AM26LS30D [ONSEMI]

IC,LINE DRIVER,2 DRIVER,ALS-TTL,SOP,16PIN,PLASTIC;
AM26LS30D
型号: AM26LS30D
厂家: ONSEMI    ONSEMI
描述:

IC,LINE DRIVER,2 DRIVER,ALS-TTL,SOP,16PIN,PLASTIC

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文件: 总14页 (文件大小:200K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Order this document by AM26LS30/D  
DUAL DIFFERENTIAL/  
QUAD SINGLE–ENDED  
LINE DRIVERS  
The AM26LS30 is a low power Schottky set of line drivers which can be  
configured as two differential drivers which comply with EIA–422–A  
standards, or as four single–ended drivers which comply with EIA–423–A  
standards. A mode select pin and appropriate choice of power supplies  
determine the mode. Each driver can source and sink currents in excess of  
50 mA.  
SEMICONDUCTOR  
TECHNICAL DATA  
In the differential mode (EIA–422–A), the drivers can be used up to  
10 Mbaud. A disable pin for each driver permits setting the outputs into a  
high impedance mode within a ±10 V common mode range.  
In the single–ended mode (EIA–423–A), each driver has a slew rate  
control pin which permits setting the slew rate of the output signal so as to  
comply with EIA–423–A and FCC requirements and to reduce crosstalk.  
When operated from symmetrical supplies (±5.0 V), the outputs exhibit zero  
imbalance.  
PC SUFFIX  
PLASTIC PACKAGE  
CASE 648  
FN SUFFIX  
PLASTIC PACKAGE  
CASE 775  
The AM26LS30 is available in a 16–pin plastic DIP and surface mount  
package. Operating temperature range is –40° to +85°C.  
D SUFFIX  
PLASTIC PACKAGE  
CASE 751B  
Operates as Two Differential EIA–422–A Drivers, or Four Single–Ended  
EIA–423–A Drivers  
(SO–16)  
High Impedance Outputs in Differential Mode  
Short Circuit Current Limit In Both Source and Sink Modes  
± 10 V Common Mode Range on High Impedance Outputs  
± 15 V Range on Inputs  
PIN CONNECTIONS  
V
1
2
3
4
5
6
SR–A  
16  
15  
14  
13  
12  
11  
10  
9
CC  
Input A  
Input B/  
Output A  
Output B  
Low Current PNP Inputs Compatible with TTL, CMOS, and MOS  
Outputs  
Enable AB  
Mode  
SR–B  
Individual Output Slew Rate Control in Single–Ended Mode  
Gnd  
SR–C  
Replacement for the AMD AM25LS30 and National Semiconductor  
Input C/  
Enable CD  
Input D  
Output C  
DS3691  
Output D  
SR–D  
7
8
V
EE  
(Top View)  
Representative Block Diagrams  
3
9
2
1
20 19  
18  
In B/En AB  
4
5
6
7
8
Out B  
SR–B  
NC  
Single–Ended Mode  
EIA–423–A  
Differential Mode  
EIA–422–A  
Mode  
NC  
17  
16  
15  
14  
Enable AB  
Gnd  
SR–C  
Out C  
SR–A  
In C/En CD  
Input A  
Out A  
10 11 12 13  
Out A  
Out B  
Input A  
SR–B  
Out B  
SR–C  
Out C  
SR–D  
Out D  
Input B  
Input C  
Out C  
Out D  
Input D  
ORDERING INFORMATION  
Operating  
Enable CD  
Temperature Range  
Device  
Package  
AM26LS30PC  
MC26LS30D  
AM26LS30FN  
Plastic DIP  
SO–16  
V
V
–1  
–8  
Gnd–5  
CC  
EE  
Mode–4  
T = – 40° to +85°C  
A
Input D  
PLCC–20  
Motorola, Inc. 1996  
Rev 0  
AM26LS30  
MAXIMUM OPERATING CONDITIONS (Pin numbers refer to DIP and SO–16  
packages only.)  
Rating  
Symbol  
Value  
Unit  
Power Supply Voltage  
V
V
–0.5, +7.0  
–7.0, +0.5  
Vdc  
CC  
EE  
Input Voltage (All Inputs)  
V
–0.5, +20  
Vdc  
Vdc  
in  
Applied Output Voltage when in High Impedance Mode  
V
za  
±15  
(V  
= 5.0 V, Pin 4 = Logic 0, Pins 3, 6 = Logic 1)  
CC  
Output Voltage with V , V  
= 0 V  
V
±15  
CC EE  
zb  
O
Output Current  
I
Self limiting  
–65, +150  
Junction Temperature  
T
°C  
J
Devices should not be operated at these limits. The “Recommended Operating Conditions” table provides  
conditions for actual device operation.  
