74LCXH162244MTX [ONSEMI]
低压16位缓冲器/线路驱动器（输出端带26 Ohm串联电阻）;
| 型号： | 74LCXH162244MTX |
| 厂家： | 
ONSEMI |
| 描述： | 低压16位缓冲器/线路驱动器（输出端带26 Ohm串联电阻） 驱动 驱动器 |
| 文件： | 总11页 (文件大小：233K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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September 2000
Revised May 2005
74LCXH162244
Low Voltage 16-Bit Buffer/Line Driver with Bushold
and 26: Series Resistors in Outputs
General Description
Features
■ 5V tolerant control inputs and outputs
The LCXH162244 contains sixteen non-inverting buffers
with 3-STATE outputs designed to be employed as a mem-
ory and address driver, clock driver, or bus oriented trans-
mitter/receiver. The device is nibble controlled. Each nibble
has separate 3-STATE control inputs which can be shorted
together for full 16-bit operation.
■ 2.3V–3.6V VCC specifications provided
■ Outputs include equivalent series resistance of 26 to
make external termination resistors unnecessary and
reduce overshoot and undershoot
■ Bushold on data inputs eliminates the need for external
pull-up/pull-down resistors
The LCXH162244 data inputs include active bushold cir-
cuitry, eliminating the need for external pull-up resistors to
hold unused or floating data inputs at a valid logic level.
■ 5.3 ns tPD max (VCC 3.0V), 20 A ICC max
■ Power down high impedance inputs and outputs
In addition, the outputs include equivalent 26 (nominal)
series resistors to reduce overshoot and undershoot and
are designed to sink/source up to 12 mA at VCC 3.0V.
■
12 mA output drive (VCC 3.0V)
■ Implements proprietary noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
The LCXH162244 is designed for low voltage (2.5V or
3.3V) VCC applications with capability of interfacing to a 5V
signal environment.
Human body model 2000V
The LCXH162244 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Machine model 200V
Ordering Code:
Order Number
Package Number
Package Description
74LCXH162244MEA
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[RAIL]
74LCXH162244MEX
74LCXH162244MTD
74LCXH162244MTX
MS48A
MTD48
MTD48
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[RAIL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
© 2005 Fairchild Semiconductor Corporation
DS500249
www.fairchildsemi.com
Connection Diagram
Logic Symbol
Pin Descriptions
Pin Names
Description
OEn
Output Enable Input (Active LOW)
Bushold Inputs
I0–I15
O0–O15
Outputs
www.fairchildsemi.com
2
Truth Tables
Inputs
Outputs
O0–O3
Inputs
Outputs
O8–O11
OE1
I0–I3
OE3
I8–I11
L
L
L
H
X
L
H
Z
L
L
L
H
X
L
H
Z
H
H
Inputs
Outputs
O4–O7
Inputs
Outputs
O12–O15
OE2
I4–I7
OE4
I12–I15
L
L
L
H
X
L
H
Z
L
L
L
H
X
L
H
Z
H
H
H
L
HIGH Voltage Level
LOW Voltage Level
X
Z
Immaterial
High Impedance
Functional Description
The LCXH162244 contains sixteen non-inverting buffers
with 3-STATE standard outputs. The LCXH162244 data
inputs include active bushold circuitry eliminating the need
for pull-up resistors to hold unused or floating data inputs at
a valid logic level. The devise is also designed with 26
series resistors in the outputs. This design reduces line
noise in applications such as memory address drivers,
clock drivers and bus transceiver/transmitters. The device
is nibble (4 bits) controlled with each nibble functioning
identically, but independent of the other. The control pins
can be shorted together to obtain full 16-bit operation. The
3-STATE outputs are controlled by an Output Enable (OEn)
input for each nibble. When OEn is LOW, the outputs are in
2-state mode. When OEn is HIGH, the outputs are in the
high impedance mode, but this does not interfere with
entering new data into the inputs.
Logic Diagram
3
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Absolute Maximum Ratings(Note 1)
Symbol
Parameter
Supply Voltage
Value
Conditions
Units
VCC
0.5 to 7.0
V
VI
DC Input Voltage
OE
0.5 to 7.0
V
I0 - I15
0.5 to VCC 0.5
VO
DC Output Voltage
0.5 to 7.0
Output in 3-STATE
Output in HIGH or LOW State (Note 2)
VI GND
V
0.5 to VCC 0.5
IIK
DC Input Diode Current
DC Output Diode Current
50
50
mA
mA
IOK
VO GND
50
VO VCC
IO
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
50
mA
mA
mA
C
ICC
100
IGND
TSTG
100
65 to 150
Recommended Operating Conditions (Note 3)
Symbol
Parameter
Min
2.0
1.5
0
Max
3.6
3.6
VCC
VCC
5.5
12
Units
VCC
Supply Voltage
Operating
V
V
V
Data Retention
VI
Input Voltage
VO
Output Voltage
HIGH or LOW State
3-STATE
0
0
I
OH/IOL
Output Current
VCC 3.0V 3.6V
VCC 2.7V 3.0V
VCC 2.3V 2.7V
8
mA
4
TA
t/ V
Free-Air Operating Temperature
40
0
85
C
Input Edge Rate, VIN 0.8V–2.0V, VCC 3.0V
10
ns/V
Note 1: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom-
mended Operating Conditions” table will define the conditions for actual device operation.
Note 2: I Absolute Maximum Rating must be observed.
