74LCX16374MTDX [ONSEMI]

带 5V 耐压输入和输出的低压 16 位 D 型触发器;
74LCX16374MTDX
型号: 74LCX16374MTDX
厂家: ONSEMI    ONSEMI
描述:

带 5V 耐压输入和输出的低压 16 位 D 型触发器

驱动 光电二极管 逻辑集成电路 触发器
文件: 总12页 (文件大小:252K)
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February 1994  
Revised May 2005  
74LCX16374  
Low Voltage 16-Bit D-Type Flip-Flop  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX16374 contains sixteen non-inverting D-type  
flip-flops with 3-STATE outputs and is intended for bus ori-  
ented applications. The device is byte controlled. A buff-  
ered clock (CP) and Output Enable (OE) are common to  
each byte and can be shorted together for full 16-bit opera-  
tion.  
2.3V–3.6V VCC specifications provided  
6.2 ns tPD max (VCC 3.3V), 20 A ICC max  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
The LCX16374 is designed for low voltage (2.5V or 3.3V)  
24 mA output drive (VCC 3.0V)  
VCC applications with capability of interfacing to a 5V signal  
Uses proprietary noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
environment.  
The LCX16374 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Human body model 2000V  
Machine model 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA)  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to V  
through a pull-up resistor: the minimum value or the  
CC  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX16374G  
(Note 2)(Note 3)  
BGA54A  
MS48A  
MTD48  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
74LCX16374MEA  
(Note 3)  
74LCX16374MTD  
(Note 3)  
Note 2: Ordering code Gindicates Trays.  
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2005 Fairchild Semiconductor Corporation  
DS012003  
www.fairchildsemi.com  
Connection Diagrams  
Pin Descriptions  
Pin Assignment for SSOP and TSSOP  
Pin Names  
Description  
OEn  
Output Enable Input (Active LOW)  
CPn  
Clock Pulse Input  
Inputs  
I0I15  
O0O15  
NC  
Outputs  
No Connect  
FBGA Pin Assignments  
1
2
3
4
5
6
A
B
C
D
E
F
O0  
O2  
NC  
O1  
OE1  
NC  
CP1  
NC  
NC  
I1  
I0  
I2  
O4  
O3  
VCC  
GND  
GND  
GND  
VCC  
NC  
VCC  
GND  
GND  
GND  
VCC  
NC  
I3  
I4  
O6  
O5  
I5  
I6  
O8  
O7  
I7  
I8  
O10  
O12  
O14  
O9  
I9  
I10  
I12  
I14  
G
H
O11  
O13  
I11  
I13  
J
O15  
NC  
OE2  
CP2  
NC  
I15  
Truth Tables  
Pin Assignment for FBGA  
Inputs  
Outputs  
CP1  
OE1  
I0–I7  
O0–O7  
L
L
H
L
H
L
L
L
X
X
O0  
Z
X
H
Inputs  
OE2  
Outputs  
O8–O15  
CP2  
I8–I15  
L
L
H
L
H
L
(Top Thru View)  
L
L
X
X
O0  
Z
X
H
H
L
X
Z
O
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
High Impedance  
Previous O before HIGH-to-LOW of CP  
0
0
www.fairchildsemi.com  
2
Functional Description  
The LCX16374 consists of sixteen edge-triggered flip-flops  
with individual D-type inputs and 3-STATE true outputs.  
The device is byte controlled with each byte functioning  
identically, but independent of the other. The control pins  
can be shorted together to obtain full 16-bit operation. Each  
byte has a buffered clock and buffered Output Enable com-  
mon to all flip-flops within that byte. The description which  
follows applies to each byte. Each flip-flop will store the  
state of their individual D inputs that meet the setup and  
hold time requirements on the LOW-to-HIGH Clock (CPn)  
transition. With the Output Enable (OEn) LOW, the con-  
tents of the flip-flops are available at the outputs. When  
OEn is HIGH, the outputs go to the high impedance state.  
Operation of the OEn input does not affect the state of the  
flip-flops.  