RECOMMENDED OPERATING CONDITIONS  
Rating  
Symbol  
Min  
Typ  
Max  
Unit  
Power Supply Voltage (Differential Mode)  
V
V
+4.75  
–0.5  
5.0  
0
+5.25  
+0.3  
Vdc  
CC  
EE  
Power Supply Voltage (Single–Ended Mode)  
V
V
+4.75  
–5.25  
+5.0  
–5.0  
+5.25  
–4.75  
CC  
EE  
Input Voltage (All Inputs)  
Applied Output Voltage (when in High Impedance Mode)  
Applied Output Voltage, V  
V
0
–10  
–10  
+15  
+10  
+10  
Vdc  
in  
V
za  
V
zb  
= 0  
CC  
Output Current  
I
–65  
–40  
+65  
+85  
mA  
O
Operating Ambient Temperature (See text)  
All limits are not necessarily functional concurrently.  
T
°C  
A
ELECTRICAL CHARACTERISTICS (EIA–422–A differential mode, Pin 4 0.8 V, –40°C  
= Gnd, unless otherwise noted. Pin numbers refer to DIP and SO–16 packages only.)  
T
A
85°C, 4.75 V  
V
5.25 V,  
CC  
V
EE  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Output Voltage (see Figure 1)  
Differential, R = , V = 5.25 V  
V
V
V  
V
OD1  
OD2  
OD2  
OS  
OS  
2.0  
4.2  
2.6  
10  
2.5  
10  
6.0  
400  
3.0  
400  
Vdc  
Vdc  
mVdc  
Vdc  
L
CC  
Differential, R = 100 , V  
Change in Differential Voltage, R = 100 (Note 4)  
= 4.75 V  
L
CC  
L
Offset Voltage, R = 100 Ω  
L
V  
Change in Offset Voltage*, R = 100 Ω  
mVdc  
L
Output Current (each output)  
I
–100  
–100  
0
0
+100  
+100  
µA  
Power Off Leakage, V  
= 0, –10 V  
V
+10 V  
OLK  
OZ  
CC  
High Impedance Mode, V  
O
I
= 5.25 V, 10 V  
V
+10 V  
CC  
Short Circuit Current (Note 2)  
High Output Shorted to Pin 5 (T = 25°C)  
High Output Shorted to Pin 5 (–40°C  
Low Output Shorted to +6.0 V (T = 25°C)  
O
I
I
I
–150  
–150  
60  
–95  
75  
–60  
–50  
150  
150  
mA  
SC–  
SC–  
SC+  
SC+  
A
T
+85°C)  
A
A
I
50  
Low Output Shorted to +6.0 V (–40°C  
T
A
+85°C)  
Inputs  
V
2.0  
–200  
0
0
–8.0  
0
0.8  
40  
100  
Vdc  
Vdc  
µA  
Low Level Voltage  
High Level Voltage  
IL  
V
IH  
I
IH  
Current @ V = 2.4 V  
in  
I
Current @ V = 15 V  
in  
IHH  
I
Current @ V = 0.4 V  
in  
IL  
IX  
I
Current, 0  
V
15 V, V  
= 0  
CC  
in  
Clamp Voltage (I = –12 mA)  
V
–1.5  
Vdc  
mA  
IK  
in  
Power Supply Current (V  
= +5.25 V, Outputs Open)  
I
CC  
CC  
(0  
Enable  
V
)
16  
30  
CC  
NOTES: 1. All voltages measured with respect to Pin 5.  
2. Only one output shorted at a time, for not more than 1 second.  
3. Typical values established at +25°C, V  
= +5.0 V, V  
= –5.0 V.  
CC  
EE  
4. V switched from 0.8 to 2.0 V.  
in  
5. Imbalance is the difference between  
V
with V  
in  
0.8 V and  
V
with V  
in  
2.0 V.  
O2  
O2  
2
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
TIMING CHARACTERISTICS (EIA–422–A differential mode, Pin 4 0.8 V, T = 25°C, V  
unless otherwise noted.)  
= 5.0 V, V  
= Gnd, (Notes 1 and 3)  
EE  
A
CC  
Characteristic  
Differential Output Rise Time (Figure 3)  
Symbol  
Min  
Typ  
70  
Max  
200  
200  
Unit  
ns  
t
r
Differential Output Fall Time (Figure 3)  
t
f
70  
ns  
Propagation Delay Time – Input to Differential Output  
Input Low to High (Figure 3)  
Input High to Low (Figure 3)  
ns  
t
90  
90  
200  
200  
PDH  
t
PDL  
Skew Timing (Figure 3)  
ns  
ns  
t
t
t
9.0  
2.0  
2.0  
t
to t  
for Each Driver  
SK1  
SK2  
SK3  
PDH  
PDL  
Max to Min t  
Max to Min t  
Within a Package  
Within a Package  
PDH  
PDL  
Enable Timing (Figure 4)  
