FAN105BM6X [ONSEMI]
PSR Quasi-Resonant Valley Switch Controller;型号: | FAN105BM6X |
厂家: | ONSEMI |
描述: | PSR Quasi-Resonant Valley Switch Controller |
文件: | 总19页 (文件大小:659K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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FAN105BM6X
Offline Primary-Side-Regulation
(PSR) Quasi-Resonant Valley
Switch Controller
FAN105B is offline Primary-Side-Regulation (PSR) PWM controller with
Quasi-Resonant (QR) mode controller to achieved constant-voltage (CV)
and constant-current (CC) control for Travel Adaptor (TA) requirement,
and provide cost-effective, simplified circuit for energy-efficient power
supplies.
www.onsemi.com
MARKING DIAGRAM
FAN105B integrates proprietary operation of energy saving feature at no
load, mWSaver Technology that combines our most energy efficient
process and circuit technologies for power adapter design.
FAN105B can be used in Travel Adapter design by stand-alone or co-work
with secondary-side SR controller FAN6292B. When paired FAN105B with
FAN6292B, both SR and USB Type-C connector are compatible to
achieve higher power and advanced control applications.
PXXEX
-
- - -
Features
· · · = Year Code
mWSaver® Technology Provides Ultra-Low Standby
Power Consumption for Energy Star’s 5-Star Level
(<30 mW with HV FET)
PXX = 5A0 : FAN105BM6X
= 5B0 : FAN105BM6X
E X = Die Run Code
Constant-Current (CC) and Constant-Voltage(CV) with
Primary-Side Regulation Eliminates Secondary-Side
Feedback Component
- - - = Week Code
Valley Switch Operation for Highest Average Efficiency
PIN CONNECTIONS
Programmable Cable Drop Compensation(CDC) with One
External Resistor
Integrated Dynamic Response Enhanceement(DRE)
Function
AUX
CS
Low EMI Emissions and Common Mode Noise
Cycle-by-Cycle Current Limiting
VS
GND
GATE
Output Short-Circuit Protection
VDD
Scondary side Rectifier Short Detection via Current Sense
Protection(CSP)
Integrated Constant Current Compensation for Precise CC
Regulation
ORDERING INFORMATION
Output Over-Voltage Protection (VSOVP)
Output under-Voltage Protection (VSUVP)
VDD Over-Voltage Protection (VDD OVP)
Internal Thermal-Shutdown Protection (OTP)
Programmable Brown-In and Brown-Out Protection
Operating
Temperature
Range
Packing
Method
Part Number
Package
6-Lead,
SOT23
FAN105BM6X -40 ºC ~125ºC
Tap & Reel
For information on tape and reel specifications,
including part orientation and tape sizes,
please refer to our Tape and Reel Packaging
Typical Applications
Specifications
Brochure,
BRD8011/D.
Travel Adapter for Smart Phones, Feature Phones, and Tablet
PCs
AC-DC Adapters for Portable Devices that Require CV/CC
Control
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
Load
Switch
VBUS
Bridge
Lπ
NP
NS
RSN1
RStart
CSN2
Co1
USB Type-C
+
Co2
CDL1
CDL2
Vac
GND
GND
RX1+
RX1-
VBUS
SBU2
D-
SR MOSFET
TX1+
TX1-
VBUS
-
DSN1
RLPC1
VBUS
CC1
VBUS
Fuse
Depletion
MOSFET
CC1
RLPC2
DVDD
MOSFET
D+
LPC GATE GND VIN
D-
D+
Opto-
coupler
Rot
RFB
CVDD
CC2
VBUS
TX2-
TX2+
GND
SBU1
VBUS
FAN6292B
CC2
VBUS
DR
RGate
BLD
/AUX
CC2 CC1
LGATE
VBUS
RCDC
FAN105B
RX2-
RX2+
GND
NA
Opto-
AUX
VDD
VS
Gate
CS
coupler
RVS1
CC1
CC2
Rcs
GND
CVS
RVS2
Figure 1. FAN105B Typical Application Schematic
VDD
AUX
VCS-LIM
OCP
S1
Cable Drop
TDIS
LEB
CS
Compensation
Internal
Regulator
VDD ON/OFF
DRE Detection
OCP
OTP
AR Mode
Protection
Brown Out/In
VS OVP/UVP
VDD OVP
Peak Current
Detection
Current Monitor
IVS
VDD
VCS_CTRL
VCS_PK
Diode
Discharge
Detection
TDIS
DYN
IO Estimator
PWM
Block
GATE
COMI
COMV
OSC
Σ
2.5V
EAV
7.5V
Compensator
VD
VS
VS Sample/Hold
No-Load
Control
Maximum
On Time
GND
Valley
Detection
Figure 2.FAN105B Function Block Diagram
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
PIN FUNCTION DESCRIPTION
Pin # Name Description
Current Sense. This pin connects to a current-sense resistor to detect the MOSFET
1
CS
current for Peak-Current-Mode control for output regulation. The current-sense
information is also used to estimate the output current for CC regulation.