O
Note 3: Unused control inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
V
T
40 C to 85 C
Min Max
CC
A
Symbol
Parameter
Conditions
Units
(V)
2.3 2.7
2.7 3.6
2.3 2.7
2.7 3.6
2.3 3.6
2.3
V
V
V
HIGH Level Input Voltage
1.7
2.0
IH
V
V
LOW Level Input Voltage
HIGH Level Output Voltage
0.7
IL
0.8
I
I
I
I
I
I
I
I
I
I
I
I
100
A
V
CC
0.2
OH
OH
OH
OH
OH
OH
OH
OL
OL
OL
OL
OL
OL
4 mA
4 mA
6 mA
8 mA
1.8
2.2
2.4
2.0
2.0
2.7
V
V
3.0
2.7
12 mA
100
3.0
V
LOW Level Output Voltage
A
2.3 3.6
2.3
0.2
0.6
OL
4 mA
4 mA
6 mA
8 mA
2.7
0.4
3.0
0.55
0.6
2.7
12 mA
3.0
0.8
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4
DC Electrical Characteristics (Continued)
V
T
40 C to 85 C
CC
A
Symbol
Parameter
Input Leakage Current
Conditions
V or GND
CC
Units
(V)
Min
Max
5.0
I
I
Data
V
0
2.3 3.6
2.3 3.6
I
I
A
Control
V
5.5
5.0
I
Bushold Input Minimum
Drive Hold Current
V
V
V
V
0.7V
1.7V
0.8V
2.0V
45
45
I(HOLD)
I(OD)
OZ
IN
IN
IN
IN
2.3
3.0
A
75
75
I
I
Bushold Input Over-Drive
Current to Change State
(Note 4)
(Note 5)
(Note 4)
(Note 5)
300
300
450
450
2.7
A
A
3.6
3-STATE Output Leakage
0
V
5.5V
or V
O
2.3 3.6
5.0
V
V
V
V
V
IH
I
IL
I
I
Power-Off Leakage Current
Quiescent Supply Current
5.5V
or GND
0
10
20
A
A
A
OFF
CC
O
I
V
2.3 3.6
2.3 3.6
CC
I
Increase in I per Input
V 0.6V
CC
500
CC
CC
IH
Note 4: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 5: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
AC Electrical Characteristics
T
40 C to 85 C, R
500
A
L
V
3.3V 0.3V
50 pF
V
2.7V
V
CC
2.5V 0.2V
CC
CC
Symbol
Parameter
Units
C
C
50 pF
C
L
30 pF
Max
L
L
Min
1.0
1.0
1.0
1.0
1.0
1.0
Max
5.3
5.3
6.3
6.3
5.4
5.4
1.0
1.0
Min
Max
6.0
6.0
7.1
7.1
5.7
5.7
Min
1.0
1.0
1.0
1.0
1.0
1.0
t
t
t
t
t
t
t
t
Propagation Delay
1.0
1.0
1.0
1.0
1.0
1.0
6.4
6.4
8.2
8.2
6.5
6.5
PHL
ns
ns
ns
ns
Data to Output
PLH
Output Enable Time
PZL
PZH
PLZ
Output Disable Time
PHZ
OSHL
OSLH
Output to Output Skew (Note 6)
Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t
) or LOW-to-HIGH (t
). Parameter guaranteed by design.
OSLH
OSHL
Dynamic Switching Characteristics
V
T
25 C
CC
A
Symbol
Parameter
Conditions
Units
(V)
3.3
2.5
3.3
2.5
Typical
0.35
V
Quiet Output Dynamic Peak V
C
C
C
C
50 pF, V
30 pF, V
50 pF, V
30 pF, V
3.3V, V
2.5V, V
3.3V, V
2.5V, V
0V
0V
0V
0V
OLP
OLV
OL
L
L
L
L
IH
IH
IH
IH
IL
IL
IL
IL
V
V
0.25
V
Quiet Output Dynamic Valley V
0.35
OL
0.25
Capacitance
Symbol
Parameter
Conditions
Typical
Units
pF
C
Input Capacitance
Output Capacitance
Power Dissipation Capacitance
V
V
V
Open, V 0V or V
CC
7
8
IN
CC
CC
CC
I
C
C
3.3V, V 0V or V
CC
pF
OUT
PD
I
3.3V, V 0V or V , f 10 MHz
20
pF
I
CC
5
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AC LOADING and WAVEFORMS Generic for LCX Family
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)
VI
6V for VCC 3.3V, 2.7V
CC * 2 for VCC 2.5V
CL
50 pF
30 pF
V
3-STATE Output High Enable and
Waveform for Inverting and Non-Inverting Functions
Disable Times for Logic
Setup Time, Hold Time and Recovery Time for Logic
Propagation Delay. Pulse Width and trec Waveforms
trise and tfall
3-STATE Output Low Enable and
Disable Times for Logic
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, tR = tF = 3ns)
VCC
Symbol
Vmi
3.3V 0.3V
1.5V
2.7V
2.5V 0.2V
VCC/2
1.5V
1.5V
Vmo
Vx
1.5V
VCC/2
VOL 0.3V
VOH 0.3V
VOL 0.3V
VOH 0.3V
VOL 0.15V
VOH 0.15V
Vy
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6
Schematic Diagram Generic for LCXH Family
7
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Physical Dimensions inches (millimeters) unless otherwise noted
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
Package Number MS48A
www.fairchildsemi.com
8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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9
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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