Logic Diagrams  
Byte 1 (0:7)  
Byte 2 (8:15)  
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
3
www.fairchildsemi.com  
Absolute Maximum Ratings(Note 4)  
Symbol  
VCC  
Parameter  
Supply Voltage  
Value  
Conditions  
Units  
0.5 to 7.0  
0.5 to 7.0  
0.5 to 7.0  
V
V
VI  
DC Input Voltage  
VO  
DC Output Voltage  
3-STATE  
V
0.5 to VCC 0.5 Output in HIGH or LOW State (Note 5)  
IIK  
DC Input Diode Current  
DC Output Diode Current  
50  
50  
VI GND  
VO GND  
VO VCC  
mA  
mA  
IOK  
50  
IO  
DC Output Source/Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
50  
mA  
mA  
mA  
C
ICC  
100  
IGND  
TSTG  
100  
65 to 150  
Note 4: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated  
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The Recom-  
mended Operating Conditionstable will define the conditions for actual device operation.  
Note 5: I Absolute Maximum Rating must be observed.  
O
Recommended Operating Conditions (Note 6)  
Symbol  
Parameter  
Min  
2.0  
1.5  
0
Max  
3.6  
3.6  
5.5  
VCC  
5.5  
24  
Units  
VCC  
Supply Voltage  
Operating  
V
V
V
Data Retention  
VI  
Input Voltage  
VO  
Output Voltage  
HIGH or LOW State  
3-STATE  
0
0
I
OH/IOL  
Output Current  
VCC 3.0V 3.6V  
VCC 2.7V 3.0V  
VCC 2.3V 2.7V  
12  
mA  
8
TA  
t/ V  
Free-Air Operating Temperature  
40  
0
85  
C
Input Edge Rate, VIN 0.8V 2.0V, VCC 3.0V  
10  
ns/V  
Note 6: Unused inputs must be held HIGH or LOW. They may not float.  
DC Electrical Characteristics  
V
T
40 C to 85 C  
Min Max  
CC  
A
Symbol  
Parameter  
Conditions  
Units  
(V)  
2.3 2.7  
2.7 3.6  
2.3 2.7  
2.7 3.6  
2.3 3.6  
2.3  
V
V
V
HIGH Level Input Voltage  
1.7  
2.0  
IH  
V
V
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.7  
IL  
0.8  
I
100  
A
V
CC  
0.2  
OH  
OH  
I
8 mA  
1.8  
2.2  
2.4  
2.2  
OH  
I
12 mA  
18 mA  
24 mA  
2.7  
V
V
OH  
I
3.0  
OH  
I
3.0  
OH  
V
LOW Level Output Voltage  
I
100  
8 mA  
A
2.3 3.6  
2.3  
0.2  
0.6  
OL  
OL  
I
OL  
I
12 mA  
16 mA  
24 mA  
2.7  
0.4  
0.4  
0.55  
5.0  
OL  
I
3.0  
OL  
I
3.0  
OL  
I
I
Input Leakage Current  
0
0
V
V
V
5.5V  
5.5V  
2.3 3.6  
A
A
A
I
I
3-STATE Output Leakage  
OZ  
O
2.3 3.6  
0
5.0  
10  
V
or V  
IL  
I
IH  
I
Power-Off Leakage Current  
V or V  
O
5.5V  
OFF  
I
www.fairchildsemi.com  
4
DC Electrical Characteristics (Continued)  
V
T
40 C to 85 C  
CC  
A
Symbol  
Parameter  
Conditions  
V or GND  
CC  
Units  
(V)  
Min  
Max  
20  
I
Quiescent Supply Current  
V
2.3 3.6  
2.3 3.6  
2.3 3.6  
CC  
I
A
A
3.6V V , V  
5.5V (Note 7)  
V 0.6V  
CC  
20  
I
O
I
Increase in I per Input  
V
500  
CC  
CC  
IH  
Note 7: Outputs disabled or 3-STATE only.  
