MSM7620-001GS-K [OKI]

Echo Canceler; 回波消除器
MSM7620-001GS-K
型号: MSM7620-001GS-K
厂家: OKI ELECTRONIC COMPONETS    OKI ELECTRONIC COMPONETS
描述:

Echo Canceler
回波消除器

文件: 总28页 (文件大小:223K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
E2U0038-28-81  
This version: Aug. 1998  
Previous version: Nov. 1996  
¡ Semiconductor  
MSM7620  
Echo Canceler  
GENERAL DESCRIPTION  
The MSM7620 is an improved version of the MSM7520 with the same basic configuration. The  
MSM7620 includes following improvements: a modified through mode, timing control of the  
control pin input, and a thinner package. The MSM7620 also provides a pin-for-pin replacement  
with the MSM7520.  
The MSM7620 is a low-power CMOS IC device for canceling echo (in an acoustic system or  
telephone line) generated in a speech path.  
Echo is canceled (in digital signal processing) by estimating the echo path and generating a  
pseudo-echo signal.  
Used as an acoustic echo canceler, the MSM7620 cancels the acoustic echo between the loud  
speaker and the microphone which occurs during hands free communication, such as on a car  
phone or a conference system phone.  
Usedasalineechocanceler, thedevicecancelsthelineechoimpedancemismatchinginahybrid.  
In addition, a quality conversation is made possible by controlling the level and preventing  
howling with a howling detector, double talk detector, attenuation function and a gain control  
function, and by controlling the low level noise with a center clipping function.  
The MSM7620 I/O interface supports m-law PCM. The use of a single chip CODEC, such as the  
MSM7543, allows the configuration an economic and efficient echo canceler to be configured.  
Note: If the object is to cancel line echo, the use of the MSM7602 is recommended, for the  
MSM7602isprovidedwithahowlingdetectcontrolpin. Inaddition,theMSM7602,whilehaving  
characteristics equivalent to the MSM7620, is packaged small.  
FEATURES  
• Handles both acoustic echoes and telephone line echoes.  
• Cancelable echo delay time:  
MSM7620-001................. For a single chip: 23 ms (max.)  
MSM7620-011................. For a cascade connection (can also be used for a single chip)  
Master chip: 23 ms (max.)  
Slave chip: 31 ms (max.)  
Cancelable up to 213 ms (one master plus six slaves)  
For a single chip: 23 ms (max.)  
• Echo attenuation  
• Clock frequency  
: 30 dB (typ.)  
: 18 MHz (36 MHz cannot be used)  
External input and internal oscillator circuit are provided.  
• Power supply voltage : 5 V (4.5 V to 5.5 V)  
• Power consumption  
: 150 mW (typ.) When powered down: 20 mW (typ.)  
• Package options:  
32-pin plastic SSOP (SSOP32-P-640-0.80-K) (Product name : MSM7620-001GS-K)  
64-pin plastic QFP (QFP64-P-1414-0.80-BK) (Product name : MSM7620-011GS-BK)  
1/28  
¡ Semiconductor  
MSM7620  
BLOCK DIAGRAM  
MSM7620-001 (Single chip only)  
RIN  
ROUT  
Non-linear/  
Linear  
Linear/  
Non-linear  
S/P  
ATT  
Gain  
P/S  
Howling  
Detector  
Double Talk  
Detector  
Power  
Calculator  
Adaptive  
FIR Filter  
(AFF)  
+
SOUT  
SIN  
WDT  
VDD  
VSS  
Linear/  
Center  
Clip  
Non-linear/  
Linear  
P/S  
ATT  
S/P  
+
Non-linear  
RST  
PWDWN  
Clock Generator  
Mode Selector  
I/O Controller  
X1/CLKIN  
X2 SCKO SYNCO NLP HCL ADP ATT GC  
IRLD INT SCK SYNC  
MSM7620-011 (Cascade connection or Single chip)  
RIN  
ROUT  
Non-Linear  
/Linear  
Linear/  
Non-linear  
S/P  
ATT  
Gain  
P/S  
PD15 *  
Parallel  
I/O Port  
PD 0 *  
Howling  
Detector  
Double Talk  
Detector  
Power  
Adaptive  
FIR Filter  
(AFF)  
OF1 *  
OF2 *  
SF1 *  
SF2 *  
Calculator  
Parallel  
I/O  
Controller  
+
SOUT  
SIN  
Linear/  
Non-linear  
Center  
Clip  
Non-linear/  
Linear  
P/S  
ATT  
S/P  
+
WDT  
*RST  
VDD  
VSS  
*
*
*PWDWN  
Clock Generator  
Mode Selector  
I/O Controller  
X1/CLKIN  
*
X2 SCKO SYNCO NLP HCL ADP ATT GC MS IRLD INT SCK SYNC  
*
*
*
* If the MSM7620-011 is used in the slave mode, only the diagonally hatched blocks and  
the pins marked with * are used.  
