ESD6100 [ONSEMI]
2-Channel ESD Protection Device;
| 型号： | ESD6100 |
| 厂家： | 
ONSEMI |
| 描述： | 2-Channel ESD Protection Device |
| 文件： | 总4页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESD6100
2 Channel Very Low
Capacitance ESD
Protection Device in CSP
Product Description
http://onsemi.com
The ESD6100 is a 4−bump very low capacitance ESD protection
device in 0.4 mm CSP form factor. It is fully compliant with IEC
61000−4−2. The ESD6100 is RoHS II compliant.
Table 1. PIN DESCRIPTIONS
4−bump CSP Package
WLCSP4
CASE 567CB
Pin
A1
Description
ESD Channel 1
ESD Channel 2
Device Ground
ELECTRICAL SCHEMATIC
A2
B1 and B2
CH1 (A1)
CH2 (A2)
PACKAGE / PINOUT DIAGRAMS
4−Bump CSP Package
Orientation
Marking
1
2
2
1
A1
GND (B1)
GND (B2)
+
A
B
A
B
A2
A1
Orientation
Marking
PX
MARKING DIAGRAM
B2
B1
PX
Top View
(Bumps Down View)
Bottom View
(Bumps Up View)
P
X
= ESD6100
= Single Digit Date Code
WHERE X =
A = ww01, ww02
B = ww03, ww04
C = ww05, ww06
D = ww06, ww08
E = ww08, ww10
F = ww11, ww12
G = ww13, ww14
H = ww15, ww16
I = ww17, ww18
J = ww19, ww20
K = ww21, ww22
L = ww23, ww24
M = ww25, ww26
N = ww27, ww28
O = ww29, ww30
P = ww31, ww32
Q = ww33, ww34
R = ww35, ww36
S = ww37, ww38
T = ww39, ww40
U = ww41, ww42
V = ww43, ww44
W = ww45, ww46
X = ww47, ww48
Y = ww49, ww50
Z = ww51, ww52
ORDERING INFORMATION
†
Device
ESD6100
Package
Shipping
WLCSP4
(Pb−Free)
10000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
October, 2014 − Rev. 1
ESD6100/D
ESD6100
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Units
°C
Storage Temperature Range
Operating Temperature Range
–55 to +150
–40 to +85
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Input Operating Supply Voltage
Breakdown Voltage (Positive)
Channel Leakage Current
Conditions
Min
Typ
Max
Units
V
V
IN
3.0
5.5
V
B
I = 1 mA
6
V
F
I
V
IN
= 3 V (Note 2)
1.0
100
1.5
nA
pF
pF
kV
LEAK
C
Channel Input Capacitance
At 1 MHz, V = 0 V (Note 2)
IN
IN
DC
Channel Input Capacitance Matching
At 1 MHz, V = 0 V (Note 2)
0.02
IN
IN
V
ESD
ESD Protection Peak Discharge Voltage at any
channel input
(Notes 2 and 3)
a) Contact Discharge per IEC 61000−4−2
standard
b) Air Discharge per IEC 61000−4−2 standard
8
15
V
CL
Channel Clamp Voltage
Positive Transients
Negative Transients
I
PP
= 1 A, t = 8/20 ms (Note 2)
V
P
+9.8
−1.5
R
Dynamic Resistance
Positive Transients
Negative Transients
I
= 1 A, t = 8/20 ms
W
DYN
PP
P
Any I/O pin to Ground (Note 2)
0.7
0.5
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. All parameters specified at T = 25°C unless otherwise noted.
A
2. These parameters are guaranteed by design and characterization.
3. Standard IEC 61000−4−2 with C
= 150 pF, R
= 330 W.
Discharge
Discharge
http://onsemi.com
2
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP4, 0.8x0.8
CASE 567CB−01
ISSUE O
SCALE 4:1
DATE 26 JUL 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
A
D
B
E
PIN A1
REFERENCE
MILLIMETERS
2X
0.05
0.05
C
DIM
A
A1
A2
b
MIN
0.57
0.17
0.41 REF
0.24
MAX
0.63
0.24
2X
C
TOP VIEW
0.29
D
E
e
0.80 BSC
0.80 BSC
0.40 BSC
A2
0.05
C
C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05
SEATING
PLANE
PACKAGE
OUTLINE
A1
NOTE 3
C
A1
SIDE VIEW
e
4X0.25
4X
b
0.40
PITCH
e
0.05
0.03
C
C
A B
0.40
B
PITCH
A
DIMENSIONS: MILLIMETERS
1
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON50305E
WLCSP4, 0.8X0.8
PAGE 1 OF 1
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