74LCXR2245MTCX [ONSEMI]
低压双向收发器在A和B端口都有5V容差输入和输出以及26 Ohm串联电阻;型号: | 74LCXR2245MTCX |
厂家: | ONSEMI |
描述: | 低压双向收发器在A和B端口都有5V容差输入和输出以及26 Ohm串联电阻 光电二极管 逻辑集成电路 |
文件: | 总14页 (文件大小:579K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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March 2008
74LCXR2245
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs
and Outputs and 26Ω Series Resistors on Both A and B Ports
Features
General Description
■ 5V tolerant inputs and outputs
The LCXR2245 contains eight non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus ori-
ented applications. The device is designed for low volt-
■ 2.3V–3.6V V specifications provided
CC
■ 8.0ns t max. (V = 3.3V), 10µA I max.
PD
CC
CC
age (2.5V and 3.3V) V
applications with capability of
CC
■ Power down high impedance inputs and outputs
interfacing to a 5V signal environment. The T/R input
determines the direction of data flow through the device.
The OE input disables both the A and B ports by placing
them in a high impedance state. The 26Ω series resistor
helps reduce output overshoot and undershoot.
(1)
■ Supports live insertion/withdrawal
■
12mA output drive (V = 3.0V)
CC
■ Implements proprietary noise/EMI reduction circuitry
■ Latch-up performance exceeds 500mA
■ Equivalent 26Ω series resistor on all outputs
■ ESD performance:
The LCXR2245 is fabricated with an advanced CMOS
technology to achieve high speed operation while main-
taining CMOS low power dissipation.
– Human body model > 2000V
– Machine model > 200V
Note:
1. To ensure the high-impedance state during power up
or down, OE should be tied to V through a pull-up
CC
resistor: the minimum value or the resistor is
determined by the current-sourcing capability of the
driver.
Ordering Information
Package
Order Number
74LCXR2245WM
74LCXR2245SJ
Number
Package Description
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
M20D
74LCXR2245MSA
74LCXR2245MTC
MSA20
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
Connection Diagram
Logic Symbol
Truth Table
Inputs
OE
L
T/R
L
Outputs
Bus B – B Data to Bus A – A
7
0
7
0
Pin Description
L
H
Bus A – A Data to Bus B – B
0 7 0 7
(2)
H
X
HIGH Z State on A – A , B – B
0 7 0 7
Pin Names
Description
OE
Output Enable Input
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
T/R
Transmit/Receive Input
A –A
Side A Inputs or 3-STATE Outputs
Side B Inputs or 3-STATE Outputs
0
7
Z = High Impedance
B –B
0
7
Note:
2. Unused bus terminals during HIGH Z State must be
held HIGH or LOW.
Logic Diagram
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Rating
V
Supply Voltage
–0.5V to +7.0V
CC
V
DC Input Voltage
DC Output Voltage
Output in 3-STATE
–0.5V to +7.0V
I
V
O
–0.5V to +7.0V
(3)
Output in HIGH or LOW State
–0.5V to V + 0.5V
CC
I
DC Input Diode Current, V < GND
–50mA
IK
I
I
DC Output Diode Current
OK
V
< GND
–50mA
+50mA
O
V
> V
CC
O
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
50mA
O
I
100mA
CC
I
100mA
GND
T
–65°C to +150°C
STG
Note:
3. I Absolute Maximum Rating must be observed.
O
(4)
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Max.
Units
V
Supply Voltage
Operating
CC
2.0
1.5
0
3.6
3.6
5.5
V
V
V
Data Retention
Input Voltage
Output Voltage
HIGH or LOW State
3-STATE
V
I
V
O
0
0
V
CC
5.5
I
/ I
Output Current
OH OL
V
V
V
= 3.0V–3.6V
= 2.7V–3.0V
= 2.3V–2.7V
12
8
mA
CC
CC
CC
4
T
Free-Air Operating Temperature
Input Edge Rate, V = 0.8V–2.0V, V = 3.0V
–40
0
85
10
°C
A
∆t / ∆V
ns/V
IN
CC
Note:
4. Unused inputs must be held HIGH or LOW. They may not float.
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
3
DC Electrical Characteristics
T = –40°C to +85°C
A
Symbol
Parameter
V
(V)
Conditions
Min
1.7
Max
Units
CC
V
HIGH Level Input Voltage
2.3–2.7
2.7–3.6
2.3–2.7
2.7–3.6
2.3–3.6
2.3
V
IH
2.0
V
LOW Level Input Voltage
HIGH Level Output Voltage
0.7
0.8
V
V
IL
V
I
I
I
I
I
I
I
I
I
I
I
I
= –100µA
= –4mA
= –4mA
= –6mA
= –8mA
= –12mA
= 100µA
= 4mA
V
– 0.2
OH
OH
OH
OH
OH
OH
OH
OL
OL
OL
OL
OL
OL
CC
1.8
2.2
2.4
2.0
2.0
2.7
3.0
2.7
3.0
V
LOW Level Output Voltage
2.3–3.6
2.3
0.2
0.6
0.4
0.55
0.6
0.8
5.0
5.0
V
OL
2.7
= 4mA
3.0
= 6mA
2.7
= 8mA
3.0
= 12mA
I
Input Leakage Current
3-STATE I/O Leakage
2.3–3.6 0 ≤ V ≤ 5.5V
µA
µA
I
I
I
2.3–3.6 0 ≤ V ≤ 5.5V,
O
OZ
V = V or V
I
IH
IL
I
Power-Off Leakage Current
Quiescent Supply Current
0
V or V = 5.5V
10
10
µA
µA
OFF
I
O
I
2.3–3.6 V = V or GND
I CC
CC
(5)
2.3–3.6 3.6V ≤ V , V ≤ 5.5V
10
I
O
∆I
Increase in I per Input
2.3–3.6
V
= V –0.6V
500
µA
CC
CC
IH
CC
Note:
5. Outputs disabled or 3-STATE only.
AC Electrical Characteristics
T = –40°C to +85°C, R = 500Ω
A
L
V
= 3.3V 0.3V,
V
= 2.7V,
V = 2.5V 0.2V,
CC
CC
CC
C = 50pF
C = 50pF
C = 30pF
L
L
L
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Units
t
, t
Propagation Delay,
1.5
8.0
1.5
9.0
1.5
9.6
ns
PHL PLH
A to B or B to A
n
n
n
n
t
t
, t
Output Enable Time
Output Disable Time
Output to Output Skew
1.5
1.5
9.5
7.5
1.0
1.5
1.5
10.5
8.5
1.5
1.5
11.0
9.0
ns
ns
ns
PZL PZH
, t
PLZ PHZ
(6)
t
, t
OSHL OSLH
Note:
6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate
outputs of the same device. The specification applies to any outputs switching in the same direction, either
HIGH-to-LOW (t
) or LOW-to-HIGH (t
).
OSHL
OSLH
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
4
Dynamic Switching Characteristics
T = 25°C
A
Symbol
Parameter
V
(V)
Conditions
Typical
0.5
Unit
CC
V
Quiet Output Dynamic Peak V
3.3
C = 50pF, V = 3.3V, V = 0V
V
OLP
OL
L
IH
IL
2.5
3.3
2.5
C = 30pF, V = 2.5V, V = 0V
0.4
L
IH
IL
V
Quiet Output Dynamic Valley V
C = 50pF, V = 3.3V, V = 0V
0.5
V
OLV
OL
L
IH
IL
C = 30pF, V = 2.5V, V = 0V
0.4
L
IH
IL
Capacitance
Symbol
Parameter
Conditions
Typical
Units
pF
C
Input Capacitance
V
= Open, V = 0V or V
CC
7
8
IN
CC
CC
CC
I
C
Output Capacitance
V
V
= 3.3V, V = 0V or V
CC
pF
OUT
I
C
Power Dissipation Capacitance
= 3.3V, V = 0V or V , f = 10MHz
25
pF
PD
I
CC
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
5
AC Loading and Waveforms (Generic for LCX Family)
Test
Switch
t
t
, t
Open
PLH PHL
, t
6V at V = 3.3 0.3V
PZL PLZ
CC
V
x 2 at V = 2.5 0.2V
CC
CC
t
, t
GND
PZH PHZ
Figure 1. AC Test Circuit (C includes probe and jig capacitance)
L
3-STATE Output High Enable and
Waveform for Inverting and Non-Inverting Functions
Disable Times for Logic
Setup Time, Hold Time and Recovery Time for Logic
Propagation Delay. Pulse Width and t Waveforms
rec
3-STATE Output Low Enable and
Disable Times for Logic
t
and t
fall
rise
V
CC
Symbol
3.3V 0.3V
1.5V
2.7V
1.5V
1.5V
2.5V 0.2V
V
V
V
/ 2
/ 2
mi
CC
CC
V
1.5V
mo
V
V
+ 0.3V
– 0.3V
V
+ 0.3V
V
+ 0.15V
– 0.15V
x
y
OL
OL
OL
V
V
V
– 0.3V
V
OH
OH
OH
Figure 2. Waveforms (Input Characteristics; f = 1MHz, t = t = 3ns)
r
f
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
6
Schematic Diagram (Generic for LCX Family)
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
7
Physical Dimensions
13.00
