ESD5384NCTBG [ONSEMI]

ESD 保护,5 线,HDMI 控制线;
ESD5384NCTBG
型号: ESD5384NCTBG
厂家: ONSEMI    ONSEMI
描述:

ESD 保护,5 线,HDMI 控制线

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文件: 总9页 (文件大小:358K)
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ESD5384  
ESD Protection Diode  
5Line HDMI Control Line ESD Protection  
Functional Description  
The ESD5384 chip is a low capacitance ESD protection for HDMI  
control pins. It also integrates pullup resistor for I C bus and  
www.onsemi.com  
MARKING  
2
pulldown resistor for hot plug detect and pullup resistor for CEC  
line.  
The ESD protection circuitry prevents damage to the protected  
device when subjected to ESD surges up to 15 kV.  
The ESD5384 is available in 9 bump CSP package.  
DIAGRAM  
WLCSP9  
CASE 567CX  
53M  
Features  
Line Capacitance: 12 pF max  
IEC 6100042 Level 4  
53  
M
= Specific Device Code  
= Date Code  
15 kV (air discharge)  
8 kV (contact discharge)  
This is a PbFree Device  
PINOUT  
3
2
1
Applications  
A
SCL  
CEC  
5V  
HDMI Control Line Interfaces  
Smart Phones  
Tablets  
Consumer Electronics  
B
C
SDA  
HPD  
GND  
GND  
RPU2  
RPU  
(Bump Side)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
A1  
C3  
B3  
A3  
A2  
HPD  
SDA  
SCL  
CEC  
1.75KW  
1.75KW  
5V  
C1  
B1  
27KW  
B2, C2  
ESD5384  
Figure 1. Electrical Schematic  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
September, 2017 Rev. 1  
ESD5384/D  
ESD5384  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
PP  
External pins (A1, A2, A3, B3 and C3):  
kV  
ESD IEC 6100042, level 4 – air discharge  
ESD IEC 6100042, level 4 – contact discharge  
Internal pins (B1, C1):  
15  
8
ESD IEC 6100042, level 1 – air discharge  
ESD IEC 6100042, level 1 – contact discharge  
2
2
T
Operating Temperature Range  
Storage Temperature Range  
30 to +85  
°C  
°C  
op  
T
stg  
55 to +150  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
ELECTRICAL CHARACTERISTICS (Note 1)  
Symbol  
Test Condition  
Min  
Typ  
Max  
20  
Unit  
V
V
Breakdown Voltage (I = 1mA)  
6
BR  
RM  
RM  
r
I
I
Leakage Current @ V (V = 3 V per line), excluding HPD line  
50  
200  
32  
nA  
mA  
W
rm  
rm  
Leakage Current @ V (V = 3 V per line), HPD line  
rm  
rm  
R1, R2  
R3  
Resistance  
1575  
80  
1750  
100  
27  
1925  
120  
32  
Pullup Resistance  
Pullup Resistance  
kW  
kW  
pF  
R4  
22  
C
V
line  
V
line  
V
line  
= 0 V, V  
= 0 V, V  
= 0 V, V  
= 30 mV, F = 1 MHz, A2 with B1 not connected  
14  
17  
line  
osc  
osc  
osc  
= 30 mV, F = 1 MHz, A3, B3 with C1 not connected.  
= 30 mV, F = 1 MHz, A2, A3, B3 with C1 and B1 grounded  
24  
29  
10  
12  
1. All parameters specified at T = 25°C unless otherwise noted.  
A
TYPICAL CHARACTERISTICS  
Figure 2. Crosstalk Measurements  
www.onsemi.com  
2
 