Enable to Active High Differential Output  
Enable to Active Low Differential Output  
Enable to 3–State Output From Active High  
Enable to 3–State Output From Active Low  
t
t
150  
190  
80  
300  
350  
350  
300  
PZH  
PZL  
PHZ  
t
t
110  
PLZ  
ELECTRICAL CHARACTERISTICS (EIA–423–A single–ended mode, Pin 4 2.0 V, 40°C  
T
A
85°C, 4.75 V  
V
CC  
,
|V  
5.25 V, (Notes 1 and 3) unless otherwise noted).  
EE  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Vdc  
Output Voltage (V  
Single–Ended Voltage, R = (Figure 2)  
Single–Ended Voltage, R = 450 , (Figure 2)  
Voltage Imbalance (Note 5), R = 450 Ω  
=
V
= 4.75 V)  
CC  
EE  
L
L
4.0  
3.6  
4.2  
3.95  
0.05  
6.0  
6.0  
0.4  
V
O1  
V
O2  
V  
L
O2  
Slew Control Current (Pins 16, 13, 12, 9)  
I
±120  
µA  
SLEW  
Output Current (Each Output)  
Power Off Leakage, V  
Short Circuit Current (Output Short to Ground, Note 2)  
= V  
= 0, –6.0 V  
V
+6.0 V  
I
OLK  
–100  
0
+100  
µA  
CC  
EE  
O
V
in  
V
in  
V
in  
V
in  
0.8 V (T = 25°C)  
I
I
I
I
60  
50  
–150  
–150  
80  
–95  
150  
150  
–60  
–50  
mA  
A
SC+  
SC+  
SC–  
SC–  
0.8 V (–40°C  
T
+85°C)  
+85°C)  
A
2.0 V (T = 25°C)  
A
2.0 V (–40°C  
T
A
Inputs  
Low Level Voltage  
High Level Voltage  
Current @ V = 2.4 V  
V
V
I
2.0  
–200  
0
0
8.0  
0
0.8  
40  
100  
Vdc  
Vdc  
µA  
IL  
IH  
IH  
in  
Current @ V = 15 V  
I
in  
Current @ V = 0.4 V  
IHH  
I
in  
IL  
IX  
Current, 0  
V
in  
15 V, V  
= 0  
I
CC  
Clamp Voltage (I = –12 mA)  
V
–1.5  
Vdc  
mA  
in  
Power Supply Current (Outputs Open)  
= +5.25 V, V = 5.25 V, V = 0.4 V  
IK  
I
–22  
17  
8.0  
30  
CC  
V
CC  
I
EE  
EE  
in  
TIMING CHARACTERISTICS (EIA–423–A single–ended mode, Pin 4 2.0 V, T = 25°C, V  
unless otherwise noted.)  
= 5.0 V, V  
= –5.0 V, (Notes 1 and 3)  
EE  
A
CC  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Output Timing (Figure 5)  
Output Rise Time, C = 0  
t
t
65  
65  
3.0  
3.0  
300  
300  
ns  
C
r
f
Output Fall Time, C = 0  
C
Output Rise Time, C = 50 pF  
t
t
µs  
C
r
Output Fall Time, C = 50 pF  
C
f
Rise Time Coefficient (Figure 16)  
C
0.06  
µs/pF  
rt  
Propagation Delay Time, Input to Single Ended Output (Figure 5)  
ns  
Input Low to High, C = 0  
t
t
100  
100  
300  
300  
C
PDH  
PDL  
Input High to Low, C = 0  
C
Skew Timing, C = 0 (Figure 5)  
ns  
C
t
to t  
for Each Driver  
t
t
t
15  
2.0  
5.0  
PDH  
PDL  
SK4  
SK5  
SK6  
Max to Min t  
Max to Min t  
Within a Package  
Within a Package  
PDH  
PDL  
3
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
Table 1  
Inputs  
Outputs  
Operation  
V
CC  
V
EE  
Mode  
A
B
C
D
A
B
C
D
Differential  
(EIA–422–A)  
+5.0  
Gnd  
0
0
0
0
0
0
0
1
X
1
0
1
0
0
1
0
0
0
0
0
0
0
0
1
0
1
1
0
1
X
0
1
Z
1
0
1
1
0
Z
0
1
0
1
0
0
1
0
Z
0
1
1
0
1
Z
Single–Ended  
(EIA–423–A)  
+5.0  
–5.0  
1
1
1
1
1
0
1
0
0
0
0
0
1
0
0
0
0
0
1
0
0
0
0
0
1
0
1
0
0
0
0
0
1
0
0
0
0
0
1
0
0
0
0
0
1
X
0
X
X
X
X
X
X
Z
Z
Z
Z
X = Don’t Care  
Z = High Impedance (Off)  
Figure 1. Differential Output Test  
Figure 2. Single–Ended Output Test  
V
CC  
V
CC  
R /2  
L
V
in  
(0.8 or 2.0 V)  
V
in  
(0.8 or 2.0 V)  
V
R
C
OD2  
L
L
V
O
V
R /2  
L
OS  
V
EE  
Mode = 1  
Mode = 0  
Figure 3. Differential Mode Rise/Fall Time and Data Propagation Delay  
+3.0 V  
1.5 V  
V
CC  
1.5 V  
V
in  
V
0 V  
in  
t
PDH  
100  
t
500 pF  
V
PDL  
OD  
90%  
50%  
10%  
90%  
50%  
out 10%  
S.G.  
