EMI6316FCTBG [ONSEMI]
带 ESD 保护的 EMI 滤波器;
| 型号： | EMI6316FCTBG |
| 厂家： | 
ONSEMI |
| 描述： | 带 ESD 保护的 EMI 滤波器 |
| 文件： | 总6页 (文件大小：245K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EMI6316FCTBG
EMI Filter with ESD
Protection for MicroSD Card
Applications
Product Description
http://onsemi.com
MARKING
The EMI6316 is a 4 x 4, 15−bump EMI filter with ESD protection
device for MicroSD card applications in a 0.4 mm pitch CSP form
factor. It is fully compliant with IEC 61000−4−2. The EMI6316 is also
RoHS II compliant.
DIAGRAM
63
YW
G
WLCSP15
CASE 567FX
63 = Specific Device Code
PACKAGE / PINOUT DIAGRAMS
A1 Corner
Indicator
Y
W
G
= Year
= Work Week
= Pb−Free Package
1
2
3
4
4
3
2
1
A
B
C
D
A
B
C
D
63
YW
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 3 of this data sheet.
Top View
(Bumps Down View)
Bottom View
(Bumps Up View)
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
September, 2012 − Rev. 1
EMI6316/D
EMI6316FCTBG
External
Internal
(B2)
(B1)
(B4)
(C1)
(A1)
(A2)
(D2)
(D1)
(C4)
(A4)
External
(A3)
(D3)
(D4)
(B3, C3)
Figure 1. Electrical Schematic
Table 1. PIN DESCRIPTIONS
Pin
A1
A2
A3
A4
Description
dat0 Internal
Pin
B1
B2
B3
B4
Description
Pin
Description
Pin
D1
D2
D3
D4
Description
data3 Internal
clk Internal
C1
cmd Internal
dat1 Internal
V
CC
External
data2 Internal
SDdat1 External
SDdat0 External
GND
SDclk External
C3
C4
GND
SDdata2 External
SDdata3 External
SDcmd External
http://onsemi.com
2
EMI6316FCTBG
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Unit
°C
Storage Temperature Range
Operating Temperature Range
−55 to +150
−40 to +85
°C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol Parameter
Conditions
Min
Typ
Max
Unit
R R R
Resistance
Resistance
Resistance
34
40
46
W
1
2
3
6
R R R
4
5
R R
R
42.5
50
57.5
kW
0
9
1
11
R
12
R
12.75
15
10
17.25
100
14
kW
nA
pF
pF
13
I
Leakage Current per Channel
Line Capacitance
V
= 3.0 V
LEAK
IN
C
At 1 MHz, V = 0 V
9
6
11.5
8
IN
At 1 MHz, V = 1.8 V
(Note 2)
IN
At 1 MHz, V = 2.5 V
7
7
pF
V
IN
V
B
Breakdown Voltage (Positive)
I
R
= 1 mA
9
V
ESD
ESD Protection Peak Discharge Voltage at A3, A4, B2,
B4, C4, D3 and D4 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 3)
kV
8
15
ESD Protection Peak Discharge Voltage at A1, A2, B1,
C1, D1 and D2 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 3)
2
2
1. All parameters specified at T = 25°C unless otherwise noted.
A
2. MicroSD version 3.0 SDR104 compliant.
3. Standard IEC 61000−4−2 with C
= 150 pF, R
= 330 W.
Discharge
Discharge
Table 4. CSP TAPE AND REEL SPECIFICATIONS†
†
Part Number
EMI6316FCTBG
Chip Size (mm)
Package
Shipping
1.56 x 1.56 x 0.50
WLCSP15
(Pb−Free)
5000 / Tape & Reel
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
http://onsemi.com
3
EMI6316FCTBG
RF CHARACTERISTICS
2.5V
0V
Figure 2. S21 Attenuation Simulation
http://onsemi.com
4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP15, 1.56x1.56
CASE 567FX
ISSUE O
SCALE 4:1
DATE 07 JUN 2012
D
A
B
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN A1
REFERENCE
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM
A
A1
A2
b
D
E
MIN
0.47
0.185
0.305 REF
0.24
1.56 BSC
1.56 BSC
0.40 BSC
MAX
0.53
0.205
2X
0.10
0.10
C
0.29
2X
C
TOP VIEW
SIDE VIEW
e
A2
A
0.10
C
GENERIC
MARKING DIAGRAM*
0.05
C
XX
YW
G
SEATING
PLANE
NOTE 3
C
A1
e/2
XX = Specific Device Code
15X
b
Y
W
G
= Year
= Work Week
= Pb−Free Package
e
e
0.05
0.03
C
C
A B
D
C
B
A
e/2
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
1
2
3
4
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.40
PITCH
A1
PACKAGE
OUTLINE
15X
0.23
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON81359E
WLCSP15, 1.56X1.56
PAGE 1 OF 1
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