BZX84C5V1ET3G [ONSEMI]

Energy Rated Zeners in SOT-23 225 W;
BZX84C5V1ET3G
型号: BZX84C5V1ET3G
厂家: ONSEMI    ONSEMI
描述:

Energy Rated Zeners in SOT-23 225 W

测试 光电二极管 齐纳二极管
文件: 总6页 (文件大小:78K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BZX84C2V4ET1 Series  
Zener Voltage Regulators  
225 mW SOT−23 Surface Mount  
This series of Zener diodes is offered in the convenient, surface  
mount plastic SOT−23 package. These devices are designed to provide  
voltage regulation with minimum space requirement. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
Specification Features  
3
1
Cathode  
Anode  
225 mW Rating on FR−4 or FR−5 Board  
Zener Breakdown Voltage Range − 2.4 V to 75 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Peak Power − 225 W (8 X 20 ms)  
3
SOT−23  
CASE 318  
STYLE 8  
1
2
Pb−Free Package is Available  
Mechanical Characteristics  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
MARKING DIAGRAM  
xxxM  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
xxx = Specific Device Code  
M
= Date Code  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
ORDERING INFORMATION  
Peak Power Dissipation @ 20 ms (Note 1)  
P
pk  
225  
Watts  
@ T 25°C  
Device  
Package  
Shipping  
L
Total Power Dissipation on FR−5 Board,  
P
D
BZX84CxxxET1  
SOT−23  
3000/Tape & Reel  
3000/Tape & Reel  
(Note 2) @ T = 25°C  
225  
1.8  
mW  
mW/°C  
A
BZX84CxxxET1G SOT−23  
(Pb−Free)  
Derated above 25°C  
Thermal Resistance,  
Junction−to−Ambient  
R
556  
°C/W  
q
JA  
BZX84CxxxET3  
SOT−23 10,000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Total Power Dissipation on Alumina  
P
D
Substrate, (Note 3) @ T = 25°C  
300  
2.4  
mW  
mW/°C  
A
Derated above 25°C  
Thermal Resistance,  
Junction−to−Ambient  
R
417  
°C/W  
°C  
q
JA  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
Junction and Storage  
Temperature Range  
T , T  
J
−65 to  
+150  
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
1. Nonrepetitive current pulse per Figure 9.  
2. FR−5 = 1.0 X 0.75 X 0.62 in.  
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
July, 2004 − Rev. 3  
BZX84C2V4ET1/D  
 
