CAV25010 [ONSEMI]

SPI Serial CMOS EEPROM;
CAV25010
型号: CAV25010
厂家: ONSEMI    ONSEMI
描述:

SPI Serial CMOS EEPROM

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
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CAV25010, CAV25020,  
CAV25040  
1-Kb, 2-Kb and 4-Kb SPI  
Serial CMOS EEPROM  
Description  
The CAV25010/20/40 are 1Kb/2Kb/4Kb Serial CMOS  
EEPROM devices internally organized as 128x8/256x8/512x8 bits.  
They feature a 16byte page write buffer and support the Serial  
Peripheral Interface (SPI) protocol. The device is enabled through a  
Chip Select (CS) input. In addition, the required bus signals are a clock  
input (SCK), data input (SI) and data output (SO) lines. The HOLD  
input may be used to pause any serial communication with the  
CAV25010/20/40 device. These devices feature software and  
hardware write protection, including partial as well as full array  
protection.  
http://onsemi.com  
SOIC8  
V SUFFIX  
TSSOP8  
Y SUFFIX  
CASE 751BD  
CASE 948AL  
PIN CONFIGURATION  
Features  
1
CS  
SO  
WP  
V
CC  
Automotive Temperature Grade 1 (40°C to +125°C)  
10 MHz SPI Compatible  
2.5 V to 5.5 V Supply Voltage Range  
SPI Modes (0,0) & (1,1)  
HOLD  
SCK  
SI  
V
SS  
SOIC (V), TSSOP (Y)  
16byte Page Write Buffer  
Selftimed Write Cycle  
Hardware and Software Protection  
Block Write Protection  
For the location of Pin 1, please consult the  
corresponding package drawing.  
Protect 1/4, 1/2 or Entire EEPROM Array  
Low Power CMOS Technology  
1,000,000 Program/Erase Cycles  
100 Year Data Retention  
PIN FUNCTION  
Pin Name  
CS  
Function  
Chip Select  
SO  
Serial Data Output  
Write Protect  
Industrial and Extended Temperature Range  
SOIC and TSSOP 8Lead Packages  
These Devices are PbFree, Halogen Free/BFR Free, and RoHS  
Compliant  
WP  
V
Ground  
SS  
SI  
Serial Data Input  
Serial Clock  
SCK  
V
CC  
HOLD  
Hold Transmission Input  
Power Supply  
V
CC  
SI  
CS  
CAV25010  
CAV25020  
CAV25040  
SO  
ORDERING INFORMATION  
WP  
See detailed ordering and shipping information in the package  
dimensions section on page 12 of this data sheet.  
HOLD  
SCK  
V
SS  
Figure 1. Functional Symbol  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2012 Rev. 0  
CAV25010/D  
CAV25010, CAV25020, CAV25040  
MARKING DIAGRAMS  
25010E = CAV25010  
25020E = CAV25020  
25040E = CAV25040  
S01E = CAV25010  
S02E = CAV25020  
S04E = CAV25040  
25xx0E  
AYMXXX  
G
SxxE  
AYMXXX  
A
Y
M
= Assembly Location  
= Production Year (Last Digit)  
= Production Month (19, O, N, D)  
A
Y
M
= Assembly Location  
= Production Year (Last Digit)  
= Production Month (19, O, N, D)  
G
XXX = Last Three Digits of  
XXX = Assembly Lot Number  
XXX = Last Three Digits of  
XXX = Assembly Lot Number  
(TSSOP8)  
(SOIC8)  
G
= PbFree Package  
G
= PbFree Package  
Table 1. ABSOLUTE MAXIMUM RATINGS  
Parameters  
Ratings  
Units  
°C  
Operating Temperature  
45 to +130  
65 to +150  
Storage Temperature  
°C  
Voltage on any Pin with Respect to Ground (Note 1)  
0.5 to V + 0.5  
V
CC  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
Table 2. RELIABILITY CHARACTERISTICS (Note 2)  
Symbol  
(Note 3)  
Parameter  
Min  
1,000,000  
100  
Units  
Program / Erase Cycles  
Years  
N
Endurance  
END  
T
DR  
Data Retention  
Table 3. D.C. OPERATING CHARACTERISTICS (V = 2.5 V to 5.5 V, T = 40°C to +125°C, unless otherwise specified.)  
CC  
A
Symbol  
Parameter  
Supply Current (Read Mode)  
Supply Current (Write Mode)  
Standby Current  
Test Conditions  
Min  
Max  
Units  
mA  
I
Read, V = 5.5 V, 10 MHz, SO open  
2
2
2
CCR  
CC  
I
Write, V = 5.5 V, 10 MHz, SO open  
mA  
CCW  
CC  
I
V
= GND or V , CS = V  
,
mA  
SB1  
IN  
CC  
CC  
WP = V , V = 5.5 V  
CC  
CC  
I
Standby Current  
V
= GND or V , CS = V  
,
5
mA  
SB2  
IN  
CC  
CC  
WP = GND, V = 5.5 V  
CC  
I
Input Leakage Current  
Output Leakage Current  
V
= GND or V  
CC  
2  
1  
2
2
mA  
mA  
L
IN  
I
CS = V  
V
,
LO  
CC  
= GND or V  
OUT  
CC  
V
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
0.5  
0.3 V  
V
V
V
V
IL  
CC  
V
0.7 V  
V
+ 0.5  
CC  
IH  
CC  
V
I
I
= 3.0 mA  
0.4  
OL  
OH  
OL  
V
= 1.6 mA  
V
0.8 V  
CC  
OH  
Table 4. PIN CAPACITANCE (Note 2) (T = 25°C, f = 1.0 MHz, V = +5.0 V)  
A
CC  
Symbol  
Test  
Conditions  
Min  
Typ  
Max  
8
Units  
pF  
C
OUT  
Output Capacitance (SO)  
Input Capacitance (CS, SCK, SI, WP, HOLD)  
V
= 0 V  
OUT  
C
IN  
V
= 0 V  
IN  
8
pF  
1. The DC input voltage on any pin should not be lower than 0.5 V or higher than V + 0.5 V. During transitions, the voltage on any pin may  
CC  
undershoot to no less than 1.5 V or overshoot to no more than V + 1.5 V, for periods of less than 20 ns.  
CC  
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AECQ100  
and JEDEC test methods.  
3. Page Mode, V = 5 V, 25°C.  
CC  
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2
 
