FDZ2040L [ONSEMI]
集成式负载开关;
| 型号： | FDZ2040L |
| 厂家： | 
ONSEMI |
| 描述： | 集成式负载开关 开关 |
| 文件： | 总13页 (文件大小：1331K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
June 2013
FDZ2040L
Integrated Load Switch
Features
General Description
This device is particularly suited for compact power
management in portable applications where 1.6 V to 4 V
input and 1.2 A output current capability are needed.
This load switch integrates a level-shifting function that
drives a P-channel power MOSFET in the very small 0.8
X 0.8 X 0.5 mm3 WL-CSP package.
.
Optimized for Low-Voltage Core ICs in
Portable Systems
.
Very Small Package Dimension: WL-CSP
0.8 X 0.8 X 0.5 mm3
.
.
.
.
.
.
Current = 1.2 A, VIN max. = 4 V
Current = 2 A, VIN max. = 4 V (Pulsed)
RDS(ON) = 80 mΩ at VON = 0 V, VIN = 4 V
RDS(ON) = 85 mΩ at VON = 0 V, VIN = 3.6 V
RDS(ON) = 90 mΩ at VON = 0 V, VIN = 3 V
RoHS Compliant
Applications
.
.
Load Switch
Power Management in Portable Applications
Ordering Information
Part
Number
Device
Marking
Ball
Operating
Packing
Method
Switch
Package
Pitch Temperature Range
80 mΩ,
P-Channel
MOSFET
0.8x0.8x0.5 mm3
WL-CSP
Tape and
Reel
FDZ2040L
ZL
0.4 mm
-25 to 75°C
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
Application Diagram and Block Diagram
Figure 1. Block Diagram and Typical Application Pin Configuration
Figure 2. Pin Assignment
Pin Definitions
Pin #
A1
Name
VIN
Description
Supply Input: Input to the load switch
Switch Output: Output of the load switch
ON/OFF Control Input, Active LOW
Ground
A2
VOUT
ON
B1
B2
GND
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
2
Absolute Maximum Ratings
Parameter
Min.
Max.
4.2
1.2
2
Unit
V
VIN, VOUT, ON to GND
-0.3
IOUT – Load Current (Continuous)(1a)
IOUT – Load Current (Pulsed)(2)
Power Dissipation @ TA = 25°C(1a)
Operating Temperature Range
Storage Temperature
A
A
0.9
105
150
W
-40
-65
8
°C
°C
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Electrostatic Discharge Capability
kV
2
Thermal Characteristics
Parameter
Min.
Max.
Unit
Thermal Resistance, Junction to Ambient(1a)
117
°C/W
Recommended Operating Conditions
Parameter
Min.
1.6
Max.
4.0
Unit
V
VIN
Ambient Operating Temperature, TA
-25
75
°C
Notes:
1. RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference
is defined as the solder mounting surface of the drain pins. RӨJC is guaranteed by design while RӨJA is
determined by the user’s board design.
2. Pulse Test: Pulse Width < 300 μs, Duty Cycle < 2.0%.
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
3
Electrical Characteristics
TJ = 25 °C unless otherwise noted.
