MSM98P05 [OKI]
Voice Synthesis IC with Built-in 2-Mbit OTP ROM; 语音合成芯片，内置的2 - Mbit的OTP ROM
| 型号： | MSM98P05 |
| 厂家： | 
OKI ELECTRONIC COMPONETS |
| 描述： | Voice Synthesis IC with Built-in 2-Mbit OTP ROM |
| 文件： | 总14页 (文件大小：151K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
E2D0019-39-92
Preliminary
This version: Sep. 1999
Previous version: May. 1997
¡ Semiconductor
MSM98P05
Voice Synthesis IC with Built-in 2-Mbit OTP ROM
GENERAL DESCRIPTION
The MSM98P05 is a PCM-based voice synthesis IC with built-in 2-Mbit OTP (One Time PROM).
This IC employs OKI nonlinear PCM algorithm and straight PCM algorithm for playback and
contains a current mode 10-bit D/A converter and a low-pass filter.
External control can be made easily by the built-in edit ROM that can form sentences by linking
phrases. With OKI Voice Analyzing/Editing Tool, the built-in edit ROM can be set up and also
the built-in ROM data can be created and evaluated easily.
With the stand-alone mode/microcontroller interface mode switching pin, the MSM98P05 can
support various applications.
The products with build-in OTP are suited to applications to be produced in small quantities in
awidevarietyorinshortdeliverytime. Demandlikethese, thatis, productioninsmallquantities
in a wide variety and delivery with an early deadline is what the MSM9800 family of products
with built-in mask ROM cannot meet.
FEATURES
• 8-bit OKI nonlinear PCM algorithm and 8-bit straight PCM algorithm
• Built-in edit ROM
• Random playback function
• Sampling frequency
: 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/
16.0 kHz
Note: IfRCoscillationisselected, 10.6kHz, 12.8kHz, and
16.0 kHz cannot be selected.
• Maximum number of phrases
: 63 (Microcontroller interface mode)
56 (Stand-alone mode)
• Built-in current mode 10-bit D/A converter
• Built-in low-pass filter (LPF)
• Standby function
• RC oscillation (256 kHz)/ceramic oscillation (4.096 MHz) selectable
• Package options:
20-pin plastic DIP (DIP20-P-300-2.54-W1) (Product name : MSM98P05RS)
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name : MSM98P05GS-K)
1/13
VPP
PGM
Program Circuit
A2
A1
2-Mbit OTP ROM
(Including 11 Kbits of
Edit ROM & Address ROM)
A0
Address &
Switching
Controller
18-Bit
Multiplexer
6
SW2
SW1
SW0
8
CPU/STD
Random
Circuit
DATA
Controller
RND
18-Bit
Address Counter
PCM
Synthesizer
I/O
Interface
BUSY
10
10-Bit
DAC
&
OSC1
OSC2
OSC
XT/RC
LPF
Timing Controller
OSC3/TEST
XT/CR
VDD
GND
RESET
AOUT
VREF
¡ Semiconductor
MSM98P05
PIN CONFIGURATION (TOP VIEW)
VPP
A0
1
2
3
4
5
6
7
8
9
20 PGM
19 SW2
A1
18 SW1
A2
17 SW0
RESET
XT/CR
BUSY
GND
VREF
16 RND
15 CPU/STD
14 OSC3/TEST
13 OSC2
12 OSC1
11 VDD
AOUT 10
20-Pin Plastic DIP
Note: Applies to MSM98P05RS
VDD
OSC1
1
2
3
4
5
6
7
8
9
24 AOUT
23 VREF
22 GND
21 NC
OSC2
NC
OSC3/TEST
NC
20 BUSY
19 NC
CPU/STD
RND
18 XT/CR
17 RESET
16 VPP
15 A2
PGM
SW0 10
SW1 11
SW2 12
14 A1
13 A0
NC: No connection
24-Pin Plastic SOP
Note: Applies to MSM98P05GS-K
3/13
¡ Semiconductor
MSM98P05
PIN DESCRIPTIONS
Pin
Symbol Type
Description
DIP SOP
The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0mA and becomes GND level,
then the IC returns to the initial state. Apply a "L" pulse during power-on.
