FCPF600N60ZL1-F154 [ONSEMI]

Power MOSFET, N-Channel, SUPERFET® II, FAST, 600 V, 7.4 A, 600 mΩ, TO-220F Ultra narrow lead;
FCPF600N60ZL1-F154
型号: FCPF600N60ZL1-F154
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET, N-Channel, SUPERFET® II, FAST, 600 V, 7.4 A, 600 mΩ, TO-220F Ultra narrow lead

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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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MOSFET – N-Channel,  
SUPERFET) II  
600 V, 7.4 A, 600 mW  
FCPF600N60ZL1-F154  
Description  
SUPERFET II MOSFET is ON Semiconductor’s brandnew high  
voltage superjunction (SJ) MOSFET family that is utilizing charge  
balance technology for outstanding low onresistance and lower gate  
charge performance. This technology is tailored to minimize  
conduction loss, provide superior switching performance, and  
withstand extreme dv/dt rate and higher avalanche energy.  
Consequently, SUPERFET II FAST MOSFET series helps minimize  
various power systems and improve system efficiency.  
www.onsemi.com  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
600 V  
600 mW @ 10 V  
7.4 A  
D
Features  
650 V @ T = 150°C  
J
Typ. R  
= 510 mW  
DS(on)  
G
Ultra Low Gate Charge (Typ. Q = 20 nC)  
g
Low Effective Output Capacitance (Typ. C eff.) = 74 pF)  
oss(  
100% Avalanche Tested  
ESD Improved Capacity  
S
MOSFET  
These Devices are PbFree and are RoHS Compliant  
Applications  
Computing / Display Power Supplies  
Telecom / Server Power Supplies  
Industrial Power Supplies  
G
D
S
Lighting / Charger / Adapter  
TO220F Ultra Narrow Lead  
CASE 221BN  
MARKING DIAGRAM  
$Y&Z&3&K  
FCPF  
600N60Z  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
FCPF600N60Z  
= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
FCPF600N60ZL1F154/D  
December, 2020 Rev. 0  
FCPF600N60ZL1F154  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)  
C
Symbol  
Parameter  
Value  
600  
Unit  
V
V
DSS  
V
GSS  
Drain to Source Voltage  
Gate to Source Voltage  
DC  
20  
V
AC (f > 1 Hz)  
30  
I
D
Drain Current  
Continuous (T = 25°C)  
7.4*  
A
C
Continuous (T = 100°C)  
4.7*  
C
I
Drain Current  
Pulsed (Note 1)  
22.2*  
135  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy (Note 2)  
Avalanche Current (Note 2)  
Repetitive Avalanche Energy (Note 1)  
MOSFET dv/dt  
AS  
AS  
I
1.5  
E
0.89  
100  
mJ  
V/ns  
V/ns  
W
AR  
dv/dt  
Peak Diode Recovery dv/dt (Note 3)  
Power Dissipation  
20  
P
(T = 25°C)  
C
28  
D
Derate Above 25°C  
0.22  
55 to +150  
300  
W/°C  
°C  
T , T  
Operating and Storage Temperature Range  
J
STG  
T
L
Maximum Lead Temperature for Soldering, 1/8from Case for 5 Seconds  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
*Drain current limited by maximum junction temperature.  
1. Repetitive rating: pulse width limited by maximum junction temperature.  
2. I = 1.5 A, V = 50 V, R = 25 W, starting T = 25°C.  
AS  
DD  
G
J
3. I 3.7 A, di/dt 200 A/ms, V BV  
, starting T = 25°C.  