Ground
2
3
GND
PWM Signal Output. This pin has an internal totem-pole output driver to drive the power
MOSFET. The gate driving voltage is internally clamped at 7.5 V.
GATE
Power Supply. IC operating current and MOSFET driving current are supplied through
this pin. This pin is typically connected to an external VDD capacitor.
4
5
VDD
VS
Voltage Sense. This pin detects the output voltage information and diode current
discharge time based on the voltage of auxiliary winding. It also senses sink current
through the auxiliary winding to detect input voltage information.
Auxiliary Function. This pin generates one voltage level proportional to output current
6
AUX to compensate output voltage drop due to cable resistance. The pin is also used for
startup with external HV FET.
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
ABSOLUTE MAXIMUM RATINGS (Note 1,2,3,4)
Parameter
Symbol Min. Max. Unit
DC Supply Voltage
VVDD
VAUX
VVS
VCS
PD
-0.3
-0.3
-0.3
-0.3
30
30
V
V
AUX Pin Input Voltage
VS Pin Input Voltage
6.0
V
CS Pin Input Voltage
6.0
V
0.391
+150
+150
+260
mW
C
C
C
Power Dissipation (TA=25C)
Operating Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering, 10 Seconds)
TJ
-40
-60
TSTG
TL
Human Body Model,
ANSI/ESDA/JEDEC, JESD22_A114
>1.5
Electrostatic Discharge Capability
ESD
kV
Charged Device Model,
JEDEC:JESD22_C101
>0.5
1. Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the
recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
2. All voltage values, except differential voltages, are given with respect to the GND pin.
3. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
4. Meets JEDEC standards JS-001-2012 and JESD 22-C101.
THERMAL CHARACTERISTICS (Note 5)
Parameter
Symbol
θJA
Min.
Max.
242
56
Unit
°C/W
°C/W
Junction-to-Ambient Thermal Impedance
Junction-to-Top Thermal Impedance
θJT
5. TA=25°C unless otherwise specified.
RECOMMENDED OPERATING RANGES (Note 6)
Parameter
Symbol
VCS
Min.
0
Max.
0.8
8.0
25
Unit
V
CS Pin Input Voltage
Gate Pin Input Voltage
VDD Pin Input Voltage
VS Pin Input Voltage
AUX Pin Input Voltage
VGATE
VDD
0
V
7.0
1.6
5.0
V
VVS
3.2
25
V
VAUX
V
6. The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance. On Semiconductor does not recommend exceeding
them or designing to Absolute Maximum Ratings.
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
ELECTRICAL CHARACTERISTICS
VDD=12 V and TA=-40~85C unless noted
Parameter
VDD Section
Test Conditions
Symbol
Min
Typ
Max
Unit
Turn-On Threshold Voltage
Turn-Off Threshold Voltage
VDD Over-Voltage-Protection Level
VDD-ON
VDD-OFF
VDD-OVP
16.5
6.1
17.5
6.5
18.5
6.9
V
V
V
26.5
28.0
29.5
VDD Over-Voltage-Protection De-
bounce Time
tD-VDD-OVP
-
120
200
µs
Startup Current(8)
IDD-ST
IDD-OP
-
20
1.7
525
µA
mA
µA
Operating Current
1
1.4
450
Deep Green-Mode Operating Current
Oscillator Section
IDD-DPGN
375
Maximum Voltage-Mode Quasi-
Resonant Blanking Frequency
fOSC-BNK-MAX
fOSC-BNK-MIN
fOSC-DPGN
70
4.5
320
18
76
5.0
420
21
82
5.5
480
24
kHz
kHz
Hz
Minimum Current-Mode Time-Out
Blankig Frequency
Deep Green Mode Operating
Frequency(8)
Minimum CCM Prevention
Frequency(7)
fOSC-CCM-PRVENT
kHz
Over-Temperature Protection Section
Over-Temperature Protection
Threshold(7)
TOTP-H
TOTP-L
120
100
C
C
Over-Temperature Protection
Recovery Threshold(7)
Continues on next page…
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
FAN105BM6X
May 2017- Rev. 1.0
ELECTRICAL CHARACTERISTICS
VDD=12 V and TA=-40~85C unless noted
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
