BCW32LT1G_09 [ONSEMI]
General Purpose Transistors; 通用晶体管型号: | BCW32LT1G_09 |
厂家: | ONSEMI |
描述: | General Purpose Transistors |
文件: | 总6页 (文件大小:189K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BCW32LT1G
General Purpose
Transistors
NPN Silicon
Features
http://onsemi.com
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
COLLECTOR
3
1
BASE
MAXIMUM RATINGS
Rating
Symbol
Value
32
Unit
Vdc
2
EMITTER
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
V
CEO
V
CBO
32
Vdc
V
EBO
5.0
Vdc
Collector Current − Continuous
I
C
100
mAdc
3
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1
2
SOT−23 (TO−236AB)
CASE 318
THERMAL CHARACTERISTICS
STYLE 6
Characteristic
Symbol
Value
Unit
Total Device Dissipation
FR-5 Board
P
D
mW
(1)
MARKING DIAGRAM
225
T = 25°C
Derate above 25°C
A
1.8
mW/°C
°C/W
D2 M G
Thermal Resistance,
R
q
JA
556
G
Junction−to−Ambient
1
Total Device Dissipation
P
300
mW
D
(2)
Alumina Substrate, T = 25°C
A
D2 = Device Code
Derate above 25°C
2.4
mW/°C
°C/W
M
G
= Date Code*
= Pb−Free Package
Thermal Resistance,
Junction−to−Ambient
R
q
417
JA
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Junction and Storage Temperature
T , T
−55 to +150
°C
J
stg
1. FR−5 = 1.0 ꢀ 0.75 ꢀ 0.062 in.
2. Alumina = 0.4 ꢀ 0.3 ꢀ 0.024 in. 99.5% alumina.
ORDERING INFORMATION
†
Device
Package
Shipping
BCW32LT1G
SOT−23
3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
August, 2009 − Rev. 2
BCW32LT1/D
BCW32LT1G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Collector−Emitter Breakdown Voltage
V
32
32
−
−
−
−
−
−
Vdc
Vdc
Vdc
(BR)CEO
(BR)CBO
(BR)EBO
(I = 2.0 mAdc, V = 0)
C
EB
Collector−Base Breakdown Voltage
(I = 10 mAdc, I = 0)
V
V
C
E
Emitter−Base Breakdown Voltage
(I = 10 mAdc, I = 0)
5.0
E
C
Collector Cutoff Current
(V = 32 Vdc, I = 0)
I
CBO
−
−
−
−
100
10
nAdc
mAdc
CB
E
(V = 32 Vdc, I = 0, T = 100°C)
CB
E
A
ON CHARACTERISTICS
DC Current Gain
h
FE
−
(I = 2.0 mAdc, V = 5.0 Vdc)
200
−
−
−
−
450
0.25
0.70
C
CE
Collector−Emitter Saturation Voltage
(I = 10 mAdc, I = 0.5 mAdc)
V
Vdc
Vdc
CE(sat)
C
B
Base−Emitter On Voltage
(I = 2.0 mAdc, V = 5.0 Vdc)
V
BE(on)
0.55
C
CE
SMALL−SIGNAL CHARACTERISTICS
Output Capacitance
C
−
−
−
−
4.0
10
pF
dB
obo
(I = 0, V = 10 Vdc, f = 1.0 MHz)
E
CB
Noise Figure
NF
(I = 0.2 mAdc, V = 5.0 Vdc, R = 2.0 kW, f = 1.0 kHz, BW = 200 Hz)
C
CE
S
TYPICAL NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25°C)
20
10
100
I = 1.0 mA
C
BANDWIDTH = 1.0 Hz
R ≈ ∞
BANDWIDTH = 1.0 Hz
R = 0
50
I = 1.0 mA
C
S
S
20
300 mA
300 mA
10
100 mA
5.0
7.0
5.0
100 mA
2.0
1.0
10 mA
0.5
0.2
0.1
30 mA
30 mA
3.0
2.0
10 mA
10 20
50 100 200
500 1ꢀk
2ꢀk
5ꢀk 10ꢀk
10
20
50 100 200
500 1ꢀk
2ꢀk
5ꢀk 10ꢀk
f, FREQUENCY (Hz)
f, FREQUENCY (Hz)
Figure 1. Noise Voltage
Figure 2. Noise Current
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2
BCW32LT1G
NOISE FIGURE CONTOURS
(VCE = 5.0 Vdc, TA = 25°C)
500ꢀk
1ꢀM
500ꢀk
BANDWIDTH = 1.0 Hz
BANDWIDTH = 1.0 Hz
200ꢀk
100ꢀk
50ꢀk
200ꢀk
100ꢀk
50ꢀk
20ꢀk
20ꢀk
10ꢀk
10ꢀk
