BUL146F [ONSEMI]
功率 8A 400V NPN;型号: | BUL146F |
厂家: | ONSEMI |
描述: | 功率 8A 400V NPN 局域网 开关 晶体管 功率双极晶体管 |
文件: | 总11页 (文件大小:229K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BUL146G, BUL146FG
SWITCHMODEt NPN
Bipolar Power Transistor
For Switching Power Supply Applications
The BUL146G / BUL146FG have an applications specific
state−of−the−art die designed for use in fluorescent electric lamp
ballasts to 130 W and in Switchmode Power supplies for all types of
electronic equipment.
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POWER TRANSISTOR
8.0 AMPERES
Features
• Improved Efficiency Due to Low Base Drive Requirements:
♦ High and Flat DC Current Gain
♦ Fast Switching
1000 VOLTS
45 and 125 WATTS
♦ No Coil Required in Base Circuit for Turn−Off (No Current Tail)
MARKING
DIAGRAMS
• Full Characterization at 125°C
• Two Packages Choices: Standard TO−220 or Isolated TO−220
• Parametric Distributions are Tight and Consistent Lot−to−Lot
• BUL146F, Case 221D, is UL Recognized to 3500 V
: File # E69369
• These Devices are Pb−Free and are RoHS Compliant*
RMS
BUL146G
AYWW
MAXIMUM RATINGS
TO−220AB
CASE 221A−09
STYLE 1
Rating
Symbol
Value
Unit
Vdc
Vdc
Vdc
Adc
1
Collector−Emitter Sustaining Voltage
Collector−Base Breakdown Voltage
Emitter−Base Voltage
V
CEO
400
700
9.0
2
3
V
CES
V
EBO
Collector Current − Continuous
− Peak (Note 1)
I
6.0
15
C
I
I
CM
Base Current
− Continuous
− Peak (Note 1)
I
4.0
8.0
Adc
V
B
BM
BUL146FG
AYWW
RMS Isolation Voltage (Note 2)
BUL146F
4500
3500
1500
(for 1 sec, R.H. < 30%, T = 25_C)
V
ISOL1
V
ISOL2
V
ISOL3
C
TO−220 FULLPACK
CASE 221D
STYLE 2
UL RECOGNIZED
1
2
3
Total Device Dissipation @ T = 25_C
P
D
W
W/_C
C
BUL146
100
40
BUL146F
Derate above 25°C
BUL146
0.8
BUL146F
0.32
G
A
Y
WW
= Pb−Free Package
= Assembly Location
Operating and Storage Temperature
T , T
−65 to 150
_C
J
stg
= Year
= Work Week
THERMAL CHARACTERISTICS
Characteristics
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case
R
_C/W
q
JC
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
BUL146
1.25
BUL146F
3.125
Thermal Resistance, Junction−to−Ambient
R
62.5
260
_C/W
_C
q
JA
Maximum Lead Temperature for Soldering
Purposes 1/8″ from Case for 5 Seconds
T
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤ 10%.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
