CSPESD304G [ONSEMI]
4-Channel ESD Protection Array;
| 型号： | CSPESD304G |
| 厂家： | 
ONSEMI |
| 描述： | 4-Channel ESD Protection Array |
| 文件： | 总6页 (文件大小：307K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CSPESD304
4-Channel ESD Array in CSP
Product Description
The CSPESD304 is a quad ESD transient voltage suppression diode
array. Each diode provides a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). These diodes safely dissipate ESD strikes of 15 kV,
exceeding the maximum requirement of the IEC 61000−4−2
international standard. Using the MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater than 30 kV.
The CSPESD304 is particularly well−suited for portable electronics
(e.g., cellular telephones, PDAs, notebook computers) because of its
small package and low weight.
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WLCSP5
CASE 567AY
The CSPESD304 is available in a space−saving, low−profile Chip
Scale Package with lead−free finishing.
ELECTRICAL SCHEMATIC
Features
• Four Channels of ESD Protection
ESD_1 ESD_2 ESD_3 ESD_4
A1
A3
C1
C3
•
15 kV ESD Protection on each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
30 kV ESD Protection on each Channel (HBM)
•
B2
• Chip Scale Package Features Extremely Low Lead Inductance for
Optimum ESD Protection
• 5−Bump, 0.960 mm x 1.330 mm Footprint Chip Scale Package
(CSP)
• These Devices are Pb−Free and are RoHS Compliant
MARKING DIAGRAM
Applications
E
• ESD Protection for Sensitive Electronic Equipment
• I/O Port and Keypad and Button Circuitry Protection for Portable
Devices
E
= CSPESD304
• Can be Used for EMI Filtering when Combined with External
Series Resistance
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
ORDERING INFORMATION
†
Device
Package
Shipping
CSPESD304
CSP−5
3500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
May, 2011 − Rev. 3
CSPESD304/D
CSPESD304
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
5−bump CSP Package
Name Description
Top View
(Bumps Down View)
Bottom View
(Pins Up View)
Pin
A1
A3
B2
C1
C3
Orientation
Marking
(see Note)
ESD_1
ESD_2
GND
ESD Channel 1
ESD Channel 2
Device Ground
ESD Channel 3
ESD Channel 4
1
2 3
+
A
B
C
C1
C3
A3
ESD_3
ESD_4
B2
Orientation
Marking
A1
A1
CSPESD304
CSP Package
Note: Lead−free devices are specified by using a “+” character
for the top side orientation mark.
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
−65 to +150
200
Units
°C
Storage Temperature Range
DC Package Power Rating
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Rating
Units
Operating Temperature Range
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Diode Reverse Breakdown Voltage
Diode Leakage Current
Conditions
Min
Typ
Max
Units
V
V
DIODE
I
= 10 mA
5.5
DIODE
I
V
= 3.3 V, T = 25°C
100
nA
V
LEAK
IN
A
V
SIG
Signal Voltage
Positive Clamp
Negative Clamp
I
= 10 mA
DIODE
5.6
−0.4
6.8
−0.8
9.0
−1.5
V
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
(Note 2)
(Note 2)
kV
V
ESD
30
15
V
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
CL
+15
−8
Negative Transients
C
Diode Capacitance
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
22
27
32
pF
DIODE
1. T = −40 to +85°C unless otherwise specified.
A
2. ESD applied to input and output pins with respect to GND, one at a time.
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2
CSPESD304
PERFORMANCE INFORMATION
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 1. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC)
Figure 2. Frequency Response (single channel vs. GND, in 50 W system)
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3
CSPESD304
APPLICATION INFORMATION
Parameter
Value
0.240 mm
Pad Size on PCB
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
0.290 mm Round
0.125 mm − 0.150 mm
0.300 mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
50 mm
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
20 mm
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
60 seconds
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP5, 0.96x1.33
CASE 567AY−01
ISSUE O
SCALE 4:1
DATE 26 JUL 2010
NOTES:
D
A
B
E
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN A1
REFERENCE
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM
A
A1
A2
b
MIN
0.56
0.21
0.40 REF
0.29
MAX
0.72
0.27
2X
0.05
0.05
C
2X
C
0.35
TOP VIEW
D
0.96 BSC
E
eD
eE
1.33 BSC
0.50 BSC
0.435 BSC
OptiGuard Option
A2
0.05
C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05
C
A1
PACKAGE
OUTLINE
SEATING
PLANE
NOTE 3
C
SIDE VIEW
A1
eD/2
0.87
eD
5X
b
eE
0.05
0.03
C
C
A B
C
B
A
0.44
5X
0.25
0.25
0.50
DIMENSIONS: MILLIMETERS
1
2 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON49808E
WLCSP5, 0.96X1.33
PAGE 1 OF 1
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