FDY6342L [ONSEMI]

集成式负载开关;
FDY6342L
型号: FDY6342L
厂家: ONSEMI    ONSEMI
描述:

集成式负载开关

开关
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中文:  中文翻译
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FDY6342L  
Integrated Load Switch  
General Description  
This device is particularly suited for compact power management in  
portable electronic equipment where 2.5 V to 8 V input and 0.83 A  
output current capability are needed. This load switch integrates a  
small NChannel power MOSFET (Q1) that drives a large PChannel  
power MOSFET (Q2) in one tiny SC896 package.  
www.onsemi.com  
Features  
Max r  
Max r  
Max r  
Max r  
= 0.5 at V = 4.5 V, I = 0.83 A  
GS D  
DS(on)  
DS(on)  
DS(on)  
DS(on)  
= 0.7 at V = 2.5 V, I = 0.70 A  
GS  
D
= 1.2 at V = 1.8 V, I = 0.43 A  
GS  
D
= 1.8 at V = 1.5 V, I = 0.36 A  
GS  
D
Control MOSFET (Q1) Includes Zener Protection for ESD  
Ruggedness (>4 kV Human Body Model)  
High Performance Trench Technology for Extremely Low r  
DS(on)  
Compact Industry Standard SC896 Surface Mount Package  
This Device is PbFree and is RoHS Compliant  
Applications  
Power Management  
Load Switch  
MOSFET MAXIMUM RATINGS T = 25°C Unless Otherwise Noted  
A
Symbol  
VIN  
Parameter  
Gate to Source Voltage (Q2)  
Gate to Source Voltage (Q1)  
Rating  
8
Units  
6
5
4
V
V
A
VON/OFF  
ILoad  
–0.5 to 8  
0.83  
1
2
3
Load Current  
Continuous (Note 2)  
Pulsed (Note 2)  
1.0  
SOT563  
CASE 419BH  
PD  
Power Dissipation (Note 1a)  
Power Dissipation (Note 1b)  
0.625  
W
0.446  
TJ, TSTG  
Operating and Storage Junction  
Temperature Range  
–55 to +150  
°C  
MARKING DIAGRAM  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
H&2  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Rating  
Units  
°C/W  
RθJA  
Thermal Resistance, Junction to Ambient  
(Note 1a)  
200  
H
&2  
= Device Code (FDY6342L)  
= Date Code (Year & Week)  
RθJA  
Thermal Resistance, Junction to Ambient  
(Note 1b)  
280  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
April, 2019 Rev. 3  
FDY6342L/D  
FDY6342L  
PACKAGE MARKING AND ORDERING INFORMATION  
Device Marking  
Device  
Package  
Reel Size  
7”  
Tape Width  
Quantity  
H
FDY6342L  
SC896  
8 mm  
3000 units  
ELECTRICAL CHARACTERISTICS T = 25°C, Unless Otherwise Noted  
J
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
OFF CHARACTERISTICS  
I
D
= –250 A, V  
= 0 V  
BV  
V
IN  
Breakdown Voltage  
8
V
ON/OFF  
IN  
A  
A  
A  
I
Zero Gate Voltage Drain Current  
Leakage Current, Forward  
Leakage Current, Reverse  
V
IN  
V
IN  
V
IN  
= –6.4 V, V  
= 0 V  
–1  
10  
Load  
ON/OFF  
I
FL  
RL  
= 8 V, V  
= 0 V  
ON/OFF  
I
= –8 V, V  
= 0 V  
–10  
ON/OFF  
ON CHARACTERISTICS  
V
V
V
V
V
= V  
, I = –250 A  
V
Gate Threshold Voltage  
0.65  
0.85  
0.28  
0.35  
0.45  
0.57  
2.9  
1.5  
0.5  
0.7  
1.2  
1.8  
4.0  
5.0  
V
IN  
IN  
IN  
IN  
IN  
ON/OFF D  
ON/OFF(th)  
r
Static Drain to Source On Resistance (Q2)  
Ω
= 4.5 V, I = –0.83 A  
DS(on)  
D
= 2.5 V, I = –0.70 A  
D
= 1.8 V, I = –0.43 A  
D
= 1.5 V, I = –0.36 A  
D
Static Drain to Source On Resistance (Q1)  
V
V
= 4.5 V, I = 0.4 A  
D
IN  
= 2.7 V, I = 0.2 A  
3.5  
IN  
D
DRAINSOURCE DIODE CHARACTERISTICS  
Maximum Continuous Drain to Source Diode Forward Current  
Source to Drain Diode Forward Voltage = 0 V, I = –0.25 A  
I
–0.25  
–1.2  
A
V
S
V
SD  
V
–0.8  
ON/OFF  
S
(Note 2)  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2
1. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR4 material. R  
is guaranteed  
JC  
θ
θ
JA  
by design while R  
is determined by the user’s board design.  
θ
JA  
a) 200°C/W when mounted  
on a 1 in pad of 2 oz copper.  
b) 280°C/W when mounted  
on a minimum pad of 2 oz copper.  
2
2. Pulse Test: Pulse Width < 300 s, Duty cycle < 2.0%.  
FDY6342L Load Switch Application Circuit  
IN  
R1  
OUT  
Q2  
C1  
Q1  
ON/OFF  
LOAD  
R2  
External Component Recommendation:  
For additional inrush current control, R2 and C1 can be added. For more information, see application note AN1030.  
www.onsemi.com  
2
 
