74LCXH16245MTDX [ONSEMI]

带总线保持功能的低电压16位双向收发器;
74LCXH16245MTDX
型号: 74LCXH16245MTDX
厂家: ONSEMI    ONSEMI
描述:

带总线保持功能的低电压16位双向收发器

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May 2002  
Revised June 2005  
74LCXH16245  
Low Voltage 16-Bit Bidirectional Transceiver  
with Bushold  
General Description  
Features  
The LCXH16245 contains sixteen non-inverting bidirec-  
tional buffers with 3-STATE outputs and is intended for bus  
oriented applications. The device is designed for low volt-  
age (2.5V or 3.3V) VCC applications with capability of inter-  
2.3V–3.6V VCC specifications provided  
4.5 ns tPD max (VCC 3.3V), 20 A ICC max  
Power-down high impedance outputs  
Bushold on inputs eliminates the need for external  
pull-up/pull-down resistors  
facing to a 5V signal environment. The device is byte  
controlled. Each byte has separate control inputs which  
could be shorted together for full 16-bit operation. The T/R  
inputs determine the direction of data flow through the  
device. The OE inputs disable both the A and B Ports by  
placing them in a high impedance state.  
24 mA output drive (VCC 3.0V)  
Implements patented noise/EMI reduction circuitry  
Latch-up performance conforms to the requirements of  
JESD78  
The LCXH16245 data inputs include active bushold cir-  
cuitry, eliminating the need for external pull-up resistors to  
hold unused or floating data inputs at a valid logic level.  
ESD performance:  
Human body model 2000V  
Machine model 200V  
The LCXH16245 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA)  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74LCXH16245G  
(Note 1) (Note 2)  
BGA54A  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
74LCXH16245MTD  
(Note 2)  
MTD48  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: Ordering Code Gindicates Trays.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2005 Fairchild Semiconductor Corporation  
DS500581  
www.fairchildsemi.com  
Connection Diagrams  
Pin Descriptions  
Pin Names  
Description  
Output Enable Input  
Transmit/Receive Input  
Pin Assignment for SSOP and TSSOP  
OEn  
T/Rn  
A0A15  
B0B15  
Side A Inputs or 3-STATE Outputs (Bushold)  
Side B Inputs or 3-STATE Outputs (Bushold)  
FBGA Pin Assignments  
1
2
3
4
5
6
A
B
C
D
E
F
B0  
B2  
NC  
B1  
T/R1  
NC  
OE1  
NC  
NC  
A1  
A0  
A2  
B4  
B3  
VCC  
GND  
GND  
GND  
VCC  
NC  
VCC  
GND  
GND  
GND  
VCC  
NC  
A3  
A4  
B6  
B5  
A5  
A6  
B8  
B7  
A7  
A8  
B10  
B12  
B14  
B9  
A9  
A10  
A12  
A14  
G
H
B11  
B13  
A11  
A13  
J
B15  
NC  
T/R2  
OE2  
NC  
A15  
Truth Tables  
Inputs  
Outputs  
OE1  
T/R1  
L
L
L
H
X
Bus B0B7 Data to Bus A0A7  
Bus A0A7 Data to Bus B0B7  
HIGH Z State on A0A7, B0B7  
H
Inputs  
Outputs  
OE2  
T/R2  
Pin Assignment for FBGA  
L
L
L
H
X
Bus B8B15 Data to Bus A8A15  
Bus A8A15 Data to Bus B8B15  
H
HIGH Z State on A8A15, B8B15  
H
L
X
Z
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
High Impedance  
Logic Diagram  
(Top Thru View)  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 3)  
Symbol  
VCC  
Parameter  
Supply Voltage  
Value  
Conditions  
Units  
0.5 to 7.0  
V
V
VI  
DC Input Voltage  
0.5 to VCC 0.5  
0.5 to 7.0  
VO  
DC Output Voltage  
Output in 3-STATE  
V
0.5 to VCC 0.5 Output in HIGH or LOW State (Note 4)  
IIK  
DC Input Diode Current  
DC Output Diode Current  
50  
50  
VI GND  
VO GND  
VO VCC  
mA  
mA  
IOK  
50  
IO  
DC Output Source/Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
50  
mA  
mA  
mA  
C
ICC  
100  
IGND  
TSTG  
100  
65 to 150  
Recommended Operating Conditions (Note 5)  
Symbol  
Parameter  
Min  
2.0  
1.5  
0
Max  
3.6  
3.6  
VCC  
VCC  
VCC  
24  
Units  
VCC  
Supply Voltage  
Operating  
V
V
V
Data Retention  
VI  
Input Voltage  
VO  
Output Voltage  
HIGH or LOW State  
3-STATE  
0
0
IOH/IOL  
Output Current  
VCC 3.0V 3.6V  
VCC 2.7V 3.0V  
VCC 2.3V 2.7V  
12  
mA  
8
TA  
Free-Air Operating Temperature  
40  
0
85  
C
t/ V  
Input Edge Rate, VIN 0.8V2.0V, VCC 3.0V  
10  
ns/V  
Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated  
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The Recom-  
mended Operating Conditionstable will define the conditions for actual device operation.  
Note 4: I Absolute Maximum Rating must be observed.  
O
Note 5: Floating or unused control inputs must be HIGH or LOW.  
DC Electrical Characteristics  
V
T
40 C to 85 C  