2. Proper strike and creepage distance must be provided.
©
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
April, 2010 − Rev. 9
BUL146/D
BUL146G, BUL146FG
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (I = 100 mA, L = 25 mH)
V
400
−
−
−
Vdc
mAdc
mAdc
C
CEO(sus)
Collector Cutoff Current (V = Rated V
, I = 0)
I
CEO
−
100
CE
CEO
B
Collector Cutoff Current (V = Rated V
, V = 0)
I
−
−
−
−
−
−
100
500
100
CE
CES EB
CES
(T = 125°C)
(T = 125°C)
C
C
Collector Cutoff Current (V = 500 V, V = 0)
CE
EB
Emitter Cutoff Current (V = 9.0 Vdc, I = 0)
I
−
−
100
mAdc
EB
C
EBO
ON CHARACTERISTICS
Base−Emitter Saturation Voltage (I = 1.3 Adc, I = 0.13 Adc)
V
−
−
0.82
0.93
1.1
Vdc
Vdc
C
B
BE(sat)
Base−Emitter Saturation Voltage (I = 3.0 Adc, I = 0.6 Adc)
1.25
C
B
Collector−Emitter Saturation Voltage (I = 1.3 Adc, I = 0.13 Adc)
V
−
−
−
−
0.22
0.20
0.30
0.30
0.5
0.5
0.7
0.7
C
B
CE(sat)
(T = 125°C)
C
Collector−Emitter Saturation Voltage (I = 3.0 Adc, I = 0.6 Adc)
C
B
(T = 125°C)
C
DC Current Gain (I = 0.5 Adc, V = 5.0 Vdc)
h
FE
14
−
−
34
−
−
C
CE
(T = 125°C)
30
20
20
13
12
20
C
DC Current Gain (I = 1.3 Adc, V = 1.0 Vdc)
12
12
8.0
7.0
10
−
C
CE
(T = 125°C)
C
−
DC Current Gain (I = 3.0 Adc, V = 1.0 Vdc)
−
C
CE
(T = 125°C)
C
−
DC Current Gain (I = 10 mAdc, V = 5.0 Vdc)
−
C
CE
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth (I = 0.5 Adc, V = 10 Vdc, f = 1.0 MHz)
f
−
−
−
14
95
−
MHz
pF
C
CE
T
Output Capacitance (V = 10 Vdc, I = 0, f = 1.0 MHz)
C
OB
150
1500
CB
E
Input Capacitance (V = 8.0 V)
C
1000
pF
EB
IB
−
−
2.5
6.5
−
−
1.0 ms
3.0 ms
1.0 ms
3.0 ms
(I = 1.3 Adc
C
(T = 125°C)
C
I
B1
= 300 mAdc
Dynamic Saturation Voltage:
Determined 1.0 ms and
−
−
0.6
2.5
−
−
V
CC
= 300 V)
(T = 125°C)
C
3.0 ms respectively after
V
V
CE(dsat)
rising I reaches 90% of
B1
−
−
3.0
7.0
−
−
final I
(I = 3.0 Adc
C
B1
(T = 125°C)
C
(see Figure 18)
I
B1
= 0.6 Adc
−
−
0.75
1.4
−
−
V
CC
= 300 V)
(T = 125°C)
C
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2
BUL146G, BUL146FG
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)
C
Characteristic
SWITCHING CHARACTERISTICS: Resistive Load (D.C. ≤ 10%, Pulse Width = 20 ms)
Symbol
Min
Typ
Max
Unit
Turn−On Time
Turn−Off Time
Turn−On Time
Turn−Off Time
(I = 1.3 Adc, I = 0.13 Adc
t
on
t
off
t
on
t
off
−
−
100
90
200
ns
ms
ns
ms
C
B1
I
= 0.65 Adc, V = 300 V)
(T = 125°C)
−
B2
CC
C
−
−
1.35
1.90
2.5
−
(T = 125°C)
C
(I = 3.0 Adc, I = 0.6 Adc
−
−
90
100
150
−
C
B1
B1
CC
I
= 1.5 Adc, V = 300 V)
(T = 125°C)
C
−
−
1.7
2.1
2.5
−
(T = 125°C)
C
SWITCHING CHARACTERISTICS: Inductive Load (V
= 300 V, V = 15 V, L = 200 mH)
CC
clamp
Fall Time
(I = 1.3 Adc, I = 0.13 Adc
B2
t
fi
−
−
115
120
200
ns
ms
ns
ns
ms
ns
ns
ms
ns
C
B1
I
= 0.65 Adc)
(T = 125°C)
−
C
Storage Time
Crossover Time
Fall Time
t
si
−
−
1.35
1.75
2.5
−
(T = 125°C)
C
t
c
−
−
200
210
350
−
(T = 125°C)
C
(I = 3.0 Adc, I = 0.6 Adc
t
fi
−
−
85
100
150
−
C
B2
B1
I
= 1.5 Adc)
(T = 125°C)
C
Storage Time
Crossover Time
Fall Time
t
si
−
−
1.75
2.25
2.5
−
(T = 125°C)
C
t
−
−
175
200
300
−
c
fi
(T = 125°C)
C
(I = 3.0 Adc, I = 0.6 Adc
t
80
−
−
210
180
−
C
B2
B1
I
= 0.6 Adc)
(T = 125°C)
C
Storage Time
Crossover Time
t
si
2.6
−
