74VHC08MTCX [ONSEMI]
四路 2 输入 AND 门极;
| 型号： | 74VHC08MTCX |
| 厂家： | 
ONSEMI |
| 描述： | 四路 2 输入 AND 门极 栅 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总8页 (文件大小：283K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74VHC08
Quad 2-Input AND Gate
General Description
The VHC08 is an advanced high speed CMOS 2 Input AND Gate
fabricated with silicon gate CMOS technology. It achieves the
high−speed operation similar to equivalent Bipolar Schottky TTL
while maintaining the CMOS low power dissipation.
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The internal circuit is composed of 4 stages including buffer output,
which provide high noise immunity and stable output. An input
protection circuit insures that 0 V to 7 V can be applied to the input
pins without regard to the supply voltage. This device can be used to
interface 5 V to 3 V systems and two supply systems such as battery
backup. This circuit prevents device destruction due to mismatched
supply and input voltages.
MARKING
DIAGRAMS
Order Number: 74VHC08M
Features
• High Speed: t = 4.3 ns (Typ.) at T = 25°C
PD
A
SOIC14
CASE 751EF
• High Noise Immunity: V
= V = 28% V (Min.)
NIH
NIL
CC
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
• Power Down Protection is Provided on All Inputs
• Low Power Dissipation: I = 2 mA (Max.) @ T = 25°C
CC
A
WW
= Work Week
• Low Noise: V
= 0.8 V (Max.)
• Pin and Function Compatible with 74HC08
OLP
Order Number: 74VHC08MTCX
14
14
AXYKK
V08
1
1
TSSOP−14 WB
CASE 948G
A
= Assembly Location
XY
KK
= 2−digit 2 Weekly Date Code
= 2−digit Lot Run Code
Order Number: 74VHC08SJX
14
SOP14
CASE 565BE
AXYKK
VHC08
1
A
= Assembly Location
XY
KK
= 2−digit 2 Weekly Date Code
= 2−digit Lot Run Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
June, 2019 − Rev. 3
74VHC08/D
74VHC08
IEEE/IEC
Figure 1. Connection Diagram
PIN DESCRIPTION
Figure 2. Logic Symbol
TRUTH TABLE
Pin Names
Description
A , B
Inputs
A
L
B
L
O
L
n
n
O
Outputs
n
L
H
L
L
H
H
L
H
H
ORDERING INFORMATION
Part Number
†
Package Number
M14A
Package
Packing Method
74VHC08M
SOIC14 (Pb−Free)
SOP14 (Pb−Free)
55 / Tube
74VHC08SJ
M14D
2000 / Tape & Reel
2500 / Tape & Reel
74VHC08MTC
MTC14
TSSOP−14 WB (Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
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2
74VHC08
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Rating
–0.5 V to +7.0 V
–0.5 V to +7.0 V
–0.5 V to VCC + 0.5 V
–20 mA
Supply Voltage
V
CC
DC Input Voltage
V
IN
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current
DC VCC / GND Current
Storage Temperature
V
OUT
I
IK
20 mA
I
OK
25 mA
I
OUT
50 mA
I
CC
–65°C to +150°C
260°C
T
STG
T
L
Lead Temperature (Soldering, 10 seconds)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS (Note 1)
Symbol
Parameter
Rating
Supply Voltage
2.0 V to +5.5 V
0 V to +5.5 V
V
CC
Input Voltage
V
IN
Output Voltage
0 V to V
V
CC
OUT
OPR
Operating Temperature
–40°C to +85°C
T
t , t
Input Rise and Fall Time,
r
f
0 ns/V ∼ 100 ns/V
0 ns/V ∼ 20 ns/V
V
V
= 3.3 V 0.3 V
= 5.0 V 0.5 V
CC
CC
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
74VHC08
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
T
= –405C to +855C
A
Min
Max
Min
1.50
Max
Symbol
Parameter
V
CC
(V)
Conditions
Units
V
2.0
1.50
V
IH
HIGH Level Input
Voltage
3.0–5.5
2.0
0.7 x VCC
0.7 x VCC
V
0.50
0.50
V
V
IL
LOW Level Input
Voltage
3.0–5.5
2.0
0.3 x VCC
0.3 x VCC
V
= V
or VIL
IOH = –50 mA
V
OH
1.9
2.9
2.0
3.0
4.5
1.9
2.9
IN
IH
HIGH Level Output
Voltage
3.0
4.5
4.4
4.4
IOH = –4 mA
IOH = –8 mA
IOL = 50 mA
3.0
2.58
3.94
2.48
3.80
4.5
V
= V
or VIL
V
OL
2.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
V
IN
IH
LOW Level Output
Voltage
3.0
4.5
0.1
0.1
IOL = 4 mA
IOL = 8 mA
3.0
0.36
0.36
0.1
0.44
0.44
1.0
4.5
VIN = 5.5 V or GND
VIN = VCC or GND
I
0–5.5
mA
mA
IN
Input Leakage Current
I
5.5
2.0
20.0
CC
Quiescent Supply
Current
NOISE CHARACTERISTICS
T
A
= 255C
Symbol
Parameter
V
(V)
Conditions
Units
CC
Typ
0.3
Limits
(2)
V
CL = 50 pF
CL = 50 pF
CL = 50 pF
Quiet Output Maximum Dynamic VOL
Quiet Output Minimum Dynamic VOL
5.0
0.8
–0.8
3.5
V
V
V
OLP
(2)
V
5.0
5.0
–0.3
OLV
(2)
V
IHD
Minimum HIGH Level Dynamic Input
Voltage
(2)
V
CL = 50 pF
5.0
1.5
V
ILD
Maximum LOW Level Dynamic Input
Voltage
2. Parameter guaranteed by design.
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4
74VHC08
AC ELECTRICAL CHARACTERISTICS
T
A
= 255C
T
= –405C to +855C
A
Min
Typ
Max
8.8
12.3
5.9
7.9
10
Min
Max
10.5
14.0
7.0
Symbol
, t
Parameter
V
(V)
Conditions
Units
CC
CL = 15 pF
CL = 50 pF
CL = 15 pF
CL = 50 pF
VCC = Open
(Note 3)
Propagation Delay
3.3 0.3
6.2
8.7
4.3
5.8
4
1.0
1.0
1.0
1.0
ns
t
PHL PLH
5.0 0.5
ns
9.0
Input Capacitance
10
pF
pF
C
IN
18
C
PD
Power Dissipation
Capacitance
3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC (opr.) = CPD • VCC • fIN + ICC / 4 (per gate).
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC14
CASE 751EF
ISSUE O
DATE 30 SEP 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13739G
SOIC14
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
−V−
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
J1
K
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
0.65
PITCH
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASH70246A
TSSOP−14 WB
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
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