This pin has an internal pull-up resistor.
5
17
RESET
I
Outputs "L" level while voice is being played back.
In "H" level when power is turned ON.
7
6
20
18
7
BUSY
XT/CR
O
I
XT/RC switching pin. Set to "H" level if ceramic oscillation is used. Set to "L"
level if RC oscillation is used.
Microcontroller interface/stand-alone mode switching pin. Set to "L" level if
the IC is used in stand-alone mode.
15
CPU/STD
I
Volume setting pin. If this pin is set to GND level, the maximum amplitude is
delivered. If this pin is set to VDD level, the minimum amplitude is delivered.
This pin is internally connected to a pull-down resistor of approx. 10 kW
during IC operation.
9
23
VREF
I
Voice output pin.
The voice signals are output as current changes. A logic "L" is output from
this pin in standby state.
10
24
AOUT
O
8
22
1
GND
VDD
—
—
Ground pin.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between VDD
and GND pins.
11
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
12
13
14
16
2
3
5
8
OSC1
OSC2
I
O
O
I
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Leave this pin open if external clock is used.
Outputs "L" level in standby state.
Leave this pin open when ceramic oscillation is used.
RC connection pin when RC oscillation is selected.
Outputs "H" level in standby state when RC oscillation is selected.
Random playback starts if RND pin is set to "L" level.
Fetches addresses from random address generation circuit in the IC at the
falling edge of RND. Set to "H" level when the random playback function is
not used. This pin has internal pull-up resistor.
OSC3/TEST
RND
4/13
¡ Semiconductor
MSM98P05
Pin
Symbol Type
Description
DIP SOP
Phrase input pins corresponding to playback sound.
If input changes, SW0 to SW2 pins fetch addresses after 16 ms and start voice
synthesis. Each of these pins has internal pull-down resistor.
Phrase input pins corresponding to playback sound.
17-19 10-12 SW0 - SW2
I
2-4 13-15
A0 - A2
VPP
I
—
I
Logic input to A0 pin becomes invalid if the random playback function is used.
Power supply pin for writing to the built-in OTP. This pin should be set to "H"
level or be open during playback.
1
16
9
Interface pin for writing to the built-in OTP. This pin should be set to "L"
level or be open during playback.
20
PGM
5/13
¡ Semiconductor
MSM98P05
APPLICATION CIRCUITS
VDD
S3
S2
S1
SW0
SW1
AOUT
VPP
SW2
PGM
VREF
RND
BUSY
A0
A1
RESET
S4
A2
OSC3
OSC2
OSC1
XT/CR
CPU/STD
GND
A2
0
A1
A0
0
SW2
SW1
SW0
Address [HEX]
S1
S2
S3
S1
S2
S3
0
0
0
0
0
0
0
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
0
01
02
04
09
0A
0C
S4="L"
S4="H"
0
0
0
0
0
1
0
1
0
1
Application Circuit for Playing Six Phrases Using Four Switches
6/13
1
2
3
4
5
6
7
VDD
SW0
SW1
AOUT
SW2
VREF
VPP
PGM
XT/CR
BUSY
CPU/STD
RND
RESET
A0
OSC3
OSC2
OSC1
A1
A2
GND
VPP
PGM
Program Circuit
I5
I4
I3
I2
I1
I0
2-Mbit OTP ROM
(Including 11 Kbits of
Edit ROM & Address ROM)
18-Bit
Multiplexer
6
Address
Controller
8
DATA
Controller
18-Bit
Address Counter
PCM
Synthesizer
CPU/STD
I/O
Interface
ST
NAR
10
10-Bit
DAC
&
OSC1
OSC2
OSC
XT/RC
LPF
Timing Controller
OSC3/TEST
XT/CR
VDD
GND
RESET
AOUT
VREF
¡ Semiconductor
MSM98P05
PIN CONFIGURATION (TOP VIEW)
VPP
I3
1
2
3
4
5
6
7
8
9
20 PGM
19 I2
I4
18 I1
I5
17 I0
RESET
XT/CR
NAR
GND
VREF
16 ST
15 CPU/STD
14 OSC3/TEST
13 OSC2
12 OSC1
11 VDD
AOUT 10
20-Pin Plastic DIP
Note: Applies to MSM98P05RS
VDD
OSC1
1
2
3
4
5
6
7
8
9
24 AOUT
23 VREF
22 GND
21 NC
OSC2
NC
OSC3/TEST
NC
20 NAR
19 NC
CPU/STD
ST
18 XT/CR
17 RESET
16 VPP
15 I5
PGM
I0 10
I1 11
I2 12
14 I4
13 I3
NC: No connection
24-Pin Plastic SOP
Note: Applies to MSM98P05GS-K
9/13
¡ Semiconductor
MSM98P05
PIN DESCRIPTIONS
Pin
Symbol Type
Description
DIP SOP
The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0mA and becomes GND level,
then the IC returns to the initial state. If the power cannot be applied within 1ms,
apply an "L" pulse during power-on. This pin has an internal pull-up resistor.
