74LCX543MSAX [ONSEMI]
低压八路注册收发器（5V容差输入和输出）;
| 型号： | 74LCX543MSAX |
| 厂家： | 
ONSEMI |
| 描述： | 低压八路注册收发器（5V容差输入和输出） |
| 文件： | 总10页 (文件大小：209K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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May 1995
Revised March 2001
74LCX543
Low Voltage Octal Registered Transceiver with
5V Tolerant Inputs and Outputs
General Description
Features
■ 5V tolerant inputs and outputs
The LCX543 is a non-inverting octal transceiver containing
two sets of D-type registers for temporary storage of data
flowing in either direction. Separate Latch Enable and Out-
put Enable inputs are provided for each register to permit
independent input and output control in either direction of
data flow.
■ 2.3V − 3.6V VCC specifications provided
■ 7.0 ns tPD max (VCC = 3.3V), 10 µA ICC max
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
■ ±24 mA Output Drive (VCC = 3.0V)
The LCX543 is designed for low voltage (2.5V or 3.3V) VCC
applications with capability of interfacing to a 5V signal
environment.
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
The LCX543 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Human body model > 2000V
Machine model > 200V
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number Package Number
Package Description
74LCX543WM
74LCX543MSA
74LCX543MTC
M24B
MSA24
MTC24
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Pin Descriptions
Pin Names
Description
OEAB
OEBA
CEAB
CEBA
LEAB
LEBA
A0–A7
A-to-B Output Enable Input (Active LOW)
B-to-A Output Enable Input (Active LOW)
A-to-B Enable Input (Active LOW)
B-to-A Enable Input (Active LOW)
A-to-B Latch Enable Input (Active LOW)
B-to-A Latch Enable Input (Active LOW)
A-to-B Data Inputs or
B-to-A 3-STATE Outputs
B0–B7
B-to-A Data Inputs or
A-to-B 3-STATE Outputs
© 2001 Fairchild Semiconductor Corporation
DS012463
www.fairchildsemi.com
Logic Symbols
Data I/O Control Table
Inputs
Latch Status Output Buffers
CEAB LEAB OEAB
H
X
L
X
H
L
X
X
X
H
L
Latched
Latched
Transparent
—
High Z
—
—
X
X
High Z
Driving
L
X
—
IEEE/IEC
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
A-to-B data flow shown; B-to-A flow control is the same, except using
CEBA, LEBA and OEBA
Functional Description
The LCX543 contains two sets of eight D-type latches, with
separate input and output controls for each set. For data
flow from A to B, for example, the A-to-B Enable (CEAB)
input must be LOW in order to enter data from A0–A7 or
take data from B0–B7, as indicated in the Data I/O Control
Table. With CEAB LOW, a LOW signal on the A-to-B Latch
Enable (LEAB) input makes the A-to-B latches transparent;
a subsequent LOW-to-HIGH transition of the LEAB signal
puts the A latches in the storage mode and their outputs no
longer change with the A inputs. With CEAB and OEAB
both LOW, the 3-STATE B output buffers are active and
reflect the data present at the output of the A latches. Con-
trol of data flow from B to A is similar, but using the CEBA,
LEBA and OEBA inputs.
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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2
Absolute Maximum Ratings(Note 2)
Symbol
VCC
Parameter
Supply Voltage
Value
Conditions
Units
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
V
V
VI
DC Input Voltage
VO
DC Output Voltage
Output in 3-STATE
V
−0.5 to VCC + 0.5 Output in HIGH or LOW State (Note 3)
IIK
DC Input Diode Current
DC Output Diode Current
−50
−50
VI < GND
mA
mA
IOK
V
V
O < GND
O > VCC
+50
IO
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
±50
mA
mA
mA
°C
ICC
±100
IGND
TSTG
±100
−65 to +150
Recommended Operating Conditions (Note 4)
Symbol
Parameter
Min
2.0
1.5
0
Max
3.6
3.6
5.5
VCC
5.5
±24
±12
±8
Units
VCC
Supply Voltage
Operating
Data Retention
V
V
V
VI
Input Voltage
VO
Output Voltage
HIGH or LOW State
3-STATE
0
0
IOH/IOL
Output Current
V
V
V
CC = 3.0V − 3.6V
CC = 2.7V − 3.0V
CC = 2.3V − 2.7V
mA
TA
Free-Air Operating Temperature
−40
85
°C
∆t/∆V
Input Edge Rate, VIN = 0.8V − 2.0V, VCC = 3.0V
0
10
ns/V
Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom-
mended Operating Conditions” table will define the conditions for actual device operation.
Note 3: IO Absolute Maximum Rating must be observed.