Voltage Sampling Section
Reference Voltage of Constant
Voltage Feedback
VVR
2.475 2.500 2.525
V
VS Sampling Phase-Shift Resistance(7)
RVS-S/H
CVS-S/H
300
5
kΩ
pF
VS Sampling Phase-Shift
Capacitance(7)
VS Sampling Blanking Time of High
Level
Io over 100mA
tVS_BNK-H
tVS_BNK-CC
VVS-Offset
1.65
2.05
150
1.80
2.20
200
2.00
2.35
250
µs
µs
VS Sampling Blanking Time at CC
Controlling
VS Discharging Time Judgment
Threshold Voltage(7)
mV
Voltage Sense Section
Temperature-Independent Bias
Current
ITC
9.0
10.0
11.0
μA
VS Pin Source Current Threshold to
Enable Brown-Out
IVS-BROWN-OUT
tD-BROWN-OUT
IVS-BROWN-IN
NBROWN-IN
VVS-OVP
260
12
310
17
360
22
μA
ms
μA
Brown-Out De-bounce Time
VS Pin Source Current Threshold to
Enable Brown-In
405
3
475
4
545
5
Brown-In De-bounce Time
cycle
V
Output Over-Voltage-Protection of VS
Sampling threshold
2.70
2.80
2.90
Output Over-Voltage-Protection
Debounce Cycle Counts
NVS-OVP
VVS-UVP
tVS-UVP
3
4
5
Cycle
V
Output Low Level Under-Voltage-
Protection of VS Sampling threshold
1.50
30
1.60
40
1.70
50
Output Under-Voltage Protection
Debounce Time
ms
No-Load Control Section
Deep Green Mode Entry Threshold
Voltage of COMV(7)
VCOMV-CV-DPGN-
0.4
0.5
0.6
V
V
V
ENTRY
Criteria to Enter Deep Green Mode
VVS_EAV_Hi
VVS-EAV-H
2.550 2.600 2.650
2.550
Deep Green Mode Band-Band Control
High Threshold Voltage
Deep Green Mode Band-Band Control
Low Threshold Voltage
VVS-EAV-L
VVS_EAV_Lo
VVS-EAV-DYN
2.525
V
V
V
Criteria to Exit Deep Green Mode
2.425 2.450 2.475
2.375 2.400 2.425
Dynamic Event Trigger Threshold
Voltage in Deep Green Mode
Minimum On-time at 264VAC
Minimum On-time at 230VAC
Minimum On-time at 115VAC
Minimum On-time at 90VAC
CGATE=1nF
CGATE=1nF
CGATE=1nF
CGATE=1nF
tON-MIN-264VAC
tON-MIN-230VAC
tON-MIN-115VAC
tON-MIN-90VAC
450
500
500
550
550
600
ns
ns
ns
ns
1250
1500
1350
1650
1450
1800
Continues on next page…
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
FAN105BM6X
May 2017- Rev. 1.0
ELECTRICAL CHARACTERISTICS
VDD=12 V and TA=-40~85C unless noted.
Parameter
Test Conditions
Symbol
Min
Typ
Max Unit
Current Feedback Section
Reference Voltage of Constant Current
Feedback
VCCR
APK
1.19
1.2 1.21
3.9
V
VCS Peak Value Amplifying Gain(7)
V/V
V/V
Attenuator ratio of Constant Current
Feedback Loop(7)
AV-CC
1/3.5
Current Sense Section
Current Limit Threshold Voltage
VCS-LIM
tPD
0.70 0.75 0.80
100
V
GATE Output Turn-Off Delay(7)
Leading-Edge Blanking Time(7)
ns
tLEB
150
200 250 ns
GATE Section
Maximum On-Time
tON-MAX
VGATE-L
15
0
17
20
1.5
8.0
μs
V
Gate Output Voltage Low
Internal Gate PMOS Driver ON
Internal Gate PMOS Driver OFF
Gate Output Clamping Voltage
AUX Section
VDD-PMOS-ON
VDD-PMOS-OFF
VGATE-CLAMP
7.0
9.0
7.0
7.5
V
9.5 10.0
V
VDD level higher than 9V
7.5
8.0
V
Dynamic Response Enhancement (DRE)
function trigger threshold current at AUX
IDRE-DET
110
140
170 μA
RCDC is 330kΩ
RCDC is 560kΩ
RCDC is 920kΩ
RCDC is 1.3MΩ
VVS-CDC4
VVS-CDC3
VVS-CDC2
VVS-CDC1
0.298 0.320 0.343
0.223 0.240 0.257
0.149 0.160 0.171
0.074 0.080 0.086
V
V
V
V
CDC compensation voltage at internal
reference
Notes:
7. Guaranteed by Design.
8. TA guaranteed range at 25C
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
Typical Performance Characteristics
1.06
1.04
1.02
1.00
0.98
0.96
0.94
1.009
1.006
1.003
1.000
0.997
0.994
0.991
-40 -30 -15
0
25 50 75 85 100 125
-40 -30 -15 0 25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 3.Turn-On Threshold Voltage (VDD-ON) vs.
Temperature
Figure 4.Turn-Off Threshold Voltage (VDD-OFF) vs.