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
VIN
Operation Voltage
1.6
4.0
V
VIN = 1.6 V, Ramp-Down VON from 1 V
to 0 V, VOUT LOW to HIGH, TJ = -25 to
75°C
0.35
V
VIL
ON Input Logic LOW Voltage
ON Input Logic HIGH Voltage
VIN = 4 V, Ramp-Down VON from 1 V to
0 V, VOUT LOW to HIGH, TJ = -25 to
75°C
0.35
V
V
V
VIN = 1.6 V, Ramp-Up VON from 0 V to
1 V, VOUT HIGH to LOW, TJ = -25 to
75°C
1.35
1.35
VIH
VIN = 4 V, Ramp-Up VON from 0 V to
1 V, VOUT HIGH to LOW, TJ = -25 to
75°C
VIN = 3 V, VON = 0.35 V, IOUT = 0 A,
TJ = -25 to 75°C
IQ
Quiescent Current
Off Supply Current
Off Switch Current
1.55
2.4
2.50
6.5
µA
µA
VIN = 3 V, VON = 1.3 V, IOUT = 0 A,
TJ = -25 to 75°C
IQ_off
ISD_off
VIN = 3 V, VON = 1.3 V, VOUT = 0 V,
TJ = -25 to 75°C
0.1
1.6
1.6
3.5
2.3
4.0
µA
µA
µA
VIN = 3 V, VON = Floating, IOUT = 0 A
IQ_off
Off Supply Current with ON
Pin Floating
VIN = 3 V, VON = Floating, IOUT = 0 A,
TJ = -25 to 75°C
(VON float)
RPULL-DOWN Output Pull-Down Resistance VIN=3 V, IOUT=10 mA
VIN = 1.6 V, VON = 0 V, IOUT = 300m A
22
68
50
48
120
90
VIN = 3 V, VON = 0 V, IOUT = 300m A
VIN = 3.6 V, VON = 0 V, IOUT = 300 mA
RDS(ON)
On Resistance
m
85
VIN = 4 V, VON = 0 V, IOUT = 300 mA,
TJ = -25 to 75°C
47
80
CV-ON(INP) ON Input Capacitance
ION(PULL-UP) ON Pull-Up Current
TJ = -25 to 75°C
5
pF
µA
VIN = 3 V, VON = 0 V, TJ = -25 to 75°C
0.30
0.76
1.20
Switching Characteristics
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
Turn-On Time (VON 50% to
VOUT 90%)
ton
45
35
10
60
25
35
150
100
50
ns
ns
ns
ns
ns
Turn-On Delay (VON 50% to
VOUT 10%)
tdon
trise
toff
Turn-On Rise Time (VOUT
10% to 90%)
VIN=3 V, VON = 0 V as Logic LOW and
1.3 V as Logic HIGH, COUT = 1 nF, RL =
30 Ω, TJ = -25 to 75°C
Turn-Off Time (VON 50% to
VOUT 10%)
150
100
Turn-Off Delay (VON 50% to
VOUT 90%)
tdoff
tfall
Turn-Off Fall Time (VOUT 90%
to 10%)
65
50
ns
ns
tdon – tdoff Turn-On Turn-Off Delay Delta
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
4
Typical Performance Characteristics
2.50
2.5
2.0
1.5
1.0
0.5
0.0
VIN = 3V
VON = 0.35V
IOUT = 0A
TA = 25(oC)
2.25
2.00
1.75
1.50
1.25
1.00
-55
-35
-15
5
25
45
65
85
105
125
1
1.5
2
2.5
3
3.5
4
4.5
Supply Voltage, VIN (V)
Junction Temperature, TJ (oC)
Figure 3.Quiescent Current vs. Temperature
Figure 4. Quiescent Current vs. Supply Voltage
15
4.0
VIN = 3V
TA = 25(oC)
3.5
VON = 1.3V
IOUT = 0A
13
3.0
2.5
2.0
1.5
1.0
0.5
0.0
11
9
7
5
3
1
-55
-35
-15
5
25
45
65
85
105
125
1
1.5
2
2.5
3
3.5
4
4.5
Supply Voltage, VIN (V)
Junction Temperature, TJ (oC)
Figure 5.Off Supply Current vs. Temperature
Figure 6. Off Supply Current vs. Supply Voltage
2.5
15
VIN = 3V
VON = float
IOUT = 0A
TA = 25(oC)
13
11
9
2.0
1.5
1.0
0.5
0.0
7
5
3
1
-55
-35
-15
5
25
45
65
85
105
125
1
1.5
2
2.5
3
3.5
4
4.5
Junction Temperature, TJ (oC)
Supply Voltage, VIN (V)
Figure 7. Off Supply Current (VON Float)
Figure 8. Off Supply Current (VON Float) vs.
vs. Temperature
Supply Voltage
© 2012 Fairchild Semiconductor Corporation
FDZ2040L • Rev. B3
www.fairchildsemi.com
5
Typical Performance Characteristics (Continued)
0.0
-0.3
-0.6
-0.9
-1.2
-1.5
0.0
TA = 25(oC)
VIN = 3V
VON = 0V
IOUT = 0A
-0.3
-0.6
-0.9
-1.2
-1.5
-55
-35
-15
5
25
45
65
85
105
125
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Junction Temperature, TJ (oC)
Supply Voltage, VIN (V)
Figure 9. ON Pin Pull-Up Current vs. Temperature
Figure 10. ON Pin Pull-Up Current vs.
