98AON66279G [ONSEMI]
TinyLogic UHS 2-Input NAND Gate, Open Drain Output;
| 型号： | 98AON66279G |
| 厂家： | 
ONSEMI |
| 描述： | TinyLogic UHS 2-Input NAND Gate, Open Drain Output 栅 |
| 文件： | 总10页 (文件大小：487K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TinyLogic UHS 2-Input
NAND Gate, Open Drain
Output
NC7SZ38
Description
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The NC7SZ38 is a single 2−Input NAND gate with open drain
output stage from ON Semiconductor’s Ultra−High Speed Series of
TinyLogic. The device is fabricated with advanced CMOS technology
to achieve ultra−high speed with high output drive while maintaining
MARKING
DIAGRAMS
low static power dissipation over a very broad V operating range.
CC
A6KK
XYZ
SIP6 1.45x1.0
CASE 127EB
The device is specified to operate over the 1.65 V to 5.5 V V range.
CC
The inputs and output are high impedance when V is 0 V. Inputs
CC
tolerate voltages up to 5.5 V, independent of V when in the high
impedance state. The open drain output stage tolerates voltages up to
CC
Pin 1
6 V independent of V when in the high impedance state.
CC
UDFN6
1.0X1.0, 0.35P
CASE 517DP
A6KK
XYZ
Features
• Ultra−High Speed: t = 2.2 ns (Typical) into 50 pF at 5 V V
PD
CC
Pin 1
• Open Drain Output Stage for OR Tied Applications
• High Output Sink Drive: 24 mA at 3 V V
CC
SC−74A
CASE 318BQ
7Z38 MG
• Broad V Operating Range: 1.65 V to 5.5 V
CC
G
• Matches Performance of LCX Operated at 3.3 V V
• Power Down High−Impedance Inputs / Outputs
CC
• Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
• Ultra−Small MicroPak™ Packages
Z38MG
SC−88A
CASE 419A−02
G
• Space−Saving SC−74A and SC−88A Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A6, 7Z38, Z38 = Specific Device Code
KK
XY
Z
M
G
= 2−Digit Lot Run Traceability Code
IEEC / IEC
= 2−Digit Date Code Format
= Assembly Plant Code
= Data Code*
A
B
&
Y
= Pb−Free Package
Figure 1. Logic Symbol
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 1996
1
Publication Order Number:
January, 2021 − Rev. 3
NC7SZ38/D
NC7SZ38
Pin Configurations
A 1
B 2
6 V
CC
A
B
1
2
3
5
4
V
Y
CC
5 NC
4 Y
GND
GND 3
Figure 2. SC−88A and SC−74A (Top
Figure 3. MicroPak (Top Through View)
View)
PIN DEFINITIONS
FUNCTION TABLE
Pin # SC−88A /
SC−74A
Inputs
Output
Pin # MicroPak
Name
A
Description
Input
A
L
B
L
Y
*H
*H
*H
L
1
2
3
4
5
1
2
3
4
6
5
B
Input
L
H
L
GND
Y
Ground
Output
H
H
H
V
CC
Supply Voltage
No Connect
H = HIGH Logic Level
L = LOW Logic Level
*H = High Impedance Output State, Open Drain
NC
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2
NC7SZ38
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−0.5
−0.5
−
Max
6.5
Unit
V
V
CC
Supply Voltage
V
IN
DC Input Voltage
6.5
V
V
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Current
6.5
V
OUT
I
V
V
< 0 V
−50
−50
50
mA
mA
mA
mA
°C
IK
IN
I
< 0 V
−
OK
OUT
I
−
OUT
I
or I
DC V or Ground Current
−
50
CC
GND
CC
T
STG
Storage Temperature Range
−65
−
+150
+150
+260
390
332
812
812
4000
2000
T
J
Junction Temperature Under Bias
°C
T
L
Junction Lead Temperature (Soldering, 10 Seconds)
−
°C
P
D
Power Dissipation in Still Air
SC−74A
−
mW
SC−88A
−
MicroPak−6
MicroPak2ꢀ−6
−
−
ESD
Human Body Model, JEDEC: JESD22−A114
Charge Device Model, JEDEC: JESD22−C101
−
V
−
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage Operating
Supply Voltage Data Retention
Input Voltage
Conditions
Min
1.65
1.50
0
Max
5.5
5.5
5.5
5.5
+85
20
Unit
V
CC
V
V
IN
V
V
V
OUT
Output Voltage
0
T
A
Operating Temperature
Input Rise and Fall Times
−40
0
°C
t , t
V
CC
V
CC
V
CC
= 1.8 V, 2.5 V 0.2 V
= 3.3 V 0.3 V
ns/V
r
f
0
10
= 5.0 V 0.5 V
0
5
q
Thermal Resistance
SC−74A
−
320
377
154
154
°C/W
JA
SC−88A
−
MicroPak−6
MicroPak2−6
−
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZ38
DC ELECTICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
Typ
−
Max
−
Min
Max
Symbol
Parameter
V
(V)
Conditions
Unit
CC
V
IH
HIGH Level Input Voltage
1.65 to 1.95
2.30 to 5.50
1.65 to 1.95
2.30 to 5.50
5.50
0.65 V
0.65 V
−
−
V
CC
CC
CC
0.70 V
−
−
0.70 V
CC
V
IL
LOW Level Input Voltage
−
−
−
−
−
−
0.35 V