2/28  
¡ Semiconductor  
MSM7620  
PIN CONFIGURATION (TOP VIEW)  
1
2
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
32-Pin Plastic SSOP  
Pin  
1
Symbol  
*
Pin  
9
Symbol  
SIN  
Pin  
17  
18  
19  
20  
21  
22  
23  
24  
Symbol  
Pin  
25  
26  
27  
28  
29  
30  
31  
32  
Symbol  
SCKO  
*
*
2
NLP  
HCL  
ADP  
VSS  
10  
11  
12  
13  
14  
15  
16  
RIN  
*
*
3
SCK  
RST  
WDT  
GC  
4
SYNC  
SOUT  
ROUT  
*
X1/CLKIN  
X2  
5
6
ATT  
*
*
7
INT  
PWDWN  
SYNCO  
*
8
IRLD  
VSS  
VDD  
*: No connect pin  
Note:  
Pin 26 of the MSM7520 is CKSEL, while that of the MSM7620 is in open state.  
It is possible to replace the MSM7520 with the MSM7620.  
3/28  
¡ Semiconductor  
MSM7620  
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32  
64-Pin Plastic SSOP  
Pin  
1
Symbol  
NLP  
HCL  
ADP  
MS  
Pin  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
Symbol  
*
Pin  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
Symbol  
PD12  
PD13  
X1/CLKIN  
X2  
Pin  
Symbol  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
*
*
2
*
3
PD0  
PD1  
PD2  
PD3  
PD4  
PD5  
PD6  
PD7  
PD8  
PD9  
PD10  
PD11  
*
PD14  
PD15  
*
4
5
ATT  
INT  
*
6
PWDWN  
*
SF2  
OF1  
*
7
*
8
IRLD  
*
SYNCO  
SCKO  
*
9
*
10  
11  
12  
13  
14  
15  
16  
SIN  
*
RIN  
*
SF1  
OF2  
*
SCK  
SYNC  
SOUT  
ROUT  
VSS  
RST  
WDT  
GC  
VDD  
*
VDD  
*
VDD  
*
*: No connect pin  
Note:  
Pins43,53,and61oftheMSM7520areCKSEL,V ,andTST2respectively.Whilethese  
pins of the MSM7620 are in open state, it is possible to replace the MSM7520 with the  
MSM7620.  
DD  
4/28  
¡ Semiconductor  
MSM7620  
PIN DESCRIPTIONS (1/5)  
Pin  
Symbol  
32-pin 64-pin  
SSOP QFP  
Type  
Description  
2
1
NLP  
I
The control pin for the center clipping function. This forces the SOUT  
output to a minimum value (FF) when the SOUT signal is below -54  
dBm0. Effective for reducing low-level noise.  
• Single Chip or Master Chip in a Cascade Connection  
"H": Center clip ON  
"L": Center clip OFF  
• Slave Chip in a Cascade Connection  
Fixed at "L"  
This input signal is loaded in synchronization with the falling edge of  
the INT signal or the rising edge of the RST signal.  
3
2
I
HCL  
The through mode control.  
When this pin is in the through mode, RIN and SIN data are output to  
ROUT and SOUT. At the same time, the coefficient of the adaptive FIR  
filter is cleared.  
• Single Chip or Master Chip in a Cascade Connection  
"H": Through mode  
"L": Normal mode (echo canceler operates)  
• Slave Chip in a Cascade Connection  
Same as master  
This input signal is loaded in synchronization with the falling edge of  
the INT signal or the rising edge of the RST signal.  
4
3
ADP  
I
AFF coefficient control pin. This pin stops updating of the adaptive FIR  
filter (AFF) coefficient and sets the coefficient to a fixed value, when this  
pin is configured to be the coefficient fix mode.  
This pin is used when holding the AFF coefficient which has been once  
converged.  
• Single Chip or Master Chip in a Cascade Connection  
"H": Coefficient fix mode  
"L": Normal mode (coefficient update)  
• Slave Chip in a Cascade Connection  
Fixed at "L"  
This input signal is loaded in synchronization with the falling edge of  
the INT signal or the rising edge of the RST signal.  
Selection of the Master Chip and slave chip when used in a cascade  
connection.  
4
I
MS  
"L": Single chip or master chip  
"H": Slave chip  
5/28  
¡ Semiconductor  
MSM7620  
(2/5)  
Pin  
32-pin 64-pin  
SSOP QFP  
Symbol  
Description  
Type  
6
5
I
Control for the ATT function that prevents howling by attenuators (ATT)  
for the RIN input and SOUT output.  
ATT  
If there is input only to RIN, then the ATT for the SOUT output is  
activated.  
If there is no input to SIN, or if there is input to both SIN and RIN, the  
ATT for the RIN input is activated.  
Either the ATT for the RIN output or the ATT for the SOUT is always  
activated in all cases, and the attenuation of ATT is 6 dB.  
• Single Chip or Master Chip in a Cascade Connection  
"H": ATT OFF  
"L": ATT ON  
"L" is recommended for echo cancellation.  
