FCI7N60 [ONSEMI]

N 沟道 SuperFET® MOSFET 600V, 7A, 600mΩ;
FCI7N60
型号: FCI7N60
厂家: ONSEMI    ONSEMI
描述:

N 沟道 SuperFET® MOSFET 600V, 7A, 600mΩ

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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s  
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
2014 1 月  
FCI7N60  
®
N 沟道 SuperFET MOSFET  
600 V, 7 A, 600 m  
特性  
说明  
SuperFET®MOSFET 是飞兆半导体第一代利用电荷平衡技术实  
现出色低导通电阻和更低栅极电荷性能的高压超级结 (SJ)  
MOSFET 系列产品项技术专用于最小化导通损耗并提供卓越  
的开关性能、 dv/dt 额定值和更高雪崩能量。因此, SuperFET  
MOSFET 非常适合开关电源应用功率因数校正 (PFC)务  
/ 电信电源、平板电视电源、 ATX 电源及工业电源应用。  
650 V @ TJ = 150°C  
典型值 RDS(on) = 530 m  
超低栅极电荷 (典型值 Qg = 23 nC)  
低有效输出电容 (典型值 Coss(eff.)= 60 pF)  
100% 经过雪崩测试  
符合 RoHS 标准  
应用  
照明  
太阳能逆变器  
AC-DC 电源  
D
G
G
I2-PAK  
D
S
S
MOSFET 最大额定TC = 25°C 除非另有说明  
FCI7N60  
600  
7
符号  
VDSS  
参数  
单位  
V
漏极 - 源极电压  
- 连续 (TC = 25°C)  
- 连续 (TC = 100°C)  
- 脉冲  
ID  
A
漏极电流  
4.4  
IDM  
21  
A
V
漏极电流  
(注 1)  
VGSS  
EAS  
IAR  
±30  
230  
7
栅极 - 源极电压  
单脉冲雪崩能量  
雪崩电流  
mJ  
A
(注 2)  
(注 1)  
(注 1)  
(注 3)  
EAR  
dv/dt  
8.3  
mJ  
V/ns  
W
重复雪崩能量  
二极管恢复 dv/dt 峰值  
4.5  
(TC = 25°C)  
83  
PD  
功耗  
0.67  
W/°C  
°C  
- 超过 25°C 时降额  
TJ, TSTG  
TL  
工作和存储温度范围  
-55 +150  
300  
°C  
用于焊接的最大引脚温度,距离外壳 1/8”,持续 5 秒  
热性能  
FCI7N60  
1.5  
符号  
RJC  
参数  
结至外壳热阻最大值  
单位  
°C/W  
°C/W  
RJA  
结至环境热阻最大值  
62.5  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
1
FCI7N60 Rev. C1  
封装标识与定购信息  
器件编号  
顶标  
封装  
I2-PAK  
包装方法  
塑料管  
卷尺寸  
不适用  
带宽  
数量  
FCI7N60  
FCI7N60  
不适用  
50 单元  
电气特性 TC = 25°C 除非另有说明。  
符号  
关断特性  
BVDSS  
参数  
测试条件  
最小值 典型值 最大值  
单位  
VGS = 0 V, ID = 250 μA, TC = 25°C  
VGS = 0 V, ID = 250 μA, TC = 150°C  
600  
-
-
-
-
V
V
漏极-源极击穿电压  
650  
BVDSS  
/ TJ  
BVDS  
击穿电压温度系数  
-
0.6  
-
V/°C  
V
ID = 250 μA,参考 25°C  
VGS = 0 V, ID = 7 A  
-
-
-
-
700  
-
1
漏源极雪崩击穿电压  
零栅极电压漏极电流  
栅极 - 体漏电流  
VDS = 600 V, VGS = 0 V  
VDS = 480 V, TC = 125°C  
VGS = ±30 V, VDS = 0 V  
-
-
-
IDSS  
IGSS  
A  
10  
±100  
nA  
导通特性  
VGS(th)  
RDS(on)  
gFS  
VGS = VDS, ID = 250 A  
VGS = 10 V, ID = 3.5 A  
VDS = 40 V, ID = 3.5 A  
3.0  
-
0.53  
6
5.0  
0.6  
-
V
S
栅极阈值电压  
-
-
漏极至源极静态导通电阻  
正向跨导  
动态特性  
Ciss  
-
-
-
-
-
710  
380  
34  
920  
500  
-
pF  
pF  
pF  
pF  
pF  
输入电容  
VDS = 25 V, VGS = 0 V,  
f = 1.0 MHz  
Coss  
输出电容  
Crss  
反向传输电容  
输出电容  
Coss  
VDS = 480 V, VGS = 0 V, f = 1 MHz  
VDS = 0 V to 400 V, VGS = 0 V  
22  
29  
-
Coss(eff.)  