Temperature
1.3
1.2
1.1
1.0
0.9
0.8
0.7
1.06
1.04
1.02
1.00
0.98
0.96
0.94
-40 -30 -15
0
25 50 75 85 100 125
Tempeature (°C)
-40 -30 -15 0 25 50 75 85 100 125
Tempeature (°C)
Figure 5.Operating Supply Current (IDD-OP) vs.
Temperature
Figure 6.Deep Green Mode Operation Current (IDD-
DPGN) vs. Temperature
1.06
1.04
1.02
1.00
0.98
0.96
0.94
1.06
1.04
1.02
1.00
0.98
0.96
0.94
-40 -30 -15
0
25 50 75 85 100 125
-40 -30 -15
0
25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 7.Maximum Operation Frequency of QR
Blanking Time (fOSC-BNK-MAX) vs. Temperature
Figure 8. Deep Green Mode Operation Frequency
(fOSC-DPGN) vs. Temperature
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
FAN105BM6X
May 2017- Rev. 1.0
Typical Performance Characteristics
1.009
1.006
1.003
1.000
0.997
0.994
0.991
1.009
1.006
1.003
1.000
0.997
0.994
0.991
-40 -30 -15
0
25 50 75 85 100 125
-40 -30 -15 0 25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 9.Reference Voltage of CV Feedback (VVR
vs. Temperature
)
Figure 10.Vs Sampling Blanking Time (tVS-BNK-H) vs.
Temperature
1.060
1.040
1.020
1.000
0.980
0.960
0.940
1.009
1.006
1.003
1.000
0.997
0.994
0.991
-40 -30 -15
0
25 50 75 85 100 125
-40 -30 -15
0
25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 11.Output Over-Voltage Protection of Vs
sampling Threshold(VVS-OVP) vs. Temperature
Figure 12.Output Under-Voltage of Vs sampling
Threshold(VVS-UVP) vs. Temperature
1.009
1.006
1.003
1.000
0.997
0.994
0.991
1.06
1.04
1.02
1.00
0.98
0.96
0.94
-40 -30 -15
0
25 50 75 85 100 125
-40 -30 -15 0 25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 13.Current Limit Threshold Voltage(VCS-LIM
)
Figure 14.Minmum Gate Turn On time(tON-MIN-264VAC
)
vs. Temperature
vs. Temperature
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
FAN105BM6X
Typical Performance Characteristics
1.06
1.04
1.02
1.00
0.98
0.96
0.94
1.009
1.006
1.003
1.000
0.997
0.994
0.991
-40 -30 -15
0
25 50 75 85 100 125
-40 -30 -15
0
25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 15.Maximum Gate Turn On Time (tON-MAX) vs.
Temperature
Figure 16.Dynamic trigger current threshold (IZTC) vs.
Temperature
1.009
1.006
1.003
1.000
0.997
0.994
0.991
1.06
1.04
1.02
1.00
0.98
0.96
0.94
-40 -30 -15 0 25 50 75 85 100 125
-40 -30 -15 0 25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 17.Cable Compensation Level 4 Reference
Voltage(VVS-CDC4) vs. Temperature
Figure 18.Brown In Threshold Current (IVS-BROWN-IN) vs.
Temperature
1.06
1.04
1.02
1.00
0.98
0.96
0.94
1.06
1.04
1.02
1.00
0.98
0.96
0.94
-40 -30 -15
0
25 50 75 85 100 125
-40 -30 -15
0
25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 19.Clamp Voltage (VGATE-CLAMP) vs.
Temperature
Figure 20.Brown Out Threshold Current (IVS-BROWN-OUT) vs.
Temperature
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
FAN105BM6X
May 2017- Rev. 1.0
FAN105BM6X
Typical Performance Characteristics
1.060
1.040
1.020
1.000
0.980
0.960
0.940
1.06
1.04
1.02
1.00
0.98
0.96
0.94
-40 -30 -15
0
25 50 75 85 100 125
-40 -30 -15 0 25 50 75 85 100 125
Tempeature (°C)
Tempeature (°C)
Figure 21.Blanking time of VSUVP(tVS-UVP) vs.
Temperature
Figure 22.VDD Over Voltage Protection Threshold (VDD-OVP
)
vs. Temperature
© Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
FAN105BM6X
When the MOSFET is turned off, the energy stored in the
inductor forces the secondary diode (Dsec) to turn on. While
the diode is conducting, the output voltage (Vo), together
with diode forward voltage drop (VF), are applied across the
Functional Description
2
secondary-side inductor (LmNs2/ Np ) and the diode current
FAN105B is an offline PWM and Primary-Side Regulated
(PSR) fly-back controller that can simplify feedback circuit
and secondary side circuit compare to traditional fly-back
converter. In addition, FAN105B detects Quasi-Resonant
valley switching to minimize the switching loss and get
better EMI performance.
(ID) decreases linearly from the peak value (IpkNp/Ns) to
zero. At the end of inductor current discharge time (tDIS), all
the energy stored in the inductor has been delivered to the
output.