AC Electrical Characteristics  
T
40 to 85 C, R  
500  
A
L
V
3.3V 0.3V  
50 pF  
V
2.7V  
V
CC  
2.5V 0.2V  
CC  
CC  
Symbol  
Parameter  
Units  
C
C
50 pF  
C
L
30 pF  
Max  
L
L
Min  
170  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
2.5  
1.5  
3.0  
Max  
Min  
Max  
Min  
f
t
t
t
t
t
t
t
t
t
t
t
Maximum Clock Frequency  
Propagation Delay  
CP to O  
MHz  
ns  
MAX  
6.2  
6.2  
6.1  
6.1  
6.0  
6.0  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
2.5  
1.5  
3.0  
6.5  
6.5  
6.3  
6.3  
6.2  
6.2  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
3.0  
2.0  
3.5  
7.4  
7.4  
7.9  
7.9  
7.2  
7.2  
PHL  
PLH  
PZL  
PZH  
PLZ  
PHZ  
S
n
Output Enable time  
ns  
ns  
Output Disable Time  
Setup Time  
ns  
ns  
ns  
Hold Time  
H
Pulse Width  
W
Output to Output Skew (Note 8)  
1.0  
1.0  
OSHL  
OSLH  
ns  
Note 8: Skew is defined as the absolute value of the differences between the actual propagation delay for any two separate outputs of the same device. The  
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t  
) or LOW-to-HIGH (t  
). Parameter guaranteed by design.  
OSLH  
OSHL  
Dynamic Switching Characteristics  
V
T
25 C  
CC  
A
Symbol  
Parameter  
Conditions  
Units  
(V)  
3.3  
2.5  
3.3  
2.5  
Typical  
0.8  
V
V
Quiet Output Dynamic Peak V  
C
C
C
C
50 pF, V  
30 pF, V  
50 pF, V  
30 pF, V  
3.3V, V  
2.5V, V  
3.3V, V  
2.5V, V  
0V  
0V  
0V  
0V  
OLP  
OL  
L
L
L
L
IH  
IH  
IH  
IH  
IL  
IL  
IL  
IL  
V
V
0.6  
Quiet Output Dynamic Valley V  
0.8  
OLV  
OL  
0.6  
Capacitance  
Symbol  
Parameter  
Conditions  
Typical  
Units  
pF  
C
C
C
Input Capacitance  
Output Capacitance  
V
V
V
Open, V 0V or V  
CC  
7
8
IN  
CC  
CC  
CC  
I
3.3V, V 0V or V  
CC  
pF  
OUT  
PD  
I
Power Dissipation Capacitance  
3.3V, V 0V or V , f 10 MHz  
20  
pF  
I
CC  
5
www.fairchildsemi.com  
AC LOADING and WAVEFORMS Generic for LCX Family  
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)  
Test  
PLH, tPHL  
PZL, tPLZ  
Switch  
Open  
t
t
6V at VCC 3.3 0.3V, and 2.7V  
VCC x 2 at VCC 2.5 0.2V  
tPZH, tPHZ  
GND  
3-STATE Output High Enable and  
Disable Times for Logic  
Waveform for Inverting and Non-Inverting Functions  
Setup Time, Hold Time and Recovery Time for Logic  
Propagation Delay. Pulse Width and trec Waveforms  
trise and tfall  
3-STATE Output Low Enable and  
Disable Times for Logic  
FIGURE 2. Waveforms  
(Input Characteristics; f = 1MHz, tr = tf = 3ns)  
VCC  
Symbol  
3.3V 0.3V  
1.5V  
2.7V  
1.5V  
2.5V 0.2V  
VCC/2  
Vmi  
Vmo  
Vx  
1.5V  
1.5V  
VCC/2  
VOL 0.3V  
VOH 0.3V  
VOL 0.3V  
VOH 0.3V  
VOL 0.15V  
VOH 0.15V  
Vy  
www.fairchildsemi.com  
6
Schematic Diagram Generic for LCX Family  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
Package Number BGA54A  
www.fairchildsemi.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
Package Number MS48A  
9
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Package Number MTD48  
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Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
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SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
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10  
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
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