74LCX2244MTC [ONSEMI]
带 5V 耐压输入和输出（输出具有 26 Ω 串联电阻）的低压缓冲器/线路驱动器;
| 型号： | 74LCX2244MTC |
| 厂家： | 
ONSEMI |
| 描述： | 带 5V 耐压输入和输出（输出具有 26 Ω 串联电阻）的低压缓冲器/线路驱动器 驱动 光电二极管 逻辑集成电路 驱动器 |
| 文件： | 总14页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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October 1995
Revised May 2003
74LCX2244
Low Voltage Buffer/Line Driver with 5V Tolerant Inputs
and Outputs with 26Ω Series Resistors in the Outputs
General Description
Features
■ 5V tolerant inputs and outputs
The LCX2244 contains eight non-inverting buffers with
3-STATE outputs. The device may be employed as a mem-
ory address driver, clock driver and bus-oriented transmit-
ter/receiver. The LCX2244 is designed for low voltage
(2.5V or 3.3V) VCC applications with capability of interfac-
■ 2.3V to 3.6V VCC specifications provided
■ 7.5 ns tPD max (VCC = 3.3V) 10 µA ICC max
■ Power down high impedance inputs and outputs
■ 26Ω-series resistors in the outputs
ing to a 5V signal environment. The 26Ω series resistors
help reduce output overshoot and undershoot.
■ Supports live insertion/withdrawal (Note 1)
■ ±12 mA output drive (VCC = 3.0V)
The LCX2244 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human body model > 2000V
Machine model > 200V
■ Leadless DQFN package
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Package
Order Number
Package Description
Number
74LCX2244WM
74LCX2244SJ
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX2244BQ
(Preliminary)
MLP020B
(Preliminary) 2.5 x 4.5mm
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241,
74LCX2244MSA
74LCX2244MTC
MSA20
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
© 2003 Fairchild Semiconductor Corporation
DS012569
www.fairchildsemi.com
Logic Symbol
Pin Descriptions
IEEE/IEC
Pin Names
Description
OE1, OE2
I0–I7
3-STATE Output Enable Inputs
Inputs
O0–O7
Outputs
Truth Tables
Inputs
Outputs
OE1
In
(Pins 12, 14, 16, 18)
L
L
L
H
X
L
H
Z
H
Connection Diagrams
Pin Assignments for
SOIC, SOP, SSOP, and TSSOP
Inputs
Outputs
OE2
In
(Pins 3, 5, 7, 9)
L
L
L
L
H
Z
H
X
H
H = HIGH Voltage Level
X = Immaterial
L = LOW Voltage Level
Z = High Impedance
Pad Assignment for DQFN
(Top Through View)
www.fairchildsemi.com
2
Absolute Maximum Ratings(Note 2)
Symbol
VCC
Parameter
Supply Voltage
Value
Conditions
Units
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
V
V
VI
DC Input Voltage
VO
DC Output Voltage
Output in 3-STATE
V
−0.5 to VCC + 0.5 Output in HIGH or LOW State (Note 3)
IIK
DC Input Diode Current
DC Output Diode Current
−50
−50
VI < GND
mA
mA
IOK
V
V
O < GND
O > VCC
+50
IO
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
±50
mA
mA
mA
°C
ICC
±100
IGND
TSTG
±100
−65 to +150
Recommended Operating Conditions (Note 4)
Symbol
Parameter
Min
2.0
1.5
0.0
0.0
0.0
Max
3.6
Units
VCC
Supply Voltage
Operating
V
V
V
Data Retention
3.6
VI
Input Voltage
5.5
VO
Output Voltage
HIGH or LOW State
3-STATE
VCC
5.5
IOH/IOL
Output Current
V
V
V
CC = 3.0V − 3.6V
CC = 2.7V − 3.0V
CC = 2.3V − 2.7V
±12.0
±8.0
±4.0
85.0
10.0
mA
TA
Free-Air Operating Temperature
−40.0
°C
∆t/∆V
Input Edge Rate, VIN = 0.8V − 2.0V, VCC = 3.0V
0.0
ns/V
Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom-
mended Operating Conditions” table will define the conditions for actual device operation.
Note 3: IO Absolute Maximum Rating must be observed.