Note 4: Unused inputs or I/O's must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
VCC
TA = −40°C to +85°C
Symbol
VIH
Parameter
Conditions
Units
(V)
2.3 − 2.7
2.7 − 3.6
2.3 − 2.7
2.7 − 3.6
2.3 − 3.6
2.3
Min
1.7
2.0
Max
HIGH Level Input Voltage
V
V
VIL
LOW Level Input Voltage
HIGH Level Output Voltage
0.7
0.8
VOH
I
I
I
I
I
I
I
I
I
I
OH = −100 µA
OH = −8 mA
OH = −12 mA
OH = −18 mA
OH = −24 mA
OL = 100 µA
OL = 8mA
VCC − 0.2
1.8
2.7
2.2
V
V
3.0
2.4
3.0
2.2
VOL
LOW Level Output Voltage
2.3 − 3.6
2.3
0.2
0.6
OL = 12 mA
OL = 16 mA
OL = 24 mA
2.7
0.4
3.0
0.4
3.0
0.55
±5.0
II
Input Leakage Current
3-STATE I/O Leakage
0 ≤ VI ≤ 5.5V
0 ≤ VO ≤ 5.5V
VI = VIH or VIL
2.3 − 3.6
µA
µA
µA
IOZ
2.3 − 3.6
±5.0
IOFF
Power-Off Leakage Current
VI or VO = 5.5V
0
10
3
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DC Electrical Characteristics (Continued)
VCC
TA = −40°C to +85°C
Symbol
ICC
Parameter
Conditions
Units
(V)
Min
Max
10
Quiescent Supply Current
VI = VCC or GND
3.6V ≤ VI, VO ≤ 5.5V (Note 5)
VIH = VCC −0.6V
2.3 − 3.6
2.3 − 3.6
2.3 − 3.6
µA
µA
±10
500
∆ICC
Increase in ICC per Input
Note 5: Outputs disabled or 3-STATE only.
AC Electrical Characteristics
T
A = −40°C to +85°C, RL = 500Ω
VCC = 2.7V
V
CC = 3.3V ± 0.3V
L = 50 pF
Max
V
CC = 2.5V ± 0.2V
L = 30 pF
Min Max
Symbol
Parameter
Units
C
C
L = 50 pF
Max
C
Min
Min
tPHL
Propagation Delay
1.5
1.5
1.5
1.5
1.5
1.5
7.0
7.0
8.5
8.5
9.0
9.0
1.5
1.5
1.5
1.5
1.5
1.5
8.0
8.0
1.5
1.5
1.5
1.5
1.5
1.5
8.4
8.4
ns
ns
tPLH
tPHL
tPLH
tPZL
tPZH
An to Bn or Bn to An
Propagation Delay
9.5
10.5
10.5
11.0
11.0
LEBA to An or LEAB to Bn
Output Enable Time
9.5
10.0
10.0
OEBA or OEAB to An or Bn
CEBA or CEAB to An or Bn
Output Disable Time
ns
tPLZ
tPHZ
1.5
1.5
7.0
7.0
1.5
1.5
7.5
7.5
1.5
1.5
8.4
8.4
OEBA or OEAB to An or Bn
CEBA or CEAB to An or Bn
ns
ns
tS
Setup Time, HIGH or LOW Data to LEXX
2.5
2.5
4.0
tH
Hold Time, HIGH or LOW Data to LEXX
Pulse Width, Latch Enable, LOW
Output to Output Skew
1.5
3.3
1.5
3.3
2.0
3.3
ns
ns
tW
tOSHL
tOSLH
1.0
1.0
ns
(Note 6)
Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Dynamic Switching Characteristics
VCC
TA = 25°C
Symbol
VOLP
Parameter
Conditions
Units
(V)
3.3
2.5
3.3
2.5
Typical
0.8
Quiet Output Dynamic Peak VOL
C
C
C
C
L = 50 pF, VIH = 3.3V, VIL = 0V
L = 30 pF, VIH = 2.5V, VIL = 0V
L = 50 pF, VIH = 3.3V, VIL = 0V
L = 30 pF, VIH = 2.5V, VIL = 0V
V
V
0.6
VOLV
Quiet Output Dynamic Valley VOL
−0.8
−0.6
Capacitance
Symbol
Parameter
Conditions
CC = Open, VI = 0V or VCC
Typical
Units
pF
CIN
Input Capacitance
Input/Output Capacitance
Power Dissipation Capacitance
V
V
V
7
8
CI/O
CPD
CC = 3.3V, VI = 0V or VCC
pF
CC = 3.3V, VI = 0V or VCC, f = 10 MHz
25
pF
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4
AC LOADING and WAVEFORMS Generic for LCX Family
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)
Test
tPLH, tPHL
tPZL, tPLZ
Switch
Open
6V at VCC = 3.3 ± 0.3V
VCC x 2 at VCC = 2.5 ± 0.2V
tPZH,tPHZ
GND
3-STATE Output High Enable and
Waveform for Inverting and Non-Inverting Functions
Disable Times for Logic
Setup Time, Hold Time and Recovery Time for Logic
Propagation Delay. Pulse Width and trec Waveforms
trise and tfall
3-STATE Output Low Enable and
Disable Times for Logic
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, tR = tF = 3ns)
VCC
Symbol
3.3V ± 0.3V
1.5V
2.7V
1.5V
2.5V ± 0.2V
VCC/2
Vmi
Vmo
Vx
1.5V
1.5V
VCC/2
V
OL + 0.3V
V
OL + 0.3V
VOL + 0.15V
Vy
V
OH − 0.3V
V
OH − 0.3V
VOH − 0.15V
5
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Schematic Diagram Generic for LCX Family
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6
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M24B
24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA24
7
www.fairchildsemi.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC24
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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8
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
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