SD  
DD  
DSS  
J
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
4.5  
Unit  
R
R
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
_C/W  
_C/W  
q
JC  
JA  
62.5  
q
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Shipping  
50 Units / Tube  
FCPF600N60ZL1F154  
FCPF600N60Z  
TO220F  
(PbFree)  
www.onsemi.com  
2
 
FCPF600N60ZL1F154  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
600  
650  
V
V
V
V
I
= 0 V, I = 10 mA, T = 25_C  
DSS  
GS  
D
J
= 0 V, I = 10 mA, T = 150_C  
GS  
D
J
DBV  
/ DT  
Breakdown Voltage Temperature  
Coefficient  
= 10 mA, Referenced to 25_C  
0.67  
V/_C  
DSS  
J
D
BV  
Drain to Source Avalanche Breakdown  
Voltage  
V
GS  
= 0 V, I = 7.4 A  
700  
V
DS  
D
I
Zero Gate Voltage Drain Current  
V
DS  
V
DS  
V
GS  
= 600 V, V = 0 V  
1.32  
1
mA  
DSS  
GS  
= 480 V, T = 125_C  
C
I
Gate to Source Leakage Current  
=
20 V, V = 0 V  
10  
mA  
GSS  
DS  
ON CHARACTERISTICS  
V
Gate Threshold Voltage  
V
GS  
V
GS  
V
DS  
= V , I = 250 mA  
2.5  
3.5  
0.6  
V
W
S
GS(th)  
DS(on)  
DS  
D
R
Static Drain to Source On Resistance  
Forward Transconductance  
= 10 V, I = 3.7 A  
0.51  
6.7  
D
g
FS  
= 20 V, I = 3.7 A  
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 25 V, V = 0 V, f = 1 MHz  
840  
630  
30  
1120  
840  
45  
pF  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
W
iss  
DS  
GS  
C
Output Capacitance  
oss  
C
Reverse Transfer Capacitance  
Output Capacitance  
rss  
C
V
DS  
V
DS  
V
DS  
= 380 V, V = 0 V, f = 1 MHz  
16.5  
74  
oss  
GS  
C
Effective Output Capacitance  
Total Gate Charge at 10 V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance  
= 0 V to 480 V, V = 0 V  
oss(eff.)  
GS  
Q
= 380 V, I = 3.7 A, V = 10 V  
20  
26  
g(tot)  
D
GS  
(Note 4)  
Q
3.4  
7.5  
2.89  
gs  
Q
gd  
ESR  
f = 1 MHz  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
V
= 380 V, I = 3.7 A, V = 10 V,  
13  
7
36  
24  
88  
28  
ns  
ns  
ns  
ns  
d(on)  
DD  
g
D
GS  
R = 4.7 W  
t
r
(Note 4)  
t
39  
9
d(off)  
t
f
SOURCEDRAIN DIODE CHARACTERISTICS  
I
Maximum Continuous Source to Drain Diode Forward Current  
Maximum Pulsed Source to Drain Diode Forward Current  
7.4  
22.2  
1.2  
A
A
S
I
SM  
V
SD  
Source to Drain Forward Voltage  
Reverse Recovery Time  
V
V
= 0 V, I = 3.7 A  
V
GS  
SD  
t
rr  
= 400 V, I = 3.7 A,  
200  
2.3  
ns  
mC  
DD  
SD  
dI /dt = 100 A/ms  
F
Q
Reverse Recovery Charge  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
3
 
FCPF600N60ZL1F154  
TYPICAL PERFORMANCE CHARACTERISTICS  
20  
10  
50  
V
GS  
=10.0 V  
8.0 V  
7.0 V  
6.0 V  
5.5 V  
5.0 V  
4.5 V  
V
= 20 V  
DS  
250 ms Pulse Test  
10  
25°C  
55°C  
150°C  
1
1
250 ms Pulse Test  
= 25°C  
T
C
0.4  
0.2  
0.2  
1
10  
20  
2
3
V
4
5
6
7
8
V
DS  
, Drain to Source Voltage (V)  
, Gate to Source Voltage (V)  
GS  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
50  
10  
1.2  
0.9  
0.6  
0.3  
T
C
= 25°C  
V
= 0 V  
GS  
250 ms Pulse Test  
150°C  
V
GS  
= 10 V  
25°C  
V
= 20 V  
GS  
1
0
5
10  
15  
20  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
V
, Body Diode Forward Voltage (V)  
I , Drain Current (A)  
D
SD  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current and  
Temperature  
Figure 3. OnResistance Variation vs.  
