FDP10N60NZ [ONSEMI]

Power MOSFET,N 沟道,UniFETTMII,600V,10A,750mΩ,TO-220;
FDP10N60NZ
型号: FDP10N60NZ
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET,N 沟道,UniFETTMII,600V,10A,750mΩ,TO-220

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FDP10N60NZ / FDPF10N60NZ  
N沟道UniFETTM II MOSFET  
600 V, 10 A, 750 m  
特性  
说明  
RDS(on) = 640 m(典型值) @ VGS = 10 V, ID = 5 A  
低栅极电荷(典型值 23 nC)  
TM  
®
UniFET II MOSFET是飞兆半导高压MOSFET系列产品,基于平  
面条形技术和DMOS技术先进MOSFET系列产品在平面 MOSFET 产  
品中具有最小的通态电阻可提供卓越的开关性能和更高的雪崩  
Crss(典型值 10 pF)  
100%经过雪崩测试  
改善的dv/dt处理能力  
增强的 ESD 能力  
TM  
能量强度。此外,内部的栅源 ESD 二极管使 UniFET II MOSFET  
产品可承受超过 2kV HBM静电冲击应力。该器件系列适用于开  
关电源转换器应用功率因数校正(PFC)板显示器(FPD)电视  
电源、ATX 及灯用电子镇流器。  
符合 RoHS 标准  
应用  
LCD/ LED/ PDP TV  
照明  
不间断电源  
o
MOSFET最大额定值Tc = 25C,除非另有说明*  
符号  
参数  
FDP10N60NZ  
FDPF10N60NZ  
600  
单位  
漏极-源极电压  
栅极-源极电压  
VDSS  
VGSS  
V
V
±25  
- 连续 (TC = 25oC)  
- 连续(TC = 100oC)  
- 脉冲  
10  
6
10*  
6*  
lD  
漏极电流  
A
漏极电流  
(注 1)  
(2)  
40  
40*  
lDM  
EAS  
lAR  
EAR  
A
mJ  
单脉冲雪崩能量  
雪崩电流  
550  
10  
(注 1)  
(注 1)  
(注 3)  
A
重复雪崩能量  
二极管恢复dv/dt峰值  
18.5  
10  
mJ  
dv/dt  
V/ns  
(TC = 25oC)  
185  
1.5  
38  
0.3  
W
W/oC  
功耗  
PD  
- 降低至 25oC 以上  
工作和存储温度范围  
-55 to +150  
300  
o
TJ TSTG  
C
用于焊接的最大引脚温度,距离外壳1/8",持续5秒  
o
C
TL  
*限于结温  
热性能  
符号  
参数  
FDP10N60NZ  
0.68  
FDPF10N60NZ  
单位  
RθJC  
RθCS  
RθJA  
结至外壳热阻最大值  
3.3  
-
外壳与散热体之间的热阻典型值  
结至环境热阻最大值  
0.5  
oC/W  
62.5  
62.5  
©2010 公司  
1
www.fairchildsemi.com  
FDP10N60NZ / FDPF10N60NZRev. C0  
封装标识与定购信息  
器件标识  
FDP10N60NZ  
FDPF10N60NZ  
设备  
封装  
规格  
带宽  
数量  
50  
FDP10N60NZ  
FDPF10N60NZ  
TO-220  
TO-220F  
-
-
-
-
50  
o
电气特性 TC = 25C,除非另有说明  
符号  
关断特性  
BVDSS  
参数  
测试条件  
最小值 典型值 最大值  
单位  
o
ID = 250μA, VGS = 0V, TJ = 25C  
漏极-源极击穿电压  
击穿电压温度系数  
600  
-
-
-
-
V
△BVDSS  
△TJ  
o
ID = 250μA,推荐选用25C  
o
V/C  
0.6  
VDS = 600V, VGS = 0V  
-
-
-
-
-
-
1
IDSS  
IGSS  
零栅极电压漏极电流  
μA  
μA  
o
VDS = 480V, TC = 125C  
10  
栅极-体漏电流  
VGS = ±25V, VDS = 0V  
±10  
导通特性  
VGS(th)  
栅极阈值电压  
VGS = VDS, ID = 250μA  
VGS = 10V, ID = 5A  
VDS = 20 V, ID = 5A  
3.0  
-
-
5.0  
0.75  
-
V
RDS(on)  
漏极至源极静态导通电阻  
正向跨导  
0.64  
14  
gFS  
-
S
动态特性  
Ciss  
Coss  
Crss  
Qg  
直流母线电容值  
输出电容  
VDS = 25V, VGS = 0V  
f = 1MHz  
-
-
-
-
-
-
1110  
130  
10  
23  
6
1475  
175  
15  
30  
-
pF  
pF  
pF  
nC  
nC  
nC  
反向传输电容  
VDS = 480V, ID = 10A  
VGS = 10V  
10V的栅极电荷总量  
栅极 - 源极栅极电荷  
栅极-漏极“密勒”电荷  
Qgs  
(说明4)  
Qgd  
8
-
特性  
VDD = 300V, ID = 10A  
RG = 25  
td(on)  
tr  
导通延迟时间  
开通上升时间  
关断延迟时间  
关断下降时间  
-
-
-
-
25  
50  
70  
50  
60  
ns  
ns  
ns  
ns  
110  
150  
110  
(说明4)  
td(off)  
tf  
漏极 - 源极二极管特性  
IS  
漏极 - 源极二极管最大正向连续电流  
漏极 - 源极二极管最大正向脉冲电流  
-
-
-
-
-
-
-
10  
40  
1.4  
-
A
A
ISM  
VSD  
trr  
漏极 - 源极二极管正向电压  
反向恢复时间  
VGS = 0V, ISD = 10A  
-
V
VGS = 0V, ISD = 10A  
300  
2
ns  
μC  
dIF/dt = 100A/μs  
Qrr  
反向恢复电荷  
-
注意:  
1.重复率额定值温  
2.L = 11mHIAS = 10AVDD = 50VRG = 25TJ = 25°C  
3.ISD 10Adi/dt <200A/μsVDD BVDSS,开TJ = 25°C  
4.本质上独立于性  
典型性能特征  
1. 态区域特性  
2. 递特性  
3. 通态变化与  
电流和栅极电压  
4. 体二极管正向电压  
与 源极电流  
度  
5. 容特性  
6. 极电荷特性  
典型性能特征(接上页)  
7. 穿电压变化  
8. 态变化  
vs 度  
vs 度  
9. 大安全操作区  
-FDP10N60NZ  
10. 大安全工作区  
-FDPF10N60NZ  
11. 漏极电流与 壳体温度  
典型性能特征 (接上页)  
12. 热响应曲线 -FDP10N60NZ  
13. 热响应曲线 -FDPF10N60NZ  
栅极电荷测试电路与波形  
阻性开关测试电路与波形  
非箝位感性开关测试电路与波形  
二极管恢复dv/dt值测试电路与波形  
机械尺寸  
TO-220B03  
尺寸单位为毫米  
封装尺寸  
TO-220M03  
尺寸单位为毫米  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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