V
t
t
f
r
NOTES: 1. S.G. set to: f  
1.0 MHz; duty cycle = 50%; t , t ,  
–t for each driver.  
10 ns.  
r
f
2. t  
3. t  
4. t  
=
t
SK1  
SK2  
SK3  
PDH PDL  
computed by subtracting the shortest t  
computed by subtracting the shortest t  
from the longest t  
from the longest t  
of the 2 drivers within a package.  
of the 2 drivers within a package.  
PDH  
PDL  
PDH  
PDL  
4
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
Figure 4. Differential Mode Enable Timing  
+3.0 V  
1.5 V  
V
CC  
1.5 V  
V
in  
0 V  
0 or 3.0 V  
500 pF  
R
L
V
SS  
t
PHZ  
t
450  
En  
PZH  
0.1 V /R  
SS  
V
L
in  
(V = Hi)  
in  
V
/R  
SS  
L
0.5 V /R  
SS  
L
Output  
S.G.  
Current  
t
PLZ  
0.5 V /R  
SS  
L
V
/R  
SS  
L
(V = Lo)  
in  
t
0.1 V /R  
SS  
PZL  
L
NOTES: 1. S.G. set to: f  
1.0 MHz; duty cycle = 50%; t , t ,  
10 ns.  
r
f
2. Above tests conducted by monitoring output current levels.  
Figure 5. Single–Ended Mode Rise/Fall Time and Data Propagation Delay  
+2.5 V  
1.5 V  
V
CC  
1.5 V  
V
in  
C
C
0 V  
Vin  
t
PDH  
t
PDL  
450  
500 pF  
V
O
90%  
50%  
10%  
90%  
50%  
10%  
V
EE  
S.G.  
V
out  
t
t
f
r
NOTES: 1. S.G. set to: f  
100 kHz; duty cycle = 50%; t , t , 10 ns.  
r f  
2. t  
3. t  
4. t  
=
t
–t for each driver.  
SK4  
SK5  
SK6  
PDH PDL  
computed by subtracting the shortest t  
computed by subtracting the shortest t  
from the longest t  
from the longest t  
of the 4 drivers within a package.  
of the 4 drivers within a package.  
PDH  
PDL  
PDH  
PDL  
5
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
Figure 6. Differential Output Voltage  
versus Load Current  
Figure 7. Internal Bias Current  
versus Load Current  
5.0  
4.0  
40  
Differential Mode  
Mode = 0  
Supply Current = Bias Current + Load Current  
30  
20  
10  
3.0  
2.0  
Differential Mode  
Mode = 0, V  
= 5.0 V  
CC  
V
= 5.25 V  
20  
CC  
0.8 or  
2.0 V  
1.0  
0
I
O
V
OD  
0
10  
20  
30  
40  
50  
60  
0
40  
60  
80  
100  
120  
I
, OUTPUT CURRENT (mA)  
TOTAL LOAD CURRENT (mA)  
O
Figure 9. Input Current versus  
Input Voltage  
(Pin numbers refer to DIP and SO–16 packages only.)  
Figure 8. Short Circuit Current  
versus Output Voltage  
+100  
+60  
+5.0  
V
= 0  
CC  
0
Normally Low Output  
Normally High Output  
–5.0  
–10  
–15  
–20  
–25  
V
= 5.0 V  
CC  
+20  
–20  
Pins 2 to 4, 6, 7  
–5.0 V  
Differential or  
Single–Ended Mode  
V
0
EE  
Differential Mode  
Mode = 0, V = 5.0 V  
–60  
CC  
–100  
0
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
–1.0  
1.0  
3.0  
5.0  
7.0  
9.0  
11  
13  
15  
V
, APPLIED OUTPUT VOLTAGE (V)  
za  
V
, INPUT VOLTAGE (V)  
in  
Figure 10. Output Voltage versus  
Output Source Current  
Figure 11. Output Voltage versus  
Output Sink Current  
4.5  
4.0  
3.5  
–3.25  
–3.75  
Single–Ended Mode  
Mode = 1  
Single–Ended Mode  
Mode = 1  
–4.25  
–4.75  
V
V
= 5.0 V, V  
= 1  
= –5.0 V  
CC  
in  
EE  
V
V
= 5.0 V, V  
= 0  
= –5.0 V  
CC  
in  
EE  
3.0  
0
10  
20  
30  
40  
50  
60  
0
10  
20  
30  
40  
50  
60  
I
, OUTPUT CURRENT (mA)  
I
, OUTPUT CURRENT (mA)  
OH  
OL  
6
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
Figure 12. Internal Positive Bias Current  
versus Load Current  
Figure 13. Internal Negative Bias Current  
versus Load Current  
26  
22  
0
Single Ended Mode  
Mode = 1  
V
= 5.0 V, V  
= –5.0 V  
CC  
Supply Current = Bias Current + I  
EE  
–5.0  
–10  
–15  
–20  
OH  
18  
14  
10  
V
= Lo  
V
= Hi  
in  
in  
Single–Ended Mode  
Mode = 1  
V
= 5.0 V, V  
= –5.0 V  
CC  
Supply Current = Bias Current + I  
EE  
V
= Lo V = Hi  
in  
in  
OL  
240  
160  
80  
0
–80  
–160  
–240  
240  
160  
80  
0
–80  
–160  
–240  
I
I
I
I
OH  
OL  
TOTAL LOAD CURRENT (mA)  
OH  
OL  
TOTAL LOAD CURRENT (mA)  
Figure 14. Short Circuit Current  
versus Output Voltage  
Figure 15. Short Circuit Current  
versus Temperature  
110  
90  
100  
60  
Normally Low Output  
Normally Low Output  
20  
70  
Single or Differential Mode  
= 5.0 V, V = 5.0 V or Gnd  
V
CC  
EE  
–20  
50  
