC oscillation halt)
CPU in halt state
RT0 = 10 kW
—
—
300
450
mA
mA
(400k RC oscillation
halt), RC oscillator for
IDD5
A/D converter is in
RT0 = 2 kW
1300 2000
operating state
26/41
¡ Semiconductor
MSM64164C
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = VSS = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
IOH1
IOL1
VOH1 = –0.5 V
VOL1 = VSS + 0.5 V
–6
–2
–0.7
mA
3.0
–36
4.0
8.0
–12
12
25
–4
36
mA
mA
mA
Output Current 1
(P1.0)
IOH1S VSS = –5 V, VOH1S = –0.5 V
IOL1S VSS = –5 V, VOL1 = VSS + 0.5 V
IOH2
IOL2
V
OH2 = –0.5 V
–6.0
0.7
–2.0
2.0
–0.7
6.0
mA
mA
mA
mA
Output Current 2
(P1.1 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
VOL2 = VSS + 0.5 V
IOH2S VSS = –5 V, VOH2S = –0.5 V
IOL2S VSS = –5 V, VOL2 = VSS + 0.5 V
–9.0
1.0
–3.0
3.0
–1.0
9.0
IOH3
IOL3
IOH4
VOH3 = –0.7 V
–6.0
0.7
–2.0
2.0
–0.7
6.0
mA
mA
mA
mA
Output Current 3
(BD)
VOL3 = VSS2 + 0.7 V
VOH4 = –0.1 V
Output Current 4
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
–2.5
–1.3
1.3
–0.7
2.5
IOL4
IOH5
IOL5
VOL4 = VSS2 + 0.1 V
VOH5 = –0.5 V
0.7
–1.5
0.15
–2.0
–0.6 –0.15 mA
Output Current 5
(When L26 to L33 are
configured as output
ports)
VOL5 = VSS + 0.5 V
0.6
–0.7
0.7
1.5
–0.2
2.0
mA
mA
mA
2
IOH5S VSS = –5 V, VOH5S = –0.5 V
IOL5S VSS = –5 V, VOL5S = VSS + 0.5 V 0.2
IOH6
IOL6
IOH7
VOH6 = –0.5 V
–6.0
0.7
—
–2.0
2.0
—
–0.7
6.0
mA
mA
mA
mA
mA
mA
mA
mA
Output Current 6
(OSC2)
VOL6 = VSS2 + 0.5 V
VOH7 = –0.2 V
(VDD level)
–4.0
—
IOMH7 VOMH7 = VSS1 + 0.2 V (VSS1 level) 4.0
IOMH7S VOMH7S = VSS1 – 0.2 V (VSS1 level)
IOML7 VOML7 = VSS2 + 0.2 V (VSS2 level) 4.0
IOML7S VOML7S = VSS2 – 0.2 V (VSS2 level)
—
—
—
–4.0
—
Output Current 7
(L0 to L33)
—
—
—
–4.0
—
IOL7
VOL7 = VSS3 + 0.2 V (VSS3 level) 4.0
—
Output Leakage Current
(P1.0 to P1.3)
IOOH
VOH = VDD
—
—
—
0.3
—
mA
mA
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
IOOL
VOL = VSS2
–0.3
27/41
¡ Semiconductor
MSM64164C
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = VSS = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
IIH1
VIH1 = VDD (when pulled down)
VIL1 = VSS (when pulled up)
30
90
300
mA
IIL1
–300
–90
250
–30
800
mA
mA
Input Current 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
IIH1S
VIH1 = VDD, VSS = –5 V (when pulled down) 80
VIL1 = VSS = –5 V (when pulled up) –800
IIL1S
IIH1Z
IIL1Z
IIH2
–250
—
–80
1.0
0
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
VIH1 = VDD (in a high impedance state)
0
VIL1 = VSS (in a high impedance state) –1.0
—
VIH2 = VDD (when pulled down)
VIH2 = VDD (in a high impedance state)
30
0
90
300
1.0
0
3
Input Current 2
(IN0, IN1)
IIH2Z
IIL2Z
IIL3
—
VIL2 = VSS2 (in a high impedance state) –1.0
—
VIL3 = VSS2 (when pulled up)
–300
0
–110
—
–10
1.0
0
Input Current 3
(OSC1)