CAV25010, CAV25020, CAV25040  
Table 5. A.C. CHARACTERISTICS (T = 40°C to +125°C) (Note 4)  
A
V
= 2.5 V 5.5 V  
CC  
Min  
DC  
10  
Max  
Symbol  
Parameter  
Units  
MHz  
ns  
f
Clock Frequency  
Data Setup Time  
Data Hold Time  
SCK High Time  
SCK Low Time  
10  
SCK  
t
SU  
t
H
10  
ns  
t
40  
ns  
WH  
t
40  
ns  
WL  
t
HOLD to Output Low Z  
Input Rise Time  
25  
2
ns  
LZ  
t
RI  
(Note 5)  
(Note 5)  
ms  
t
FI  
Input Fall Time  
2
ms  
t
t
HOLD Setup Time  
HOLD Hold Time  
Output Valid from Clock Low  
Output Hold Time  
Output Disable Time  
HOLD to Output High Z  
CS High Time  
0
ns  
HD  
CD  
10  
ns  
t
V
35  
ns  
t
0
ns  
HO  
t
20  
25  
ns  
DIS  
t
ns  
HZ  
t
40  
30  
30  
20  
20  
10  
10  
ns  
CS  
t
CS Setup Time  
ns  
CSS  
CSH  
CNS  
CNH  
WPS  
WPH  
t
t
CS Hold Time  
ns  
CS Inactive Setup Time  
CS Inactive Hold Time  
WP Setup Time  
ns  
t
ns  
t
ns  
t
WP Hold Time  
ns  
t
(Note 6)  
Write Cycle Time  
5
ms  
WC  
4. AC Test Conditions:  
Input Pulse Voltages: 0.3 V to 0.7 V  
CC  
CC  
Input rise and fall times: 10 ns  
Input and output reference voltages: 0.5 V  
CC  
Output load: current source I  
/I  
; C = 30 pF  
OL max OH max L  
5. This parameter is tested initially and after a design or process change that affects the parameter.  
6. t is the time from the rising edge of CS after a valid write sequence to the end of the internal write cycle.  
WC  
Table 6. POWERUP TIMING (Notes 7, 8)  
Symbol  
Parameter  
Min  
0.1  
0.1  
Max  
1
Units  
t
Powerup to Read Operation  
Powerup to Write Operation  
ms  
ms  
PUR  
t
1
PUW  
7. This parameter is tested initially and after a design or process change that affects the parameter.  
8. t  
and t  
are the delays required from the time V is stable at the operating voltage until the specified operation can be initiated.  
PUR  
PUW  
CC  
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3
 
