74ACT139 [ONSEMI]
Dual 1−of−4 Decoder/Demultiplexer; 1 -的-4双解码器/多路解复用器
| 型号： | 74ACT139 |
| 厂家： | 
ONSEMI |
| 描述： | Dual 1−of−4 Decoder/Demultiplexer |
| 文件： | 总11页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC139, MC74ACT139
Dual 1−of−4
Decoder/Demultiplexer
The MC74AC139/74ACT139 is a high−speed, dual 1−of−4
decoder/demultiplexer. The device has two independent decoders,
each accepting two inputs and providing four mutually−exclusive
active−LOW outputs. Each decoder has an active−LOW Enable input
which can be used as a data input for a 4−output demultiplexer. Each
half of the MC74AC139/74ACT139 can be used as a function
generator providing four minterms of two variables.
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DIP−16
N SUFFIX
CASE 648
• Multifunctional Capability
16
• Two Completely Independent 1−of−4 Decoders
• Active LOW Mutually Exclusive Outputs
• Outputs Source/Sink 24 mA
1
SO−16
• ′ACT139 Has TTL Compatible Inputs
D SUFFIX
CASE 751B
16
w These devices are available in Pb−free package(s). Specifications herein
apply to both standard and Pb−free devices. Please see our website at
www.onsemi.com for specific Pb−free orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
1
TSSOP−16
DT SUFFIX
CASE 948F
V
CC
E
b
A
0b
A
1b
O
0b
O
1b
O
O
3b
2b
16
16
15
14
13
12
11
10
9
1
EIAJ−16
M SUFFIX
CASE 966
16
1
1
2
3
4
5
6
7
8
ORDERING INFORMATION
E
a
A
0a
A
1a
O
0a
O
1a
O
2a
O
3a
GND
Device
Package
Shipping
Figure 1. Pinout: 16−Lead Packages Conductors
MC74AC139N
MC74ACT139N
MC74AC139D
MC74ACT139D
MC74AC139DR2
25 Units/Rail
25 Units/Rail
PDIP−16
PDIP−16
SOIC−16
(Top View)
PIN ASSIGNMENT
48 Units/Rail
PIN
FUNCTION
Address Inputs
Enable Inputs
Outputs
48 Units/Rail
SOIC−16
SOIC−16
A , A
0
1
2500 Tape & Reel
E
MC74ACT139DR2
MC74AC139DT
2500 Tape & Reel
96 Units/Rail
SOIC−16
O −O
0
3
TSSOP−16
MC74ACT139DT
96 Units/Rail
TSSOP−16
TRUTH TABLE
Inputs
MC74AC139DTR2
MC74AC139M
2500 Tape & Reel
50 Units/Rail
TSSOP−16
EIAJ−16
Outputs
E
A
0
A
1
O
O
O
O
3
0
1
2
50 Units/Rail
MC74ACT139M
MC74AC139MEL
MC74ACT139MEL
EIAJ−16
EIAJ−16
EIAJ−16
H
L
L
L
L
X
X
L
L
H
H
H
H
H
H
2000 Tape & Reel
2000 Tape & Reel
L
H
L
L
H
H
H
H
L
H
H
H
H
L
H
H
H
L
H
H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 7
MC74AC139/D
MC74AC139, MC74ACT139
E
A A
0 1
DECODER a
O
0
O
1
O
2
O
3
E
A A
0 1
DECODER b
O
0
O O O
1 2 3
Figure 2. Logic Symbol
E
a
A
0a
A
1a
E
b
A
0b
A
1b
0
0a
0
1a
0
2a
0
3a
0
0b
0
1b
0
2b
0
3b
NOTE: This diagram is provided only for the understanding of logic
operations and should not be used to estimate propagation
delays.
Figure 3. Logic Diagram
E
E
FUNCTIONAL DESCRIPTION
A
A
O
O
O
0
1
0
1
0
0
The MC74AC139/74ACT139 is a high−speed dual
1−of−4 decoder/demultiplexer. The device has two
independent decoders, each of which accepts two binary
A
A
E
E
A
A
0
0
O
1
1
weighted inputs (A −A ) and provides four mutually
0
1
A
A
1
1
exclusive active−LOW outputs (O −O ). Each decoder has
0
3
E
E
an active−LOW enable (E). When E is HIGH all outputs are
forced HIGH. The enable can be used as the data input for
a 4−output demultiplexer application. Each half of the
MC74AC139/74ACT139 generates all four minterms of
two variables. These four minterms are useful in some
applications, replacing multiple gate functions as shown in
Figure 4, and thereby reducing the number of packages
required in a logic network.