Normally High Output  
Single–Ended Mode  
Mode = 1  
–60  
–90  
–100  
–110  
Normally High Output to Ground  
V
= 5.0 V, V  
= –5.0 V  
CC  
EE  
–100  
–6.0  
–4.0  
–2.0  
0
2.0  
4.0  
6.0  
–40  
–20  
0
20  
40  
60  
85  
V
, APPLIED OUTPUT VOLTAGE (V)  
T , AMBIENT TEMPERATURE (  
°C)  
za  
A
Figure 16. Rise/Fall Time versus Capacitance  
1.0 k  
100  
10  
Single–Ended Mode  
Mode = 1  
V
= 5.0 V, V  
= –5.0 V  
CC  
EE  
1.0  
10  
100  
1.0 k  
, CAPACITANCE (pF)  
10 k  
C
C
7
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
APPLICATIONS INFORMATION  
(Pin numbers refer to DIP and SO–16 packages only.)  
Description  
Figure 11 will vary directly with V . A “high” output can only  
EE  
source current, while a “low” output can only sink current  
The AM26LS30 is a dual function line driver – it can be  
configured as two differential output drivers which comply  
with EIA–422–A Standard, or as four single–ended drivers  
which comply with EIA–423–A Standard. The mode of  
operation is selected with the Mode pin (Pin 4) and  
appropriate power supplies (see Table 1). Each of the four  
outputs is capable of sourcing and sinking 60 to 70 mA while  
providing sufficient voltage to ensure proper data  
transmission.  
As differential drivers, data rates to 10 Mbaud can be  
transmitted over a twisted pair for a distance determined by  
the cable characteristics. EIA–422–A Standard provides  
guidelines for cable length versus data rate. The advantage  
of a differential (balanced) system over a single–ended  
system is greater noise immunity, common mode rejection,  
and higher data rates.  
(except short circuit current – see Figure 14).  
The outputs will be in a high impedance mode only if  
V
1.1 V. Changing V  
to 0 V does not set the outputs  
CC  
EE  
to a high impedance mode. Leakage current over a common  
mode range of ±10 V is typically less than 1.0 µA.  
The outputs have short circuit current limiting, typically  
less than 100 mA over a voltage range of ±6.0 V (see Figure  
14). Short circuits should not be allowed to last indefinitely as  
the IC may be damaged.  
Capacitors connected between Pins 9, 12, 13, and 16 and  
their respective outputs will provide slew rate limiting of the  
output transition. Figure 16 indicates the required capacitor  
value to obtain a desired rise or fall time (measured between  
the 10% and 90% points). The positive and negative  
transition times will be within ≈ ±5% of each other. Each  
output may be set to a different slew rate if desired.  
Where extraneous noise sources are not a problem, the  
AM26LS30 may be configured as four single–ended drivers  
transmitting data rates to 100 Kbaud. Crosstalk among wires  
within a cable is controlled by the use of the slew rate control  
pins on the AM26LS30.  
Inputs  
The five inputs determine the state of the outputs in  
accordance with Table 1. All inputs (regardless of the  
operating mode) have a nominal threshold of +1.3 V, and  
their voltage must be kept within a range of 0 V to +15 V for  
proper operation. If an input is taken more than 0.3 V below  
ground, excessive currents will flow, and the proper operation  
of the drivers will be affected. An open pin is equivalent to a  
logic high, but good design practices dictate that inputs  
should never be left open. Unused inputs should be  
connected to ground. The characteristics of the inputs are  
shown in Figure 9.  
Mode Selection  
(Differential Mode)  
In this mode (Pins 4 and 8 at ground), only a +5.0 V supply  
±5% is required at V . Pins 2 and 7 are the driver inputs,  
while Pins 10, 11, 14 and 15 are the outputs (see Block  
Diagram on page 1). The two outputs of a driver are always  
complementary and the differential voltage available at each  
pair of outputs is shown in Figure 6 for V  
differential output voltage will vary directly with V . A “high”  
output can only source current, while a “low” output can only  
sink current (except for short circuit current – see Figure 8).  