CAV25010, CAV25020, CAV25040  
Pin Description  
Functional Description  
The CAV25010/20/40 devices support the Serial  
Peripheral Interface (SPI) bus protocol, modes (0,0) and  
(1,1). The device contains an 8bit instruction register. The  
instruction set and associated opcodes are listed in Table 7.  
Reading data stored in the CAV25010/20/40 is  
accomplished by simply providing the READ command and  
an address. Writing to the CAV25010/20/40, in addition to  
a WRITE command, address and data, also requires  
enabling the device for writing by first setting certain bits in  
a Status Register, as will be explained later.  
SI: The serial data input pin accepts opcodes, addresses  
and data. In SPI modes (0,0) and (1,1) input data is latched  
on the rising edge of the SCK clock input.  
SO: The serial data output pin is used to transfer data out of  
the device. In SPI modes (0,0) and (1,1) data is shifted out  
on the falling edge of the SCK clock.  
SCK: The serial clock input pin accepts the clock provided  
by the host and used for synchronizing communication  
between host and CAV25010/20/40.  
CS: The chip select input pin is used to enable/disable the  
CAV25010/20/40. When CS is high, the SO output is  
tristated (high impedance) and the device is in Standby  
Mode (unless an internal write operation is in progress).  
Every communication session between host and  
CAV25010/20/40 must be preceded by a high to low  
transition and concluded with a low to high transition of the  
CS input.  
After a high to low transition on the CS input pin, the  
CAV25010/20/40 will accept any one of the six instruction  
opcodes listed in Table 7 and will ignore all other possible  
8bit combinations. The communication protocol follows  
the timing from Figure 2.  
Table 7. INSTRUCTION SET (Note 9)  
Instruction  
WREN  
WRDI  
Opcode  
0000 0110  
0000 0100  
0000 0101  
0000 0001  
0000 X011  
0000 X010  
Operation  
WP: The write protect input pin will allow all write  
operations to the device when held high. When WP pin is  
tied low all write operations are inhibited.  
Enable Write Operations  
Disable Write Operations  
Read Status Register  
Write Status Register  
Read Data from Memory  
Write Data to Memory  
RDSR  
HOLD: The HOLD input pin is used to pause transmission  
between host and CAV25010/20/40, without having to  
retransmit the entire sequence at a later time. To pause,  
HOLD must be taken low and to resume it must be taken  
back high, with the SCK input low during both transitions.  
When not used for pausing, the HOLD input should be tied  
WRSR  
READ  
WRITE  
9. X = 0 for CAV25010, CAV25020. X = A8 for CAV25040  
to V , either directly or through a resistor.  
CC  
t
CS  
CS  
t
t
t
WL  
CSS  
WH  
t
t
t
CNH  
CSH  
CNS  
SCK  
SI  
t
H
t
RI  
t
FI  
t
SU  
VALID  
IN  
t
V
t
V
t
DIS  
t
HO  
HIZ  
HIZ  
VALID  
OUT  
SO  
Figure 2. Synchronous Data Timing  
Status Register  
The Status Register, as shown in Table 8, contains a  
number of status and control bits.  
Write Enable state and when set to 0, the device is in a Write  
Disable state.  
The RDY (Ready) bit indicates whether the device is busy  
with a write operation. This bit is automatically set to 1 during  
an internal write cycle, and reset to 0 when the device is ready  
to accept commands. For the host, this bit is read only.  
The WEL (Write Enable Latch) bit is set/reset by the  
WREN/WRDI commands. When set to 1, the device is in a  
The BP0 and BP1 (Block Protect) bits determine which  
blocks are currently write protected. They are set by the user  
with the WRSR command and are nonvolatile. The user is  
allowed to protect a quarter, one half or the entire memory,  
by setting these bits according to Table 9. The protected  
blocks then become readonly.  
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4
 