• Slave Chip in a Cascade Connection  
• Fixed at "L"  
This input signal is loaded in synchronization with the falling edge of the  
INT signal or the rising edge of the RST signal.  
7
6
INT  
I
Interrupt signal which starts 1 cycle (8 kHz) of the signal processing.  
Signal processing starts when H-to-L transition is detected.  
• Single Chip or Master Chip in a Cascade Connection  
Connect the IRLD pin.  
• Slave Chip in a Cascade Connection  
Connect the IRLD pin of the master chip.  
INT input is invalid for 100 ms after reset due to initialization. Refer to  
the control pin connection example.  
8
8
O
IRLD  
Load detection signal when the SIN and RIN serial input data is loaded  
in the internal registers.  
• Single Chip  
Connect to the INT pin.  
• Master Chip in a Cascade Connection  
Connect to the INT pin of the master chip and all the slave  
chips.  
• Slave Chip in a Cascade Connection  
Leave open.  
Refer to the control pin connection example.  
9
10  
I
Transmit serial data.  
SIN  
Input the m-law PCM signal synchronized to SYNC and SCK. Data is  
read in at the fall of SCK.  
6/28  
¡ Semiconductor  
MSM7620  
(3/5)  
Pin  
Type  
Symbol  
Description  
32-pin 64-pin  
SSOP QFP  
Receive serial data.  
10  
11  
RIN  
I
I
Input the m-law PCM signal synchronized to SYNC and SCK. Data is read in at the fall of SCK.  
12  
11  
SCK  
Clock pin for transmit/receive serial data. This pin uses the external  
SCK or the SCKO.  
Input the PCM CODEC transmit/receive clock (64 to 2048 kHz).  
Sync signal for transmit/receive serial data. This pin uses the external  
SYNC or SYNCO.  
12  
13  
14  
13  
14  
15  
19  
SYNC  
SOUT  
ROUT  
PD0  
I
O
Input the PCM CODEC transmit/receive sync signal (8 kHz).  
Transmit serial data.  
This pin outputs the m-law PCM signal synchronized to SYNC and SCK.  
This pin is in a high impedance state while there is no data output.  
Receive serial data.  
O
This pin outputs the m-law PCM signal synchronized to SYNC and SCK.  
This pin is in a high impedance state while there is no data output.  
Bidirectional bus for parallel data transfer between the Master Chip and  
Slave Chip when used in a cascade connection.  
The PD15 pin corresponds to MSB.  
I/O  
30  
33  
34  
51  
52  
35  
PD11  
PD12  
20  
This pin is in a high impedance state while there is no data output. Data  
is loaded in at the falling edge of SFx.  
PD13  
PD14  
PD15  
X1/CLKIN  
I
External input for the basic clock or for the crystal oscillator.  
Input the basic clock (18 MHz).  
Refer to the internal clock generator circuit example.  
Crystal oscilator.  
O
36  
38  
21  
23  
X2  
Used to configure the oscillation circuit.  
Refer to the internal clock generator circuit example.  
When inputting the basic clock externally, insert a 5 pF capacitor with  
excellent high frequency characteristics between X2 and GND.  
Power-down mode control.  
I
PWDWN  
"L": Power-down mode  
"H": Normal operation mode  
During power-down, all input pins are disabled and output pins are in  
the following sates :  
High impedance : SOUT, ROUT, PD0 to 15  
"L": SYNCO, SCKO  
"H": OF1, OF2  
Holds the last state : WDT, IRLD  
Not affected: X2, MCKO  
Reset after power-down is released.  
7/28  
¡ Semiconductor  
MSM7620  
(4/5)  
Pin  
Symbol  
Type  
Description  
32-pin 64-pin  
SSOP QFP  
40  
24  
SYNCO  
O
8 kHz sync signal for the PCM CODEC.  
Connect this pin to the SYNC pin andthePCMCODECtransmit/receive  
sync pin.  
Leave it open if using an external SYNC.  
Transmit clock signal (200 kHz) for the PCM CODEC.  
Connect this pin to the SCK pinandthe PCM CODECtransmit/receive  
clock pin.  
41  
SCKO  
O
25  
Not affected by reset. Outputs "0" during power-down.  
Leave it open if using an external SCK.  
Reset signal.  
27  
44  
I
RST  
"L": Reset mode  
"H": Normal operation mode  
During initialization, input signals, except for PWDWN are disabled for  
100 ms after reset (after RST is returned from "L" to "H").  
Input the basic clock during the reset.  
Output pins during reset are in the following sates :  
High impedance: SOUT, ROUT, PD0 to 15  
"L": WDT  
"H": OF1, OF2  
Not affected: X2, SYNCO, SCKO, IRLD, MCKO  
Test pin.  
28  
29  
WDT  
GC  
O
I
45  
46  
Leave this pin open.  
Input signal for the gain controller when RIN input is controlled and the  
RIN input level is controlled and howling is prevented.  
