ESD12ST5G [ONSEMI]

ESD Protection Diodes In Ultra Small SOD-723 Package; ESD保护二极管采用超小SOD- 723封装


型号：	ESD12ST5G
厂家：	ONSEMI
描述：	ESD Protection Diodes In Ultra Small SOD-723 Package ESD保护二极管采用超小SOD- 723封装二极管
文件：	总4页 (文件大小：79K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

mESD3.3ST5G SERIES

ESD Protection Diodes

In Ultra Small SOD-723 Package

The mESD Series is designed to protect voltage sensitive

components from ESD. Excellent clamping capability, low leakage,

and fast response time provide best in class protection on designs that

are exposed to ESD. Because of its small size, it is suited for use in

cellular phones, MP3 players, digital cameras and many other portable

applications where board space comes at a premium.

http://onsemi.com

Specification Features:

•ꢀSmall Body Outline Dimensions:

0.055″ x 0.024″ (1.40 mm x 0.60 mm)

•ꢀLow Body Height: 0.020″ (0.5 mm)

•ꢀStand-off Voltage: 3.3 V - 12 V

•ꢀLow Leakage

PIN 1. CATHODE

2. ANODE

MARKING

DIAGRAM

•ꢀResponse Time is Typically < 1 ns

•ꢀESD Rating of Class 3 (> 16 kV) per Human Body Model

•ꢀIEC61000-4-2 Level 4 ESD Protection

•ꢀIEC61000-4-4 Level 4 EFT Protection

•ꢀThese are Pb-Free Devices

XX MG

SOD-723

CASE 509AA

= Specific Device Code

= Date Code

= Pb-Free Package

Mechanical Characteristics:

(Note: Microdot may be in either location)

CASE: Void‐free, transfer‐molded, thermosetting plastic

Epoxy Meets UL 94 V-0

ORDERING INFORMATION

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

†

Device

Package

Shipping

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

mESDxxST5G

SOD-723 8000/Tape & Reel

(Pb-Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

MAXIMUM RATINGS

Rating

IEC 61000-4-2 (ESD)

Symbol

Value

Unit

Air

Contact

IEC 61000-4-4 (EFT)

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the table on page 2 of this data sheet.

ESD Voltage

Per Human Body Model

Per Machine Model

400

Total Power Dissipation on FR-5 Board

(Note 1) @ T = 25°C

⎪

150

Junction and Storage Temperature Range

T , T

-55 to

+150

°C

stg

Lead Solder Temperature - Maximum

(10 Second Duration)

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR-5 = 1.0 x 0.75 x 0.62 in.

©ꢀ Semiconductor Components Industries, LLC, 2008

February, 2008 - Rev. 3

Publication Order Number:

UESD3.3ST5G/D

mESD3.3ST5G SERIES

ELECTRICAL CHARACTERISTICS

(T = 25°C unless otherwise noted)

Symbol

Parameter

Maximum Reverse Peak Pulse Current

Clamping Voltage @ I

RWM

Working Peak Reverse Voltage

V V

BR RWM

Maximum Reverse Leakage Current @ V

RWM

Breakdown Voltage @ I

Test Current

Forward Current

Forward Voltage @ I

Peak Power Dissipation

Max. Capacitance @V = 0 and f = 1 MHz

Uni-Directional TVS

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 1.1 V Max. @ I = 10 mA for all types)

(mA) @

V (V) @ I

(Note 2)

(V)

(W)

@ Max I

†

RWM

(V)

I (A)

C (pF)

Typ

RWM

Device

Marking

Max

3.3

5.0

Max

Min

1.0

Max

10.4

8.8

Max

113

117

128

Device*

mESD3.3ST5G

mESD5.0ST5G

mESD12ST5G

2.5

1.0

5.0

10.9

6.2

13.3

13.5

23.7

5.4

*Other voltages available upon request.

†Surge current waveform per Figure 1.

2. V is measured with a pulse test current I at an ambient temperature of 25°C.

100

PEAK VALUE I

@ 8 ms

RSM

PULSE WIDTH (t ) IS DEFINED

AS THAT POINT WHERE THE

PEAK CURRENT DECAY = 8 ms

HALF VALUE I /2 @ 20 ms

RSM

t, TIME (ms)

Figure 1. 8 x 20 ms Pulse Waveform

http://onsemi.com

mESD3.3ST5G SERIES

TYPICAL CHARACTERISTICS

7.4

7.3

7.2

7.1

7.0

6.9

6.8

6.7

6.6

6.5

6.4

6.3

mESDxxST5G

-ꢁ55

+ꢁ25

+ꢁ150

-55

+ꢁ25

+ꢁ150

TEMPERATURE (°C)

Figure 2. Typical Breakdown Voltage

versus Temperature

Figure 3. Typical Leakage Current

versus Temperature

Figure 4. Positive 8 kV contact per IEC 6100-4-2

- mESD5.0ST5G

Figure 5. Negative 8 kV contact per IEC 61000-4-2

- mESD5.0ST5G

http://onsemi.com

mESD3.3ST5G SERIES

PACKAGE DIMENSIONS

SOD-723

CASE 509AA-01

ISSUE O

-X-

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

-Y-

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

b 2X

0.08 (0.0032)

X Y

MILLIMETERS

DIM MIN NOM MAX

INCHES

MIN NOM MAX

0.019 0.020 0.022

0.49

0.25

0.08

0.95

0.55

1.35

0.15

0.52

0.28

0.12

1.00

0.60

1.40

0.20

0.55

0.32 0.0098 0.011 0.013

0.15 0.0032 0.0047 0.0059

1.05

0.65

1.45

0.25

0.037 0.039 0.041

0.022 0.024 0.026

0.053 0.055 0.057

0.006 0.0079 0.010

SOLDERING FOOTPRINT*

1.1

0.043

0.45

0.0177

0.50

0.0197

inches

SCALE 10:1

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800-282-9855 Toll Free

ꢂUSA/Canada

Europe, Middle East and Africa Technical Support:

ꢂPhone: 421 33 790 2910

Japan Customer Focus Center

ꢂPhone: 81-3-5773-3850

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

ꢂLiterature Distribution Center for ON Semiconductor

ꢂP.O. Box 5163, Denver, Colorado 80217 USA

ꢂPhone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada

ꢂFax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada

ꢂEmail: orderlit@onsemi.com

For additional information, please contact your local

Sales Representative

UESD3.3ST5G/D

http://onsemi.com

ESD12ST5G [ONSEMI]

相关型号：

ESD12V12D-A

ESD12V12D-C

ESD12VD3

ESD12VD3

ESD12VD3-T

ESD12VD3-TP

ESD12VD3-TP-HF

ESD12VD3B-TP

ESD12VD3B-TP-HF

ESD12VD3F2

ESD12VD5

ESD12VD5-T