CAV25010, CAV25020, CAV25040  
Table 8. STATUS REGISTER  
7
1
6
1
5
1
4
1
3
2
1
0
BP1  
BP0  
WEL  
RDY  
Table 9. BLOCK PROTECTION BITS  
Status Register Bits  
BP1  
BP0  
Array Address Protected  
Protection  
No Protection  
0
0
1
1
0
1
0
1
None  
CAV25010: 06007F, CAV25020: 0C00FF, CAV25040: 1801FF  
CAV25010: 04007F, CAV25020: 0800FF, CAV25040: 1001FF  
CAV25010: 00007F, CAV25020: 0000FF, CAV25040: 0001FF  
Quarter Array Protection  
Half Array Protection  
Full Array Protection  
WRITE OPERATIONS  
The CAV25010/20/40 device powers up into a write  
disable state. The device contains a Write Enable Latch  
(WEL) which must be set before attempting to write to the  
memory array or to the status register. In addition, the  
address of the memory location(s) to be written must be  
outside the protected area, as defined by BP0 and BP1 bits  
from the status register.  
instruction to the CAV25010/20/40. Care must be taken to  
take the CS input high after the WREN instruction, as  
otherwise the Write Enable Latch will not be properly set.  
WREN timing is illustrated in Figure 3. The WREN  
instruction must be sent prior to any WRITE or WRSR  
instruction.  
The internal write enable latch is reset by sending the  
WRDI instruction as shown in Figure 4. Disabling write  
operations by resetting the WEL bit, will protect the device  
against inadvertent writes.  
Write Enable and Write Disable  
The internal Write Enable Latch and the corresponding  
Status Register WEL bit are set by sending the WREN  
CS  
SCK  
1
1
0
SI  
0
0
0
0
0
HIGH IMPEDANCE  
SO  
Dashed Line = mode (1, 1)  
Figure 3. WREN Timing  
CS  
SCK  
1
0
0
SI  
0
0
0
0
0
HIGH IMPEDANCE  
SO  
Dashed Line = mode (1, 1)  
Figure 4. WRDI Timing  
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5
 
CAV25010, CAV25020, CAV25040  
Byte Write  
Page Write  
Once the WEL bit is set, the user may execute a write  
sequence, by sending a WRITE instruction, a 8bit address  
and data as shown in Figure 5. For the CAV25040, bit 3 of  
the write instruction opcode contains A8 address bit.  
Internal programming will start after the low to high CS  
transition. During an internal write cycle, all commands,  
except for RDSR (Read Status Register) will be ignored.  
The RDY bit will indicate if the internal write cycle is in  
progress (RDY high), or the device is ready to accept  
commands (RDY low).  
After sending the first data byte to the CAV25010/20/40,  
the host may continue sending data, up to a total of 16 bytes,  
according to timing shown in Figure 6. After each data byte,  
the lower order address bits are automatically incremented,  
while the higher order address bits (page address) remain  
unchanged. If during this process the end of page is  
exceeded, then loading will “roll over” to the first byte in the  
page, thus possibly overwriting previously loaded data.  
Following completion of the write cycle, the  
CAV25010/20/40 is automatically returned to the write  
disable state.  
CS  
0
1
2
3
4
5
6
7
8
13 14 15 16 17 18 19 20 21 22 23  
SCK  
SI  
OPCODE  
X*  
DATA IN  
BYTE ADDRESS  
A
D7 D6 D5 D4 D3 D2 D1 D0  
0
0
0
0
0
0
1
0
A
7
HIGH IMPEDANCE  
Dashed Line = mode (1, 1)  
SO  
* X = 0 for CAV25010, CAV25020. x = A8 for CAV25040  
Figure 5. Byte WRITE Timing  
CS  
16+(N1)x81..16+(N1)x8  
0
1
2
3
4
5
6
7
8
13 14 15  
2431  
1623  
16+Nx81  
SCK  
SI  
Data Byte N  
7..1  
BYTEADDRESS  
OPCODE  
X*  
DATA IN  
A
A
0
0
0
0
0
0
1
0
7
0
Data Data Data  
Byte 1 Byte 2 Byte 3  
HIGH IMPEDANCE  
SO  
Dashed Line = mode (1, 1)  
* X = 0 for CAV25010, CAV25020. x = A8 for CAV25040  
Figure 6. Page WRITE Timing  
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6
 