ESD5384  
TYPICAL CHARACTERISTICS  
Figure 3. ESD Clamping Voltage Screenshot Positive  
Figure 4. ESD Clamping Voltage Screenshot  
8 kV Contact per IEC6100042, CEC line  
Negative 8 kV Contact per IEC6100042, CEC line  
Figure 5. ESD Clamping Voltage Screenshot  
Figure 6. ESD Clamping Voltage Screenshot  
Positive 8 kV Contact per IEC6100042, SCL line  
Negative 8 kV Contact per IEC6100042, SCL line  
Figure 7. ESD Clamping Voltage Screenshot  
Figure 8. ESD Clamping Voltage Screenshot  
Positive 8 kV Contact per IEC6100042, SDA line  
Negative 8 kV Contact per IEC6100042, SDA line  
www.onsemi.com  
3
ESD5384  
TYPICAL CHARACTERISTICS  
Figure 9. ESD Clamping Voltage Screenshot  
Figure 10. ESD Clamping Voltage Screenshot  
Positive 8 kV Contact per IEC6100042, HPD line  
Negative 8 kV Contact per IEC6100042, HPD line  
Figure 11. ESD Clamping Voltage Screenshot  
Figure 12. ESD Clamping Voltage Screenshot  
Positive 8 kV Contact per IEC6100042, 5 V line  
Negative 8 kV Contact per IEC6100042, 5 V line  
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4
ESD5384  
IEC6100042 Waveform  
IEC6100042 Spec.  
I
peak  
First Peak  
Current  
(A)  
100%  
90%  
Test Volt-  
age (kV)  
Current at  
30 ns (A)  
Current at  
60 ns (A)  
Level  
1
2
3
4
2
4
6
8
7.5  
15  
4
8
2
4
6
8
I @ 30 ns  
22.5  
30  
12  
16  
I @ 60 ns  
10%  
t
P
= 0.7 ns to 1 ns  
Figure 13. IEC6100042 Spec  
Oscilloscope  
ESD Gun  
50 W  
Cable  
50 W  
Figure 14. Diagram of ESD Clamping Voltage Test Setup  
The following is taken from Application Note  
AND8308/D Interpretation of Datasheet Parameters  
for ESD Devices.  
systems such as cell phones or laptop computers it is not  
clearly defined in the spec how to specify a clamping voltage  
at the device level. ON Semiconductor has developed a way  
to examine the entire voltage waveform across the ESD  
protection diode over the time domain of an ESD pulse in the  
form of an oscilloscope screenshot, which can be found on  
the datasheets for all ESD protection diodes. For more  
information on how ON Semiconductor creates these  
screenshots and how to interpret them please refer to  
AND8307/D.  
ESD Voltage Clamping  
For sensitive circuit elements it is important to limit the  
voltage that an IC will be exposed to during an ESD event  
to as low a voltage as possible. The ESD clamping voltage  
is the voltage drop across the ESD protection diode during  
an ESD event per the IEC6100042 waveform. Since the  
IEC6100042 was written as a pass/fail spec for larger  
100  
t
r
PEAK VALUE I  
@ 8 ms  
RSM  
90  
80  
70  
60  
50  
40  
30  
20  
PULSE WIDTH (t ) IS DEFINED  
P
AS THAT POINT WHERE THE  
PEAK CURRENT DECAY = 8 ms  
HALF VALUE I /2 @ 20 ms  
RSM  
t
P
10  
0
0
20  
40  
t, TIME (ms)  
60  
80  
Figure 15. 8 x 20 ms Pulse Waveform  
www.onsemi.com  
5
ESD5384  
Figure 16. Positive TLP IV Curve  
Figure 17. Negative TLP IV Curve  
50 W Coax  
Cable  
Transmission Line Pulse (TLP) Measurement  
L
Attenuator  
S
Transmission Line Pulse (TLP) provides current versus  
voltage (IV) curves in which each data point is obtained  
from a 100 ns long rectangular pulse from a charged  
transmission line. A simplified schematic of a typical TLP  
system is shown in Figure 18. TLP IV curves of ESD  
protection devices accurately demonstrate the product’s  
ESD capability because the 10s of amps current levels and  
under 100 ns time scale match those of an ESD event. This  
is illustrated in Figure 19 where an 8 kV IEC6100042  
current waveform is compared with TLP current pulses at  
8 A and 16 A. A TLP IV curve shows the voltage at which  
the device turns on as well as how well the device clamps  
voltage over a range of current levels. A typical TLP IV  
curve for the ESD7383 is shown in Figures 16 and 17.  
÷
50 W Coax  
Cable  
I
M
V
M
10 MW  
DUT  
V
C
Oscilloscope  
Figure 18. Simplified Schematic of a Typical TLP  
System  
Figure 19. Comparison Between 8 kV IEC6100042 and 8 A and 16 A TLP Waveforms  
www.onsemi.com  
6
 
ESD5384  
TYPICAL APPLICATION SCHEMATIC  
ESD7484  
ESD7484  
HDMI Type C  
Connector  
Data2 Shield  
1
A3  
A3 A1 C3 C1 B2  
D3 D1 F3 F1 E2  
A1 C3 C1 B2  
D3 D1 F3 F1 E2  
Data2 +  
Data2  
Data2 +  
2
3
4
5
6
Data2 −  
Data1 Shield  
Data1 +  
Data1 −  
Data1 +  
Data1 −  
Data0 Shield  
Data0 +  
Data0 −  
7
8
Data0 +  
Data0 −  
9
CLK Shield  
CLK +  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
CLK +  
CLK −  
CLK −  
DDC GROUND  
CEC  
CEC  
SCL  
SCL  
SDA  
SDA  
Reserved  
+5 Power  
HPD  
+5 Power  
HPD  
A1  
5V  
C3  
HPD  
B3  
SDA  
A3  
SCL  
A2  
CEC  
1.75KW  
1.75KW  
5V  
C1  
B1  
VDD_CEC  
27KW  
B2, C2  
ESD5384  
Figure 20. Typical Application Schematic  
ORDERING INFORMATION  
Part Number  
Chip Size (mm)  
Package  
Shipping  
ESD5384  
1.14 x 1.14 x 0.605  
WLCSP9  
(PbFree)  
5000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
WLCSP9, 1.14x1.14  
CASE 567CX01  
ISSUE O  
SCALE 4:1  
DATE 22 OCT 2010  
NOTES:  
D
A
B
E
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
PIN A1  
REFERENCE  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. COPLANARITY APPLIES TO SPHERICAL  
CROWNS OF SOLDER BALLS.  
MILLIMETERS  
DIM  
A
A1  
A2  
b
MIN  
0.57  
0.17  
0.41 REF  
0.24  
MAX  
0.63  
0.24  
2X  
0.05  
0.05  
C
2X  
C
0.29  
TOP VIEW  
D
1.14 BSC  
E
e
1.14 BSC  
0.40 BSC  
A2  
0.05  
C
RECOMMENDED  
SOLDERING FOOTPRINT*  
A
PACKAGE  
OUTLINE  
0.05  
C
A1  
SEATING  
PLANE  
NOTE 3  
C
A1  
SIDE VIEW  
9X0.25  
e
9X  
b
e
0.05  
0.03  
C
C
A B  
0.40  
PITCH  
C
B
A
0.40  
PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
1
2
3
BOTTOM VIEW  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON54062E  
WLCSP9, 1.14X1.14  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
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