60  
有效输出电容  
开关特性  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
35  
55  
80  
120  
160  
75  
ns  
ns  
导通延迟时间  
VDD = 300 V, ID = 7 A,  
开通上升时间  
V
GS = 10 V, RG = 25   
75  
ns  
关断延迟时间  
32  
ns  
关断下降时间  
(说明 4)  
(说明 4)  
Qg(tot)  
Qgs  
Qgd  
23  
30  
nC  
nC  
nC  
10 V 的栅极电荷总量  
栅极 - 源极栅极电荷  
栅极 - 漏极 密勒 电荷  
V
V
DS = 480 V, ID = 7 A,  
GS = 10 V  
4.2  
11.5  
5.5  
-
漏极 - 源极二极管特性  
IS  
-
-
-
-
-
-
-
7
21  
1.4  
-
A
A
漏极 - 源极二极管最大正向连续电流  
漏极 - 源极二极管最大正向脉冲电流  
漏极 - 源极二极管正向电压  
反向恢复时间  
ISM  
VSD  
trr  
VGS = 0 V, ISD = 7 A  
-
V
360  
4.5  
ns  
C  
VGS = 0 V, ISD = 7 A,  
dIF/dt = 100 A/s  
Qrr  
-
反向恢复电荷  
注意:  
1. 重复额定值:脉冲宽度受限于最大结温。  
2. I = 3.5 AV = 50 VR = 25,启动 T = 25°C。  
AS  
DD  
G
J
3. I 7 Adi/dt 200 A/sV BV  
,启动 T = 25°C。  
SD  
DD  
DSS  
J
4. 本质上独立于工作温度的典型特性。  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
2
FCI7N60 Rev. C1  
典型性能特征  
1. 导通区域特性  
2. 传输特性  
VGS  
Top :  
15.0 V  
10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
101  
101  
100  
10-1  
Bottom : 5.5 V  
150C  
25C  
100  
-55C  
* Notes :  
1. 250s Pulse Test  
2. TC = 25C  
* Note  
1. VDS = 40V  
2. 250s Pulse Test  
10-1  
2
10-1  
100  
101  
4
6
8
10  
VGS , Gate-Source Voltage [V]  
VDS, Drain-Source Voltage [V]  
3. 导通电阻变化与漏极电流和栅极电压  
4. 体二极管正向电压变化与源极电流和  
温度的关系  
2.0  
1.8  
1.6  
1.4  
101  
VGS = 10V  
1.2  
1.0  
0.8  
0.6  
100  
150C  
25C  
VGS = 20V  
0.4  
0.2  
0.0  
* Notes :  
1. VGS = 0V  
2. 250s Pulse Test  
* Note : TJ = 25C  
10-1  
0.2  
0
5
10  
15  
20  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
VSD , Source-Drain Voltage [V]  
ID, Drain Current [A]  
5. 电容特性  
6. 栅极电荷  
3000  
12  
10  
8
Ciss = Cgs + Cgd (Cds = shorted)  
VDS = 100V  
VDS = 250V  
Coss = Cds + Cgd  
Crss = Cgd  
VDS = 400V  
2000  
1000  
Coss  
6
* Notes :  
1. VGS = 0 V  
Ciss  
4
2. f = 1 MHz  
Crss  
2
* Note : ID = 7A  
20  
0
0
0
10-1  
100  
101  
5
10  
15  
25  
VDS, Drain-Source Voltage [V]  
QG, Total Gate Charge [nC]  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
3
FCI7N60 Rev. C1  
典型性能特(接上页)  
7. 击穿电压变化与温度  
8. 导通电阻变化与温度  
3.0  
1.2  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.1  
1.0  
0.9  
0.8  
* Notes :  
1. VGS = 0 V  
* Notes :  
1. VGS = 10 V  
2. ID = 250A  
2. ID = 3.5 A  