IIH3Z
IIL3Z
IIH4
VIH3 = VDD (in a high impedance state)
VIL3 = VSS2 (in a high impedance state) –1.0
—
VIH4 = VDD
VIL4 = VSS2
0
—
1.0
Input Current 4
(RESET, TST1, TST2)
IIL4
–3.0
–0.6
–3.0
–1.0
–5.0
–0.6
–3.0
–0.6
–3.0
–1.5 –0.75 mA
VIH1
VIL1
VIH1S
—
—
—
—
—
—
—
—
—
—
0
–2.4
0
V
V
V
V
V
V
V
V
Input Voltage 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
VSS = –5 V
VIL1S VSS = –5 V
–4.0
0
4
VIH2
VIL2
VIH3
VIL3
—
—
—
—
Input Voltage 2
(IN0, IN1, OSC1)
–2.4
0
Input Voltage 3
(RESET, TST1, TST2)
–2.4
28/41
¡ Semiconductor
MSM64164C
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = VSS = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
Hysteresis Width
DVT1
DVT1S VSS = –5 V
—
0.2
0.5
1.0
1.0
1.5
V
V
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
0.25
4
1
Hysteresis Width
(RESET, TST1, TST2)
DVT2
—
—
0.2
—
0.5
—
1.0
5.0
V
Input Pin Capacitance
(P0.0 to P0.3)
(P2.0 to P2.3)
CIN
pF
(P3.0 to P3.3)
(P4.0 to P4.3)
29/41
¡ Semiconductor
MSM64164C
Measuring circuit 1
CS0
RT0
RI0
RT0
CS0
IN0
XT
Crystal
OSC1
32.768 kHz
ROS
XT
C1
C2
OSC2
VSSL
C12
VDD
VSS2
VSS1
VSS3
VSS
Cl
: 0.47 mF
: 0.1 mF
A
Ca, Cb, C12
Ca
Cb
Cl
ROS
RT0
CS0
RI0
: 100 kW
: 10 kW/2 kW
: 820 pF
V
V
V
: 10 kW
Measuring circuit 2
(*2)
VIH
A
(*1)
VIL
VDD
VSS1 VSS2 VSS3
VSSL
VSS
30/41
¡ Semiconductor
MSM64164C
Measuring circuit 3
(*3)
A
VDD
VSS1 VSS2 VSS3
VSSL
VSS
Measuring circuit 4
VIH
Waveform
Monitoring
(*3)
VIL
VDD
VSS1 VSS2 VSS3
VSSL
VSS
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
31/41
¡ Semiconductor
MSM64164C
A/D Converter Characteristics
(VDD = 0 V, VSS2 = VSS = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Measur-
Parameter
Symbol
Condition
Min. Typ. Max. Unit
ing
Circuit
RS0, RS1,
RT0,
RT0-1,
RT1
Resistor
for Oscillation
—
—
1.0
kW
kW
CS0, CT0, CS1 ≥ 740 pF
Input Current
Limiting Resistor
—
RI0, RI1
1.0
10
—
5
fOSC1
fOSC2
fOSC3
Kf1
Resistor for oscillation = 2 kW
Resistor for oscillation = 10 kW
Resistor for oscillation = 200 kW
RT0, RT0-1, RT1 = 2 kW
200
46.5
2.79
239
55.4
3.32
277
64.3
3.85
kHz
kHz
kHz
—
Oscillation
Frequency
4.115 4.22 4.326
0.990 1.0 1.010
0.0573 0.0616 0.0659
RS•RT Oscillation
Frequency Ratio
(*)
Kf2
RT0, RT0-1, RT1 = 10 kW
—
Kf3
RT0, RT0-1, RT1 = 200 kW
—
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency
by a reference resistor in the same condition.
f
OSCX (RT0–CS0 Oscillation)
fOSCX (RT0-1–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation)
Kfx =
,
,
fOSCX (RS1–CS1 Oscillation)
f
OSCX (RS0–CS0 Oscillation)
(x = 1, 2, 3)
fOSCX (RS0–CS0 Oscillation)
32/41
¡ Semiconductor
MSM64164C
Measuring circuit 5
(CROSC1)
(CROSC0)
RT1 RS1 CS1 IN1
IN0 CS0 RS0 CRT0 RT0
RESET
TST1
TST2
P0.0
P0.1
P4.3
Frequency
Measurement
(fOSCX
)