A
0
O
O
A
O
O
2
0
1
2
A
A
1
E
E
A
3
A
3
0
1
0
1
A
A
Figure 4. Gate Functions (Each Half)
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2
MC74AC139, MC74ACT139
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
V
V
V
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
CC
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
−0.5 to V +0.5
V
IN
CC
−0.5 to V +0.5
V
OUT
CC
I
I
I
±20
±50
mA
mA
mA
°C
IN
DC Output Sink/Source Current, per Pin
OUT
CC
DC V or GND Current per Output Pin
±50
CC
T
stg
Storage Temperature
−65 to +150
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recom-
mended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
4.5
0
Typ
5.0
5.0
−
Max
6.0
Unit
′AC
V
V
Supply Voltage
V
V
CC
′ACT
5.5
, V
OUT
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
IN
V
CC
V
CC
V
CC
V
CC
V
CC
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
−
−
−
−
−
ns/V
t , t
r
f
−
−
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
t , t
ns/V
r
f
−
T
J
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
−
140
85
°C
°C
T
A
−40
−
25
−
I
I
−24
24
mA
mA
OH
OL
Output Current − Low
−
−
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
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3
MC74AC139, MC74ACT139
DC CHARACTERISTICS
74AC
74AC
T
A
=
−40°C to
+85°C
T
A
= +25°C
V
CC
Typ
Guaranteed Limits
(V)
Symbol
Parameter
Minimum High Level
Input Voltage
Unit
Conditions
3.0
4.5
5.5
1.5
2.25
2.75
2.1
2.1
V
= 0.1 V
V
V
V
OUT
IH
3.15
3.85
3.15
3.85
V
or V − 0.1 V
CC
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
= 0.1 V
Maximum Low Level
Input Voltage
OUT
IL
V
V
or V − 0.1 V
CC
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
Minimum High Level
Output Voltage
I
= −50 mA
OH
OUT
*V = V or V
IH
IN
IL
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
−12 mA
−24 mA
−24 mA
V
V
I
OH
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
V
OL
Maximum Low Level
Output Voltage
I
= 50 mA
OUT
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
12 mA
24 mA
24 mA
V
I
OL
I
IN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
V = V , GND
I
CC
I
I
I
5.5
5.5
−
−
−
−
75
mA
mA
V
V
= 1.65 V Max
= 3.85 V Min
†Minimum Dynamic
Output Current
OLD
OHD
CC
OLD
−75
OHD
Maximum Quiescent
Supply Current
5.5
−
8.0
80
mA
V
= V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
IN
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
.
CC
CC
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74AC
74AC
T
= −40°C
A
T
A
= +25°C
to +85°C
C = 50 pF
C = 50 pF
L
L
V
(V)
*
Fig.
No.
CC
Min
Typ
Max
Min
Max
Symbol
Parameter
Unit
3.3
5.0
4.0
3.0
8.0
6.5
11.5
8.5
3.5
2.5
13
9.5
Propagation Delay
A to O
t
t
t
t
ns
3−6
3−6
3−6
3−6
PLH
n
n
3.3
5.0
3.0
2.5
7.0
5.5
10
7.5
2.5
2.0
11
8.5
Propagation Delay
A to O
ns
ns
ns
PHL
PLH
PHL
n
n
3.3
5.0
4.5
3.5
9.5
7.0
12
8.5
3.5
3.0
13
10
Propagation Delay
E to O
n
n
3.3
5.0
4.0
2.5
8.0
6.0
10
7.5
3.0
2.5
11
8.5
Propagation Delay
E to O
n
n
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
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4
MC74AC139, MC74ACT139
DC CHARACTERISTICS
74ACT
74ACT
T
A
=
−40°C to
+85°C
T
A
= +25°C
V
CC
Typ
Guaranteed Limits
(V)
Symbol
Parameter
Minimum High Level
Input Voltage
Unit
Conditions
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
= 0.1 V
V
V
V
OUT
IH
V
or V − 0.1 V
CC
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
= 0.1 V
Maximum Low Level
Input Voltage
OUT
IL
V
V
or V − 0.1 V
CC
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
Minimum High Level
Output Voltage
I
= −50 mA
OH
OUT
*V = V or V
IH
IN
IL
4.5
5.5
−
−
3.86
4.86
3.76
4.76
V
V
−24 mA
−24 mA
I
I
OH
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
V
OL
Maximum Low Level
Output Voltage
= 50 mA
OUT
*V = V or V
IN
IL
IH
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
24 mA
24 mA
I
OL
I
IN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
V = V , GND
I CC
DI
Additional Max. I /Input
5.5
5.5
5.5
0.6
−
−
−
−
1.5
75
mA
mA
mA
V = V − 2.1 V
CCT
CC
I
CC
I
V
OLD
V
OHD
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
I
−
−75
= 3.85 V Min
OHD
CC
I
Maximum Quiescent
Supply Current
5.5
−
8.0
80
mA
V = V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74ACT
74ACT
T
= −40°C
A
T
A
= +25°C
to +85°C
C = 50 pF
C = 50 pF
L
L
V
(V)
*
Fig.
No.