5ꢀk
2.0 dB
1.0 dB
5ꢀk
2ꢀk
1ꢀk
3.0 dB
4.0 dB
2.0 dB
2ꢀk
1ꢀk
3.0 dB
5.0 dB
8.0 dB
6.0 dB
10 dB
500
500
200
100
50
200
100
10
20 30
50 70 100
200 300
500 700 1ꢀk
10
20 30
50 70 100
200 300
500 700 1ꢀk
I , COLLECTOR CURRENT (mA)
C
I , COLLECTOR CURRENT (mA)
C
Figure 3. Narrow Band, 100 Hz
Figure 4. Narrow Band, 1.0 kHz
500ꢀk
10 Hz to 15.7 kHz
200ꢀk
100ꢀk
50ꢀk
Noise Figure is defined as:
2
20ꢀk
2
R
n S
2
1ń2
e
n
) 4KTR ) I
S
10ꢀk
5ꢀk
10 ǒ
Ǔ
NF + 20 log
4KTR
S
1.0 dB
e
n
= Noise Voltage of the Transistor referred to the input. (Figure 3)
2ꢀk
1ꢀk
2.0 dB
I
= Noise Current of the Transistor referred to the input.
3.0 dB
(Figure 4)
n
500
−23
K
= Boltzman’s Constant (1.38 x 10
j/°K)
5.0 dB
8.0 dB
T
R
= Temperature of the Source Resistance (°K)
= Source Resistance (W)
200
100
50
S
20 30
50 70 100
200 300
500 700 1ꢀk
10
I , COLLECTOR CURRENT (mA)
C
Figure 5. Wideband
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3
BCW32LT1G
TYPICAL STATIC CHARACTERISTICS
400
200
T = 125°C
J
25°C
-ꢁ55°C
100
80
60
V
V
= 1.0 V
= 10 V
CE
CE
40
0.004 0.006 0.01
0.02 0.03 0.05 0.07 0.1
0.2 0.3
0.5 0.7 1.0
3.0
2.0
5.0 7.0 10
20
30
50 70 100
I , COLLECTOR CURRENT (mA)
C
Figure 6. DC Current Gain
1.0
100
T = 25°C
PULSE WIDTH = 300 ms
DUTY CYCLE ≤ 2.0%
A
T = 25°C
J
I = 500 mA
B
0.8
0.6
0.4
0.2
0
80
60
400 mA
300 mA
200 mA
I = 1.0 mA
C
10 mA
50 mA
100 mA
40
20
0
100 mA
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
5.0 10 20
0
5.0
10
15
20
25
30
35
40
I , BASE CURRENT (mA)
B
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 7. Collector Saturation Region
Figure 8. Collector Characteristics
1.4
1.2
1.6
0.8
0
*APPLIES for I /I ≤ h /2
C
B
FE
T = 25°C
J
25°C to 125°C
-55°C to 25°C
1.0
0.8
0.6
0.4
*q for V
VC
CE(sat)
V
@ I /I = 10
C B
BE(sat)
-ꢁ0.8
-ꢁ1.6
-ꢁ2.4
V
BE(on)
@ V = 1.0 V
CE
25°C to 125°C
-55°C to 25°C
0.2
0
q
for V
BE
VB
V
@ I /I = 10
C B
CE(sat)
0.1 0.2
0.5 1.0
2.0
5.0
10
20
50 100
0.1
0.2
0.5
1.0 2.0
5.0 10 20
50 100
I , COLLECTOR CURRENT (mA)
C
I , COLLECTOR CURRENT (mA)
C
Figure 9. “On” Voltages
Figure 10. Temperature Coefficients
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4
BCW32LT1G
TYPICAL DYNAMIC CHARACTERISTICS
10
7.0
5.0
T = 25°C
J
f = 1.0 MHz
C
ib
C
ob
3.0
2.0
1.0
0.05 0.1
0.2
0.5
1.0
2.0
5.0
10
20
50
V , REVERSE VOLTAGE (VOLTS)
R
Figure 11. Capacitance
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5
BCW32LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
SEE VIEW C
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE,
NEW STANDARD 318−08.
3
H
E
E
1
2
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
e
L
L1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
MIN
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
b
0.25
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
e
q
A
L
A1
L1
H
E
VIEW C
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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BCW32LT1/D
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