The gain controller adjusts the RIN input level when it is –20 dBm0 or  
above. RIN input levels from –20 to –11.5 dBm0 will be suppressed to  
–20 dBm0 in the attenuation range from 0 to 8.5 dB.  
RIN input levels above –11.5 dBm0 will always be attenuated by 8.5 dB.  
• Single Chip or Master Chip in a Cascade Connection  
"H": Gain control ON  
"L": Gain control OFF  
"H" is recommended for echo cancellation.  
• Slave Chip in a Cascade Connection  
Fixed at "L"  
This pin is loaded in synchronization with the falling edge of the INT  
signal or the rising edge of RST.  
8/28  
¡ Semiconductor  
MSM7620  
(5/5)  
Pin  
Symbol  
Type  
Description  
32-pin 64-pin  
SSOP QFP  
Parallel data transfer flag.  
• Single Chip  
54  
SF2  
I
Fixed at "H"  
• Master Chip in a Cascade Connection  
Fixed at "H"  
• Slave Chip in a Cascade Connection  
Connect OF2 of the master chip to the first stage slave chip.  
Connect OF1 of the previous stage slave chip to the second and  
later stage slave chips.  
Refer to the control pin connection example.  
55  
OF1  
O
Parallel data transfer flag.  
• Single Chip  
Leave this pin open.  
• Master Chip in a Cascade Connection  
Connect to the SF1 of all slaves.  
• Slave chip in a Cascade Connection  
Connect to the SF2 of the next stage slave chip.  
Connect the last stage slave chip to the SF1 of the master chip.  
Refer to the control pin connection example.  
Parallel data transfer flag.  
59  
I
SF1  
• Single Chip  
Connect OF2.  
• Master Chip in a Cascade Connection  
Connect OF1 of the last stage slave chip.  
• Slave Chip in a Cascade Connection  
Connect OF1 of master chip for all slave chips.  
Refer to the control pin connection example.  
O
Parallel data output flag.  
60  
OF2  
• Single Chip  
Connect to SF1.  
• Master Chip in a Cascade Connection  
Connect to SF2 of the first stage slave chip.  
• Slave Chip in a Cascade Connection  
Leave open.  
Refer to the control pin connection example.  
9/28  
¡ Semiconductor  
MSM7620  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Power Supply Voltage  
Input Voltage  
Symbol  
VDD  
Condition  
Ta = 25°C  
Rating  
–0.3 to +7  
–0.3 to VDD + 0.3  
1
Unit  
V
VIN  
V
Power Dissipation  
Storage Temperature  
PD  
W
TSTG  
–55 to +150  
°C  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Power Supply Voltage  
Power Supply Voltage  
Symbol  
VDD  
Condition  
Min.  
Typ.  
5
Max.  
Unit  
V
4.5  
5.5  
VSS  
0
V
Pins other than X1  
2.4  
3.5  
0
+25  
VDD  
VDD  
0.8  
+85  
V
Input High Voltage  
VIH  
X1 pin  
V
Input Low Voltage  
VIL  
Ta  
V
Operating Temperature  
–40  
°C  
ELECTRICAL CHARACTERISTICS  
DC Characteristics  
(Ta = –40°C to +85°C)  
Parameter  
Output High Voltage  
Symbol  
VOH  
Condition  
IOH = 40 mA  
IOL = 1.6 mA  
IH = VDD  
VIL  
SS to VDD  
Min.  
4.2  
0
Typ.  
Max.  
VDD  
0.4  
Unit  
V
Output Low Voltage  
VOL  
V
High Level Input Current  
IIH  
V
0.1  
10  
mA  
=
SF1, SF2  
–100  
–50  
–10  
mA  
V
with pull-up  
Input other than  
the above  
IIL  
Low Level Input Current  
High Level Output Current  
Low Level Output Current  
–10  
–0.1  
0.1  
10  
mA  
mA  
mA  
IOZH  
VOH = VDD  
VOL  
SS to VDD  
=
PD15 to PD0  
with pull-up  
Input other than  
the above  
–100  
–50  
+10  
V
IOZL  
–10  
–0.1  
30  
4
40  
5
mA  
mA  
mA  
mA  
Power Supply Current  
(Operating)  
IDDO  
When extarnal input is used  
Power Supply Current(Stand-by)  
as basic clock  
IDDS  
When oscillation circuit is  
PWDWN="L"  
6
8
used as basic clock  
Input Capacitance  
CI  
15  
20  
pF  
pF  
Output Load Capacitance  
CLOAD  
10/28  
¡ Semiconductor  
MSM7620  
Echo Canceler Characteristics (Refer to Characteristics Diagram)  
Parameter  
Symbol  
Condition  
RIN = –10 dBm0  
Min.  
Typ.  
Max.  