D. U. T.
P0.2
P0.3
VDD
VSSL
VSS
VSS2
Cl
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW
RS0, RS1 = 10 kW
RI0, RI1 = 10 kW
CS0, CT0, CS1 = 820 pF
Cl = 0.47 mF
33/41
¡ Semiconductor
MSM64164C
AC Characteristics (Serial Interface)
(VDD = 0 V, VSS2 = –3 V, VSS = –5 V, Ta = –40 to +85°C)
Parameter
Symbol
tf
Condition
Min. Typ. Max. Unit
SCLK Input Fall Time
—
—
—
—
—
—
—
—
1.0
1.0
—
—
—
ms
ms
ms
ms
ms
SCLK Input Rise Time
—
tr
SCLK Input "L" Level Pulse Width
SCLK Input "H" Level Pulse Width
SCLK Input Cycle Time
—
0.8
0.8
2.0
—
tCWL
tCWH
tCYC
—
—
tCYC1(O)
SCLK Output Cycle Time
SCLK Output Cycle Time
CPU is operating at 32.768 kHz.
—
—
0.4
—
—
ms
ms
ms
ms
ms
30.5
2.5
—
tCYC2(O) CPU is operating at 400 kHz.
—
tDDR
tDS
SOUT Output Delay Time
SIN Input Setup Time
SIN Input Hold TIme
Cl = 10 pF
—
0.5
0.8
—
—
—
—
tDH
tCYC
SCLK
(P4.2)
0 V
tr
tf
tCWH
tCWL
tDDR
tDDR
SOUT
(P4.0)
0 V
0 V
tDS
tDS
tDH
SIN
(P3.3)
("H" level = –1 V, "L" level = –4 V)
34/41
¡ Semiconductor
MSM64164C
FUNCTIONAL DESCRIPTION
• A/D converter (ADC)
TheMSM64164Chasabuilt-in2-channelRCoscillationtypeA/Dconverter. TheA/Dconverter
is composed of a 2-channel oscillation circuit, Counter A (CNTA0-4, a 4.8-digit decade counter),
Counter B (CNTB0-3, a 14-bit binary counter), and A/D Converter Control Registers 0 and 1
(ADCON0, ADCON1).
By counting oscillation frequencies that vary depending on a resistor or capacitor connected to
the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to
corresponding digital values. By using a thermistor or humidity sensor as a resistance, a
thermometer or a hygrometer can be constructed. By applying a separate sensor to each channel
of the 2-channel RC oscillation circuit, it is also possible to extend measure ranges or measure at
two places.
• Serial port (SIOP)
The MSM64164C has an 8-bit synchronous serial port. Receive/transmit operation of the serial
port is performed simultaneously and the serial transfer clock can select either internal or
external mode. Direction of transfer data can be big endian or little endian. Each pin of the serial
port is assigned as secondary functions of P3.3 and P4.0 to P4.2. Setting each bit of SIN, SOUT,
SPR and SCLK of P33CON and P40CON to P42CON to "1" makes each pin valid.
• LCD driver (LCD)
The MSM64164C has a built-in LCD driver for 34 outputs.
The LCD driver consists of 31 ¥ 4-bit display registers (DSPR0-30), the Display Control Register
(DSPCON), a 34-output LCD driver circuit, and a bias generation circuit (BIAS).
There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. Software selects the
duty mode.
A mask option can select either a common driver or a segment driver for each LCD driver pin.
A mask option can also specify assignment of each bit of the display register to each segment.
All the display registers must be selected by a mask option.
L26 to L33 of the LCD driver can be configured to be output ports by a mask option.
Therelationshipbetweentheduty,thebiasmethod,andthemaximumsegmentnumberfollows:
1/4 duty 1/3 bias method ------- 120 segments
1/3 duty 1/3 bias method ------- 93 segments
1/2 duty 1/2 bias method ------- 64 segments
• Buzzer driver (BD)
The MSM64164C has a built-in buzzer driver with 15 buzzer output frequencies and 4 buzzer
output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the
Buzzer Frequency Control Register (BFCON).
• Capture circuit (CAPR)
The MSM64164C captures 32 Hz to 256 Hz output of the time base counter at the falling of Port
0.0 or 0.1 (P0.0 or P0.1) to "L" level when the pull-up resistor input is chosen, or at the rising to
"H" level when the pull-down resistor input is chosen. The capture circuit is composed of the
Capture Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch
output from the time base counter.
35/41
¡ Semiconductor
MSM64164C
• Watchdog timer (WDT)
The MSM64164C has a built-in watchdog timer to detect CPU malfunction. The watchdog timer
is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog
timer control register (WDTCON) to reset WDTC.