CAV25010, CAV25020, CAV25040  
Write Status Register  
Write Protection  
The Status Register is written by sending a WRSR  
instruction according to timing shown in Figure 7. Only bits  
2 and 3 can be written using the WRSR command.  
When WP input is low all write operations to the memory  
array and Status Register are inhibited. WP going low while  
CS is still low will interrupt a write operation. If the internal  
write cycle has already been initiated, WP going low will  
have no effect on any write operation to the Status Register  
or memory array. The WP input timing is shown in Figure 8.  
CS  
0
1
2
3
4
5
6
7
1
8
9
6
10  
5
11  
4
12  
13  
2
14  
1
15  
0
SCK  
SI  
OPCODE  
0
DATA IN  
3
0
0
0
0
0
0
7
MSB  
HIGH IMPEDANCE  
Dashed Line = mode (1, 1)  
SO  
Figure 7. WRSR Timing  
t
t
WPH  
WPS  
CS  
SCK  
WP  
WP  
Dashed Line = mode (1, 1)  
Figure 8. WP Timing  
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7
 
CAV25010, CAV25020, CAV25040  
READ OPERATIONS  
Read Status Register  
Read from Memory Array  
To read from memory, the host sends a READ instruction  
followed by a 8bit address (for the CAV25040, bit 3 of the  
read instruction opcode contains A8 address bit).  
To read the status register, the host simply sends a RDSR  
command. After receiving the last bit of the command, the  
CAV25010/20/40 will shift out the contents of the status  
register on the SO pin (Figure 10). The status register may  
be read at any time, including during an internal write cycle.  
While the internal write cycle is in progress, the RDSR  
command will output the full content of the status register.  
For easy detection of the internal write cycle completion,  
both during writing to the memory array and to the status  
register, we recommend sampling the RDY bit only through  
the polling routine. After detecting the RDY bit “0”, the next  
RDSR instruction will always output the expected content  
of the status register.  
After receiving the last address bit, the CAV25010/20/40  
will respond by shifting out data on the SO pin (as shown in  
Figure 9). Sequentially stored data can be read out by simply  
continuing to run the clock. The internal address pointer is  
automatically incremented to the next higher address as data  
is shifted out. After reaching the highest memory address,  
the address counter “rolls over” to the lowest memory  
address, and the read cycle can be continued indefinitely.  
The read operation is terminated by taking CS high.  
CS  
12 13 14 15 16 17 18 19 20 21 22  
0
1
2
3
4
5
6
7
8
9
SCK  
SI  
OPCODE  
X*  
BYTE ADDRESS  
A
A
0
0
0
0
0
0
1
1
7
DATA OUT  
HIGH IMPEDANCE  
SO  
D7 D6 D5 D4 D3 D2 D1 D0  
MSB  
Dashed Line = mode (1, 1)  
* X = 0 for CAV25010, CAV25020. X = A8 for CAV25040  
Figure 9. READ Timing  
CS  
0
1
2
3
4
5
1
6
0
7
1
8
9
10  
11  
12  
13  
14  
SCK  
OPCODE  
0
0
0
0
0
SI  
DATA OUT  
3
HIGH IMPEDANCE  
Dashed Line = mode (1, 1)  
5
7
6
4
2
1
0
SO  
MSB  
Figure 10. RDSR Timing  
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8
 
CAV25010, CAV25020, CAV25040  
Hold Operation  
VCC drops below the POR trigger level. This bidirectional  
POR behavior protects the device against ‘brownout’  
failure following a temporary loss of power.  
The CAV25010/20/40 device powers up in a write disable  
state and in a low power standby mode. A WREN instruction  
must be issued prior to any writes to the device.  
After power up, the CS pin must be brought low to enter  
a ready state and receive an instruction. After a successful  
byte/page write or status register write, the device goes into  
a write disable mode. The CS input must be set high after the  
proper number of clock cycles to start the internal write  
cycle. Access to the memory array during an internal write  
cycle is ignored and programming is continued. Any invalid  
opcode will be ignored and the serial output pin (SO) will  
remain in the high impedance state.  
The HOLD input can be used to pause communication  
between host and CAV25010/20/40. To pause, HOLD must  
be taken low while SCK is low (Figure 11). During the hold  
condition the device must remain selected (CS low). During  
the pause, the data output pin (SO) is tristated (high  
impedance) and SI transitions are ignored. To resume  
communication, HOLD must be taken high while SCK is low.  
Design Considerations  
The CAV25010/20/40 devices incorporate PowerOn  
Reset (POR) circuitry which protects the internal logic  
against powering up in the wrong state. The device will  
power up into Standby mode after VCC exceeds the POR  
trigger level and will power down into Reset mode when  
CS  
t
t
CD  
CD  
SCK  
t
HD  
t
HD  
HOLD  
SO  
t
HZ  
HIGH IMPEDANCE  
t
LZ  
Dashed Line = mode (1, 1)  
Figure 11. HOLD Timing  
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9
 