When the diode current reaches zero, the transformer
auxiliary winding voltage (VAux) begins to oscillate by the
resonance between the primary-side inductor (Lm) and the
effective capacitor loaded across MOSFET.
FAN105B modulates pulse width and switching frequency
based on feedback signal auxiliary winding signal (VS) and
current sense signal (CS). Extremely accurately Constant
Voltage(CV) with Cable Drop Compensation (CDC) and
Constant Current (CC) could meet strict requirement from
market. The CV and CC output characteristic is shown as
Figure 23. There are 4 levels (80mV - 320mV) choices in
CDC compensation weighting that is easily set via external
SMD resistor.
During the inductor current discharge time, the sum of
output voltage and diode forward-voltage drop is reflected to
the auxiliary winding side as (Vo+VF) NAux/Ns. Since the
diode forward-voltage drop decreases as current
decreases, the auxiliary winding voltage reflects the output
voltage best at the end of diode conduction time, where the
diode current diminishes to zero. By sampling the winding
voltage at the end of the diode conduction time, the output
voltage information can be obtained. The internal error
amplifier for output voltage regulation (EAV) compares the
sampled voltage with internal precise reference to generate
error voltage (COMV), which determines the duty cycle of
the MOSFET in CV Mode.
Before Cable Compensation
After Cable Compensation
VO
Maximum Specification
Minimum Specification
The output current is obtained by averaging the triangular
output diode current area over a switching cycle as:
1
2
NP TDIS
IO ID AVG
IPK
(1)
NS TS
IO
Figure 23.CV with CDC and CC V/I Curve at the Cable
End
The internal FAN105B circuits identify the peak value of the
drain current with a peak detection circuit and calculate the
output current using the inductor discharge time (tDIS) and
switching period (tS). This output information (EAI) is
compared with internal precise reference to generate error
voltage (COMI), which determines the duty cycle of the
MOSFET in CC Mode. With TRUECURRENT® technique,
constant output current can be precisely controlled.
FAN105B implements DeeP GreeN mode (DPGN) with
lowest switching frequency, limites IC current consumption
(450µA) for excellent system standby power performance.
Furthermore, the system design allowes two kinds of startup
circuit with resistor or high voltage FET.
With a given current sensing resistor, the output current can
be programmed as:
Protections are : over/under voltage protection (VSOVP,
VSUVP), Brown In and Brown Out, cycle by cycle over
current protection(OCP), current sense resistor short
protection, secondary rectifier short protection.
ꢂ ꢅꢆ
ꢈ
ꢉꢉꢊ
ꢁ
ꢀ
ꢄ
ꢄ
(2)
ꢃ ꢅꢇ ꢋꢉꢇ
Basic CV/CC Control Principle
Of the two error voltages, COMV and COMI, the smaller
one determines the duty cycle. During Constant Voltage
regulation, COMV determines the duty cycle while COMI is
saturated to HIGH. During Constant Current regulation,
COMI determines the duty cycle while COMV is saturated to
HIGH.
Figure 24 shows the circuit diagram of a PSR fly-back
converter, FAN105B estimates output current through
primary side peak current from CS, output voltage via
auxiliary winding signal that proportional to secondary side
voltage, the current and voltage sampling are shown in
Figure 25. Generally, Discontinuous Conduction Mode
(DCM) with valley switching operation is preferred for PSR
since it allows better output regulation. The operation
principles of DCM/BCM flyback converter are as follows:
During the MOSFET turn on time (tON), input voltage (VDL) is
applied across the primary-side inductor (Lm). Then
MOSFET current (IDS) increases linearly from zero to the
peak value (Ipk). Meanwhile, the energy is drawn from the
input and stored in the inductor.
© Semiconductor Components Industries, LLC, 2017
12
Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
FAN105BM6X
Dsec
VDL
CDL
NP
NS
as EAV at timing like gray point showed. Base on EAV level
to regulate Pulse width to achieve estimation output voltage.
+
RSN1
CSN1
Co
Vo
-
DSN1
RGate
GATE
CS
MOSFET
GATE
CC
Estimator
EAI
VCCR
VVR
RCG
COMI
RCS
NA
PWM
Control
Block
VAux
CS
VAuxiliary
COMV
VS
RVS1
CV
Estimator
EAV
NA
NP
VBLK
CVS
RVS2
200mV
Figure 24.Simplified PSR Flyback Converter Circuit
IDS (MOSFET Drain-to-Source Current)
VS (With Schottky)
IPK
ID (Diode Current)
NP
NS
IPK
Io ID AVG
VS (With SR control)
tVS-BNK-L
tDIS
tS
VS (With Schottky)
tON
NA
RVS 2
VO
EAV
NS RVS1 RVS 2
NA
RVS 2
VF
NS RVS1 RVS 2
Figure 26.VS sampling with Diode or Synchronous
Rectifier
A leading edge blanking time(tVS-BNK-H/L) start from primary
switch turned off. Most of TA design have VS oscillation
after primary switch turned off, that is caused by the
resonance of leakage inductance and parasistic
capacitance at transformer. In order to avoid VS sampling
procedure get impacted by that ringing, the oscillation
should be settle before settle down before tVS-BNK-L ended as
Figure 26 showed. tDIS is secondary rectifier current
discharging time which recommend better design is longer
than tVS-BNK-H during miimum on time controlling. tDIS is
predictable by following formula:
TON
TDIS
TS
Figure 25.Cycling Current and VS Sampling in DCM
Quasi-Resonant Valley Switch
FAN105B Build-In Quasi-Resonant valley detecting function
and inductor discharging time detecting function. During
MOSFET turn off period, FAN105B checked falling of VVS,
TDIS information will update as falling of VVS checked.