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [C]  
TJ, Junction Temperature [C]  
9. 最大安全工作区  
10. 最大漏极电流与壳体温度  
10.0  
7.5  
5.0  
2.5  
0.0  
102  
Operation in This Area  
is Limited by R DS(on)  
100 us  
1 ms  
101  
10 ms  
DC  
100  
* Notes :  
1. TC = 25C  
10-1  
2. TJ = 150C  
3. Single Pulse  
10-2  
100  
101  
102  
103  
25  
50  
75  
100  
125  
150  
VDS, Drain-Source Voltage [V]  
TC, Case Temperature [C]  
11. 瞬态热响应曲线  
100  
D =0.5  
0.2  
0.1  
*
N otes  
1. ZJC(t)  
:
=
1.5 C /W M ax.  
2. D uty Factor, D =t1/t2  
10-1  
0.05  
3. TJM  
- TC = PDM * ZJC(t)  
0.02  
0.01  
PDM  
t1  
t2  
single pulse  
10-2  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t1, Square W ave Pulse Duration [sec]  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
4
FCI7N60 Rev. C1  
VGS  
Same Type  
as DUT  
50KΩ  
Qg  
12V  
200nF  
300nF  
VDS  
VGS  
Qgs  
Qgd  
DUT  
I
= 常量  
G
Charge  
12. 栅极电荷测试电路与波形  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
13. 阻性开关测试电路与波形  
BVDSS  
--------------------  
BVDSS - VDD  
L
1
2
2
----  
EAS  
=
L IAS  
VDS  
I D  
BVDSS  
IAS  
RG  
VDD  
ID (t)  
V
VDS (t)  
VDD  
DUT  
GS  
t p  
t p  
Time  
14. 非箝位感性开关测试电路与波形  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
5
FCI7N60 Rev. C1  
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
15. 二极管恢复 dv/dt 峰值测试电路与波形  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
6
FCI7N60 Rev. C1  
10.29  
9.65  
A
4.83  
4.06  
B
8.33  
6.22  
1.40  
1.14  
1.40  
1.00  
7°  
7.88  
6.86  
9.65  
8.64  
5°  
5°  
2
1
3
3.96  
2.80  
B
2.13  
14.73  
12.70  
2.79  
2.03  
1.78  
1.14  
SEE NOTE "G"  
B
0.64  
0.33  
B
2.54  
0.90  
0.64  
B
5.08  
M
0.254 A  
B
NOTES:  
A. EXCEPT WHERE NOTED CONFORMS TO  
TO262 JEDEC VARIATION AA.  
B
DOES NOT COMPLY JEDEC STD. VALUE.  
C. ALL DIMENSIONS ARE IN MILLIMETERS.  
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR PROTRUSIONS.  
E. DIMENSION AND TOLERANCE AS PER ANSI  
Y14.5-1994.  
F. LOCATION OF PIN HOLE MAY VARY  
(LOWER LEFT CORNER, LOWER CENTER  
AND CENTER OF PACKAGE)  
G. MAXIMUM WIDTH FOR F102 DEVICE = 1.35 MAX.  
H. DRAWING FILE NAME: TO262A03REV6  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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