ES1D [ONSEMI]

1.0A快速恢复整流器;
ES1D
型号: ES1D
厂家: ONSEMI    ONSEMI
描述:

1.0A快速恢复整流器

PC 光电二极管
文件: 总6页 (文件大小:157K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
1.0 A Ultra Fast Recovery  
Rectifier  
ES1A-ES1D  
SMA  
CASE 403AE  
Features  
(COLOR BAND DENOTES CATHODE)  
For Surface Mount Applications  
Glass Passivated Junction  
Low Profile Package  
MARKING DIAGRAM  
Easy Pick and Place  
Builtin Strain Relief  
Superfast Recovery Times for High Efficiency  
This Device is PbFree and is RoHS Compliant  
$Y&Z&3  
ES1X  
Applications  
This Product is General Usage and Suitable for Many Different  
$Y  
&Z  
&3  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
Applications  
ES1X  
X
= Specific Device Code  
= A/B/C/D  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
May, 2022 Rev. 5  
ES1D/D  
ES1AES1D  
ABSOLUTE MAXIMUM RATINGS T = 25°C Unless Otherwise Noted  
A
Value  
1A  
1B  
1C  
1D  
Symbol  
Parameter  
Units  
V
Maximum Repetitive Reverse Voltage  
50  
100  
150  
200  
V
A
A
RRM  
I
Average Rectified Forward Current, @ T = 120°C  
1.0  
30  
F(AV)  
A
I
Nonrepetitive Peak Forward Surge Current  
8.3 ms Single HalfSineWave  
FSM  
Storage Temperature Range  
50 to +150  
50 to +150  
°C  
°C  
T
stg  
T
Jm  
Operating Junction Temperature  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
1.47  
85  
Units  
W
P
D
Power Dissipation  
Thermal Resistance, Junction to Ambient*  
Thermal Resistance, Junction to Lead*  
°C/W  
°C/W  
R
θ
JA  
35  
R
q
JL  
*Device mounted on FR4 PCB 0.013 mm.  
ELECTRICAL CHARACTERISTICS T = 25°C Unless Otherwise Noted  
J
Device  
1A  
1B  
1C  
1D  
Symbol  
Parameter  
Units  
V
V
F
Forward Voltage @ 1.0 A  
Reverse Recovery Time  
0.92  
15  
t
rr  
ns  
I = 0.5 A, I = 1.0 A, I = 0.25 A  
F
R
RR  
I
mA  
Reverse Current  
@ rated V  
R
R
5.0  
100  
T = 25_C  
A
T = 100_C  
A
C
Total Capacitance  
7.0  
pF  
T
V
R
= 4.0 V, f = 1.0 MHz  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
PACKAGE MARKING AND ORDERING INFORMATION TBD  
Device Marking  
ES1A  
Device  
ES1A  
ES1B  
ES1C  
ES1D  
Package  
SMA  
Quantity  
7500 / Tape & Reel  
7500 / Tape & Reel  
7500 / Tape & Reel  
7500 / Tape & Reel  
ES1B  
SMA  
ES1C  
SMA  
ES1D  
SMA  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
2
ES1AES1D  
TYPICAL CHARACTERISTICS  
10  
1
1.5  
1.25  
1
0.75  
0.5  
0.2 5  
0
0.1  
RESISTIVE OR  
INDUCTIVE LOAD  
P.C.B. MOUNTED  
ON 0.2 x 0.2”  
(5.0 x 5.0 mm)  
COPPER PAD AREAS  
0.01  
T
= 25°C  
A
Pulse Width = 300 ms  
2% Duty Cycle  
0.001  
0
25  
50  
75  
100  
125  
150  
175  
0.6  
1.4  
0.4  
0.8  
1
1.2  
Ambient Temperature [5C]  
Forward Voltage, V [V]  
F
Figure 2. Forward Voltage Characteristics  
Figure 1. Forward Current Derating Curve  
1000  
30  
25  
20  
15  
10  
100  
T
A
= 125°C  
10  
1
T
A
= 75°C  
5
T
A
= 25°C  
0.1  
0
0
20  
40  
60  
80  
100  
120  
140  
1
2
5
10  
20  
50  
100  
Percent of Rated Peak Reverse Voltage [%]  
Number of Cycles at 60 Hz  
Figure 3. NonRepetitive Surge Current  
Figure 4. Reverse Current vs Reverse Voltage  
14  
12  
10  
8
6
4
2
0
0.1  
1
10  
100  
Reverse Voltage, V [V]  
R
Figure 5. Total Capacitance  
www.onsemi.com  
3
ES1AES1D  
TYPICAL CHARACTERISTICS (continued)  
50 W  
NONINDUCTIVE  
50 W  
NONINDUCTIVE  
trr  
+0.5 A  
()  
DUT  
0
Pulse  
Generator  
(Note 2)  
50 V  
(approx)  
0.25 A  
(+)  
50 W  
NONINDUCTIVE  
OSCILLOSCOPE  
(Note 1)  
NOTES:  
1.0 A  
1. Rise time = 7.0 ns max; Input impedance = 1.0 MW 22 pf.  
2. Rise time = 10 ns max; Source impedance = 50 W.  
1.0 cm  
SET TIME BASE FOR  
5/ 10 ns/ cm  
Figure 6. Reverse Recovery Time Characterstic and Test Circuit Diagram  
www.onsemi.com  
4
 
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SMA  
CASE 403AE  
ISSUE O  
DATE 31 AUG 2016  
5.60  
4.80  
M
B
B
0.13  
B
C
B
A
2.65  
2.95  
2.50  
1.65  
1.20  
1.75  
4.30  
4.75  
4.00  
B
A
LAND PATTERN RECOMMENDATION  
TOP VIEW  
2.50 MAX  
A
2.20  
1.90  
NOTES:  
A. EXCEPT WHERE NOTED, CONFORMS  
TO JEDEC DO214 VARIATION AC.  
0.30  
0.05  
B
DOES NOT COMPLY JEDEC STANDARD  
VALUE.  
0.203  
0.050  
B
C
C. ALL DIMENSIONS ARE IN MILLIMETERS.  
D. DIMENSIONS ARE EXCLUSIVE OF  
BURRS, MOLD FLASH AND TIE BAR  
PROTRUSIONS.  
E. DIMENSIONS AND TOLERANCE AS  
PER ASME Y14.52009.  
E. LAND PATTERN STD. DIOM5025X231M  
2.05  
1.95  
M
0.13  
C
B
A
SIDE VIEW  
8 °  
0 °  
R0.15 4X  
GAGE PLANE  
0.45  
0.41  
0.15  
1.52  
0.75  
8 °  
0 °  
DETAIL A  
SCALE 20 : 1  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13440G  
SMA  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
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TECHNICAL PUBLICATIONS:  
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