FDS89161 [ONSEMI]

双 N 沟道,屏蔽门极,PowerTrench® MOSFET,100 V,2.7A,105mΩ;
FDS89161
型号: FDS89161
厂家: ONSEMI    ONSEMI
描述:

双 N 沟道,屏蔽门极,PowerTrench® MOSFET,100 V,2.7A,105mΩ

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September 2015  
FDS89161  
Dual N-Channel Shielded Gate PowerTrench® MOSFET  
100 V, 2.7 A, 105 mΩ  
Features  
General Description  
„ Shielded Gate MOSFET Technology  
This N-Channel MOSFET is produced using Fairchild  
Semiconductor‘s advanced PowerTrench® process that  
incorporates Shielded Gate technology. This process has been  
optimized for rDS(on), switching performance and ruggedness.  
„ Max rDS(on) = 105 mΩ at VGS = 10 V, ID = 2.7 A  
„ Max rDS(on) = 171 mΩ at VGS = 6 V, ID = 2.1 A  
„ High performance trench technology for extremely low rDS(on)  
Applications  
„ High power and current handling capability in a widely used  
surface mount package  
„ Synchronous Rectifier  
„ Primary Switch For Bridge Topology  
„ 100% UIL Tested  
„ RoHS Compliant  
D2  
D2  
G2  
S2  
G1  
S1  
4
3
D2  
D2  
D1  
D1  
5
6
7
8
D1  
D1  
Q2  
Q1  
G2  
2
1
S2  
G1  
S1  
Pin 1  
SO-8  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Pulsed  
100  
V
V
±20  
2.7  
ID  
A
15  
EAS  
PD  
Single Pulse Avalanche Energy  
Power Dissipation  
(Note 3)  
13  
31  
mJ  
W
TC = 25 °C  
TA = 25 °C  
Power Dissipation  
(Note1a)  
1.6  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
(Note 1)  
40  
78  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
FDS89161  
FDS89161  
SO-8  
2500 units  
©2011 Fairchild Semiconductor Corporation  
FDS89161 Rev. 1.4  
1
www.fairchildsemi.com  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 250 μA, VGS = 0 V  
100  
V
ΔBVDSS  
ΔTJ  
Breakdown Voltage Temperature  
Coefficient  
I
D = 250 μA, referenced to 25 °C  
67  
mV/°C  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
VDS = 80 V, VGS = 0 V  
VGS = ±20 V, VDS = 0 V  
1
μA  
±100  
nA  
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VGS = VDS, ID = 250 μA  
2
3
4
V
ΔVGS(th)  
ΔTJ  
Gate to Source Threshold Voltage  
Temperature Coefficient  
I
D = 250 μA, referenced to 25 °C  
-9  
mV/°C  
V
GS = 10 V, ID = 2.7 A  
86  
120  
144  
5
105  
171  
176  
rDS(on)  
gFS  
Static Drain to Source On Resistance  
Forward Transconductance  
VGS = 6 V, ID = 2.1 A  
mΩ  
VGS = 10 V, ID = 2.7 A, TJ = 125 °C  
VDS = 10 V, ID = 2.7 A  
S
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
158  
43  
3
210  
58  
5
pF  
pF  
pF  
Ω
VDS = 50 V, VGS = 0 V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
1
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
4.2  
1.3  
7.3  
1.9  
3
10  
10  
ns  
ns  
ns  
ns  
nC  
VDD = 50 V, ID = 2.7 A,  
V
GS = 10 V, RGEN = 6 Ω  
Turn-Off Delay Time  
Fall Time  
15  
10  
Qg(TOT)  
Qg(TOT)  
Qgs  
Total Gate Charge  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain “Miller” Charge  
VGS = 0 V to 10 V  
VGS = 0 V to 5 V  
4.1  
2.4  
1.7  
0.8  
0.8  
VDD = 50 V,  
D = 2.7 A  
I
nC  
nC  
Qgd  
Drain-Source Diode Characteristics  
V
GS = 0 V, IS = 2.7 A  
(Note 2)  
(Note 2)  
0.85  
0.82  
34  
1.3  
1.2  
54  
VSD  
Source to Drain Diode Forward Voltage  
V
VGS = 0 V, IS = 2 A  
trr  
Reverse Recovery Time  
ns  
IF = 2.7 A, di/dt = 100 A/μs  
Qrr  
Reverse Recovery Charge  
21  
34  
nC  
NOTES:  
2
1. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R  
is guaranteed by design while R is determined by  
θCA  
θJA  
θJC  
the user's board design.  
a) 78°C/W when  
mounted on a 1 in  
pad of 2 oz copper  
b) 135°C/W when  
mounted on a  
minimun pad  
2
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.  
3. Starting T = 25°C, L = 3 mH, I = 3 A, V = 100 V, V = 10 V.  