• Clock generation circuit (2CLK)
The clock generation circuit (2CLK) in the MSM64164C contains a 32.768 kHz crystal oscillation
circuit, a400kHzRCoscillationcircuit, andaclockcontrolport. Thiscircuitgeneratesthesystem
clock (CLK) and the time base clock (32.768 kHz).
The system clock drives the CPU while the time base clock drives the time base counter and the
buzzer driver.
Via the contents of the frequency Control Register (FCON), the system clock can be switched
between 32.768 kHz (the output of the crystal oscillation circuit) and 400 kHz (the output of the
RC oscillation circuit).
Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of
an external resistor (R ), operating power supply voltage (V ), and ambient
OS
DD
temperatures (Ta).
• Time base counter (TBC)
The MSM64164C has a built-in time base counter (TBC) that generates clocks to be supplied to
internal peripheral circuits. The time base counter is composed of 15 binary counters and a 1/
10 frequency dividing circuit. The count clock of the time base is driven by the oscillation clock
(32.768 kHz) of the crystal oscillation circuit. The output of the time base counter is used for the
buzzer driver, the system reset circuit, the watchdog timer, the time base interrupt, the sampling
clocks of each port, and the capture circuit.
• I/O port
Input-output ports (P2, P3, P4) (12 bits): Pull-up (pull-down) resistor input or high-
impedance input, CMOS output or NMOS
open drain output: these can be specified for
each bit; external 0 interrupt
Input port (P0) (4 bits)
: Pull-up (pull-down) resistor input or high-
impedance input; external 1 interrupt
Output port (P1) (4 bits)
: CMOS output or NMOS open drain output
• Interrupt (INTC)
The MSM64164C has ten interrupt sources (10 vector addresses), of which two are external
interrupts from ports and eight are internal interrupts.
Of the ten interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable
interrupt). The other nine interrupts are controlled by the master interrupt enable flag (MI) and
the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the CPU
branches to a vector address corresponding to the interrupt source.
36/41
L C D
ROS
OSC2
OSC1
L33
L0
Crystal
32.768 kHz
VDD
C2
XT
XT
C2
MSM64164C-xxx
(3.0 V spec.)
C1
VSS3
VSS2
VSS
VSS1
VSSL
CS
CGEX
RESET
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
C12
3 V 5 V
Cb
Ca
Cl
• With 5 V interface
• Temperature
TST2
TST1
measurement
by two thermistors
• CGEX of crystal
oscillator : External
RT0
Switch matrix (4 ¥ 4)
RS0
RI0
RT1 RS1 CS1 RI1
CS0
Buzzer
OSC monitor
SCLK
To serial communication
SPR
SOUT
SIN
interface (to 5 V (VSS) system)
L C D
ROS
OSC2
OSC1
L33
L0
Crystal
32.768 kHz
VDD
C2
C1
XT
XT
C1
MSM64164C-xxx
(1.5 V spec.)
RESET
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
C12
1.5 V
VSS3
Cb
Ca
VSS2
VSS
VSS1
VSSL
TST2
TST1
Cl
• Without 5 V interface
• Temperature
measurement
Switch matrix (4 ¥ 4)
RT0
RS0
by two thermistors
• CG of crystal oscillator :
Internal
RI0
CS0
RT1 RS1 CS1 RI1
Buzzer
¡ Semiconductor
MSM64164C
PACKAGE DIMENSIONS
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Epoxy resin
42 alloy
Solder plating
5 mm or more
Solder plate thickness
Package weight (g)
1.27 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
39/41
¡ Semiconductor
MSM64164C
(Unit : mm)
QFP80-P-1414-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.85 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
40/41
¡ Semiconductor
MSM64164C
(Unit : mm)
TQFP80-P-1212-0.50-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.40 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
41/41
相关型号：
MSM64164C-XXXGS-K
Microcontroller, 4-Bit, MROM, 0.4MHz, CMOS, PQFP80, 14 X 14 MM, PLASTIC, QFP-80
OKI
MSM64164C-XXXTS-K
Microcontroller, 4-Bit, MROM, 0.4MHz, CMOS, PQFP80, 12 X 12 MM, PLASTIC, TQFP-80
OKI
MSM64167E-XXXGA
Microcontroller, 4-Bit, MROM, 0.7MHz, CMOS, PQFP80, 14 X 20 MM, 0.80 MM PITCH, PLASTIC, QFP-80
OKI
©2020 ICPDF网 联系我们和版权申明