BZX84C2V4ET1 Series  
ELECTRICAL CHARACTERISTICS  
(Pinout: 1-Anode, 2-No Connection, 3-Cathode) (T = 25°C  
A
I
unless otherwise noted, V = 0.95 V Max. @ I = 10 mA)  
F
F
I
F
Symbol  
Parameter  
V
Reverse Zener Voltage @ I  
Reverse Current  
Z
ZT  
I
ZT  
Z
Maximum Zener Impedance @ I  
ZT  
V
Z
V
R
ZT  
V
I
V
F
R
ZT  
I
Reverse Leakage Current @ V  
Reverse Voltage  
R
R
I
V
R
I
F
Forward Current  
V
F
Forward Voltage @ I  
F
QV  
Maximum Temperature Coefficient of V  
Z
Z
C
Max. Capacitance @ V = 0 and f = 1 MHz  
R
Zener Voltage Regulator  
ELECTRICAL CHARACTERISTICS  
(Pinout: 1-Anode, 2-No Connection, 3-Cathode) (T = 25°C unless otherwise noted, V = 0.90 V Max. @ I = 10 mA)  
A
F
F
(Devices listed in bold, italic are ON Semiconductor Preferred devices.)  
Max  
V
(V)  
= 5 mA  
V
(V)  
= 1 mA  
V
(V)  
Reverse  
Leakage  
Current  
q
VZ  
(mV/k)  
Z1  
Z2  
Z3  
Z
(W)  
@ I  
Z
(W)  
@ I  
Z
ZT3  
(W)  
@
C (pF)  
@
V = 0  
R
ZT1  
ZT2  
@ I  
@ I  
@ I =20 mA  
ZT1  
(Note 4)  
ZT2  
(Note 4)  
ZT3  
(Note 4)  
@ I =5 mA  
ZT1  
Device  
Mark-  
ing  
ZT1  
ZT2  
I
V
(V)  
=
=
I
=
f =  
R
R
ZT3  
@
Min Nom Max  
Min  
Max  
2.9  
4.7  
5.3  
6
Min  
3.6  
4.5  
5
Max  
4.2  
mA  
Min Max  
Device  
5 mA  
1 mA  
20 mA  
40  
15  
15  
10  
6
1 MHz  
450  
260  
225  
200  
185  
155  
140  
130  
130  
110  
105  
100  
80  
BZX84C3V3ET1  
BZX84C4V7ET1  
BZX84C5V1ET1  
BZX84C5V6ET1  
BZX84C6V2ET1, G*  
BZX84C6V8ET1  
BZX84C7V5ET1  
BZX84C10ET1  
BZX84C12ET1  
BZX84C15ET1  
BZX84C16ET1  
BZX84C18ET1  
BZX84C24ET1  
BA4  
BA9  
BB1  
BB2  
BB3  
BB4  
BB5  
BB8  
BC1  
BC3  
BC4  
BC5  
BC8  
3.1  
4.4  
3.3  
4.7  
5.1  
5.6  
6.2  
6.8  
7.5  
10  
3.5  
5
95  
80  
60  
40  
10  
15  
15  
20  
25  
30  
40  
45  
70  
2.3  
3.7  
600  
500  
480  
400  
150  
80  
5
3
2
1
3
2
1
1
−3.5  
0
5.4  
2
−3.5 0.2  
−2.7 1.2  
−2.0 2.5  
4.8  
5.4  
4.2  
5.9  
2
5.2  
6
4.8  
5.2  
5.8  
6.4  
7
6.3  
2
5.8  
6.6  
5.6  
6.6  
7.2  
7.9  
10.6  
12.7  
15.5  
17  
6.8  
4
0.4  
1.2  
2.5  
4.5  
3.7  
4.5  
5.3  
8.0  
6.4  
7.2  
6.3  
7.4  
6
4
7
7.9  
6.9  
80  
8
6
5
9.4  
10.6  
12.7  
15.8  
17.1  
19.1  
25.6  
9.3  
150  
150  
200  
200  
225  
250  
9.4  
11.4  
13.9  
15.4  
16.9  
22.9  
10.7  
12.9  
15.7  
17.2  
19.2  
25.7  
10  
10  
20  
20  
20  
25  
0.2  
0.1  
7
11.4  
14.3  
15.3  
16.8  
22.8  
12  
11.2  
13.7  
15.2  
16.7  
22.7  
8
6.0 10.0  
15  
0.05 10.5  
9.2 13.0  
16  
0.05 11.2 10.4 14.0  
0.05 12.6 12.4 16.0  
0.05 16.8 18.4 22.0  
18  
19  
24  
25.5  
q
VZ  
Max  
(mV/k) Be-  
low  
V
@ I  
Below  
V
@ I  
Below  
Reverse  
Leakage  
Current  
Z2  
Z3  
Z
Z
Z
ZT3  
Below  
@ I  
ZT3  
C (pF)  
ZT1  
ZT2  
V
Z1  
Below  
=
= 10 m  
@ I  
= 2  
ZT2  
ZT3  
ZT1  
Below  
@ I  
Below  
@ I  
@ V  
R
@ I  
= 2 mA  
0.1 mA  
A
mA  
ZT1  
Device  
Mark-  
ing  
= 0  
f =  
1 MHz  
ZT1  
=
ZT4  
=
I
V
(V)  
=
R
R
@
Min Nom Max  
Min  
Max  
28.9  
46  
Min  
Max  
29.3  
46.5  
mA  
Min Max  
Device  
BZX84C27ET1  
BZX84C43ET1  
2 mA  
0.5 mA  
10 mA  
BC9  
BK6  
25.1  
40  
27  
43  
28.9  
46  
80  
25  
300  
25.2  
40.1  
45  
0.05 18.9 21.4 25.3  
0.05 30.1 37.6 46.6  
70  
40  
150  
39.7  
375  
80  
* The “G” suffix indicates Pb−Free package available.  
4. Zener voltage is measured with a pulse test current I at an ambient temperature of 25°C  
Z
http://onsemi.com  
2
 