Drain Current and Gate Voltage  
10  
10000  
V
DS  
V
DS  
V
DS  
= 120 V  
= 300 V  
= 480 V  
C
8
6
4
2
0
iss  
1000  
100  
10  
C
oss  
V
= 0 V  
GS  
f = 1 MHz  
C
C
C
= C + C (C = shorted)  
iss  
gs gd ds  
= C + C  
ds  
oss  
rss  
gd  
1
= C  
C
gd  
I
D
= 3.7 A  
rss  
0.5  
0.1  
1
10  
100  
600  
0
5
10  
15  
20  
25  
V
DS  
, Drain to Source Voltage (V)  
Q , Total Gate Charge (nC)  
g
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
www.onsemi.com  
4
FCPF600N60ZL1F154  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
3.0  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
V
= 0 V  
= 10 mA  
V
= 10 V  
GS  
GS  
I
D
I = 3.7 A  
D
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
100 50  
50  
100  
150  
200  
0
100 50  
50  
100  
150  
200  
0
T , Junction Temperature (°C)  
J
T , Junction Temperature (°C)  
J
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. OnResistance Variation  
vs. Temperature  
50  
8
10  
10 ms  
6
4
2
0
100 ms  
1
1 ms  
Operation in this Area  
10 ms  
is Limited by R  
DS(on)  
0.1  
DC  
T
= 25°C  
T = 150°C  
Single Pulse  
C
J
0.01  
150  
0.1  
1
10  
100  
1000  
25  
50  
75  
100  
125  
V
DS  
, Drain to Source Voltage (V)  
T , Case Temperature (°C)  
C
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current vs. Case  
Temperature  
4
3
2
1
0
0
100  
200  
300  
400  
500  
600  
V
DS  
, Drain to Source Voltage (V)  
Figure 11. EOSS vs. Drain to Source Voltage  
www.onsemi.com  
5
FCPF600N60ZL1F154  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
5
1
0.5  
0.2  
0.1  
0.05  
PDM  
t1  
0.02  
0.01  
t2  
Z
(t) = 4.5°C/W Max.  
q
JC  
Single Pulse  
Duty Factor, D = t / t  
1
2
T
JM  
T = P  
x Z (t)  
q
C
DM  
JC  
0.1  
1
105  
104  
103  
102  
101  
100  
10  
100  
t, Rectangular Pulse Duration (s)  
Figure 12. Transient Thermal Response Curve  
www.onsemi.com  
6
FCPF600N60ZL1F154  
V
GS  
R
Q
g
L
V
DS  
Q
Q
gd  
gs  
V
GS  
DUT  
I
G
= const.  
Charge  
Figure 13. Gate Charge Test Circuit & Waveform  
R
L
V
DS  
GS  
90%  
90%  
10%  
90%  
V
DS  
V
DD  
V
GS  
R
G
10%  
V
DUT  
V
GS  
t
t
d(off)  
t
r
t
f
d(on)  
t
on  
t
off  
Figure 14. Resistive Switching Test Circuit & Waveforms  
L
2
1
2
EAS  
+
LIAS  
V
DS  
BV  
DSS  
I
D
I
AS  
R
G
V
DD  
I
D
(t)  
DUT  
V
DD  
V
GS  
V
DS  
(t)  
t
p
Time  
t
p
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
7
FCPF600N60ZL1F154  
+
DUT  
V
DS  
I
SD  
L
Driver  
R
G
Same Type  
as DUT  
V
DD  
V
GS  
dv/dt controlled by R  
G
I controlled by pulse period  
SD  
Gate Pulse Width  
D +  
Gate Pulse Period  
V
GS  
10 V  
(Driver)  
I
, Body Diode Forward Current  
FM  
I
di/dt  
SD  
(DUT)  
I
RM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V
DS  
V
DD  
V
SD  
(DUT)  
Body Diode  
Forward Voltage Drop  
Figure 16. Peak Recovery dv/dt Test Circuit & Waveforms  
SUPERFET is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or  
other countries.  
www.onsemi.com  
8
FCPF600N60ZL1F154  
PACKAGE DIMENSIONS  
TO220 FULLPACK, 3LEAD  
CASE 221BN  
ISSUE O  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
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Email Requests to: orderlit@onsemi.com  
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