Unit  
(5 kHz band white noise)  
E. R. L. (echo return loss)  
= 6 dB  
Echo Attenuation  
LRES  
30  
dB  
TD = 20 ms  
ATT, GC, NLP: OFF  
Cancelable Echo Delay Time for a  
Single Chip or a Master Chip in a  
Cascade  
RIN = –10 dBm0  
TD  
23  
31  
ms  
ms  
(5 kHz band white noise)  
E.R.L. = 6 dB  
Cancelable Echo Delay Time for a  
Slave Chip in a Cascade  
ATT, GC, NLP: OFF  
TDS  
11/28  
¡ Semiconductor  
MSM7620  
AC Characteristics  
(Ta = –40°C to +85°C)  
Typ.  
18.0  
55.56  
50  
Parameter  
Condition  
Min.  
17.5  
54.1  
40  
Max.  
18.5  
57.1  
60  
Unit  
MHz  
ns  
Symbol  
fC  
Clock Frequency  
tMCK  
tDMC  
tMCH  
tMCL  
tr  
Clock Cycle Time  
%
Clock Duty Ratio  
ns  
Clock "H" Level Pulse Width  
Clock "L" Level Pulse Width  
Clock Rise Time  
23.5  
23.5  
ns  
ns  
5
ns  
Clock Fall Time  
tf  
5
tDCM  
fCO  
ns  
Sync Clock Output Time  
100  
Internal Sync Clock Frequency  
Internal Sync Clock Output Cycle Time  
Internal Sync Clock Duty Ratio  
Internal Sync Signal Output Delay Time  
Internal Sync Signal Period  
Internal Sync Signal Output Width  
Transmit/receive Operation Clock Frequency  
Transmit/receive Sync Clock Cycle Time  
Transmit/receive Sync Clock Duty Ratio  
Transmit/receive Sync Signal Period  
fc = 18 MHz  
200  
5
kHz  
ms  
%
tCO  
fc = 18 MHz  
tDCO  
tDCC  
tCYO  
tWSO  
fSCK  
tSCK  
tDSC  
tCYC  
tXS  
50  
fc = 18 MHz  
5
ns  
fc = 18 MHz  
125  
tCO  
ms  
ms  
kHz  
ms  
%
fc = 18 MHz  
fc = 18 MHz  
2048  
15.6  
60  
64  
0.488  
40  
50  
123  
45  
125  
ms  
ns  
Sync Timing  
tSX  
45  
ns  
tSCK  
tWSY  
tDS  
tCYC–tSCK  
ms  
ns  
Sync Signal Width  
Receive Signal Setup Time  
Receive Data Hold Time  
Receive Data Input Time  
IRLD Signal Output Delay Time  
IRLD Signal Output Width  
45  
45  
tDH  
ns  
7tSCK  
tID  
ms  
ns  
tDIC  
tWIR  
tSD  
138  
tSCK  
ms  
90  
Serial Output Delay Time  
ns  
tXD  
90  
12/28  
¡ Semiconductor  
MSM7620  
AC Characteristics (Continued)  
(Ta = –40°C to +85°C)  
Parameter  
Reset Signal Input Width  
Reset Start Time  
Symbol  
Condition  
Min.  
1
Typ.  
Max.  
Unit  
ms  
ns  
ns  
ms  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tWR  
tDRS  
tDRE  
tDIT  
5
Reset End Time  
100  
20  
120  
20  
10  
52  
Processing Operation Start Time  
Power Down Start Time  
Power Down End Time  
Control Pin Setup Time (INT)  
Control Pin Hold Time (INT)  
Control Pin Setup Time (RST)  
Control Pin Hold Time (RST)  
Parallel Data Output Signal Width  
Flag Signal Output Time  
Flag Signal Output Width  
Flag Signal Input Width  
Data Read Setup Time  
tDPS  
tDPE  
tDTS  
tDTH  
tDSR  
tDHR  
tWPD  
tDF  
111  
15  
2tMCK  
tMCK  
tMCK/2  
tWFO  
20  
tWFO  
tWFI  
tFS  
OFz connected to SFx  
Data Read Hold Time  
tFH  
10  
13/28  
¡ Semiconductor  
MSM7620  
TIMING DIAGRAM  
Clock Timing  
fc. tMCK  
tMCH  
tMCL  
tr  
tf  
tDMC  
X1/CLKIN  
tDCM  
SCKO  
SCKO  
fco. tCO  
tDCO  
tDCC  
tDCC  
tCYO  
SYNCO  
tWSO  
Serial Input Timing  
fsck. tSCK  
tDSC  
SCK  
tSX  
tXS  
tCYC  
SYNC  
tWSY  
tDH  
tDS  
SIN  
RIN  
MSB  
7
LSB  
0
MSB  
7
6
5
4
3
2
1
tID  
tDIC  
tDIC  
IRLD  
tWIR  
14/28  
¡ Semiconductor  
MSM7620  
Serial Output Timing  
fsck. tSCK  
tDSC  
SCK  
tSX  
tXS  
tCYC  
SYNC  
tWSY  
tXD  
tSD  
tXD  
tXD  
High-Z  
High-Z  
SOUT  
ROUT  
MSB  
7
LSB  
0
MSB  
7
6
5
4
3
2
1
Operation Timing After Reset  
tWR  
*Reset timing can be asynchronous  
RST  
tDIT  
tDRS  
tDRE  
Reset  
Initialization  
Processing Start  
Internal operation  
Note: INT is invalid in the diagonally shaded interval.  
