FDD6670A [ONSEMI]

N 沟道,逻辑电平,PowerTrench® MOSFET,30V,66A,8mΩ;
FDD6670A
型号: FDD6670A
厂家: ONSEMI    ONSEMI
描述:

N 沟道,逻辑电平,PowerTrench® MOSFET,30V,66A,8mΩ

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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
March 2015  
FDD6670A  
30V N-Channel PowerTrenchÒ MOSFET  
General Description  
Features  
This N-Channel MOSFET has been designed  
specifically to improve the overall efficiency of DC/DC  
converters using either synchronous or conventional  
switching PWM controllers. It has been optimized for  
low gate charge, low RDS ( ON) , fast switching speed and  
extremely low RDS(ON) in a small package.  
· 66 A, 30 V  
RDS(ON) = 8 mW @ VGS = 10 V  
RDS(ON) = 10 mW @ VGS = 4.5 V  
· Low gate charge  
· Fast Switching  
Applications  
· High performance trench technology for extremely  
· DC/DC converter  
· Motor Drives  
low R  
DS(ON)  
D
D
G
G
S
D-PAK  
(TO-252)  
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
Drain-Source Voltage  
Ratings  
Units  
30  
V
V
A
VGSS  
Gate-Source Voltage  
Continuous Drain Current @TC=25°C  
@TA=25°C  
±20  
ID  
(Note 3)  
(Note 1a)  
(Note 1a)  
(Note 3)  
66  
15  
100  
Pulsed  
PD  
W
Power Dissipation  
@TC=25°C  
@TA=25°C  
@TA=25°C  
63  
(Note 1a)  
(Note 1b)  
3.2  
1.3  
TJ, T  
Operating and Storage Junction Temperature Range  
–55 to +175  
°C  
STG  
Thermal Characteristics  
RqJC  
RqJA  
RqJA  
Thermal Resistance, Junction-to-Case  
(Note 1)  
2.4  
40  
96  
°C/W  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1b)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape width  
16mm  
Quantity  
FDD6670A  
FDD6670A  
D-PAK (TO-252)  
13’’  
2500 units  
FDD6670A Rev. 3.3  
Ó2005 Fairchild Semiconductor Corp.  
Electrical Characteristics  
TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min Typ Max Units  
Drain-Source Avalanche Ratings (Note 2)  
EAS  
IAS  
Drain-Source Avalanche Energy  
Drain-Source Avalanche Current  
Single Pulse, VDD = 15 V, ID= 66 A  
67  
66  
mJ  
A
Off Characteristics  
BVDSS  
Drain–Source Breakdown Voltage  
30  
V
VGS = 0 V,  
ID = 250 mA  
DBVDSS  
DTJ  
Breakdown Voltage Temperature  
Coefficient  
26  
ID = 250 mA,Referenced to 25°C  
mV/°C  
IDSS  
Zero Gate Voltage Drain Current  
Gate–Body Leakage  
VDS = 24 V,  
VGS = 0 V  
1
mA  
IGSS  
VGS = ±20 V, VDS = 0 V  
±100  
nA  
On Characteristics  
(Note 2)  
VGS(th)  
Gate Threshold Voltage  
1
1.8  
–5  
3
V
VDS = VGS  
,
ID = 250 mA  
Gate Threshold Voltage  
Temperature Coefficient  
DVGS(th)  
DTJ  
ID = 250 mA,Referenced to 25°C  
mV/°C  
6.3  
7.9  
9.5  
RDS(on)  
Static Drain–Source  
On–Resistance  
VGS = 10 V,  
VGS = 4.5 V, ID = 13 A  
VGS = 10 V, ID = 15 A,T =125°C  
ID = 15 A  
8
10  
13  
mW  
J
ID(on)  
gFS  
On–State Drain Current  
VGS = 10 V,  
VDS = 10 V,  
VDS = 5 V  
ID = 15 A  
50  
A
S
Forward Transconductance  
60  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
RG  
Input Capacitance  
1755  
430  
180  
1.3  
pF  
pF  
pF  
W
VDS = 15 V,  
f = 1.0 MHz  
V GS = 0 V,  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VGS = 15 mV, f = 1.0 MHz  
Switching Characteristics (Note 2)  
td(on)  
tr  
td(off)  
tf  
Turn–On Delay Time  
Turn–On Rise Time  
Turn–Off Delay Time  
Turn–Off Fall Time  
Total Gate Charge  
Gate–Source Charge  
Gate–Drain Charge  
11  
12  
29  
19  
16  
4.6  
6.2  
20  
21  
47  
34  
22  
ns  
ns  
VDD = 15 V,  
VGS = 10 V,  
ID = 1 A,  
RGEN = 6 W  
ns  
ns  
Qg  
nC  
nC  
nC  
VDS = 15V,  
VGS = 5 V  
ID = 15 A,  
Qgs  
Qgd  
FDD6670A Rev. 3.3  