FAN105B keep monitor both VVS and IVS after TDIS
checked. FAN105B maximum period of MOSFET on time
and off time could be reach 45µs, it was depending on
whether valley checked. Quasi-Resonant valley switching
could minimize MOSFET switching loss during switch on,
meanwhile, to eliminate EMI and Common mode switching
component noise. Charger system would be getting better
efficiency than non-valley switching methodology.
ꢒ
ꢓ
ꢞ
ꢙꢓ
ꢌꢍꢎꢇ ꢁ ꢏ
ꢄ ꢠꢠ
ꢢ
(3)
ꢐꢑ ꢔꢕꢖꢗꢘꢕ ꢔꢚꢚꢖꢐꢛꢑꢜꢝ
ꢡ
ꢒ
ꢞ
ꢏ ꢙꢏ
ꢟ
ꢐ
Where parameter : tOFF-DELAY is switch turn off delay time
that level is chaging in differences system criteria, tON-MIN is
minimum turn on time in design that should consider
propagation delay from IC Gate to switch Gate.
Output voltage can be describe by below equation:
ꢫ
ꢣꢤꢥ ꢁ ꢤꢤꢦ ꢄ ꢒꢧ ꢨ ꢦꢤꢩꢧꢞ ꢄ ꢫ
(4)
Output Voltage Sampling
ꢩ
ꢦ
ꢤꢩꢪ
ꢬ
VS voltage which is reflected auxiliary winding and
proportional to output voltage. Therefore, It is possible to
regulate output voltage by sensing VS voltage. Figure 26
shown VS sampling waveform with secondary rectifier that
using Schottky diode or Synchronous Rectifier (SR).
Deep Green Mode (DPGN) Operation in CV
mode
FAN105B integrated mWSaver® technology that minimize
current consumption and frequency at DPGN mode is fixed
to minimum switching frequency (fOSC-DPGN) and variable
Pulse width based on VS sampling voltage (EAV).
In order to regulate output voltage in accurately range,
FAN105B build-in VS sampling methodology for signal like
Figure 26 showed, FAN105B samples and hold VS voltage
© Semiconductor Components Industries, LLC, 2017
13
Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
FAN105BM6X
VVS regulated boundary are between VVS-EAV-H and VVS-EAV-
L. After exit DPGN, internal regulation reference voltage was
changed to VVR
Programmable Brown In/ Brown Out
FAN105B implement Brown out and Brown In through high
side resistor setting at VS PIN. In actual system operation,
VS PIN is drain a current (IVS) that proportional to line
voltage during MOSFET turns on. IVS could predict by below
equation:
.
FAN105B DPGN entry and exit criteria showed as below:
DPGN entry need to meet both criteria as below:
ꢮ
Minimum frequency (fOSC-MIN) operation continues over
than NDPGN-Entry switching cycles.
ꢏꢇ
ꢁ ꢈꢍꢭ ꢄ ꢠꢜ ꢄ ꢊ
(5)
ꢠ
ꢢ
ꢯꢡꢰ
EAV > VVS-EAV-H(2.550V).
Operating Current
The operating current in FAN105B is as small as 1.4mA.
The small operating current results in higher efficiency and
reduces the VDD hold-up capacitance requirement. During
DPGN mode, the FAN105B consumption current is reduced
to 450µA, assisting the power supply meet standby power
standard requirements.
DPGN exit criteria, meet one of below criteria:
EAV < VVS-EAV-L (2.525V) and maximum on time at
DPGN.
EAV < VVS-EAV-DYN(2.4V).
During the DPGN mode controlling, FAN105B decreases
the operating current down to 450µA. Therefore, the
standby power could meet international standard
requirement when work with flexible start up circuit,
designer have flexible start up circuit that HV FET or start
up resistor depending on cost and better standby power
consideration
Protections
The FAN105B self-protection includes VDD Over-Voltage-
Protection (VDD OVP), Internal Chip Over-Temperature-
Protection (OTP), VS Over-Voltage Protection (VSOVP), VS
Under-Voltage
Protection
(VSUVP),
CS
pin
Protection(CSP), Brownout and Brown In protection, and
all of protection are implemented as Auto Restart(AR)
mode.
