CM6200 [ONSEMI]
Data Line Filter, 1 FUNCTIONS, DATA LINE FILTER, SURFACE MOUNT;
| 型号： | CM6200 |
| 厂家： | 
ONSEMI |
| 描述： | Data Line Filter, 1 FUNCTIONS, DATA LINE FILTER, SURFACE MOUNT LTE |
| 文件： | 总6页 (文件大小：297K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CM6200
Advance Information
EMI Filters with ESD
Protection for Microphone
Interface
http://onsemi.com
Description
ON Semiconductor’s CM6200 is a 3x3, 8−bump EMI filter with
ESD protection device for microphone interface applications in a CSP
form factor, 0.4 mm pitch. The CM6200 is fully compliant with
IEC 61000−4−2and is also RoHS II compliant.
WLCSP−8
PLASTIC
CASE 567CF
Features
• This Device is Pb−Free, Halogen Free/BFR Free and is RoHS
Compliant
PACKAGE PINOUT
3
2
1
A1
A1 Corner
Indicator
A3
A2
A
B
C
B3
C3
B2
C2
B1
C1
(Bottom View)
Figure 1. Electrical Schematic
MARKING DIAGRAM
Orientation
Marking
62
WWY
62
= CM6200
WWY = Date Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
October, 2010 − Rev. P5
CM6200/D
CM6200
Pin Information
Table 1. PIN DESCRIPTIONS
Pin
Description
Pin
Description
A2
A3
B1
B2
ECI
B3
C1
C2
C3
ASICp (Internal)
Mic2n (External)
GND
Mic_Bias
Mic2p (External)
GND
ASICn (Internal)
Electrical Specifications and Conditions
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Units
°C
Storage Temperature Range
−55 to +150
−40 to +85
Operating Temperature Range
°C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
R11
Parameter
Conditions
Min
1.9
Typ
2.0
Max
2.1
Units
Bias Resistance
Resistance
Resistance
Resistance
Resistance
kW
kW
kW
kW
W
R12
0.8
1.0
1.2
R21
1.76
1.76
20
2.20
2.20
25
2.64
2.64
30
R22
R31
C11, C12 Pin Capacitance
C21, C22 Pin Capacitance
At 1 MHz, V = 0 V
0.67
1.0
0.83
1.25
1.0
1.0
nF
nF
nA
IN
At 1 MHz, V = 0 V
IN
I
Leakage Current from Pins B1 to B2
V
= 5 V; B3, A2 and A3 floating.
100
LEAK_B
IN
C1, C2, and C3 grounded.
I
Diode Leakage Current from Filter C
Breakdown Voltage (Positive)
Breakdown Voltage (Negative)
V
= 5 V; (Note 3)
1.0
nA
V
LEAK_C
IN
V
B
I = +1 mA (Filter B only); (Note 3)
f
13
I = −1 mA (Filter B only); (Note 3)
f
−13
V
V
ESD
ESD Protection Peak Discharge
Voltage at B1 and C1 pins
(Note 2)
kV
a) Contact discharge per
15
15
IEC 61000−4−2 standard and
b) Air discharge per
IEC 61000−4−2 standard
ESD Protection Peak Discharge
Voltage at A2, A3, B3, and C3 pins
(Note 2)
kV
a) Contact discharge per
2
2
IEC 61000−4−2 standard and
b) Air discharge per
IEC 61000−4−2 standard
1. All parameters specified at T = 25°C unless otherwise noted.
A
2. Standard IEC 61000−4−2 with C
= 150 pF, R
= 330 W.
Discharge
Discharge
3. Filter C parameters are guaranteed by similarity to Filter B.
http://onsemi.com
2
CM6200
Performance Information
Simulation
Figure 2. Typical Insertion Loss (Bias = 0 V, TA = 25°C; 50 W Environment)
RF Characteristics
Figure 3. Typical Insertion Loss for Filter B (Bias = 0 V, TA = 25°C; 50 W Environment);
Pins A2 and A3 Floating
http://onsemi.com
3
CM6200
RF Characteristics
Figure 4. Typical Insertion Loss for Filter C (Bias = 0 V, TA = 25°C; 50 W Environment)
Vertical Structure Specification*
VERTICAL STRUCTURE DIMENSIONS (nominal)
Ref.
a
Parameter
Die Thickness
Repassivation
UBM−(Ti/Cu)
Material
Silicon
Dimension
396 mm
10 mm
h
Polyimide
Plated Cu
Sputtered Cu
Sputtered Ti
d
7.0 mm
0.4 mm
0.1 mm
e
UBM Wetting Area
Diameter
240 mm
b
f
Bump Standoff
194 mm
270 mm
Solder Bump Dia-
meter after Bump
Reflow
c
Metal Pad Height
AlSiCu
1.5 mm
310 mm
g
Metal Pad Diameter
D2
D1
0.406 mm
0.600 mm
Figure 5. Sectional View
Finished Thickness
*Daisy Chain CM6000
http://onsemi.com
4
CM6200
Table 4. CSP TAPE AND REEL SPECIFICATIONS †
Pocket Size (mm)
B X A X K
Tape Width
W
Part Number
Chip Size (mm)
Reel Dia.
Qty Per Reel
P
0
P
1
0
0
0
CM6200
1.20 X 1.20 X 0.60
1.346 X 1.346 X 0.729
8 mm
178 mm (7″)
5000
4 mm 4 mm
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
+
+
+
Figure 6. Tape and Reel Mechanical Data
http://onsemi.com
5
CM6200
PACKAGE DIMENSIONS
WLCSP8, 1.2x1.2
CASE 567CF−01
ISSUE O
NOTES:
D
A
B
E
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
PIN A1
REFERENCE
MILLIMETERS
DIM
A
A1
A2
b
D
E
MIN
0.57
0.17
0.41 REF
0.24
1.20 BSC
1.20 BSC
0.40 BSC
MAX
0.63
0.24
2X
0.05
0.05
C
2X
C
0.29
TOP VIEW
SIDE VIEW
A2
e
0.05
C
RECOMMENDED
SOLDERING FOOTPRINT*
A
0.05
C
PACKAGE
OUTLINE
A1
SEATING
C
NOTE 3
PLANE
A1
8X0.25
e
8X
b
e
0.05
0.03
C
C
A B
0.40
PITCH
C
B
A
0.40
PITCH
DIMENSIONS: MILLIMETERS
1
2
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
Ordering Information
Table 5. PART NUMBERING INFORMATION
Bumps
Package
Ordering Part Number (Note 4)
Part Marking
8
CSP−SAC105
CM6200
62
4. Parts are shipped in Tape and Reel form unless otherwise specified.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
CM6200/D
相关型号：
©2020 ICPDF网 联系我们和版权申明