FDD8796 [ONSEMI]

N 沟道,PowerTrench® MOSFET,25V,35A,5.7mΩ;
FDD8796
型号: FDD8796
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,25V,35A,5.7mΩ

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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
March 2015  
FDD8796/FDU8796  
N-Channel PowerTrench® MOSFET  
25V, 35A, 5.7mΩ  
General Description  
Features  
„ Max rDS(on) =5.7mat VGS = 10V, ID = 35A  
„ Max rDS(on) =8.0mat VGS = 4.5V, ID = 35A  
„ Low gate charge: Qg(10) = 37nC(Typ), VGS = 10V  
„ Low gate resistance  
This N-Channel MOSFET has been designed specifically to  
improve the overall efficiency of DC/DC converters using  
either synchronous or conventional switching PWM  
controllers. It has been optimized for low gate charge, low  
rDS(on) and fast switching speed.  
„ Avalanche rated and 100% tested  
„ RoHS Compliant  
Application  
„ Vcore DC-DC for Desktop Computers and Servers  
„ VRM for Intermediate Bus Architecture  
D
G
D
G
S
I-PAK  
G
D S  
Short Lead I-PAK  
(TO-251AA)  
S
MOSFET Maximum Ratings TC= 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
25  
±20  
V
V
Drain Current -Continuous (Package Limited)  
-Continuous (Die Limited)  
-Pulsed  
35  
ID  
98  
A
(Note 1)  
(Note 2)  
305  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
91  
mJ  
W
PD  
88  
TJ, TSTG  
Operating and Storage Temperature  
-55 to 175  
°C  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction to Case TO_252, TO_251  
Thermal Resistance, Junction to Ambient TO_252, TO_251  
Thermal Resistance, Junction to Ambient TO-252,1in2 copper pad area  
1.7  
100  
52  
°C/W  
°C/W  
°C/W  
Package Marking and Ordering Information  
Device Marking  
FDD8796  
Device  
FDD8796  
Package  
TO-252AA  
TO-251AA  
TO-251AA  
Reel Size  
13’’  
Tape Width  
Quantity  
16mm  
N/A  
2500 units  
75 units  
FDU8796  
FDU8796  
N/A (Tube)  
N/A (Tube)  
FDU8796  
FDU8796_F071  
N/A  
75 units  
©2006 Fairchild Semiconductor Corporation  
FDD8796/FDU8796 Rev. 1.1  
1
www.fairchildsemi.com  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 250µA, VGS = 0V  
25  
V
BVDSS  
TJ  
Breakdown Voltage Temperature  
Coefficient  
ID = 250µA, referenced to  
25°C  
7
mV/°C  
1
VDS = 20V  
VGS = 0V  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
µA  
TJ = 150°C  
250  
±100  
VGS = ±20V  
nA  
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VGS = VDS, ID = 250µA  
1.2  
1.8  
2.5  
V
VGS(th)  
TJ  
Gate to Source Threshold Voltage  
Temperature Coefficient  
ID = 250µA, referenced to  
25°C  
-6.7  
mV/°C  
VGS = 10V, ID = 35A  
VGS = 4.5V, ID = 35A  
4.5  
6.0  
5.7  
8.0  
rDS(on)  
Drain to Source On Resistance  
mΩ  
VDS = 10V, ID = 35A  
TJ = 175°C  
6.9  
9.5  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
RG  
Input Capacitance  
1960  
455  
315  
1.1  
2610  
605  
pF  
pF  
pF  
VDS = 13V, VGS = 0V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
475  
f = 1MHz  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
10  
24  
99  
57  
37  
19  
6
20  
39  
ns  
ns  
VDD =13V, ID = 35A  
VGS = 10V, RGS = 20Ω  
Turn-Off Delay Time  
Fall Time  
158  
91  
ns  
ns  
Qg  
Total Gate Charge  
Total Gate Charge  
Gate to Source Gate Charge  
Gate to Drain Charge  
VGS = 0 to10V  
52  
nC  
nC  
nC  
nC  
VDD =13V,  
ID = 35A,  
Qg  
VGS = 0 to 5V  
27  
Qgs  
Qgd  
Ig = 1.0mA  
6
Drain-Source Diode Characteristics  
VGS = 0V, IS = 35A  
0.9  
0.8  
30  
1.25  
1.0  
45  
V
V
VSD  
Source to Drain Diode Voltage  
VGS = 0V, IS = 15A  
trr  
Reverse Recovery Time  
IF = 35A, di/dt = 100A/µs  
IF = 35A, di/dt = 100A/µs  
ns  
nC  
Qrr  
Notes:  
Reverse Recovery Charge  
23  
35  
1: Pulse time < 300µs, Duty cycle = 2%.  