J
AS  
DD  
GS  
©2011 Fairchild Semiconductor Corporation  
FDS89161 Rev. 1.4  
2
www.fairchildsemi.com  
Typical Characteristics ( N-Channel) TJ = 25°C unless otherwise noted  
15  
12  
9
4
3
2
1
0
VGS = 5 V  
VGS = 10 V  
VGS = 5.5 V  
VGS = 7 V  
VGS = 6 V  
VGS = 6 V  
6
VGS = 5.5 V  
VGS = 5 V  
VGS = 7 V  
VGS = 10 V  
3
PULSE DURATION = 80 μs  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80 μs  
DUTY CYCLE = 0.5% MAX  
0
0
1
2
3
4
0
3
6
9
12  
15  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
ID, DRAIN CURRENT (A)  
Figure 1. On-Region Characteristics  
Figure2. N o r m a l i z e d O n - R e s i s ta n c e  
vs Drain Current and Gate Voltage  
500  
2.0  
PULSE DURATION = 80 μs  
DUTY CYCLE = 0.5% MAX  
ID = 2.7 A  
ID = 2.7 A  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
VGS = 10 V  
400  
300  
200  
100  
0
TJ = 125 oC  
TJ = 25 oC  
-75 -50 -25  
0
25 50 75 100 125 150  
4
5
6
7
8
9
10  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
F ig u re 3. No rmal i zed O n-Re si stan ce  
vs Junction Temperature  
Figure4. On-Resistance vs Gate to  
Source Voltage  
20  
10  
15  
PULSE DURATION = 80 μs  
DUTY CYCLE = 0.5% MAX  
VGS = 0 V  
12  
9
VDS = 5 V  
1
TJ = 150 o  
C
TJ = 25 oC  
TJ = 150 oC  
0.1  
6
TJ = 25 oC  
TJ = -55 oC  
0.01  
0.001  
3
TJ = -55 o  
C
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2
3
4
5
6
7
8
9
VSD, BODY DIODE FORWARD VOLTAGE (V)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure6. Source to Drain Diode  
Forward Voltage vs Source Current  
©2011 Fairchild Semiconductor Corporation  
FDS89161 Rev. 1.4  
3
www.fairchildsemi.com  
Typical Characteristics ( N-Channel) TJ = 25°C unless otherwise noted  
300  
10  
VDD = 25 V  
ID = 2.7 A  
C
iss  
100  
10  
1
8
6
4
2
0
VDD = 50 V  
Coss  
VDD = 65 V  
f = 1 MHz  
= 0 V  
Crss  
V
GS  
0
1
2
3
4
0.1  
1
10  
100  
Q , GATE CHARGE (nC)  
g
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics  
Figure8. C a p a c i t a n c e v s D r a i n  
to Source Voltage  
3
3.0  
2.5  
2.0  
1.5  
1.0  
VGS = 10 V  
2
1
0
TJ = 25 oC  
VGS = 6 V  
TJ = 100 oC  
R
θJA = 78 oC/W  
TJ = 125 oC  
25  
50  
75  
100  
125  
150  
0.01  
0.1  
1
2
TA, Ambient TEMPERATURE (oC)  
tAV, TIME IN AVALANCHE (ms)  
Figure9. U n c l a m p e d I n d u c t i v e  
Switching Capability  
Figure10. Maximum Continuous Drain  
Current vs Ambient Temperature  
20  
10  
700  
100  
SINGLE PULSE  
RθJA = 135 oC/W  
C = 25 oC  
100 us  
T
1 ms  
1
10 ms  
THIS AREA IS  
LIMITED BY rDS(on)  
10  
100 ms  
1 s  
0.1  
SINGLE PULSE  
TJ = MAX RATED  
RθJA = 135 oC/W  
TA = 25 oC  
10 s  
DC  
1
0.01  
0.5  
0.005  
10-4  
10-3  
10-2  
10-1  
1
10  
102  
103  
0.1  
1
10  
100  
400  
t, PULSE WIDTH (sec)  
VDS, DRAIN to SOURCE VOLTAGE (V)  
Figure 11. Forward Bias Safe  
Operating Area  
Figure12. Single Pulse Maximum  
Power Dissipation  
©2011 Fairchild Semiconductor Corporation  
FDS89161 Rev. 1.4  
4
www.fairchildsemi.com  
Typical Characteristics ( N-Channel) TJ = 25°C unless otherwise noted  
2
DUTY CYCLE-DESCENDING ORDER  
1
D = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
P
DM  
t
1
0.01  
t
2
SINGLE PULSE  
RθJA = 135 oC/W  
NOTES:  
DUTY FACTOR: D = t /t  
1
2
PEAK T = P  
J
x Z  
x R  
+ T  
DM  
θJA  
θJA A  
0.001  
10-4  
10-3  
10-2  
10-1  
t, RECTANGULAR PULSE DURATION (sec)  
1
10  
100  
1000  
Figure 13. Junction-to-Ambient Transient Thermal Response Curve  
©2011 Fairchild Semiconductor Corporation  
FDS89161 Rev. 1.4  
5
www.fairchildsemi.com  
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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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