12.60
A
11.43
20
11
B
9.50
10.65 7.60
10.00 7.40
2.25
1
10
0.65
0.51
0.35
1.27
PIN ONE
INDICATOR
1.27
M
0.25
C B A
LAND PATTERN RECOMMENDATION
SEE DETAIL A
2.65 MAX
0.33
0.20
C
0.10
C
0.30
0.10
SEATING PLANE
0.75
0.25
X 45°
NOTES: UNLESS OTHERWISE SPECIFIED
(R0.10)
(R0.10)
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
GAGE PLANE
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
0.25
8°
0°
D) CONFORMS TO ASME Y14.5M-1994
1.27
0.40
SEATING PLANE
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
F) DRAWING FILENAME: MKT-M20BREV3
(1.40)
DETAIL A
SCALE: 2:1
Figure 3. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
8
Physical Dimensions (Continued)
Figure 4. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
9
Physical Dimensions (Continued)
Figure 5. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
10
Physical Dimensions (Continued)
Figure 6. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
11
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global
subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
ACEx®
PDP-SPM™
SupreMOS™
FPS™
Power220®
SyncFET™
Build it Now™
CorePLUS™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EZSWITCH™ *
™
FRFET®
POWEREDGE®
Power-SPM™
PowerTrench®
Programmable Active Droop™
QFET®
®
Global Power ResourceSM
Green FPS™
Green FPS™e-Series™
GTO™
i-Lo™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
The Power Franchise®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
µSerDes™
UHC®
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
MicroPak™
MillerDrive™
Motion-SPM™
OPTOLOGIC®
FAST®
Ultra FRFET™
UniFET™
VCX™
OPTOPLANAR®
FastvCore™
®
FlashWriter® *
* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Advance Information
Formative or In Design
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
Preliminary
First Production
Full Production
Not In Production
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
the design.
No Identification Needed
Obsolete
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I33
©2000 Fairchild Semiconductor Corporation
74LCXR2245 Rev. 1.2.0
www.fairchildsemi.com
12
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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
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相关型号:
74LCXR2245MTCX_NL
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26ohm Series Resistors on Both A and B Ports
FAIRCHILD
74LCXR2245SJ
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26з Series Resistors on Both A and B Ports
FAIRCHILD
74LCXR2245SJ
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26 Ohm Series Resistors on Both A and B Ports, SOP 20L, 3800-RAIL
ONSEMI
74LCXR2245SJX
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26 Ohm Series Resistors on Both A and B Ports, SOP 20L, 2000-TAPE REEL
ONSEMI
74LCXR2245WM
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26з Series Resistors on Both A and B Ports
FAIRCHILD
74LCXR2245WM
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26 Ohm Series Resistors on Both A and B Ports, SO 20L WB, 4320-RAIL
ONSEMI
74LCXR2245WMX
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26 Ohm Series Resistors on Both A and B Ports, SO 20L WB, 1000-TAPE REEL
ONSEMI
74LCXR2245_05
Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26ohm Series Resistors on Both A and B Ports
FAIRCHILD
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