Signal output pin that indicates whether the register in the address controller
to latch the 10-15 addresses (see Block Diagram) is idle. NAR at "H" level
indicates that the LATCH is empty and ST input is enabled.
5
7
17
20
RESET
I
NAR
O
XT/RC switching pin. Set to "H" level if ceramic oscillation is used. Set to "L"
level if RC oscillation is used.
6
18
7
XT/CR
I
I
Microcontroller interface/stand-alone mode switching pin. Set to "H" level if
the IC is used in microcontroller interface mode.
Volume setting pin. If this pin is set to GND level, the maximum amplitude is
delivered. If this pin is set to VDD level, the minimum amplitude is delivered.
This pin is internally connected to a pull-down resistor of approx. 10 kW
during IC operation.
15
CPU/STD
9
23
VREF
I
Voice output pin.
The voice signals are output as current changes. A logic "L" is output from
this pin in standby state.
10
24
AOUT
O
8
22
1
GND
VDD
—
—
Ground pin.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this
pin and the GND pin.
11
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
12
13
2
3
OSC1
OSC2
I
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Leave this pin open if external clock is used.
O
Outputs "L" level in standby state.
Leave this pin open when ceramic oscillation is used.
RC connection pin when RC oscillation is selected.
Outputs "H" level in standby state when RC oscillation is selected.
Voice synthesis starts at fall of ST, and addresses I0 to I5 are fetched at rise
of ST. Input ST when NAR, the status signal, is at "H" level.
This pin has internal pull-up resistor.
14
16
5
8
OSC3/TEST
O
I
ST
17-19
2-4
Phrase input pins corresponding to vocalized sound.
10-15
16
I0 - I5
VPP
I
—
I
Power supply pin for writing to the built-in OTP. This pin should be set to "H"
1
level or be open.
Interface pin for writing to the built-in OTP. This pin should be set to "L" level
or be open.
20
9
PGM
10/13
¡ Semiconductor
MSM98P05
APPLICATION CIRCUIT
+
–
VDD
VCC
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
I5
I4
I3
I2
I1
I0
VREF
SP
AIN
AOUT
SP
P2.2
P2.1
ST
RESET
P3.0
NAR
VPP
CPU/STD
XT/CR
OSC2
RESET
PGM
OSC3
STBY
VR
OSC1
XTAL1 XTAL2
GND
GND
SEL
+
–
Application Circuit when Used as Microcontroller Interface
11/13
¡ Semiconductor
PACKAGE DIMENSIONS
DIP20-P-300-2.54-W1
MSM98P05
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.50 TYP.
12/13
¡ Semiconductor
MSM98P05
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
13/13
E2Y0002-29-62
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
4.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
6.
Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
thelegalityofexportoftheseproductsandwilltakeappropriateandnecessarystepsattheir
own expense for these.
8.
9.
No part of the contents contained herein may be reprinted or reproduced without our prior
permission.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan
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