Min Max  
CC  
A
Symbol  
Parameter  
Conditions  
Units  
(V)  
2.3 2.7  
2.7 3.6  
2.3 2.7  
2.7 3.6  
2.3 3.6  
2.3  
V
V
V
HIGH Level Input Voltage  
1.7  
2.0  
IH  
V
V
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.7  
IL  
0.8  
I
I
I
I
I
I
I
I
I
I
100  
A
V
CC  
0.2  
OH  
OH  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
8 mA  
1.8  
2.2  
2.4  
2.2  
12 mA  
18 mA  
24 mA  
2.7  
V
3.0  
3.0  
V
LOW Level Output Voltage  
Input Leakage Current  
100  
8mA  
A
2.3 3.6  
2.3  
0.2  
0.6  
0.4  
0.4  
0.55  
5.0  
5.0  
OL  
12 mA  
16 mA  
24 mA  
2.7  
V
A
3.0  
3.0  
I
Data  
V
V or GND  
CC  
2.3 3.6  
2.3 3.6  
I
I
Control  
O
V
5.5  
I
3
www.fairchildsemi.com  
DC Electrical Characteristics (Continued)  
V
T
40 C to 85 C  
Min Max  
CC  
A
Symbol  
Parameter  
Conditions  
Units  
(V)  
I
I
Bushold Input Minimum  
Drive Hold Current  
V
V
V
V
0.7V  
1.7V  
0.8V  
2.0V  
45  
45  
I(HOLD)  
IN  
IN  
IN  
IN  
2.3  
A
75  
3.0  
2.7  
3.6  
75  
Bushold Input Over-Drive  
Current to Change State  
(Note 6)  
(Note 7)  
(Note 6)  
(Note 7)  
300  
300  
450  
450  
I(OD)  
A
I
I
I
3-STATE I/O Leakage  
V
V
or GND  
2.3 3.6  
0
5.0  
10  
A
A
A
A
OZ  
O
CC  
O
Power-Off Leakage Current  
Quiescent Supply Current  
V or V  
5.5V  
or GND  
OFF  
CC  
I
V
V
V
2.33.6  
2.33.6  
20  
I
CC  
I
Increase in I per Input  
V 0.6V  
CC  
500  
CC  
CC  
IH  
Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH.  
Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW.  
AC Electrical Characteristics  
T
40 C to 85 C, R  
500  
A
L
V
3.3V 0.3V  
50 pF  
V
2.7V  
V
CC  
2.5V 0.2V  
CC  
CC  
Symbol  
Parameter  
Units  
C
C
50 pF  
C
L
30 pF  
Max  
L
L
Min  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
Max  
4.5  
4.5  
6.5  
6.5  
6.4  
6.4  
1.0  
1.0  
Min  
Max  
5.2  
5.2  
7.2  
7.2  
6.9  
6.9  
Min  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
t
t
t
t
t
t
t
t
Propagation Delay  
to B or B to A  
n
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
5.4  
5.4  
8.5  
8.5  
7.7  
7.7  
PHL  
ns  
ns  
ns  
ns  
A
PLH  
n
n
n
Output Enable Time  
PZL  
PZH  
PLZ  
Output Disable Time  
PHZ  
OSHL  
OSLH  
Output to Output Skew (Note 8)  
Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The  
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t  
) or LOW-to-HIGH (t  
). Parameter guaranteed by design.  
OSLH  
OSHL  
Dynamic Switching Characteristics  
T
25 C  
V
(V)  
A
CC  
Symbol  
Parameter  
Conditions  
Units  
Typical  
0.8  
V
V
Quiet Output Dynamic Peak V  
C
C
C
C
50 pF, V  
30 pF, V  
50 pF, V  
30 pF, V  
3.3V, V  
2.5V, V  
3.3V, V  
2.5V, V  
0V  
0V  
0V  
0V  
3.3  
2.5  
3.3  
2.5  
OLP  
OL  
L
L
L
L
IH  
IH  
IH  
IH  
IL  
IL  
IL  
IL  
V
V
0.6  
Quiet Output Dynamic Valley V  
0.8  
OLV  
OL  
0.6  
Capacitance  
Symbol  
Parameter  
Conditions  
Typical  
Units  
pF  
C
Input Capacitance  
Input/Output Capacitance  
Power Dissipation Capacitance  
V
V
V
Open, V 0V or V  
CC  
7
8
IN  
CC  
CC  
CC  
I
C
C
3.3V, V 0V or V  
CC  
pF  
I/O  
PD  
I
3.3V, V 0V or V , f 10 MHz  
20  
pF  
I
CC  
www.fairchildsemi.com  
4
AC LOADING and WAVEFORMS Generic for LCX Family  
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)  
Test  
PLH, tPHL  
PZL, tPLZ  
Switch  
Open  
t
t
6V at VCC 3.3 0.3V, 2.7V and  
VCC x 2 at VCC 2.5 0.2V  
tPZH, tPHZ  
GND  
3-STATE Output High Enable and  
Disable Times for Logic  
Waveform for Inverting and Non-Inverting Functions  
Setup Time, Hold Time and Recovery Time for Logic  
Propagation Delay. Pulse Width and trec Waveforms  
trise and tfall  
3-STATE Output Low Enable and  
Disable Times for Logic  
FIGURE 2. Waveforms  
(Input Characteristics; f =1MHz, tr = tf = 3ns)  
VCC  
Symbol  
3.3V 0.3V  
1.5V  
2.7V  
1.5V  
2.5V 0.2V  
VCC/2  
Vmi  
Vmo  
Vx  
1.5V  
1.5V  
VCC/2  
VOL 0.3V  
VOH 0.3V  
VOL 0.3V  
VOH 0.3V  
VOL 0.15V  
VOH 0.15V  
Vy  
5
www.fairchildsemi.com  
Schematic Diagram Generic for LCX Family  
www.fairchildsemi.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
Package Number BGA54A  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Package Number MTD48  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
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FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
8
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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