−
4.5
3.8
−
(T = 125°C)
C
t
c
−
−
230
400
350
−
(T = 125°C)
C
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3
BUL146G, BUL146FG
TYPICAL STATIC CHARACTERISTICS
100
100
V
CE
= 5 V
T = 125°C
J
T = 125°C
J
V
CE
= 1 V
T = 25°C
J
T = 25°C
J
T = -ꢀ20°C
J
T = -ꢀ20°C
J
10
10
1
0.01
1
0.01
0.1
1
10
0.1
1
10
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 1. DC Current Gain @ 1 Volt
Figure 2. DC Current Gain @ 5 Volts
2
10
1
T = 25°C
J
I = 1 A
C
2 A
3 A
5 A
6 A
1
I /I = 10
C B
0.1
T = 25°C
T = 125°C
J
J
I /I = 5
C B
0
0.01
0.01
0.01
0.1
1
10
0.1
1
10
I , BASE CURRENT (mA)
B
I COLLECTOR CURRENT (AMPS)
C
Figure 3. Collector Saturation Region
Figure 4. Collector−Emitter Saturation Voltage
1.2
10000
1000
T = 25°C
J
f = 1 MHz
1.1
1
C
ib
0.9
0.8
0.7
0.6
100
10
1
C
ob
T = 25°C
J
T = 125°C
J
I /I = 5
C B
I /I = 10
0.5
0.4
C B
0.01
0.1
1
10
1
10
100
1000
I , COLLECTOR CURRENT (AMPS)
C
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 5. Base−Emitter Saturation Region
Figure 6. Capacitance
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4
BUL146G, BUL146FG
TYPICAL SWITCHING CHARACTERISTICS
(I = I /2 for all switching)
B2
C
1000
800
600
400
4000
3500
3000
2500
2000
1500
I
= I /2
B(off) C
= 300 V
I
= I /2
B(off) C
= 300 V
I /I = 5
C B
I /I = 10
T = 25°C
T = 125°C
J
J
V
CC
V
CC
C B
PW = 20 ms
PW = 20 ms
I /I = 5
C B
T = 125°C
J
I /I = 10
C B
1000
200
0
T = 25°C
J
500
0
0
2
4
6
8
0
2
4
6
8
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 7. Resistive Switching, ton
Figure 8. Resistive Switching, toff
2500
2000
4000
3500
3000
2500
2000
1500
1000
500
T = 25°C
T = 125°C
J
I
= I /2
B(off) C
= 15 V
I
= I /2
B(off) C
= 15 V
J
V
CC
V = 300 V
V
CC
V = 300 V
I /I = 5
C B
Z
Z
I = 3 A
C
L = 200 mH
C
L = 200 mH
C
1500
1000
500
0
I = 1.3 A
C
T = 25°C
T = 125°C
J
J
I /I = 10
C B
0
0
1
2
3
4
5
6
7
8
3
4
5
6
7
I COLLECTOR CURRENT (AMPS)
C
h , FORCED GAIN
FE
Figure 9. Inductive Storage Time, tsi
Figure 10. Inductive Storage Time, tsi(hFE)
250
200
150
100
250
200
150
100
50
I
= I /2
B(off) C
= 15 V
t
c
V
CC
V = 300 V
Z
t
L = 200 mH
C
c
t
fi
t
fi
I
= I /2
B(off) C
= 15 V
50
0
V
CC
V = 300 V
T = 25°C
T = 125°C
J
T = 25°C
T = 125°C
J
Z
J
L = 200 mH
C
J
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 11. Inductive Switching, tc and tfi
IC/IB = 5
Figure 12. Inductive Switching, tc and tfi
IC/IB = 10
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BUL146G, BUL146FG
TYPICAL SWITCHING CHARACTERISTICS
(I = I /2 for all switching)
B2
C
250
200
150
130
120
110
100
90
I = 1.3 A
C
I = 1.3 A
C
I = 3 A
C
I
= I /2
B(off) C
= 15 V
V
CC
V = 300 V
I = 3 A
C
Z
80
I
= I /2
B(off) C
= 15 V
L = 200 mH
C
100
50
V
CC
V = 300 V
T = 25°C
T = 125°C
70
60
T = 25°C
T = 125°C
J
J
Z
J
L = 200 mH
C
J
3
4
5
6
7
8
9
10 11 12 13 14 15
3
4
5
6
7
8
9
10 11 12 13 14 15
h
FE
, FORCED GAIN
h
FE
, FORCED GAIN
Figure 14. Inductive Cross−Over Time
Figure 13. Inductive Fall Time
GUARANTEED SAFE OPERATING AREA INFORMATION
7
100
10
T
≤ 125°C
DC (BUL146)
5 ms
C
6
I /I ≥ 4
C B
1 ms
10 ms
1 ms
L = 500 mH
C
5
4
EXTENDED
SOA
1
3
2
V
BE(off)
0.1
-ꢀ5 V
1
0
0 V
-1, 5 V
600
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