CC
Min
Typ
Max
Min
Max
Symbol
Parameter
Unit
Propagation Delay
A to O
t
t
t
t
5.0
1.5
6.0
8.5
1.5
9.5
ns
3−6
3−6
3−6
3−6
PLH
n
n
Propagation Delay
A to O
5.0
5.0
5.0
1.5
2.5
2.0
6.0
7.0
7.0
9.5
10.0
9.5
1.5
2.0
1.5
10.5
11.0
10.5
ns
ns
ns
PHL
PLH
PHL
n
n
Propagation Delay
E to O
n
n
Propagation Delay
E to O
n
n
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Value
Typ
4.5
40
Parameter
Unit
Test Conditions
C
C
Input Capacitance
Power Dissipation Capacitance
pF
pF
V
CC
CC
= 5.0 V
= 5.0 V
IN
V
PD
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5
MC74AC139, MC74ACT139
MARKING DIAGRAMS
DIP−16
SO−16
TSSOP−16
EIAJ−16
MC74AC139N
AWLYYWW
AC139
AWLYWW
74AC139
ALYW
AC
139
ALYW
ACT139
AWLYWW
MC74ACT139N
AWLYYWW
74ACT139
ALYW
ACT
139
ALYW
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
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6
MC74AC139, MC74ACT139
PACKAGE DIMENSIONS
PDIP−16
N SUFFIX
16 PIN PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−A−
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
0.770
0.270
0.175
0.021
0.70
C
L
SEATING
PLANE
−T−
G
H
J
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
K
L
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
M
S
_
_
_
_
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
SO−16
D SUFFIX
16 PIN PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
−A−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
16
9
8
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
−B−
P 8 PL
M
S
B
0.25 (0.010)
1
G
MILLIMETERS
INCHES
MIN
0.386
DIM MIN
MAX
MAX
0.393
0.157
0.068
0.019
0.049
F
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
10.00
R X 45
K
_
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
C
G
J
1.27 BSC
0.050 BSC
−T−
SEATING
PLANE
0.19
0.10
0
0.25 0.008
0.25 0.004
0.009
0.009
7
J
M
K
M
P
R
D
16 PL
7
0
_
_
_
_
5.80
0.25
6.20 0.229
0.50 0.010
0.244
0.019
M
S
S
A
0.25 (0.010)
T
B
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7
MC74AC139, MC74ACT139
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
16 PIN PLASTIC TSSOP PACKAGE
CASE948F−01
ISSUE O
16X KREF
M
S
S
0.10 (0.004)
T
U
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
U
0.15 (0.006) T
K
K1
16
9
2X L/2
J1
B
SECTION N−N
L
−U−
J
PIN 1
IDENT.
8
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
N
0.25 (0.010)
S
0.15 (0.006) T
U
A
M
MILLIMETERS
INCHES
MIN
−V−
DIM MIN
MAX
5.10
4.50
1.20
0.15
0.75
MAX
0.200
0.177
0.047
0.006
0.030
A
B
4.90
4.30
−−−
0.193
0.169
−−−
N
C
F
DETAIL E
D
0.05
0.50
0.002
0.020
F
G
H
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28
0.20
0.16
0.30
0.25
0.007
0.004
0.004
0.007
0.007
0.011
0.008
0.006
0.012
0.010
J
J1
K
−W−
C
K1
L
6.40 BSC
_
0.252 BSC
0
0.10 (0.004)
M
0
8
8
_
_
_
DETAIL E
H
SEATING
PLANE
−T−
D
G
EIAJ−16
M SUFFIX
16 PIN PLASTIC EIAJ PACKAGE
CASE966−01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ISSUE O
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
16
9
E
Q
1
H
E
M
_
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
1
8
L
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
MIN
−−−
A
DIM MIN
MAX
MAX
0.081
0.008
0.020
0.011
0.413
0.215
c
A
−−−
0.05
0.35
0.18
9.90
5.10
2.05
A
1
0.20 0.002
0.50 0.014
0.27 0.007
b
c
D
E
10.50 0.390
5.45 0.201
A
1
b
0.13 (0.005)
e
1.27 BSC
0.050 BSC
0.10 (0.004)
M
H
7.40
0.50
1.10
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
E
L
L
E
M
Q
0
10
0.90 0.028
10
_
0.035
0.031
0
_
_
_
0.70
−−−
1
Z
0.78
−−−
http://onsemi.com
8
MC74AC139, MC74ACT139
Notes
http://onsemi.com
9
MC74AC139, MC74ACT139
Notes
http://onsemi.com
10
MC74AC139, MC74ACT139
Notes
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MC74AC139/D
相关型号：
74ACT139MTCX_NL
Decoder/Driver, ACT Series, Inverted Output, CMOS, PDSO16, 4.40 MM, MO-153, TSSOP-16
FAIRCHILD
74ACT139PC
ACT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16, 0.300 INCH, PLASTIC, DIP-16
TI
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