The two outputs will be in a high impedance mode when  
the respective Enable input (Pin 3 or 6) is high, or if V  
1.1 V. Output leakage current over a common mode range of  
± 10 V is typically less than 1.0 µA.  
The outputs have short circuit current limiting, typically,  
less than 100 mA over a voltage range of 0 to +6.0 V (see  
Figure 8). Short circuits should not be allowed to last  
indefinitely as the IC may be damaged.  
Pins 9, 12, 13 and 16 are not normally used when in this  
mode, and should be left open.  
CC  
= 5.0 V. The  
CC  
CC  
Power Supplies  
V
requires +5.0 V, ±5%, regardless of the mode of  
CC  
operation. The supply current is determined by the IC’s  
internal bias requirements and the total load current. The  
internally required current is a function of the load current and  
is shown in Figure 7 for the differential mode.  
CC  
In the single–ended mode, V  
must be –5.0 V, ±5% in  
EE  
order to comply with EIA–423–A standards. Figures 12 and  
13 indicate the internally required bias currents as a function  
of total load current (the sum of the four output loads). The  
discontinuity at 0 load current exists due to a change in bias  
current when the inputs are switched. The supply currents  
vary ≈ ± 2.0 mA as V  
5.25 V .  
and V  
are varied from  
4.75 V to  
EE  
CC  
(Single–Ended Mode)  
Sequencing of the supplies during power–up/power–down  
is not required.  
In this mode (Pin 4 2.0 V) V  
requires +5.0 V, and V  
EE  
CC  
requires –5.0 V, both ±5.0%. Pins 2, 3, 6, and 7 are inputs for  
the four drivers, and Pins 15, 14, 11, and 10 (respectively) are  
the outputs. The four drivers are independent of each other,  
and each output will be at a positive or a negative voltage  
depending on its input state, the load current, and the supply  
voltage. Figures 10 & 11 indicate the high and low output  
Bypass capacitors (0.1 µF minimum on each supply pin)  
are recommended to ensure proper operation. Capacitors  
reduce noise induced onto the supply lines by the switching  
action of the drivers, particularly where long P.C. board tracks  
are involved. Additionally, the capacitors help absorb  
transients induced onto the drivers’ outputs from the external  
cable (from ESD, motor noise, nearby computers, etc.).  
voltages for V  
= 5.0 V, and V  
= –5.0 V. The graph of  
CC  
EE  
Figure 10 will vary directly with V , and the graph of  
CC  
8
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
Operating Temperature Range  
The maximum ambient operating temperature, listed as  
+85°C, is actually a function of the system use (i.e.,  
specifically how many drivers within a package are used) and  
at what current levels they are operating. The maximum  
power which may be dissipated within the package is  
determined by:  
The junction temperature calculates to:  
T
= 85°C + (0.454 W  
= DIP package,  
= 85°C + (0.454 W  
= SOIC package.  
67°C/W) = 115°C for the  
J
T
T
T
J
J
120°C/W) = 139°C for the  
J
Since the maximum allowable junction temperature is not  
exceeded in any of the above cases, either package can be  
used in this application.  
T
T
Jmax  
R
A
P
2) Single–Ended Mode Power Dissipation  
For the single–ended mode, the power dissipated within  
the package is calculated from:  
Dmax  
JA  
where R  
= package thermal resistance which is typically:  
θJA  
P
[(I  
= (I  
V
) + (I  
)]  
V
) +  
EE  
67°C/W for the DIP (PC) package,  
120°C/W for the SOIC (D) package,  
D
O
B+  
(V  
CC  
– V  
B–  
CC  
OH (each driver)  
T
= max. allowable junction temperature (150°C)  
Jmax  
The above equation assumes I has the same magnitude  
O
for both output states, and makes use of the fact that the  
absolute value of the graphs of Figures 10 and 11 are nearly  
T = ambient air temperature near the IC package.  
A
1) Differential Mode Power Dissipation  
For the differential mode, the power dissipated within the  
package is calculated from:  
identical. I + and I – are obtained from the right half of  
B
B
Figures 12 and 13, and (V  
– V  
) can be obtained from  
CC  
Figure 10. Note that the term (V  
given value of I and does not vary with V . For an  
OH  
– V  
) is constant for a  
CC  
OH  
P
= [(V  
– V  
)
I ]  
+ (V  
I )  
B
D
CC  
OD  
O (each driver)  
CC  
O
CC  
application involving the following conditions:  
where:  
where:  
where:  
where:  
V
V
V
= the supply voltage  
CC  
OD  
OD  
T
= +85°C, I = –60 mA (each driver), V  
= 5.25 V,  
= –5.25 V, the suitability of the package types is  
A
O
CC  
= is taken from Figure 6 for the known  
= value of I  
V
EE  
O
calculated as follows.  
