ESD5Z12T5G [ONSEMI]
ESD 保护二极管，SOD-523;
| 型号： | ESD5Z12T5G |
| 厂家： | 
ONSEMI |
| 描述： | ESD 保护二极管，SOD-523 局域网 光电二极管 瞬态抑制器 |
| 文件： | 总4页 (文件大小：111K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESD5Z2.5T1 SERIES
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
The ESD5Z Series is designed to protect voltage sensitive components
from ESD and transient voltage events. Excellent clamping capability,
low leakage, and fast response time, make these parts ideal for ESD
protection on designs where board space is at a premium. Because of its
small size, it is suited for use in cellular phones, portable devices, digital
cameras, power supplies and many other portable applications.
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1
2
Cathode
Anode
Specification Features:
• Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
• Low Body Height: 0.028″ (0.7 mm)
• Stand−off Voltage: 2.5 V − 12 V
• Peak Power up to 240 Watts @ 8 x 20 ms Pulse
2
1
SOD−523
CASE 502
PLASTIC
• Low Leakage
• Response Time is Typically < 1 ns
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• IEC61000−4−2 Level 4 ESD Protection
• IEC61000−4−4 Level 4 EFT Protection
• Pb−Free Packages are Available
MARKING DIAGRAM
XX
G
2
1
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
XX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary
depending upon manufacturing location.
MAXIMUM RATINGS
ORDERING INFORMATION
Rating
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
†
Device
Package
Shipping
Air
Contact
±30
±30
kV
ESD5ZxxxT1
ESD5ZxxxT1G
SOD−523
3000/Tape & Reel
3000/Tape & Reel
IEC 61000−4−4 (EFT)
40
A
SOD−523
Pb−Free
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
kV
V
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Power Dissipation on FR−5 Board
°P °
D
200
mW
(Note 1) @ T = 25°C
A
Junction and Storage Temperature Range
T , T
−55 to
°C
J
stg
+150
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Lead Solder Temperature − Maximum
T
260
°C
L
(10 Second Duration)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
October, 2006 − Rev. 5
ESD5Z2.5T1/D
ESD5Z2.5T1 SERIES
ELECTRICAL CHARACTERISTICS
A
I
(T = 25°C unless otherwise noted)
I
F
Symbol
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
I
PP
V
C
PP
V
V
V
BR RWM
V
Working Peak Reverse Voltage
C
RWM
V
I
V
R
T
F
I
Maximum Reverse Leakage Current @ V
I
R
RWM
V
Breakdown Voltage @ I
Test Current
BR
T
I
T
F
I
Forward Current
I
PP
V
Forward Voltage @ I
F
F
Uni−Directional TVS
P
Peak Power Dissipation
Max. Capacitance @V = 0 and f = 1 MHz
pk
C
R
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 0.9 V Max. @ I = 10 mA for all types)
A
F
F
V
I
(mA)
V
(V) @ I
(Note 2)
V
(V)
V
(V)
P
pk
(W)
RWM
(V)
R
BR
T
C
C
†
†
†
†
@ V
@ I = 5.0 A
@ Max I
I
I
(A)
PP
C (pF)
Typ
145
105
80
RWM
PP
PP
T
Device
Marking
Max
2.5
3.3
5.0
6.0
7.0
12
Max
Min
4.0
mA
1.0
1.0
1.0
1.0
1.0
1.0
Typ
6.5
Max
10.9
14.1
18.6
20.5
22.7
25
Max
11.0
11.2
9.4
Max
120
158
174
181
200
240
Device**
ESD5Z2.5T1, G*
ZD
ZE
ZF
ZG
ZH
ZM
6.0
ESD5Z3.3T1, G*
ESD5Z5.0T1, G*
ESD5Z6.0T1, G*
ESD5Z7.0T1, G*
ESD5Z12T1, G*
0.05
0.05
0.01
0.01
0.01
5.0
8.4
6.2
11.6
12.4
13.5
17
6.8
8.8
70
7.5
8.8
65
14.1
9.6
55
* The “G’’ suffix indicates Pb−Free package available.
**Other voltages available upon request.
†Surge current waveform per Figure 1.
2. V is measured with a pulse test current I at an ambient temperature of 25°C.
BR
T
100
90
80
70
60
50
40
30
20
t
r
PEAK VALUE I
@ 8 ms
RSM
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
HALF VALUE I /2 @ 20 ms
RSM
t
P
10
0
0
20
40
t, TIME (ms)
60
80
Figure 1. 8 x 20 ms Pulse Waveform
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2
ESD5Z2.5T1 SERIES
Figure 2. Positive 8 kV contact per IEC 6100−4−2
− ESD5Z5.0T1G
Figure 3. Negative 8 kV contact per IEC 6100−4−2
− ESD5Z5.0T1G
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3
ESD5Z2.5T1 SERIES
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE B
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
A
−Y−
B
1
2
MILLIMETERS
NOM
INCHES
NOM
D 2 PL
DIM MIN
MAX
1.30
0.90
0.70
0.35
MIN
MAX
0.051
0.035
0.028
0.014
A
B
C
D
J
1.10
1.20
0.80
0.60
0.30
0.14
0.20
1.60
0.043
0.028
0.020
0.010
0.047
0.032
0.024
0.012
M
0.08 (0.003)
T
X
Y
0.70
0.50
0.25
0.07
0.15
1.50
0.20 0.0028 0.0055 0.0079
K
S
0.25
1.70
0.006
0.059
0.008
0.063
0.010
0.067
C
−T−
SEATING
PLANE
K
J
S
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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ESD5Z2.5T1/D
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