Electrical Characteristics  
TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min Typ Max Units  
Drain–Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain–Source Diode Forward Current  
2.3  
1.2  
A
V
VSD  
trr  
Drain–Source Diode Forward Voltage  
Diode Reverse Recovery Time  
0.74  
28  
VGS = 0 V, IS = 2.3 A  
IF = 15 A, dIF/dt = 100 A/µs  
(Note 2)  
ns  
nC  
Q
Diode Reverse Recovery Charge  
18  
rr  
Notes:  
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of  
the drain pins. RqJC is guaranteed by design while RqCA is determined by the user's board design.  
a) RqJA = 45°C/W when mounted on a  
1in2 pad of 2 oz copper  
b) RqJA = 96°C/W when mounted  
on a minimum pad.  
Scale 1 : 1 on letter size paper  
2. Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%  
PD  
3. Maximum current is calculated as:  
RDS(ON)  
where PD is maximum power dissipation at TC = 25°C and RDS(on) is at TJ(max) and VGS = 10V. Package current limitation is 21A  
FDD6670A Rev. 3.3  
Typical Characteristics  
100  
3
VGS=10V  
6.0V  
4.0V  
2.8 VGS = 3.0V  
2.6  
2.4  
2.2  
2
80  
60  
40  
20  
0
4.5V  
3.5V  
1.8  
3.5V  
1.6  
1.4  
1.2  
1
4.0V  
4.5V  
3.0V  
6.0V  
10V  
0.8  
0
0.5  
1
1.5  
2
2.5  
0
20  
40  
60  
80  
100  
VDS, DRAIN-SOURCE VOLTAGE (V)  
ID, DRAIN CURRENT (A)  
Figure 1. On-Region Characteristics  
Figure 2. On-Resistance Variation with  
Drain Current and Gate Voltage  
1.6  
1.4  
1.2  
1
0.02  
ID = 66A  
ID = 33A  
VGS = 10V  
0.0175  
0.015  
TA = 125oC  
0.0125  
0.01  
0.0075  
0.005  
0.8  
0.6  
TA = 25oC  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
2
4
6
8
10  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. On-Resistance Variation  
withTemperature  
Figure 4. On-Resistance Variation with  
Gate-to-Source Voltage  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1000  
VDS = 5V  
VGS = 0V  
100  
10  
TA = 125oC  
1
25o  
TA =125oC  
0.1  
-55oC  
-55oC  
0.01  
0.001  
0.0001  
25oC  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.5  
2
2.5  
3
3.5  
4
VSD, BODY DIODE FORWARD VOLTAGE (V)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Body Diode Forward Voltage Variation  
with Source Current and Temperature  
FDD6670A Rev. 3.3  
Typical Characteristics  
10  
2400  
2000  
1600  
1200  
800  
f = 1MHz  
VGS = 0 V  
ID = 66A  
8
6
4
2
0
VDS = 10V  
Ciss  
20V  
15V  
Coss  
400  
Crss  
0
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
Qg, GATE CHARGE (nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance Characteristics  
100  
1000  
SINGLE PULSE  
R
qJA = 96°C/W  
TA = 25°C  
100µs  
80  
100  
10  
RDS(ON) LIMIT  
1ms  
10ms  
100ms  
1s  
60  
40  
20  
0
10s  
DC  
1
VGS = 10V  
SINGLE PULSE  
0.1  
0.01  
Rq = 96oC/W  
JA  
TA = 25oC  
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
100  
VDS, DRAIN-SOURCE VOLTAGE (V)  
t1, TIME (sec)  
Figure 9. Maximum Safe Operating Area  
Figure 10. Single Pulse Maximum  
Power Dissipation  
1
D = 0.5  
R
qJA(t) = r(t) * RqJA  
0.2  
Rq = 96 °C/W  
JA  
0.1  
0.1  
0.05  
0.02  
P(pk)  
t1  
0.0  
t2  
0.01  
TJ - TA = P * RqJA(t)  
Duty Cycle, D = t1 / t2  
SINGLE PULSE  
0.001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, TIME (sec)  
Figure 11. Transient Thermal Response Curve  
Thermal characterization performed using the conditions described in Note 1b.  
Transient thermal response will change depending on the circuit board design.  
FDD6670A Rev. 3.3  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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