CM1216

更新时间:2024-09-18 10:19:50
品牌:ONSEMI
描述:6 and 8-Channel Low Capacitance ESD Arrays

CM1216 概述

6 and 8-Channel Low Capacitance ESD Arrays 6和8通道低电容ESD阵列

CM1216 数据手册

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6 and 8-Channel Low Capacitance  
ESD Arrays  
CM1216  
Features  
Product Description  
Six and eight channels of ESD protection  
Provides 15 kV ESD protection on each channel  
per the IEC 61000-4-2 ESD requirements  
Channel loading capacitance of 1.6 pF typical  
Channel I/O to GND capacitance difference of  
0.04pF typical  
Mutual capacitance of 0.13pF typical  
Minimal capacitance change with temperature  
and voltage  
Each I/O pin can withstand over 1000 ESD  
strikes  
SOIC and MSOP packages  
The CM1216 family of diode arrays provide sESD  
protection for electronic components or sub-systems  
requiring minimal capacitive loading. These devices  
are ideal for protecting systems with high data and  
clock rates or for circuits requiring low capacitive  
loading. Each ESD channel consists of a pair of  
diodes in series which steer the positive or negative  
+
ESD current pulse to either the positive (VP) or  
negative (V ) supply rail. The CM1216 protects  
N
against ESD pulses up to  
4-2 standard.  
+15kV per the IEC 61000-  
RoHs-compliant, lead-free packaging  
This device is particularly well-suited for protecting  
systems using high-speed ports such as USB2.0,  
IEEE1394 (Firewire, iLink  
), Serial ATA, DVI, HDMI  
Applications  
and corresponding ports in removable storage, digital  
camcorders, DVD-RW drives and other applications  
where extremely low loading capacitance with ESD  
protection are required in a small package footprint.  
IEEE1394 Firewireports at 400Mbps / 800Mbps  
DVI ports, HDMI ports in notebooks, set top  
boxes, digital TVs, LCD displays  
Serial ATA ports in desktop PCs and hard disk  
drives  
PCI Express ports  
General purpose high-speed data line ESD  
protection  
Block Diagram  
©2010 SCILLC. All rights reserved.  
April 2010 – Rev. 2  
Publication Order Number:  
CM1216/D  
CM1216  
Pin Configurations  
Pin Information  
PIN DESCRIPTIONS  
MSOP-8  
PIN  
SOIC-8  
MSOP-10  
NAME  
TYPE  
DESCRIPTION  
PIN NO.  
PIN NO.  
PIN NO.  
ESD Channel  
ESD Channel  
1
2
4
5
3
6
8
1
2
4
5
3
1
2
3
4
5
I/O  
I/O  
CH1  
CH2  
CH3  
ESD Channel  
I/O  
ESD Channel  
I/O  
CH4  
VN  
Negative voltage supply rail  
ESD Channel  
GND  
I/O  
6
6
CH5  
ESD Channel  
8
7
8
I/O  
CH6  
Positive voltage supply rail  
7
7
PWR  
VP  
ESD Channel  
ESD Channel  
9
I/O  
I/O  
CH7  
CH8  
10  
Rev. 2 | Page 2 of 13 | www.onsemi.com  
CM1216  
Ordering Information  
PART NUMBERING INFORMATION  
Lead-free Finish  
Ordering Part Number1  
Part Marking  
Pins  
Package  
CM1216-06SM  
8
8
SOIC  
MSOP  
MSOP  
E166  
CM1216-06MR  
CM1216-08MR  
E166  
E168  
10  
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.  
Specifications  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
RATING  
UNITS  
Operating Supply Voltage (VP-VN)  
6
V
Diode Forward DC Current(Note 1)  
20  
mA  
V
DC Voltage at any Channel Input  
Operating Temperature Range  
Ambient  
(VN-0.5) to (VP+0.5)  
-40 to +85  
-40 to +125  
-40 to +150  
°C  
°C  
°C  
Junction  
Storage Temperature Range  
Standard Operating Conditions  
STANDARD OPERATING CONDITIONS  
PARAMETER  
RATING  
UNITS  
Temperature Range (Ambient)  
-40 to +85  
°C  
Package Power Rating  
MSOP8 Package (CM1216-06MR)  
SOIC8 Package (CM1216-06SM)  
MSOP10 Package (CM1216-08MR)  
400  
600  
400  
mW  
mW  
mW  
Rev. 2 | Page 3 of 13 | www.onsemi.com  
CM1216  
ELECTRICAL OPERATING CHARACTERISTICS NOTE 1  
MA  
X
CONDITIONS  
SYMBOL  
PARAMETER  
MIN  
TYP  
UNIT  
VP  
Operating Supply Voltage  
(VP-VN)  
3.3  
5.5  
V
IP  
Operating Supply Current  
(VP-VN) = 3.3V  
8
µA  
VF  
Diode Forward Voltage  
Top Diode  
Bottom Diode  
IF = 20mA; TA=25°C  
0.6  
0.6  
0.8  
0.8  
0.95  
0.95  
V
V
ILEAK  
CIN  
Channel Leakage Current  
Channel Input Capacitance  
TA = 25°C; VP= 5V, VN = 0V  