I
B
= the internal bias current (Figure 7)  
The power dissipated is:  
P
= (24 mA  
= [60 mA  
= 490 mW  
5.25 V) + (–3.0 mA  
1.45 V 4.0]  
–5.25 V) +  
D
As indicated in the equation, the first term (in brackets) must  
be calculated and summed for each of the two drivers, while  
the last term is common to the entire package. Note that the  
P
P
D
D
The junction temperature calculates to:  
term (V  
–V ) is constant for a given value of I and does  
CC OD O  
T
= 85°C + (0.490 W  
= DIP package,  
= 85°C + (0.490 W  
= SOIC package.  
67°C/W) = 118°C for the  
J
not vary with V . For an application involving the following  
conditions:  
CC  
T
T
T
J
J
120°C/W) = 144°C for the  
T = +85°C, I = –60 mA (each driver), V = 5.25 V, the  
A
O
CC  
J
suitability of the package types is calculated as follows.  
The power dissipated is:  
Since the maximum allowable junction temperature is not  
exceeded in any of the above cases, either package can be  
used in this application.  
P
D
P
D
= [3.0 V  
= 454 mW  
60 mA  
2] + (5.25 V  
18 mA)  
9
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
SYSTEM EXAMPLES  
(Pin numbers refer to DIP and SO–16 packages only.)  
Differential System  
An example of a typical EIA–422–A system is shown in  
Figure 17. Although EIA–422–A does not specifically address  
multiple driver situations, the AM26LS30 can be used in this  
manner since the outputs can be put into a high impedance  
mode. It is, however, the system designer’s responsibility to  
ensure the Enable pins are properly controlled so as to  
prevent two drivers on the same cable from being “on” at the  
same time.  
The limit on the number of receivers and drivers which  
may be connected on one system is determined by the input  
current of each receiver, the maximum leakage current of  
each “off” driver, and the DC current through each  
terminating resistor. The sum of these currents must not  
exceed the capability of the “on” driver (60 mA). If the cable  
is of any significant length, with receivers at various points  
along its length, the common mode voltage may vary along  
its length, and this parameter must be considered when  
calculating the maximum driver current.  
The cable requirements are defined not only by the AC  
characteristics and the data rate, but also by the DC  
resistance. The maximum resistance must be such that the  
minimum voltage across any receiver inputs is never less than  
200 mV.  
The ground terminals of each driver and receiver in Figure  
17 must be connected together by a dedicated wire (or the  
shield) in the cable to provide a common reference. Chassis  
grounds or power line grounds should not be relied on for this  
common connection as they may generate significant  
common mode differences. Additionally, they usually do not  
provide a sufficiently low impedance at the frequencies  
of interest.  
minimum voltage across any receiver inputs is never less  
than 200 mV.  
The ground terminals of each driver and receiver in Figure  
18 must be connected together by a dedicated wire (or the  
shield) in the cable so as to provide a common reference.  
Chassis grounds or power line grounds should not be relied  
on for this common connection as they may generate  
significant common mode differences. Additionally, they  
usually do not provide a sufficiently low impedance at the  
frequencies of interest.  
Additional Modes of Operation  
If compliance with EIA–422–A or EIA–423–A Standard is  
not required in a particular application, the AM26LS30 can be  
operated in two other modes.  
1) The device may be operated in the differential mode  
(Pin 4 = 0) with V  
connected to any voltage between  
ground and –5.25 V. Outputs in the low state will be  
EE  
referenced to V , resulting in a differential output voltage  
EE  
greater than that shown in Figure 6. The Enable pins will  
operate the same as previously described.  
2) The device may be operated in the single–ended mode  
(Pin 4 = 1) with V  
ground and –5.25 V. Outputs in the high state will be at a  
voltage as shown in Figure 10, while outputs in a low state  
connected to any voltage between  
EE  
will be referenced to V  
.
EE  
Termination Resistors  
Transmission line theory states that, in order to preserve  
the shape and integrity of a waveform traveling along a cable,  
the cable must be terminated in an impedance equal to its  
characteristic impedance. In a system such as that depicted  
in Figure 17, in which data can travel in both directions, both  
physical ends of the cable must be terminated. Stubs leading  
to each receiver and driver should be as short as possible.  
In a system such as that depicted in Figure 18, in which  
data normally travels in one direction only, a terminator is  
theoretically required only at the receiving end of the cable.  
However, if the cable is in a location where noise spikes of  
several volts can be induced onto it, then a terminator  
(preferably a series resistor) should be placed at the driver  
end to prevent damage to the driver.  
Single–Ended System  
An example of a typical EIA–423–A system is shown in  
Figure 18. Multiple drivers on a single data line are not  
possible since the drivers cannot be put into a high  
impedance mode. Although each driver is shown connected  
to a single receiver, multiple receivers can be driven from a  
single driver as long as the total load current of the receivers  
and the terminating resistor does not exceed the capability of  
the driver (60 mA). If the cable is of any significant length,  
with receivers at various points along its length, the common  
mode voltage may vary along its length, and this parameter  
must be considered when calculating the maximum  
driver current.  