Power Down Timing  
PWDWN  
*tDPS  
tDPE  
Power Down  
Processing Start  
Internal Operation  
*Input MCK in the tDPS interval.  
15/28  
¡ Semiconductor  
MSM7620  
Control Pin Load-in Timing  
*tCYC  
INT(IRLD)  
tDTH  
*Refer to the Serial Input Timing  
tDTS  
NLP, HCL,  
ATT, ADP, GC  
tWR  
RST  
tDHR  
tDSR  
NLP, HCL,  
ATT, ADP, GC  
Parallel Output Timing  
tWPD  
PD15  
High-Z  
High-Z  
Output Data  
PD 0  
tDF  
tWFO  
OF1  
OF2  
Parallel Input Timing  
tWFI  
SF1  
SF2  
tFS  
tFH  
PD15  
PD 0  
Input Data  
16/28  
¡ Semiconductor  
MSM7620  
HOW TO USE THE MSM7620  
The MSM7620 cancels the echo which returns to SIN using the RIN signal.  
Connect the base signal to the R-side and the echo generated signal to the S-side.  
Connection Methods According to Echos  
Example 1:  
Canceling acoustic echo (to handle acoustic echo from line input)  
CODEC  
MSM7620  
CODEC  
ROUT  
SIN  
RIN  
Line input  
AFF  
m-law  
m-law  
H
Acoustic echo  
SOUT  
+
+
Example 2:  
Canceling line echo (to handle line echo from microphone input)  
CODEC  
MSM7620  
CODEC  
RIN  
ROUT  
Microphone Input  
AFF  
m-law  
m-law  
H
+
SOUT  
SIN  
+
Line echo  
Example 3:  
Canceling line echo in a cascade connection  
(to handle line echo from microphone input)  
CODEC  
MSM7620  
Master  
CODEC  
RIN  
ROUT  
SIN  
Microphone input  
AFF  
m-law  
m-law  
H
H
SOUT  
+
+
Line echo  
PD0 - 15  
Slave  
AFF  
17/28  
¡ Semiconductor  
MSM7620  
Example 4: Canceling of both acoustic echo and line echo  
(to handle both acoustic echo from line input and line echo from microphone input)  
CODEC  
MSM7620  
AFF  
MSM7620  
CODEC  
Line input  
ROUT  
SIN  
RIN SOUT  
SOUT RIN  
SIN  
+
+
m-law  
m-law  
H
Acoustic echo  
AFF  
ROUT  
+
+
Line echo  
For acoustic echo  
For line echo  
Microphone input  
18/28  
¡ Semiconductor  
MSM7620  
Control Pin Connection Example  
Two-stage Cascade Connection  
Single Chip Connection  
Master + (slave ¥ 1)  
+5 V  
Master chip  
Slave chip  
MS * * PD15  
MS  
PD15  
PD 0  
MS  
PD15  
PD 0  
NLP  
HCL  
NLP  
NLP  
HCL  
NLP  
HCL  
ADP  
ATT  
NLP  
HCL  
ADP  
ATT  
HCL * PD 0  
ADP  
ADP  
ADP  
ATT  
ATT  
ATT  
GC  
GC  
GC  
GC  
GC  
PWDWN  
RST  
PWDWN  
RST  
INT  
SF1 * * OF1  
SF2 * * OF2  
PWDWN  
RST  
PWDWN  
RST  
INT  
SF1  
SF2  
PWDWN  
RST  
INT  
SF1  
SF2  
IRLD  
IRLD  
OF1  
OF2  
IRLD  
OF1  
OF2  
+5 V  
+5 V  
Asterisk * mark indicates a pin only for the MSM7620-011.  
