506AL [ONSEMI]
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS; 机械案例外形封装尺寸
| 型号： | 506AL |
| 厂家： | 
ONSEMI |
| 描述： | MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS |
| 文件： | 总2页 (文件大小：34K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8
CASE 506AL−01
ISSUE A
8
1
DATE 20 DEC 2005
SCALE 2:1
NOTES:
A
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30mm.
D
B
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
E
DIM MIN
0.80
A1 0.00
NOM MAX
PIN ONE
REFERENCE
A
0.90
0.03
1.00
0.05
A3
b
0.20 REF
0.40
0.35
0.45
1.15
2.00
2 X
D
3.30 BSC
1.05
3.30 BSC
1.90
D2 0.95
E
E2 1.80
e
K
L
0.15
C
TOP VIEW
2 X
0.80 BSC
−−−
0.15
C
0.21
0.30
−−−
0.40
0.50
A
C
(A3)
0.10
0.08
C
C
GENERIC
MARKING DIAGRAM*
8 X
SEATING
PLANE
1
SIDE VIEW
XXXX
A1
D2
AYWW
D2
XXXX = Specific Device Code
8 X L
e
1
4
A
Y
= Assembly Location
= Year
WW = Work Week
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Freeindicator, “G” or microdot “ G”,
may or may not be present.
E2
2 X
8 X K
8 X b
8
5
SOLDERING FOOTPRINT*
0.10
0.05
C
C
A B
NOTE 3
BOTTOM VIEW
8X
0.55
3.60
1
STYLE 1:
PIN 1. IN
2. GND
3. CNTRL
4. DRAIN
5. SOURCE
6. GATE
7. OUT
2.95
0.45
8. VCC
2X
1.20
0.80
PITCH
1.95
2X
0.60
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
98AON20636D
ON SEMICONDUCTOR STANDARD
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
DESCRIPTION: DFN8, 3.3X3.3 MM, 0.8 MM PITCH, DUAL FLAG
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON20636D
PAGE 2 OF 2
ISSUE
REVISION
RELEASE FOR PRODUCTION. REQ. BY S. CHANG.
ADDED SOLDER FOOTPRINT. REQ. BY S. CHANG.
DATE
O
A
08 APR 2005
20 DEC 2005
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
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©
Semiconductor Components Industries, LLC, 2005
Case Outline Number:
December, 2005 − Rev. 01A
506AL
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