FDY6342L  
TYPICAL CHARACTERISTICS T = 25°C, Unless Otherwise Noted  
J
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
0.5  
V
= 1.8 V  
= 1.5 8 V  
V
= 1.5 V  
= 1.5 8 V  
IN  
IN  
V
V
ON/OFF  
ON/OFF  
0.4  
0.3  
0.2  
0.1  
0.0  
PW = 300 s, D 2%  
PW = 300 s, D 2%  
T = 125°C  
J
T = 125°C  
J
T = 25°C  
T = 25°C  
J
J
0.0  
0.2  
0.4  
I (A)  
0.6  
0.8  
1.0  
0.0  
0.2  
0.4  
0.6  
0.8  
I (A)  
L,  
L,  
Figure 1. Conduction Voltage Drop Variation  
with Load Current  
Figure 2. Conduction Voltage Drop Variation  
with Load Current  
0.5  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
V
= 2.5 V  
= 1.5 8 V  
IN  
V
IN  
= 4.5 V  
V
ON/OFF  
V
= 1.5 8 V  
ON/OFF  
0.4  
0.3  
0.2  
0.1  
0.0  
PW = 300 s, D < 2%  
PW = 300 s, D < 2%  
T = 125°C  
T = 125°C  
J
J
T = 25°C  
T = 25°C  
J
J
0.0  
0.4  
0.8  
1.2  
1.6  
0.0  
0.4  
0.8  
I (A)  
1.2  
1.6  
2.0  
I (A)  
L
L
Figure 3. Conduction Voltage Drop Variation  
with Load Current  
Figure 4. Conduction Voltage Drop Variation  
with Load Current  
1.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.8  
0.6  
0.4  
0.2  
0.0  
T = 125°C  
J
T = 125°C  
J
T = 25°C  
T = 25°C  
J
J
I = 0.7 A  
I = 0.83 A  
L
L
V
= 1.5 8 V  
V
= 1.5 8 V  
ON/OFF  
ON/OFF  
PW = 300 s, D 2%  
PW = 300 s, D 2%  
1.0  
1.5 2.0  
2.5  
3.0  
3.5  
4.0  
1.0  
1.5 2.0  
2.5  
3.0  
3.5  
4.0  
V INPUT VOLTAGE (A)  
IN,  
V INPUT VOLTAGE (A)  
IN,  
Figure 5. OnResistance Variaton with Input  
Figure 6. OnResistance Variaton with Input  
Current  
Current  
www.onsemi.com  
3
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT563  
CASE 419BH  
ISSUE O  
DATE 31 AUG 2016  
1.70  
A
1.50  
B
6
1
4
1.42  
1.30  
1.10  
1.70  
1.50  
0.1 C B A  
3
0.30  
0.50  
0.72  
0.50  
0.20  
0.50  
LAND PATTERN  
RECOMMENDATION  
TOP VIEW  
0.60  
0.50  
C
SEATING PLANE  
0.10  
0.00  
0.20  
0.08  
0.05 C  
C
NOTES: UNLESS OTHERWISE SPECIFIED.  
A. REFERENCE TO JEDEC MO293.  
B. ALL DIMENSIONS ARE IN MILLIMETERS.  
C
DOES NOT COMPLY JEDEC STANDARD VALUE.  
0.30  
0.10  
0.46  
0.20  
C
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR PROTRUSION.  
E. DIMENSION AND TOLERANCE AS PER ASME  
Y14.52009.  
F. LANDPATTERN RECOMMENDATION GENERATED  
WITH IPC LANDPATTERN GENERATOR  
0.31  
0.15  
0.10  
0.05  
M
M
C A B  
C
BOTTOM VIEW  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13790G  
SOT563  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
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information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
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