0.1  
1.6  
1.0  
2.0  
µA  
At 1 MHz, VP=3.3V, VN =0V,  
VIN=1.65V;Note2  
pF  
CIN  
Channel Input Capacitance  
Matching  
0.04  
0.13  
pF  
pF  
kV  
CMUTUAL  
VESD  
Mutual Capacitance  
(VP-VN) = 3.3V  
ESD Protection  
Peak Discharge Voltage at  
any  
Notes 2 and 3; TA = 25°C  
15  
channel input, in system,  
contact  
discharge per  
IEC 61000-4-  
2 standard  
VCL  
Channel Clamp Voltage  
Positive Transients  
Negative Transients  
IPP = 1A, tP = 8/20µS; TA=25°C  
IPP = 1A, tP = 8/20µS; TA=25°C  
+9.0  
-1.5  
V
V
RDYN  
Dynamic Resistance  
Positive transients  
Negative transients  
0.6  
0.4  
Note 1: All parameters specified at TA = -40°C to +85°C unless otherwise noted.  
Note 2: Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330 , VP = 3.3V, VN grounded.  
Note 3: From I/O pins to VP or VN only. VP bypassed to VN with low ESR 0.2µF ceramic capacitor.  
Rev. 2 | Page 4 of 13 | www.onsemi.com  
CM1216  
Performance Characteristics  
Figure 1. Typical Variation of CIN vs. VIN  
(f = 1MHz, VP= 3.3V, VN = 0V, 0.1µF chip capacitor between VP and VN, TA = 25 C)  
Rev. 2 | Page 5 of 13 | www.onsemi.com  
CM1216  
Application Information  
Design Considerations  
In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to  
minimize parasitic series inductances on the Supply/Ground rails as well as the signal trace segment between  
the signal input (typically a connector) and the ESD protection device. Refer to Application of Positive ESD  
Pulse between Input Channel and Ground, which illustrates an example of a positive ESD pulse striking an input  
channel. The parasitic series inductance back to the power supply is represented by L1 and L2. The voltage VCL  
on the line being protected is:  
VCL  
=
Fwd  
voltage  
drop  
of  
D1  
+
VSUPPLY  
+
L1  
x
d(IESD  
)
/
dt  
+ L2 x d(IESD / dt  
)
where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage.  
An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact  
discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. Here  
d(IESD)/dt can be approximated by IESD/t, or 30/(1x10-9). So just 10nH of series inductance (L1 and L2 combined)  
will lead to a 300V increment in VCL!  
Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to  
drastically increased negative voltage on the line being protected.  
The CM1213 has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail  
inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest  
possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is  
recommended that a 0.22µF ceramic chip capacitor be connected between VP and the ground plane.  
As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of  
expected electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to  
the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground  
planes and between the signal input and the ESD device to minimize stray series inductance.  
Additional Information  
See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the  
Applications section at www.calmicro.com.  
Figure 3. Application of Positive ESD Pulse between Input Channel and Ground  
Rev. 2 | Page 6 of 13 | www.onsemi.com  
CM1216  
Mechanical Details  
The CM1216 is available in SOIC-8, MSOP-8, and MSOP-10 packages with a lead-free finishing.  
SOIC-8 Mechanical Specifications  
The CM1216-06SM is supplied in an 8-pin SOIC package. Dimensions are presented below.  
*
PACKAGE DIMENSIONS  
SOIC  
8
Package  
Pins  
Millimeters  
Inches  
Dimensions  
Min  
Max  
Min  
Max  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
1.75  
0.053  
0.004  
0.013  
0.007  
0.189  
0.150  
0.069  
A
A1  
B
C
D
E
e
0.25  
0.51  
0.25  
5.00  
4.19  
0.010  
0.020  
0.010  
0.197  
0.165  
1.27 BSC  
0.050 BSC  
5.80  
0.40  
6.20  
1.27  
0.228  
0.016  
0.244  
0.050  
H
L
2500 pieces  
# per tape  
and reel  
Controlling dimension: inches  
Package Dimensions for SOIC-8  
Rev. 2 | Page 7 of 13 | www.onsemi.com  
CM1216  
Tape and Reel Specifications  
PACKAGE SIZE  
(mm)  
POCKET SIZE (mm) TAPE WIDTH  
B0 X A0 X K0  