Four-stage Cascade Connection  
Master + (slave ¥ 3)  
+5 V  
+5 V  
+5 V  
Master chip  
Slave chip 1  
Slave chip 2  
Slave chip 3  
MS  
PD15  
PD 0  
MS  
PD15  
PD 0  
MS  
PD15  
PD 0  
MS  
PD15  
PD 0  
NLP  
HCL  
NLP  
HCL  
ADP  
ATT  
GC  
NLP  
HCL  
ADP  
ATT  
NLP  
HCL  
ADP  
ATT  
NLP  
HCL  
ADP  
ATT  
ADP  
ATT  
GC  
GC  
GC  
GC  
PWDWN  
RST  
PWDWN  
RST  
INT  
SF1  
SF2  
PWDWN  
RST  
INT  
SF1  
SF2  
PWDWN  
RST  
INT  
SF1  
SF2  
PWDWN  
RST  
INT  
SF1  
SF2  
IRLD  
OF1  
OF2  
IRLD  
OF1  
OF2  
IRLD  
OF1  
OF2  
IRLD  
OF1  
OF2  
+5 V  
19/28  
¡ Semiconductor  
MSM7620  
Clock Circuit Example  
Internal clock generator circuit  
MSM7620  
X1/CLKIN  
X2  
XTAL : 18 MHz  
: 1 MW  
C1 : 27 pF  
C2 : 27 pF  
R
R
XTAL  
C1  
C2  
GND  
GND  
External clock input circuit  
MSM7602  
X1/CLKIN  
X2  
5pF  
18 MHz  
GND  
20/28  
¡ Semiconductor  
MSM7620  
ECHO CANCELER CHARACTERISTICS DIAGRAM  
ERL vs. echo attenuation  
RIN input level vs. echo attenuation  
40  
30  
20  
10  
0
40  
30  
20  
10  
0
40 30 20 10  
ERL. [dB]  
0
–10  
–50 –40 –30 –20 –10  
0
RIN input level [dBm]  
0 dBm = 2.2 dBm0  
Measurement Conditions  
RIN input = –10 dBm 5 kHz band white noise  
(0 dBm = 2.2 dBm0)  
Echo delay time TD = 20 ms  
ATT, GC, NLP = OFF  
Measurement Conditions  
RIN input: 5 kHz band white noise  
Echo delay time TD = 20 ms  
ERL = 6 dB  
ATT, GC, NLP = OFF  
Echo delay time vs. echo attenuation  
30  
20  
10  
0
1
2
3
4
5
6
7chip  
0
50  
100  
150  
200  
Echo delay time [ms]  
Measurement Conditions  
RIN input = –10 dBm  
5 kHz band white noise  
(0 dBm = 2.2 dBm0)  
ERL = 6 dB  
ATT, GC, NLP = OFF  
The second through seventh chips  
are connected in a cascade.  
21/28  
¡ Semiconductor  
MSM7620  
Measurement System Block Diagram  
White noise generator  
MSM7543  
PCM  
MSM7543  
TD  
RIN input  
A
RIN  
ROUT  
SIN  
PCM  
A
Delay  
L. P. F.  
5 kHz  
Echo delay time  
m-law  
CODEC  
m-law  
CODEC  
MSM7620  
Level meter  
A
PCM  
SOUT  
PCM  
A
ATT  
ERL  
(echo return loss)  
22/28  
MSM7543GS-VK  
MSM7543GS-VK  
For cancellation of acoustic echo  
For cancellation of line echo  
R6  
R12  
R4  
13  
R5  
R11  
9
R10  
13  
Mike input  
C1  
SIN  
Circuit input  
C5  
23  
6
9
13  
10  
2
13  
10  
2
23  
6
AIN+  
VFRO  
GSX  
PCMOUT  
PCMIN  
SIN  
SOUT  
RIN  
SOUT  
SIN  
ROUT  
SCK  
PCMOUT  
PCMIN  
AIN+  
VFRO  
GSX  
RIN  
12  
15  
14  
11  
14  
11  
12  
15  
ROUT  
Speaker output  
ROUT  
SCK  
RIN  
NLP  
HCL  
ADP  
ATT  
GC  
SOUT  
Circuit output  
21  
21  
BCLOCK  
NLP  
HCL  
ADP  
ATT  
GC  
BCLOCK  
R2  
R3  
R8  
R9  
11  
14  
12  
7
3
3
12  
7
11  
14  
RSYNC  
XSYNC  
SYNC  
INT  
SYNC  
INT  
RSYNC  
XSYNC  
22  
22  
R1  
R7  
AIN–  
SG  
AIN–  
SG  
4
4
8
8
IRLD  
IRLD  
6
6
1
3
5
1
10  
19  
23  
27  
28  
23  
27  
28  
10  
19  
PDN  
TMC  
PWDWN  
RST  
PWDWN  
RST  
PDN  
TMC  
3
5
24  
29  
29  
AOUT–  
PWI  
SGC  
AOUT–  
PWI  
SGC  
24  
WDT  
WDT  
C7  
C3  
R13  
C2  
24  
25  
24  
25  
R14  
8
8
SYNCO  
SCKO  
SYNCO  
SCKO  
VDD  
AG  
VDD  
AG  
32  
C4  
5
32  
C8  
5
+
C6  
+
VDD  
+
+
VDD  
C10  
C9  
9
9
16  
16  
DG  
DG  
20  
21  
20  
21  
X1  
X2  
VSS  
VSS  
VSS  
VSS  
X1  
X2  
16  
16  
32-Pin SSOP  
32-Pin SSOP  
R1 > 50 kW  
R2 > 20 kW  
R3 > 20 kW  
R4 = 2.2 kW  
R5 = 10 kW  
R6 = 10 kW  
R7 > 50 kW  
C1 = 0.1 mF  
C2 = 10 mF  
C3 = 0.1 mF  
C4 = 10 mF  
C5 = 0.1 mF  
R8 > 20 kW  
R9 > 20 kW  
CLK  
EXT.  