CAV25010, CAV25020, CAV25040  
PACKAGE DIMENSIONS  
SOIC 8, 150 mils  
CASE 751BD01  
ISSUE O  
SYMBOL  
MIN  
NOM  
MAX  
1.35  
A
1.75  
A1  
b
0.10  
0.33  
0.19  
4.80  
5.80  
3.80  
0.25  
0.51  
0.25  
5.00  
6.20  
4.00  
c
E1  
E
D
E
E1  
e
1.27 BSC  
h
0.25  
0.40  
0º  
0.50  
1.27  
8º  
L
PIN # 1  
IDENTIFICATION  
θ
TOP VIEW  
D
h
A1  
θ
A
c
e
b
L
SIDE VIEW  
END VIEW  
Notes:  
(1) All dimensions are in millimeters. Angles in degrees.  
(2) Complies with JEDEC MS-012.  
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10  
CAV25010, CAV25020, CAV25040  
PACKAGE DIMENSIONS  
TSSOP8, 4.4x3  
CASE 948AL01  
ISSUE O  
b
SYMBOL  
MIN  
NOM  
MAX  
A
A1  
A2  
b
1.20  
0.15  
1.05  
0.30  
0.20  
3.10  
6.50  
4.50  
0.05  
0.80  
0.19  
0.09  
2.90  
6.30  
4.30  
0.90  
E
c
E1  
D
3.00  
6.40  
E
E1  
e
4.40  
0.65 BSC  
1.00 REF  
L
L1  
0.50  
0.60  
0.75  
0º  
8º  
θ
e
TOP VIEW  
D
c
A2  
A
q1  
A1  
L1  
L
SIDE VIEW  
END VIEW  
Notes:  
(1) All dimensions are in millimeters. Angles in degrees.  
(2) Complies with JEDEC MO-153.  
http://onsemi.com  
11  
CAV25010, CAV25020, CAV25040  
ORDERING INFORMATION  
Specific  
Device  
Marking  
(Note 10)  
Device Order  
Number  
Temperature  
Range  
Package Type  
SOIC8, JEDEC  
SOIC8, JEDEC  
TSSOP8  
Lead Finish  
NiPdAu  
NiPdAu  
NiPdAu  
NiPdAu  
NiPdAu  
NiPdAu  
NiPdAu  
NiPdAu  
NiPdAu  
Shipping  
CAV25010VEG  
25010E  
25010E  
S01E  
40°C to +125°C  
40°C to +125°C  
40°C to +125°C  
40°C to +125°C  
40°C to +125°C  
40°C to +125°C  
40°C to +125°C  
40°C to +125°C  
40°C to +125°C  
Tube, 100 Units / Tube  
CAV25010VEGT3  
CAV25010YEG  
Tape & Reel, 3,000 Units / Reel  
Tube, 100 Units / Tube  
CAV25010YEGT3  
CAV25020VEGT3  
CAV25020YEGT3  
CAV25040VEG  
S01E  
TSSOP8  
Tape & Reel, 3,000 Units / Reel  
Tape & Reel, 3,000 Units / Reel  
Tape & Reel, 3,000 Units / Reel  
Tube, 100 Units / Tube  
25020E  
S02E  
SOIC8, JEDEC  
TSSOP8  
25040E  
25040E  
S04E  
SOIC8, JEDEC  
SOIC8, JEDEC  
TSSOP8  
CAV25040VEGT3  
CAV25040YEGT3  
Tape & Reel, 3,000 Units / Reel  
Tape & Reel, 3,000 Units / Reel  
10.Specific Device Marking shows the first row top package marking.  
11. All packages are RoHScompliant (Leadfree, Halogenfree).  
12.The standard lead finish is NiPdAu.  
13.For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.  
14.For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
15.For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device  
Nomenclature document, TND310/D, available at www.onsemi.com  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
CAV25010/D  
 

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