2: Starting T = 25°C, L = 0.3mH, I = 24.7A, V = 23V, V = 10V.  
J
AS  
DD  
GS  
2
www.fairchildsemi.com  
FDD8796/FDU8796 Rev. 1.1  
Typical Characteristics TJ = 25°C unless otherwise noted  
70  
60  
50  
40  
30  
20  
10  
0
4.0  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5%MAX  
VGS = 3V  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5%MAX  
VGS = 10V  
VGS = 4.5V  
VGS = 3.5V  
VGS = 3.5V  
VGS = 4.5V  
VGS = 3V  
VGS = 10V  
0
1
2
3
4
0
10  
20  
30  
40  
50  
60  
70  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
ID, DRAIN CURRENT(A)  
Figure 1. On Region Characteristics  
Figure 2. Normalized On-Resistance vs Drain  
Current and Gate Voltage  
14  
1.8  
ID = 35A  
PULSE DURATION = 80µs  
ID =35A  
DUTY CYCLE = 0.5%MAX  
VGS = 10V  
12  
10  
8
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
TJ = 175oC  
6
TJ = 25oC  
4
2
2
4
6
8
10  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. Normalized On Resistance vs Junction  
Temperature  
Figure 4. On-Resistance vs Gate to Source  
Voltage  
100  
70  
VGS = 0V  
PULSE DURATION = 80µs  
60  
50  
40  
30  
20  
10  
0
DUTY CYCLE = 0.5%MAX  
10  
TJ = 175oC  
TJ = 175oC  
TJ = -55oC  
1
TJ = 25oC  
0.1  
TJ = 25oC  
TJ = -55oC  
0.01  
1E-3  
0.0  
0.3  
0.6  
0.9  
1.2  
0
1
2
3
4
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Source to Drain Diode Forward  
Voltage vs Source Current  
3
www.fairchildsemi.com  
FDD8796/FDU8796 Rev. 1.1  
Typical Characteristics TJ = 25°C unless otherwise noted  
10  
8
4000  
Ciss  
VDD = 10V  
1000  
6
Coss  
VDD = 13V  
4
VDD = 16V  
Crss  
2
f = 1MHz  
GS = 0V  
V
100  
0
0.1  
1
10  
0
10  
20  
30  
40  
30  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Qg, GATE CHARGE(nC)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs Drain to Source Voltage  
50  
100  
80  
TJ = 25oC  
VGS = 10V  
10  
TJ = 125oC  
60  
VGS = 4.5V  
40  
TJ = 150oC  
20  
R
θJC = 1.7oC/W  
1
0.01  
0
25  
0.1  
1
10  
100  
300  
50  
75  
100  
125  
150  
175  
tAV, TIME IN AVALANCHE(ms)  
TC, CASE TEMPERATURE(oC)  
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain Current vs  
Case Temperature  
1000  
10000  
o
T
= 25 C  
C
VGS = 10V  
10us  
FOR TEMPERATURES  
o
ABOVE 25 C DERATE PEAK  
100  
CURRENT AS FOLLOWS:  
100us  
175 T  
C
I = I  
1000  
----------------------  
25  
150  
10  
LIMITED BY  
PACKAGE  
1ms  
1
10ms  
SINGLE PULSE  
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY rDS(on)  
T
J
= MAX RATED  
DC  
100  
50  
SINGLE PULSE  
o
T
C
= 25 C  
0.1  
10-5  
10-4  
10-3  
t, PULSE WIDTH (s)  
10-2  
10-1  
100  
101  
40  
1
10  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 11. Forward Bias Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
4
www.fairchildsemi.com  
FDD8796/FDU8796 Rev. 1.1  
Typical Characteristics TJ = 25°C unless otherwise noted  
2
DUTY CYCLE-DESENDING ORDER  
1
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.1  
P
DM  
t
1
0.01  
t
2
NOTES:  
DUTY FACTOR: D = t /t  
1
2
SINGLE PULSE  
1E-3  
PEAK T = P  
x Z  
x R  
+ T  
J
DM  
θJC  
θJC C  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 13. Transient Thermal Response Curve  
5
www.fairchildsemi.com  
FDD8796/FDU8796 Rev. 1.1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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