0.01
0
200
400
800
10
100
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
1000
V
CE
V
CE
Figure 16. Reverse Bias Switching Safe Operating Area
Figure 15. Forward Bias Safe Operating Area
There are two limitations on the power handling ability of a tran-
sistor: average junction temperature and second breakdown. Safe
operating area curves indicate IC − VCE limits of the transistor that
must be observed for reliable operation; i.e., the transistor must not
be subjected to greater dissipation than the curves indicate. The data
of Figure 15 is based on TC = 25°C; TJ(pk) is variable depending on
power level. Second breakdown pulse limits are valid for duty
cycles to 10% but must be derated when TC > 25°C. Second break-
down limitations do not derate the same as thermal limitations. Al-
lowable current at the voltages shown in Figure 15 may be found at
any case temperature by using the appropriate curve on Figure 17.
1,0
SECOND BREAKDOWN
DERATING
0,8
0,6
0,4
T
J(pk) may be calculated from the data in Figure 20. At any case tem-
peratures, thermal limitations will reduce the power that can be
handled to values less than the limitations imposed by second break-
down. For inductive loads, high voltage and current must be sus-
tained simultaneously during turn−off with the base−to−emitter
junction reverse−biased. The safe level is specified as a reverse−
biased safe operating area (Figure 16). This rating is verified under
clamped conditions so that the device is never subjected to an ava-
lanche mode.
THERMAL DERATING
0,2
0,0
20
40
60
80
100
120
140
160
T , CASE TEMPERATURE (°C)
C
Figure 17. Forward Bias Power Derating
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6
BUL146G, BUL146FG
10
5
4
V
CE
90% I
I
C
C
9
8
7
6
5
t
fi
3
dyn 1 ms
t
si
2
dyn 3 ms
1
t
c
10% I
C
V
10% V
CLAMP
0
CLAMP
-1
-2
-3
-4
-5
4
3
2
1
0
90% I
B
I
B
90% I 1
B
1 ms
3 ms
I
B
0
1
2
3
4
5
6
7
8
TIME
TIME
Figure 18. Dynamic Saturation Voltage Measurements
Figure 19. Inductive Switching Measurements
+15 V
I PEAK
C
100 mF
1 mF
MTP8P10
MUR105
MJE210
100 W
3 W
150 W
3 W
V
CE
PEAK
V
CE
MTP8P10
MPF930
R
R
B1
I 1
B
I
MPF930
+10 V
out
I
B
A
I 2
B
50 W
B2
V(BR)CEO(sus)
L = 10 mH
INDUCTIVE SWITCHING
L = 200 mH
RB2 = 0
RBSOA
COMMON
MTP12N10
150 W
3 W
L = 500 mH
RB2 = 0
RB2 = ∞
500 mF
V
= 20 VOLTS
I (pk) = 100 mA
V
CC
= 15 VOLTS
V
CC
= 15 VOLTS
CC
RB1 SELECTED FOR
DESIRED I 1
RB1 SELECTED
FOR DESIRED I 1
C
1 mF
B
B
-V
off
Table 1. Inductive Load Switching Drive Circuit
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BUL146G, BUL146FG
TYPICAL THERMAL RESPONSE
1
D = 0.5
0.2
0.1
P
(pk)
0.1
R (t) = r(t) R
q q
JC JC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
0.05
0.02
t
1
1
t
2
T
- T = P
C
R (t)
q
JC
J(pk)
(pk)
SINGLE PULSE
DUTY CYCLE, D = t /t
1 2
0.01
0.01
0.1
1
10
100
1000
t, TIME (ms)
Figure 20. Typical Thermal Response (ZqJC(t)) for BUL146
1.00
D = 0.5
0.2
P
(pk)
R
R
(t) = r(t) R
q
JC
q
JC
0.10
0.1
= 3.125°C/W MAX
q
JC
D CURVES APPLY FOR
POWER PULSE TRAIN
SHOWN READ TIME AT t
0.05
0.02
t
1
1
t
2
T
- T = P
C
R (t)
q
JC
J(pk)
(pk)
DUTY CYCLE, D = t /t
SINGLE PULSE
1 2
0.01
0.01
0.10
1.00
10.00
100.00