Cable Drop Compensation (CDC)
FAN105B integrates cable drop compensation function and
the compensation weighting is calculated based on tDIS,
current sense voltage (VCS), and CDC setting resistor (RCDC
needed to between VDD and AUX pin. During startup, as
VDD reached VDD-ON, CDC programming block detects AUX
pin current and determine cable drop compensation
weighting based on current weighting of AUX pin. Once
finished CDC compensation weighting detecting, the
information will stored until shunt-down by protections or
VDD lower than VDD-OFF. The CDC weighting automatic
detected input current during start up. which provides a
constant output voltage at the end of the cable over the
entire load range in CV Mode. The table shows the
compensation weighting with corresponding RCDC setting as
below:
When When an Auto-Restart Mode protection is triggered,
switching is terminated and the MOSFET remains off,
causing VDD to drop till VDD-OFF and shut-down the system
then all protections are reset. After then VDD will be charged
again by the input AC voltage and once touch VDD-ON then
switching resumes. This is the reason why it is called Auto-
Restart, resumes switching automatically.
)
VDD Over-Voltage-Protection(VDD OVP)
When VDD is raised up to higher level by some reasons,
transformer VDD winding turns are too many, load regulation
is not good between transformer winding, VS information is
not available anyhow and so on, and touches VDD-OVP, then
FAN105B stops switching and protects IC from higher VDD
voltage. This is different then output voltage is over than pre
determined level.
CDC Weighting and RCDC Setting
VVS Compensation
VS Under-Voltage Protection (VSUVP)
RCDC
Label
weighting
FAN105B bulid-in VSUVP function that prevent TA keep
deliver power to phone side when output voltage is under
the set voltage at VS pin. VSUVP has a 40ms de-bounce
time and once VDD touches VDD-ON, during the later 40ms
VSUVP is disabled because VSUVP should not be triggered
during the start up. VSUVP level can be calculated as
below:
1.3MΩ
920kΩ
560kΩ
330kΩ
VVS-CDC1
VVS-CDC2
VVS-CDC3
VVS-CDC4
0.08V
0.16V
0.24V
0.32V
ꢫꢩ
ꢣꢤꢥꢱꢲꢤꢳ ꢁ ꢤꢤꢩꢱꢲꢤꢳ ꢄ ꢒꢧ ꢨ ꢦ ꢞ ꢄ ꢫ
(6)
ꢤꢩꢧ
ꢦꢤꢩꢪ
TA designer can easily to set up CDC weighting via choose
RCDC following above table. In the table, resisance of RCDC
is recommended for corresponding compensation level.
Cable drop compensation voltage at output is proportional
to VVS compensation weighting that is internal referce
voltage for CDC compensation.
ꢬ
VS Over-Voltage Protection (VSOVP)
The VSOVP is designed to prevent TA output voltage is
over then the rating of used components, like capacitor.
VSOVP has 4 switching cycles of denounce time and that
prevent mis-triggered of VSOVP by switching noise. The
protection level is changed in proportional to the CDC
© Semiconductor Components Industries, LLC, 2017
14
Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
FAN105BM6X
weighting.VSOVP trigger level can be illustrates as
following formula :
VDD
VDD-OVP
ꢶꢥ
ꢫꢩ
ꢞ ꢄ ꢒꢧ ꢨ ꢦꢦ ꢞ ꢄ ꢫ
(7)
VDD-ON
ꢤꢩꢧ
ꢣꢤꢥꢱꢥꢤꢳ ꢁ ꢒꢤꢤꢩꢱꢥꢤꢳ ꢨ ꢤꢤꢩꢱꢴꢵꢴ
ꢄ
ꢶꢥꢖꢴꢴ
ꢤꢩꢪ
ꢬ
VDD-OFF
CS pin Protection(CSP)
VGATE,S1
In order to prevent MOSFET current over than safe
operating area, FAN105B build-in cycle by cycle over
current protection. The protection could protect MOSFET
damaged by saturation current and CS pin sensing error. As
CS PIN signal meet below conditions FAN105B will turn off
Gate immediately. Current Sensing Protection (CSP) criteria
shows as below:
VDD-VAUX
VAUX-CL
.
.
VCS <0.2V after switching turn on 4.5us at low line
or 1.5us at high line.
Figure 28. Start Up Sequence With AUX Controlling
VCS>1.5V
Dynamic Response Enhancement (DRE) With
AUX
Over-Temperature Protection(OTP)
In order to guarantee FAN105B works within recommended
temperature. FAN105B build-in chip Over-Temperature –
Protection (OTP). As chip junction temperature over
thareshold TOTP-H IC immediately terminated Gate switching
PSR flyback converter regulates output voltage within
requirement specification through detects VS signal which
proportional to output voltage, However VS signal can only
detects when system switched. In order to get better
standby power performance, the switching frequency is
decreases to quite low frequency, it can not maintaining out
voltage as load suddenly increases from extremely light
load to heavy load during minimum frequency operation.
signal untill chip junction termperature recover to TOTP-L
.