SCK  
R10 = 2.2 kW  
R11 = 10 kW  
R12 = 10 kW  
R13 = 0-22 W  
R14 = 0-22 W  
C6 = 10 mF  
C7 = 0.1 mF  
C8 = 10 mF  
C9 = 1.0 mF  
C10 = 1.0 mF  
EXT.  
SYNC  
RST  
PWDWN  
¡ Semiconductor  
MSM7620  
Cascade Connection Example  
MSM7620-011GS-BK  
MSM7620-011GS-BK  
24/28  
¡ Semiconductor  
MSM7620  
NOTES ON USE  
1. Set echo return loss (ERL) to be attenuated. If the echo return loss is set to be  
amplified, the echo can not be eliminated.  
Refer to the characteristics diagram for ERL vs. echo attenuation quantity.  
2. Set the level of the analog input so that the PCM CODEC does not overflow.  
3. The recommended input level is –10 to –20 dBm0. Refer to the characteristics  
diagram for the RIN input level vs. echo attenuation quantity.  
4. Applying the tone signal to this echo canceler will decrease echo attenuation. If the  
tone signal is input to the SIN pin during the time that a signal is input to the RIN  
pin, this echo cancceler operates faultily.  
A signal must be input to either the RIN pin or the SIN pin. The ADP or HCL pin  
must be driven at "H" if the tone signal is input to the SIN pin during the time that  
a signal is input to the RIN pin.  
5. Forchangesintheechopath(retransmit,circuitswitchingduringtransmission,and  
so on), convergence may be difficult.  
Perform a reset to make it converge.  
Ifthestateoftheechopathchangesafterareset, convergencemayagainbedifficult.  
In cases such as a change in the echo path, perform a reset when possible.  
6. When turning the power ON, set the PWDWN pin to "1" and input the basic clock  
simultaneouly with power ON.  
IfpoweringdownimmediatelyafterpowerON,besurefirstinput10ormoreclocks  
of the basic clock.  
7. After powering ON, be sure to reset.  
8. After the power down pin is changed to a "1" from a "0", be sure to reset.  
9. If this canceler is used to cancel acoustic echoes, an echo attenuation may be less  
than 30 dB.  
25/28  
¡ Semiconductor  
MSM7620  
EXPLANATION OF TERMS  
Attenuating Function :  
Echo Attenuation :  
Thisfunctionpreventshowlingandcontrolsthenoiselevelwithan  
attenuator for the RIN input and SOUT output. Refer to the  
explanation of pins (ATT pin).  
If there is talking (input only to RIN) in the path of a rising echo  
arises, the echo attenuation refers to the difference in the echo  
return loss (canceled amount) when the echo canceler is not used  
and when it is used.  
Echo attenuation = (SOUT level during through mode operation)  
– (SOUT level during echo canceler operation) [dB]  
This is the time from when the signal is output from ROUT until it  
returns to SIN as an echo or other similar device.  
When using a hands free phone, and so on, the signal output from  
the speaker echoes and is input again to the microphone. The  
return signal is referred to as acoustic echo.  
Echo Delay Time :  
Acoustic Echo :  
Telephone Line Echo :  
Gain Control Function :  
This is a signal which is delayed midway in a telephone line and  
returns as an echo, due to reasons such as a hybrid impedance  
mismatch.  
This function prevents howling and controls the sound level by  
with a gain controller for the RIN input. Refer to the explanation  
of pins (GC pin).  
Center Clipping Function : This function forces the SOUT output to a minimum value when  
thesignalisbelow57dBm0. Refertotheexplanationofpins(NLP  
pin).  
Double talk refers to a state in which the SIN and RIN signals are  
input simultaneously. In a double talk state, a signal outside the  
echo signal which is to be canceled can be input to the SIN input,  
resulting in misoperation.  
Double Talk Detection :  
Thedoubletalkdetectorpreventssuchmisoperationsofthecanceler.  
Thisistheoscillatingstatecausedbytheacousticcouplingbetween  
the loud speaker and the microphone during hands free talking.  
Howling not only interferes with talking, but can also cause  
misoperation of the echo canceler.  
Howling Detection :  
The howling detector prevents such misoperation and prevents  
howling.  
Echo Return Loss (ERL) :  
When the signal output from ROUT returns to SIN as an echo, ERL  
refers to how much loss there is in the signal level during ROUT.  
ERL = (ROUT level) – (SIN level of the ROUT signal which returns  
as an echo) [dB]  
IfERLispositive(ROUT>SIN),thesystemisanattenuatorsystem.  
If ERL is negative (ROUT < SIN), the system is an amplifier system.  
26/28  
¡ Semiconductor  
PACKAGE DIMENSIONS  
SSOP32-P-640-0.80-K  
MSM7620  
(Unit : mm)  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
0.83 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
27/28  
¡ Semiconductor  
MSM7620  
(Unit : mm)  
QFP64-P-1414-0.80-BK  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
0.87 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
28/28  

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