Note 4: Unused inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
VCC
TA = −40°C to +85°C
Symbol
VIH
Parameter
Conditions
Units
(V)
2.3 − 2.7
2.7 − 3.6
2.3 − 2.7
2.7 − 3.6
2.3 − 3.6
2.3
Min
1.7
2.0
Max
HIGH Level Input Voltage
V
V
VIL
LOW Level Input Voltage
HIGH Level Output Voltage
0.7
0.8
VOH
I
I
I
I
I
I
I
I
I
I
I
I
OH = −100 µA
OH = −4 mA
OH = −4 mA
OH = −6 mA
OH = − 8mA
OH = −12 mA
OL = 100 µA
OL = 4 mA
VCC − 0.2
1.8
2.7
2.2
V
V
3.0
2.4
2.7
2.0
3.0
2.0
VOL
LOW Level Output Voltage
2.3 − 3.6
2.3
0.2
0.6
OL = 4 mA
2.7
0.4
OL = 6 mA
3.0
0.55
0.6
OL = 8 mA
2.7
OL = 12 mA
3.0
0.8
II
Input Leakage Current
0 ≤ VI ≤ 5.5V
0 ≤ VO ≤ 5.5V
VI = VIH or VIL
2.3 − 3.6
2.3 − 3.6
±5.0
±5.0
µA
µA
IOZ
3-STATE Output Leakage
3
www.fairchildsemi.com
DC Electrical Characteristics (Continued)
VCC
TA = −40°C to +85°C
Symbol
IOFF
Parameter
Conditions
VI or VO = 5.5V
Units
µA
(V)
Min
Max
10.0
10.0
±10.0
500
Power-Off Leakage Current
Quiescent Supply Current
0.0
ICC
VI = VCC or GND
2.3 − 3.6
2.3 − 3.6
2.3 − 3.6
µA
3.6V ≤ VI, VO ≤ 5.5V (Note 5)
∆ICC
Increase in ICC per Input
VIH = VCC − 0.6V
µA
Note 5: Outputs disabled or 3-STATE only.
AC Electrical Characteristics
T
A = −40°C to +85°C, RL = 500Ω
V
CC = 3.3V ± 0.3V
V
CC = 2.7V
L = 50pF
Max
V
CC = 2.5 ± 0.2V
Symbol
Parameter
Units
CL = 50pF
C
CL = 30pF
Min
Max
Min
1.5
1.5
1.5
1.5
1.5
1.5
Min Max
tPHL
tPLH
tPZL
tPZH
tPLZ
Propagation Delay
Data to Output
1.5
1.5
1.5
1.5
1.5
1.5
7.5
7.5
9.0
9.0
7.0
7.0
1.0
1.0
8.5
8.5
1.5
1.5
1.5
1.5
1.5
1.5
9.0
9.0
ns
ns
ns
ns
Output Enable Time
10.0
10.0
8.0
10.5
10.5
8.4
Output Disable Time
tPHZ
tOSHL
tOSLH
8.0
8.4
Output to Output Skew (Note 6)
Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Dynamic Switching Characteristics
VCC
TA = 25°C
Symbol
VOLP
Parameter
Conditions
Units
(V)
3.3
2.5
3.3
2.5
Typical
0.35
Quiet Output Dynamic Peak VOL
C
C
C
C
L = 50 pF, VIH = 3.3V, VIL = 0V
L = 30 pF, VIH = 2.5V, VIL = 0V
L = 50 pF, VIH = 3.3V, VIL = 0V
L = 30 pF, VIH = 2.5V, VIL = 0V
V
V
0.25
VOLV
Quiet Output Dynamic Valley VOL
−0.35
−0.25
Capacitance
Symbol
Parameter
Conditions
CC = Open, VI = 0V or VCC
Typical
Units
pF
CIN
Input Capacitance
Output Capacitance
Power Dissipation Capacitance
V
V
V
7.0
8.0
COUT
CPD
CC = 3.3V, VI = 0V or VCC
pF
CC = 3.3V, VI = 0V or VCC, f = 10 MHz
25.0
pF
www.fairchildsemi.com
4
AC LOADING and WAVEFORMS Generic for LCX Family
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)
Test
tPLH, tPHL
PZL, tPLZ
Switch
Open
t
6V at VCC = 3.3 ± 0.3V
VCC x 2 at VCC = 2.5 ± 0.2V
tPZH,tPHZ
GND
3-STATE Output High Enable and
Waveform for Inverting and Non-Inverting Functions
Disable Times for Logic
Setup Time, Hold Time and Recovery Time for Logic
Propagation Delay. Pulse Width and trec Waveforms
trise and tfall
3-STATE Output Low Enable and
Disable Times for Logic
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, tr = tf = 3ns)
VCC
Symbol
3.3V ± 0.3V
1.5V
2.7V
1.5V
2.5V ± 0.2V
VCC/2
Vmi
Vmo
Vx
1.5V
1.5V
VCC/2
V
OL + 0.3V
V
OL + 0.3V
VOL + 0.15V
Vy
V
OH − 0.3V
V
OH − 0.3V
VOH − 0.15V
5
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Schematic Diagram Generic for LCX Family
www.fairchildsemi.com
6
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
7
www.fairchildsemi.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
www.fairchildsemi.com
8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm
Package Number MLP020B
(Preliminary)
9
www.fairchildsemi.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package Number MSA20
www.fairchildsemi.com
10
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
11
www.fairchildsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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