Start Up Function With AUX
FAN105B supports high voltage start up with HV FET that
can make better standby power and shorter start up time.
Figure 27 shows start up controlling function block. Figure
28 shows start up relative signal sequence with AUX
controlling.
Therefore, FAN105B build in
a Dynamic Response
Enhancement (DRE) function to detects output voltage
dropping immediately when FAN105B pair with FAN6292B.
Figure 29 shows DRE function block. Figure 30 shows
DRE function relative signal working sequence. When
output voltage undershoot is acknowledged via FAN6292B
VIN pin, BLD/AUX pin pull-down current via S2 switch to
inform undershoot to FAN105B via a photo-coupler. Once
FAN105B sensed AUX current higher than IDRE-DET, the
switching frequency is increases immediately.
At system power on moment, initial VDD voltage is zero,
internal PMOS switch is turn on and external HV FET also
turn on, CVDD is charged through HV FET till VDD reach
VDD-ON. While Internal PMOS switch S1 turn off and VGS of
HV FET will close to internal clamping voltage (VAUX-CL
)
which less than HV FET VGS turn on threshold. Meanwhile
VDD energy supplement is turn to auxiliary winding. The
voltage gap between VDD and VAUX is keep at 5V till
VBUS
NP
NS
Co1
LGATE
Co2
controller shut-down by protection or VDD touching VDD-OFF
.
SR Gate
VDD
RAUX
VDL
Opto-
RStart
coupler
RCDC
AUX
FAN105B
ROPTO(3.3kΩ)
VAUX-CL
No Load
Control
Leave
Bang-Bang
Control
TDIS
TON
VO Drop
Detection
AUX
BLD / AUX
VIN
VDD
IAUX
S1
FAN6292B
±
R
CVDD
±
1V
S2
VDD-ON/ VDD-OFF
Pulse
VIN-AUX
Figure 29. Internal function for Start Up of AUX PIN
Figure 27. Internal function for Start Up of AUX PIN
© Semiconductor Components Industries, LLC, 2017
15
Publication Order Number:
FAN105BM6X
May 2017- Rev. 1.0
FAN105BM6X
VGATE
(FAN105B)
Accurately
Constant
Current
(CC)
Compensation
IO
Heavy Load
FAN105B provides accurate constant current with
universal line voltage range, In order to achieve this
accurately output current regulated, FAN105B build in
circuits that compensate a DC level at CS signal
based on difference line voltage. It could avoid output
current gap of difference line voltage during constand
current controlling. For noise immunity, the
recommendation of CS pin series resistor is 10Ω.
VBUS
VIN-AUX
S2
tAUX-ON
tOPTO-DELAY
IAUX
IDRE-DET
Figure 30.DRE function Detecting Sequency
© Semiconductor Components Industries, LLC, 2017
16
Publication Order Number:
May 2017- Rev. 1.0
FAN105BM6X
REVISIONS
LTR
A
DESCRIPTION
DATE
11/4/2006
5 JULY 07
E.C.N.
BY/APP'D
H.ALLEN
RELEASE TO DOCUMENT CONTROL
DWG UPDATED TO CONFORM TO MO178
L.HUEBENER
2
C
D
0.15 C A-B
2X
SYMM
C
2.9
1.9
L
(0.95)
(0.95)
D
A
(1.00MIN)
1.4
1.6
2.8
C
D
(2.60)
(0.70MIN)
0.15 C D
2X
0.15 C
PIN 1 INDEX AREA
2X 3 TIPS
0.95
(1.90)
B
2X 0.3-0.5
0.20
C A-B D
LAND PATTERN RECOMMENDATION
SEE DETAIL A
1.45 MAX
1.30
0.90
0.08
0.22
C
0.10
0.15
0.05
6X
C
R0.10MIN
NOTES:
GAGE PLANE
0.25
A. THIS PACKAGE CONFORMS TO JEDEC MO-178,
VARIATION AB.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
C. DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
R0.10MIN
8°
0°
D. DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSIONS.
E. DIMENSIONS AND TOLERANCING AS PER ASME
Y14.5M-1994
0.60
0.30
SEATING PLANE
0.60 REF
F. DRAWING FILE NAME: MA06EREV2
DETAIL A
SCALE: 2:1
APPROVALS
L.HUEBENER
DATE
5 JULY 07
17 JULY 07
H.ALLEN
6LD,SOT23,JEDEC
MO-178 VARIATION AB,
1.6MM WIDE
/
MKT-MA06E
1:1 NA
2
1
FORMERLY:
SHEET :
1
OF
N/A
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