74VHC161284MTDX [ONSEMI]

IEEE 161284收发器;
74VHC161284MTDX
型号: 74VHC161284MTDX
厂家: ONSEMI    ONSEMI
描述:

IEEE 161284收发器

驱动 光电二极管 接口集成电路 驱动器
文件: 总13页 (文件大小:324K)
中文:  中文翻译
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February 1998  
Revised June 2005  
74VHC161284  
IEEE 1284 Transceiver  
General Description  
Features  
Supports IEEE 1284 Level 1 and Level 2 signaling  
standards for bidirectional parallel communications  
between personal computers and printing peripherals  
The VHC161284 contains eight bidirectional data buffers  
and eleven control/status buffers to implement  
a full  
IEEE 1284 compliant interface. The device supports the  
IEEE 1284 standard and is intended to be used in  
Extended Capabilities Port mode (ECP). The pinout allows  
for easy connection from the Peripheral (A-side) to the  
Host (cable side).  
Replaces the function of two (2) 74ACT1284 devices  
All inputs have hysteresis to provide noise margin  
B and Y output resistance optimized to drive external  
cable  
Outputs on the cable side can be configured to be either  
open drain or high drive ( 14 mA). The pull-up and pull-  
down series termination resistance of these outputs on the  
cable side is optimized to drive an external cable. In addi-  
tion, all inputs (except HLH) and outputs on the cable side  
contain internal pull-up resistors connected to the VCC sup-  
B and Y outputs in high impedance mode during power  
down  
Inputs and outputs on cable side have internal pull-up  
resistors  
Flow-through pin configuration allows easy interface  
ply to provide proper termination and pull-ups for open  
drain mode.  
between the Peripheral and Host  
Outputs on the Peripheral side are standard LOW-drive  
CMOS outputs. The DIR input controls data flow on the A1–  
A8/B1–B8 transceiver pins.  
Ordering Code:  
Ordering Number Package Number  
Package Description  
74VHC161284MEA  
74VHC161284MTD  
MS48A  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
Connection Diagram  
© 2005 Fairchild Semiconductor Corporation  
DS500098  
www.fairchildsemi.com  
Pin Descriptions  
Truth Table  
Pin Names  
Description  
Inputs  
Outputs  
HD  
HIGH Drive Enable Input (Active HIGH)  
Direction Control Input  
Inputs or Outputs  
DIR  
HD  
DIR  
L
L
B1B8 Data to A1A8, and  
A9A13 Data to Y9Y13 (Note 1)  
C14C17 Data to A14A17  
PLH Open Drain Mode  
A1A8  
B1B8  
A9A13  
Y9Y13  
A14A17  
Inputs or Outputs  
Inputs  
Outputs  
L
H
L
B1B 8 Data to A1A8, and  
A9A13 Data to Y9Y13  
Outputs  
C
14C17  
Inputs  
C14C17 Data to A14A17  
A1A8 Data to B1B8 (Note 2)  
A9A13 Data to Y9Y13 (Note 1)  
PLHIN  
PLH  
Peripheral Logic HIGH Input  
Peripheral Logic HIGH Output  
Host Logic HIGH Input  
Host Logic HIGH Output  
H
HLHIN  
HLH  
C14C17 Data to A14A17  
PLH Open Drain Mode  
A1A8 Data to B1B8  
A9A13 Data to Y9Y13  
C14C17 Data to A14A17  
H
H
Note 1: Y Y Open Drain Outputs  
9
13  
Note 2: B B Open Drain Outputs  
1
8
Logic Diagram  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 3)  
Recommended Operating  
Conditions  
Supply Voltage  
VCC  
0.5V to 7.0V  
Supply Voltage  
Input Voltage (VI) (Note 4)  
A1A 13, PLHIN, DIR, HD  
B1B8, C14C17, HLHIN  
B1B8, C14C17, HLHIN  
VCC  
4.5V to 5.5V  
0V to VCC  
0.5V to VCC 0.5V  
0.5V to 5.5V (DC)  
2.0V to 7.0V *  
DC Input Voltage (VI)  
Open Drain Voltage (VO)  
Operating Temperature (TA)  
0V to 5.5V  
40 C to 85 C  
*40 ns Transient  
Output Voltage (VO)  
A1A8, A14A17, HLH  
B1B 8, Y9Y13, PLH  
B1B 8, Y9Y13, PLH  
0.5V to VCC 0.5V  
0.5V to 5.5V (DC)  
2.0V to 7.0V*  
*40 ns Transient  
DC Output Current (IO)  
A1A8, HLH  
25 mA  
50 mA  
84 mA  
50 mA  
B1B8, Y9Y13  
PLH (Output LOW)  
PLH (Output HIGH)  
Input Diode Current (IIK) (Note 4)  
DIR, HD, A9A13  
,
PLH, HLH, C14C17  
Output Diode Current (IOK  
A1A8, A14A17, HLH  
B1B8, Y9Y13, PLH  
DC Continuous VCC or  
Ground Current  
20 mA  
)
50 mA  
50 mA  
Note 3: Absolute Maximum continuos ratings are those values beyond  
which damage to the device may occur. Exposure to these indicated may  
adversely affect device reliability. Functional operation under absolute max-  
imum rated conditions is not implied.  