BZX84C2V4ET1 Series  
TYPICAL CHARACTERISTICS  
8
7
6
5
4
3
100  
TYPICAL T VALUES  
TYPICAL T VALUES  
C
C
V @ I  
Z
ZT  
V @ I  
Z
ZT  
10  
2
1
0
−1  
−2  
−3  
1
2
3
4
5
6
7
8
9
10  
11  
12  
10  
100  
V , NOMINAL ZENER VOLTAGE (V)  
Z
V , NOMINAL ZENER VOLTAGE (V)  
Z
Figure 1. Temperature Coefficients  
Figure 2. Temperature Coefficients  
(Temperature Range 55°C to +150°C)  
(Temperature Range 55°C to +150°C)  
1000  
100  
10  
1000  
100  
10  
T = 255C  
75 V (MMBZ5267BLT1)  
91 V (MMBZ5270BLT1)  
J
I = 1 mA  
Z
I = 0.1 I  
Z(AC) Z(DC)  
f = 1 kHz  
5 mA  
20 mA  
75°C 25°C  
0.6 0.7  
0°C  
150°C  
1
1
1
10  
V , NOMINAL ZENER VOLTAGE  
100  
0.4  
0.5  
0.8  
0.9  
1.0  
1.1  
1.2  
V , FORWARD VOLTAGE (V)  
F
Z
Figure 3. Effect of Zener Voltage on  
Zener Impedance  
Figure 4. Typical Forward Voltage  
http://onsemi.com  
3
BZX84C2V4ET1 Series  
TYPICAL CHARACTERISTICS  
1000  
100  
1000  
T = 25°C  
A
0 V BIAS  
1 V BIAS  
100  
10  
1
+150°C  
BIAS AT  
50% OF V NOM  
0.1  
0.01  
Z
10  
1
+25°C  
55°C  
0.001  
0.0001  
0.00001  
1
10  
100  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
V , NOMINAL ZENER VOLTAGE (V)  
Z
V , NOMINAL ZENER VOLTAGE (V)  
Z
Figure 5. Typical Capacitance  
Figure 6. Typical Leakage Current  
100  
10  
100  
10  
T = 25°C  
A
T = 25°C  
A
1
1
0.1  
0.01  
0.1  
0.01  
10  
30  
50  
70  
90  
0
2
4
6
8
10  
12  
V , ZENER VOLTAGE (V)  
Z
V , ZENER VOLTAGE (V)  
Z
Figure 8. Zener Voltage versus Zener Current  
(12 V to 91 V)  
Figure 7. Zener Voltage versus Zener Current  
(VZ Up to 12 V)  
100  
PEAK VALUE I  
@ 8 ms  
RSM  
t
r
90  
80  
70  
60  
50  
40  
30  
20  
PULSE WIDTH (t ) IS DEFINED  
P
AS THAT POINT WHERE THE  
PEAK CURRENT DECAY = 8 ms  
HALF VALUE I  
/2 @ 20 ms  
RSM  
t
P
10  
0
0
20  
40  
60  
80  
t, TIME (ms)  
Figure 9. 8 × 20 ms Pulse Waveform  
http://onsemi.com  
4
BZX84C2V4ET1 Series  
PACKAGE DIMENSIONS  
SOT−23  
TO−236AB  
CASE 318−09  
ISSUE AJ  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD THICKNESS  
IS THE MINIMUM THICKNESS OF BASE  
MATERIAL.  
A
L
3
B
S
4. 318−01, −02, AND −06 OBSOLETE, NEW  
STANDARD 318−09.  
1
2
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
2.80  
1.20  
0.99  
0.36  
1.70  
0.10  
0.085  
0.45  
0.89  
2.10  
0.45  
MAX  
3.04  
1.40  
1.26  
0.50  
2.10  
0.25  
0.177  
0.60  
1.02  
2.50  
0.60  
V
G
A
B
C
D
G
H
J
0.1102 0.1197  
0.0472 0.0551  
0.0385 0.0498  
0.0140 0.0200  
0.0670 0.0826  
0.0040 0.0098  
0.0034 0.0070  
0.0180 0.0236  
0.0350 0.0401  
0.0830 0.0984  
0.0177 0.0236  
C
J
H
K
L
K
D
S
V
STYLE 8:  
PIN 1. ANODE  
2. NO CONNECTION  
3. CATHODE  
SOLDERING FOOTPRINT*  
0.95  
0.037  
0.95  
0.037  
2.0  
0.079  
0.9  
0.035  
0.8  
0.031  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
5
BZX84C2V4ET1 Series  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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Order Literature: http://www.onsemi.com/litorder  
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Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
BZX84C2V4ET1/D  

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