REEL  
DIAMETER  
QTY PER  
REEL  
PART NUMBER  
W
P0  
P1  
CM1216-06SM  
4.90 X 6.00 X 1.55  
5.30 X 6.50 X 2.10  
12mm  
330mm (13")  
2500  
4mm 8mm  
Rev. 2 | Page 8 of 13 | www.onsemi.com  
CM1216  
Mechanical Details (Cont’d)  
MSOP-8 Mechanical Specifications:  
The CM1216-06MR is supplied in an 8-pin MSOP package. Dimensions are presented below.  
PACKAGE DIMENSIONS  
TOP VIEW  
MSOP  
8
D
Package  
Pins  
8
7
6
5
Millimeters  
Inches  
Dimensions  
Min  
Max  
Min  
Max  
E
H
Pin 1  
Marking  
0.75  
0.05  
0.28  
0.13  
2.90  
2.90  
0.95  
0.030  
0.002  
0.011  
0.005  
0.114  
0.114  
0.037  
A
A1  
B
C
D
E
0.15  
0.38  
0.23  
3.10  
3.10  
0.006  
0.015  
0.009  
0.122  
0.122  
1
2
3
4
SIDE VIEW  
A
SEATING  
PLANE  
A1  
B
e
0.65 BSC  
4.90 BSC  
0.40 0.70  
4000 pieces  
0.026 BSC  
0.193 BSC  
0.016 0.028  
e
END VIEW  
H
L
C
# per tape  
and reel  
L
Controlling dimension: millimeters  
Package Dimensions for MSOP-8  
Rev. 2 | Page 9 of 13 | www.onsemi.com  
CM1216  
Tape and Reel Specifications  
PACKAGE SIZE  
(mm)  
POCKET SIZE (mm) TAPE WIDTH  
B0 X A0 X K0  
REEL  
DIAMETER  
QTY PER  
REEL  
PART NUMBER  
W
P0  
P1  
CM1213-06MR  
3.00 X 3.00 X 0.85  
3.3 X 5.3 X1.3  
12mm  
330mm (13")  
4000  
4mm 8mm  
Rev. 2 | Page 10 of 13 | www.onsemi.com  
CM1216  
Mechanical Details (cont’d)  
MSOP-10 Mechanical Specifications  
The CM1213-08MR is supplied in a 10-pin MSOP package. Dimensions are presented below.  
*
PACKAGE DIMENSIONS  
TOP VIEW  
MSOP  
10  
Package  
Pins  
D
8
6
10  
9
7
Millimeters  
Inches  
Dimensions  
Min  
Max  
Min  
Max  
E
H
0.75  
0.05  
0.17  
0.13  
2.90  
2.90  
0.95  
0.028  
0.002  
0.007  
0.005  
0.114  
0.114  
0.038  
A
A1  
B
C
D
E
Pin 1  
Marking  
0.15  
0.33  
0.23  
3.10  
3.10  
0.006  
0.013  
0.009  
0.122  
0.122  
1
2
3
4
5
SIDE VIEW  
A
0.50 BSC  
4.90 BSC  
0.40 0.70  
0.0196 BSC  
0.193 BSC  
0.0137 0.029  
4000  
e
SEATING  
PLANE  
A1  
B
H
L
e
END VIEW  
# per tape  
and reel  
C
Controlling dimension: inches  
L
Package Dimensions for MSOP-10  
Rev. 2 | Page 11 of 13 | www.onsemi.com  
CM1216  
Tape and Reel Specifications  
PACKAGE SIZE  
(mm)  
POCKET SIZE (mm) TAPE WIDTH  
W
REEL  
DIAMETER  
QTY PER  
REEL  
PART NUMBER  
B0 X A0 X K0  
P0  
P1  
CM1216-08MR  
3.00 X 3.00 X 0.85  
3.3 X 5.3 X1.3  
12mm  
330mm (13")  
4000  
4mm 8mm  
Rev. 2 | Page 12 of 13 | www.onsemi.com  
CM1216  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any  
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising  
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”  
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating  
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the  
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to  
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or  
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors  
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such  
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action  
Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800-282-9855  
Toll Free USA/Canada  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada  
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81-3-5773-3850  
For additional information, please contact your  
local Sales Representative  
Rev. 2 | Page 13 of 13 | www.onsemi.com  

CM1216 相关器件

型号 制造商 描述 价格 文档
CM1216-06MR CALMIRCO 6- and 8-Channel Low Capacitance ESD Arrays 获取价格
CM1216-06MR ONSEMI 6 and 8-Channel Low Capacitance ESD Arrays 获取价格
CM1216-06MS CALMIRCO 6- and 8-Channel Low Capacitance ESD Arrays 获取价格
CM1216-06SM CALMIRCO 6- and 8-Channel Low Capacitance ESD Arrays 获取价格
CM1216-06SM ONSEMI 6 and 8-Channel Low Capacitance ESD Arrays 获取价格
CM1216-06SN CALMIRCO 6- and 8-Channel Low Capacitance ESD Arrays 获取价格
CM1216-08MR CALMIRCO 6- and 8-Channel Low Capacitance ESD Arrays 获取价格
CM1216-08MR ONSEMI 6 and 8-Channel Low Capacitance ESD Arrays 获取价格
CM1216-08MS CALMIRCO 6- and 8-Channel Low Capacitance ESD Arrays 获取价格
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