0.30 V
5
−
−
−
0.35 V
CC
V
CC
0.30 V
10
CC
CC
I
HIGH Level Output Leakage
LOW Level Output Voltage
V
V
= V ,
mA
LKG
IN
OUT
IL
= V or GND
CC
V
OL
1.65
1.80
2.30
3.00
4.50
1.65
2.30
3.00
3.00
4.50
5.50
0
V
OL
= V or V ,
−
−
−
−
−
−
−
−
−
−
−
−
−
0.00
0.00
0.00
0.00
0.00
0.80
0.10
0.15
0.22
0.22
−
0.10
0.10
0.10
0.10
0.10
0.24
0.30
0.40
0.55
0.55
1
−
−
−
−
−
−
−
−
−
−
−
−
−
0.10
0.10
0.10
0.10
0.10
0.24
0.30
0.40
0.55
0.55
10
V
IN
IH
IL
I
= 100 mA
I
OL
I
OL
I
OL
I
OL
I
OL
= 4 mA
= 8 mA
= 16 mA
= 24 mA
= 32 mA
I
IN
Input Leakage Current
V
IN
V
IN
V
IN
= 5.5 V, GND
mA
mA
mA
I
Power Off Leakage Current
Quiescent Supply Current
or V
= 5.5 V
−
1
10
OFF
OUT
I
5.50
= 5.5 V, GND
−
2
20
CC
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Symbol
Parameter
V
(V)
Conditions
Min
Typ
6.5
5.4
3.5
2.8
2.2
5.5
4.6
3.0
2.1
1.3
4.0
5.0
5.1
7.3
Max
Min
Max
13.2
11.0
7.5
5.2
4.5
13.2
11.0
7.5
5.2
4.5
−
Unit
CC
t
Propagation Delay
(Figure 4, 5)
1.65
1.80
C = 50 pF,
−
−
−
−
−
−
−
−
−
−
−
−
−
−
12.7
10.5
7.0
5.0
4.3
12.7
10.5
7.0
6.0
4.3
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
ns
PZL
L
RU = 500 W,
RD = 500 W,
V
IN
= 2 · V
CC
2.50 0.20
3.30 0.30
5.00 0.50
1.65
t
C = 50 pF,
ns
PLZ
L
RU = 500 W,
RD = 500 W,
1.80
V
IN
= 2 · V
CC
2.50 0.20
3.30 0.30
5.00 0.50
0.00
C
Input Capacitance
Output Capacitance
pF
pF
pF
IN
C
0.00
−
−
OUT
C
Power Dissipation Capacitance
(Note 2) (Figure 6)
3.30
−
−
PD
5.00
−
−
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
) at
PD
CCD
no output loading and operating at 50% duty cycle. C is related to I
dynamic operating current by the expression:
PD
CCD
I
= (C ) (V ) (f ) + (I static).
CCD
PD CC IN CC
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4
NC7SZ38
V
CC
RU
RD
OUTPUT
INPUT
C
L
NOTE:
3. CL includes load and stray capacitance.
Input PRR = 10 MHz t = 500 ns.
w
Figure 4. AC Test Circuit
Figure 5. AC Waveforms
V
CC
A
INPUT
NOTE:
4. Input = AC Waveform; t = t = 1.8 ns;
r
f
PRR = 10 MHz; Duty Cycle = 50%.
Figure 6. Test Circuit
DEVICE ORDERING INFORMATION
†
Device
NC7SZ38M5X
NC7SZ38P5X
NC7SZ38L6X
NC7SZ38FHX
Top Mark
7Z38
Z38
Packages
Shipping
5−Lead SC−74A, 1.6mm
5−Lead SC70, EIAJ SC−88a, 1.25 mm Wide
6−Lead MicroPak, 1.00 mm Wide
3000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
A6
A6
6−Lead, MicroPak2, 1 x 1 mm Body, 0.35 mm Pitch
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
DATE 18 JAN 2018
SCALE 2:1
5X b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.20 C A B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
M
5
4
E1
E
1
2
3
0.05
A1
L
B
e
DETAIL A
A
D
MILLIMETERS
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.85
2.50
1.35
MAX
1.10
0.10
0.50
0.26
3.15
3.00
1.65
TOP VIEW
SIDE VIEW
A
DETAIL A
c
0.95 BSC
SEATING
PLANE
END VIEW
C
L
M
0.20
0
0.60
10
_
_
RECOMMENDED
GENERIC
SOLDERING FOOTPRINT*
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
= Specific Device Code
= Date Code
2.40
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
DATE 17 JAN 2013
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
G
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
B
D 5 PL
0.2 (0.008)
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
N
K
N
S
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
GENERIC MARKING
DIAGRAM*
K
H
XXXMG
SOLDER FOOTPRINT
0.50
G
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.65
0.025
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
STYLE 3:
STYLE 1:
PIN 1. BASE
STYLE 2:
STYLE 4:
STYLE 5:
PIN 1. ANODE
2. EMITTER
3. BASE
PIN 1. ANODE 1
2. N/C
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
4. COLLECTOR
5. CATHODE
4. CATHODE 3
5. CATHODE 4
5. GATE 2
STYLE 9:
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
STYLE 7:
STYLE 8:
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
PIN 1. BASE
2. EMITTER
3. BASE
PIN 1. CATHODE
2. COLLECTOR
3. N/C
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
4. COLLECTOR
5. COLLECTOR
4. BASE
5. EMITTER
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
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