200 mA  
Note 4: Either voltage limit or current limit is sufficient to protect inputs.  
Storage Temperature  
ESD (HBM) Last Passing  
Voltage  
65 C to 150 C  
2000V  
DC Electrical Characteristics  
V
T
40 C to 85 C  
CC  
A
Symbol  
Parameter  
Units  
Conditions  
(V)  
3.0  
Guaranteed Limits  
V
V
Input Clamp Diode Voltage  
1.2  
V
I
18 mA  
IK  
I
Minimum HIGH Level Input Voltage  
Maximum LOW Level Input Voltage  
Minimum Input Hysteresis  
A , PLH , DIR, HD  
4.5 5.5  
4.5 5.5  
4.5 5.5  
4.5 5.5  
4.5 5.5  
4.5 5.5  
4.5 5.5  
4.5 5.5  
4.5 5.5  
4.5 5.5  
5.0  
0.7 V  
CC  
IH  
n
IN  
B
2.0  
2.3  
2.6  
n
V
C
n
HLH  
IN  
V
A , PLH , DIR, HD  
0.3 V  
CC  
IL  
n
n
IN  
B
0.8  
0.8  
1.6  
0.4  
0.4  
0.8  
0.3  
4.4  
3.8  
3.73  
4.45  
V
V
C
n
HLH  
IN  
VT  
A , PLH , DIR, HD  
V
V
V
V
V  
n
n
IN  
T
T
T
B
V  
T
C
V  
V  
n
T
T
T
HLH  
5.0  
IN  
T
V
Minimum HIGH Level Output Voltage  
A , HLH  
4.5  
I
I
I
I
50 A  
OH  
n
OH  
OH  
OH  
OH  
4.5  
8 mA  
V
B , Y  
n
4.5  
14 mA  
n
PLH  
4.5  
500 A  
3
www.fairchildsemi.com  
DC Electrical Characteristics (Continued)  
V
T
40 C to 85 C  
CC  
A
Symbol  
Parameter  
Units  
Conditions  
50  
(V)  
4.5  
4.5  
4.5  
4.5  
5.0  
5.0  
5.0  
5.0  
5.5  
5.5  
5.5  
5.5  
5.5  
5.5  
5.5  
5.5  
0.0  
0.0  
0.0  
5.5  
Guaranteed Limits  
V
Maximum LOW Level Output Voltage  
A , HLH  
0.1  
0.44  
0.77  
0.7  
I
I
I
I
A
OL  
n
OL  
OL  
OL  
OL  
8 mA  
V
B , Y  
n
14 mA  
84 mA  
n
PLH  
RD  
RP  
Maximum Output Impedance  
Minimum Output Impedance  
Maximum Pull-Up Resistance  
Minimum Pull-Up Resistance  
Maximum Input Current in HIGH State  
B B , Y Y  
55  
(Note 5)(Note 6)  
(Note 5)(Note 6)  
1
8
9
13  
13  
B B , Y Y  
35  
1
8
9
B B , Y Y , C C  
1650  
1150  
1.0  
1
8
9
13  
14  
17  
B B , Y Y , C C  
1
8
9
13  
14  
17  
I
I
I
I
A A , PLH , HD, DIR, HLH  
V
V
V
V
V
V
V
5.5V  
5.5V  
0.0V  
0.0V  
5.5V  
5.5V  
0.0V  
IH  
9
13  
IN  
IN  
I
A
C
C  
100  
1.0  
14  
17  
I
Maximum Input Current in LOW State  
A A , PLH , HD, DIR, HLH  
A
IL  
9
13  
IN  
IN  
I
C
C  
5.0  
mA  
14  
17  
I
Maximum Output Disable Current  
(HIGH)  
A A  
20  
OZH  
OZL  
1
8
O
O
O
A
B B  
100  
20  
1
8
Maximum Output Disable Current  
(LOW)  
A A  
A
mA  
A
1
8
B B  
5.0  
1
8
I
I
I
I
Power Down Output Leakage  
Power Down Input Leakage  
B B , Y Y , PLH  
100  
100  
250  
70  
V
V
5.5V  
5.5V  
OFF  
OFF  
OFF  
CC  
1
8
9
13  
O
C
C , HLH  
IN  
A
14  
17  
I
I
Power Down Leakage to V  
Maximum Supply Current  
A
(Note 7)  
CC  
CC  
mA  
V
V
or GND  
I
CC  
Note 5: Output impedance is measured with the output active LOW and active HIGH (HD HIGH).  
Note 6: This parameter is guaranteed but not tested, characterized only.  
Note 7: Power-down leakage to V  
is tested by simultaneously forcing all pins on the cable-side (B B , Y Y , PLH, C C and HLH to 5.5V and  
1 8 9 13 14 17 IN  
CC  
measuring the resulting I  
.