Leaving off the terminations will generally result in  
reflections which can have amplitudes of several volts above  
V
or several volts below ground or V . These  
CC  
EE  
overshoots/undershoots can disrupt the driver and/or  
receiver, create false data, and in some cases, damage  
components on the bus.  
The cable requirements are defined not only by the AC  
characteristics and the data rate, but also by the DC  
resistance. The maximum resistance must be such that the  
10  
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
Figure 17. EIA–422–A Example  
En  
R
TTL  
R
TTL  
TTL  
D
En  
TTL  
D
R
T
En  
TTL  
D
TTL  
R
En  
TTL  
TTL  
D
R
En  
D
TTL  
TTL  
R
T
En  
Twisted  
Pair  
TTL  
D
R
NOTES: 1. Terminating resistors R should be located at the physical ends of the cable.  
T
2. Stubs should be as short as possible.  
3. Receivers = AM26LS32, MC3486, SN75173 or SN75175.  
4. Circuit grounds must be connected together through a dedicated wire.  
Figure 18. EIA–423–A Example  
C
C
+
R
R
R
R
TTL  
TTL  
TTL  
D
TTL  
R
T
T
T
C
C
C
C
C
C
+
D
D
D
TTL  
TTL  
TTL  
R
R
+
+
TTL  
R
T
AM26LS30  
AM26LS32, MC3486, SN75173, or SN75175  
11  
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
OUTLINE DIMENSIONS  
PC SUFFIX  
PLASTIC PACKAGE  
CASE 648–08  
ISSUE R  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
16  
1
9
8
B
S
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.270  
0.175  
0.021  
0.70  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
0.740  
0.250  
0.145  
0.015  
0.040  
C
L
SEATING  
PLANE  
–T–  
G
H
J
K
L
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
M
S
0.020  
0.040  
0.51  
1.01  
M
M
0.25 (0.010)  
T A  
D SUFFIX  
PLASTIC PACKAGE  
CASE 751B–05  
(SO–16)  
ISSUE J  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
1
9
8
–B–  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
S
0.25 (0.010)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
MIN  
9.80  
3.80  
1.35  
0.35  
0.40  
MAX  
10.00  
4.00  
1.75  
0.49  
1.25  
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
F
0.386  
0.150  
0.054  
0.014  
0.016  
R X 45  
K
C
F
G
J
K
M
P
R
1.27 BSC  
0.050 BSC  
–T–  
SEATING  
PLANE  
0.19  
0.10  
0
0.25  
0.25  
7
0.008  
0.004  
0
0.009  
0.009  
7
J
M
D
16 PL  
5.80  
0.25  
6.20  
0.50  
0.229  
0.010  
0.244  
0.019  
M
S
S
0.25 (0.010)  
T
B
A
12  
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
OUTLINE DIMENSIONS  
FN SUFFIX  
PLASTIC PACKAGE  
CASE 775–02  
ISSUE C  
M
S
S
0.007 (0.180)  
T
L–M  
N
B
Y BRK  
–M–  
–N–  
M
S
S
0.007 (0.180)  
T
L–M  
N
U
D
D
–L–  
Z
W
20  
1
S
S
S
0.010 (0.250)  
T
L–M  
N
G1  
X
V
VIEW D–D  
M
M
S
S
S
S
A
R
0.007 (0.180)  
0.007 (0.180)  
T
L–M  
L–M  
N
N
Z
T
M
S
S
0.007 (0.180)  
T
L–M  
N
H
C
K1  
E
K
0.004 (0.100)  
–T– SEATING  
G
J
PLANE  
M
S
S
0.007 (0.180)  
T
L–M  
N
F
VIEW S  
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T
L–M  
N
NOTES:  
INCHES  
MILLIMETERS  
1. DATUMS –L–, –M–, AND –N– DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC  
BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
DIM  
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1  
K1  
MIN  
MAX  
0.395  
0.395  
0.180  
0.110  
0.019  
MIN  
MAX  
10.03  
10.03  
4.57  
2.79  
0.48  
0.385  
0.385  
0.165  
0.090  
0.013  
9.78  
9.78  
4.20  
2.29  
0.33  
0.050 BSC  
1.27 BSC  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
–––  
0.032  
–––  
–––  
0.356  
0.356  
0.048  
0.048  
0.056  
0.020  
10  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
–––  
2
0.81  
–––  
–––  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
6. THE PACKAGE TOP MAY BE SMALLER THAN THE  
PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE TOP  
AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037 (0.940).  
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE  
THE H DIMENSION TO BE SMALLER THAN 0.025  
(0.635).  
2
0.310  
0.040  
0.330  
–––  
7.88  
1.02  
8.38  
–––  
13  
MOTOROLA ANALOG IC DEVICE DATA  
AM26LS30  
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454  
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,  
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315  
MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609  
INTERNET: http://Design–NET.com  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,  
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
AM26LS30/D  

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