1000
t, TIME (ms)
Figure 21. Typical Thermal Response for BUL146F
ORDERING INFORMATION
Device
Package
Shipping
BUL146G
TO−220AB
(Pb−Free)
50 Units / Rail
BUL146FG
TO−220 (Fullpack)
(Pb−Free)
50 Units / Rail
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BUL146G, BUL146FG
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
PACKAGE
MOUNTED
FULLY ISOLATED
PACKAGE
MOUNTED
FULLY ISOLATED
PACKAGE
CLIP
CLIP
0.099″ MIN
0.099″ MIN
LEADS
LEADS
LEADS
HEATSINK
HEATSINK
HEATSINK
0.110″ MIN
Figure 22a. Screw or Clip Mounting
Position for Isolation Test Number 1
Figure 22b. Clip Mounting Position
for Isolation Test Number 2
Figure 22c. Screw Mounting Position
for Isolation Test Number 3
*Measurement made between leads and heatsink with all leads shorted together
MOUNTING INFORMATION**
4-40 SCREW
CLIP
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
HEATSINK
NUT
Figure 23a. Screw−Mounted
Figure 23b. Clip−Mounted
Figure 23. Typical Mounting Techniques
for Isolated Package
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a
.
screw torque of 6 to 8 in lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain
a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in lbs will
.
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
.
Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in lbs without adversely affecting the
package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recom-
.
mend exceeding 10 in lbs of mounting torque under any mounting conditions.
**For more information about mounting power semiconductors see Application Note AN1040.
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9
BUL146G, BUL146FG
PACKAGE DIMENSIONS
TO−220AB
CASE 221A−09
ISSUE AF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
SEATING
PLANE
−T−
C
S
B
F
T
INCHES
DIM MIN MAX
MILLIMETERS
4
MIN
14.48
9.66
4.07
0.64
3.61
2.42
2.80
0.36
12.70
1.15
4.83
2.54
2.04
1.15
5.97
0.00
1.15
---
MAX
15.75
10.28
4.82
0.88
4.09
2.66
3.93
0.64
14.27
1.52
5.33
3.04
2.79
1.39
6.47
1.27
---
A
B
C
D
F
0.570
0.380
0.160
0.025
0.142
0.095
0.110
0.014
0.500
0.045
0.190
0.100
0.080
0.045
0.235
0.000
0.045
---
0.620
0.405
0.190
0.035
0.161
0.105
0.155
0.025
0.562
0.060
0.210
0.120
0.110
0.055
0.255
0.050
---
A
K
Q
Z
1
2
3
U
H
G
H
J
K
L
N
Q
R
S
T
L
R
J
V
G
U
V
Z
D
0.080
2.04
N
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
TO−220 FULLPAK
CASE 221D−03
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
SEATING
−T−
PLANE
−B−
C
F
S
Q
INCHES
DIM MIN MAX
MILLIMETERS
U
MIN
MAX
16.12
10.63
4.83
A
A
B
C
D
F
0.625
0.408
0.180
0.026
0.116
0.635 15.88
0.418 10.37
0.190
0.031
0.119
4.57
0.65
2.95
1
2 3
0.78
3.02
H
−Y−
G
H
J
0.100 BSC
2.54 BSC
K
0.125
0.018
0.530
0.048
0.135
0.025
3.18
0.45
3.43
0.63
K
L
0.540 13.47
1.23
13.73
1.36
5.08 BSC
0.053
G
N
L
J
N
Q
R
S
U
0.200 BSC
R
0.124
0.099
0.101
0.238
0.128
0.103
0.113
0.258
3.15
2.51
2.57
6.06
3.25
2.62
2.87
6.56
D 3 PL
M
M
STYLE 2:
PIN 1. BASE
0.25 (0.010)
B
Y
2. COLLECTOR
3. EMITTER
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10
BUL146G, BUL146FG
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
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