CC  
www.fairchildsemi.com  
4
AC Electrical Characteristics  
T
40 C to 85 C  
4.5V 5.5V  
A
Figure  
Number  
Symbol  
Parameter  
V
Units  
CC  
Min  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
Max  
30.0  
30.0  
30.0  
30.0  
30.0  
30.0  
30.0  
30.0  
6.0  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
A A to B B  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Figure 1  
Figure 2  
Figure 3  
Figure 3  
Figure 1  
Figure 2  
Figure 3  
Figure 3  
(Note 9)  
Figure 1  
Figure 2  
Figure 3  
Figure 3  
PHL  
1
8
1
8
8
8
8
A A to B B  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
SKEW  
PHL  
PLH  
PHL  
PLH  
PHZ  
PLZ  
PZH  
PZL  
PHZ  
PLZ  
pEN  
1
8
1
B B to A A  
1
8
1
B B to A A  
1
8
1
A A to Y Y  
9
13  
9
13  
13  
A A to Y Y  
9
13  
9
C
C to A A  
17 14  
14  
14  
17  
C
C to A A  
17 14  
17  
LH-LH or HL-HL  
PLH to PLH  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
30.0  
30.0  
30.0  
30.0  
18.0  
18.0  
25.0  
25.0  
25.0  
25.0  
IN  
PLH to PLH  
IN  
HLH to HLH  
IN  
HLH to HLH  
IN  
Output Disable Time  
DIR to A A  
ns  
ns  
ns  
ns  
Figure 7  
Figure 8  
Figure 9  
Figure 2  
Figure 2  
1
8
Output Enable Time  
DIR to A A  
1
8
Output Disable Time  
DIR to B B  
1
8
Output Enable Time  
HD to B B , Y Y  
13  
2.0  
2.0  
28.0  
1
8
9
t
Output Disable Time  
HD to B B , Y Y  
13  
pDis  
28.0  
20.0  
ns  
ns  
1
8
9
t
t
t
t
t  
Output Enable-Output Disable  
Output Slew Rate  
pEn pDis  
SLEW  
PLH  
B B , Y Y  
0.05  
0.05  
0.40  
0.40  
120  
120  
Figure 5  
Figure 4  
Figure 6  
(Note 10)  
1
8
9
13  
V/ns  
ns  
PHL  
t , t  
t
and t  
RISE FALL  
r
f
B B , Y Y (Note 8)  
1
8
9
13  
Note 8: Open Drain  
Note 9: t is measured for common edge output transitions and compares the measured propagation delay for a given path type.  
SKEW  
(i) A A to B B , A Y to Y Y  
13  
1
8
1
8
9
13  
9
(ii) B B to A A  
8
1
8
1
(iii) C C to A A  
17  
14  
17  
14  
Note 10: This parameter is guaranteed but not tested, characterized only.  
Capacitance (Note 11)  
Symbol  
Parameter  
Input Capacitance  
I/O Pin Capacitance  
Typ  
5
Units  
pF  
Conditions  
0.0V (HD, DIR, A A , C C , PLH and HLH )  
IN  
C
C
V
V
IN  
CC  
CC  
9
13  
14  
17  
IN  
12  
pF  
3.3V  
I/O  
Note 11: Capacitance is measured at frequency 1 MHz.  
5
www.fairchildsemi.com  
AC Loading and Waveforms  
Pulse Generator for all pulses: Rate 1.0 MHz; ZO 50 ; tf 2.5 ns, tr 2.5 ns.  
FIGURE 1. Part A to B and A to Y Propagation Delay Load and Waveforms  
FIGURE 2. Port A to B and a to Y Output Waveforms  
FIGURE 3. Port B to A, C to A and HLHin to HLH Propagation Delay Waveforms  
www.fairchildsemi.com  
6
AC Loading and Waveforms (Continued)  
FIGURE 4. Port A to B and A to Y HL Slew Test Load and Waveforms  
FIGURE 5. Part A to b and A to Y LH Slew Test Load and Waveforms  
t
t
Output Rise Time, Open Drain  
Output Fall Time, Open Drain  
r
f
FIGURE 6. tRISE and tFALL Test Load and Waveforms for Open Drain Outputs  
A1–A8 to B1–B8, A9–A13 to Y9–Y13  
7
www.fairchildsemi.com  
AC Loading and Waveforms (Continued)  
FIGURE 7. tPHZ and tPLZ Test Load and Waveforms, DIR to A1A8  
FIGURE 8. tPZH and tPZL Test Load and Waveforms, DIR to A1A8  
www.fairchildsemi.com  
8
AC Loading and Waveforms (Continued)  
FIGURE 9. tPHZ and tPLZ Test Load and Waveforms, DIR to B1B8  
9
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
Package Number MS48A  
www.fairchildsemi.com  
10  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Package Number MTD48  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
11  
www.fairchildsemi.com  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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