Supply Voltage
0.70
0.65
0.60
0.55
0.50
0.70
TA = 25(oC)
VIN = 3V
0.65
0.60
0.55
0.50
-55
-35
-15
5
25
45
65
85
105
125
Junction Temperature, TJ (oC)
1
1.5
2
2.5
3
3.5
4
4.5
Supply Voltage, VIN (V)
Figure 11. ON Pin Logic HIGH Voltage
Figure 12. ON Pin Logic HIGH Voltage vs.
vs. Temperature
Supply Voltage
0.70
0.65
0.60
0.55
0.50
0.70
VIN = 3V
TA = 25(oC)
0.65
0.60
0.55
0.50
1
1.5
2
2.5
3
3.5
4
4.5
-55
-35
-15
5
25
45
65
85
105
125
Junction Temperature, TJ (oC)
Supply Voltage, VIN (V)
Figure 13. ON Pin Logic LOW Voltage
Figure 14. ON Pin Logic LOW Voltage vs.
vs. Temperature
Supply Voltage
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
6
Typical Performance Characteristics (Continued)
35
35
30
25
20
15
10
TA = 25(oC)
VIN = 3V
30
25
20
15
10
-55
-35
-15
5
25
45
65
85
105
125
1
1.5
2
2.5
3
3.5
4
4.5
Junction Temperature, TJ (oC)
Supply Voltage, VIN (V)
Figure 15. Output Pull-Down Resistance
Figure 16. Output Pull-Down Resistance vs.
vs. Temperature
Supply Voltage
80
70
VIN = 3V
IOUT = 300mA
75
70
65
60
55
50
45
40
35
30
TA = 25(oC)
IOUT = 300mA
65
60
55
50
45
40
35
30
1
1.5
2
2.5
3
3.5
4
4.5
-55
-35
-15
5
25
45
65
85
105
125
Supply Voltage, VIN (V)
Junction Temperature, TJ (oC)
Figure 17. Static Drain-to-Source ON Resistance
Figure 18. Static Drain-to-Source ON Resistance
vs. Temperature
vs. Supply Voltage
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
7
Typical Performance Characteristics (Continued)
VIN = 3.3 V, VON = 0 V, CIN = 1 µF, COUT = 1 nF, RL = 30 Ω
Figure 19. tON Response
VIN = 3.3 V, VON = 0 V, CIN = 1 µF, COUT = 1 nF, RL = 30 Ω
Figure 20. tOFF Response
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
8
Operation Description
The FDZ2040L is a low-RDS(ON) P-channel load switch packaged in space-saving 0.8 x 0.8 WL-CSP.
The core of the device is an 80mΩ P-channel MOSFET and capable of functioning over a wide input operating range
of 1.6 V-4 V.
Applications Information
Figure 21. Typical Application
Input Capacitor
To reduce device inrush current effect, a 0.1 µF ceramic capacitor, CIN is recommended close to the VIN pin. A higher
value of CIN can be used to further reduce the voltage drop experienced as the switch is turned on into a large
capacitive load.
Output Capacitor
FDZ2040L switch works without an output capacitor. If parasitic board inductance forces VOUT below GND when
switching off, a 1 nF capacitor, COUT, should be placed between VOUT and GND.
Note:
3. The intrinsic diode for P-channel load switch would conduct if VOUT is greater than VIN, by a diode drop.
Evaluation Board Layout
Figure 22. Top View
Figure 23. Bottom View
© 2012 Fairchild Semiconductor Corporation
FDZ2040L • Rev. B3
www.fairchildsemi.com
9
Physical Dimensions
F
0.03 C
E
A
2X
B
D
0.40
A1
Ø0.20
Cu Pad
0.40
BALL A1
Ø0.30
INDEX AREA
0.03 C
Solder Mask
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.292±0.018
0.208±0.021
0.539
0.461
E
0.05 C
C
SEATING PLANE
D
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
0.005
C A B
Ø0.260±0.020
4X
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
0.40
B
A
(Y)±0.018
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
40
F
1 2
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
(X)±0.018
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
BOTTOM VIEW
G. DRAWING FILNAME: MKT-UC004AFrev1.
Figure 24. 4 Ball, WLCSP, 2 X 2 Array, 0.4 mm Pitch, 250 µm Ball
Product-Specific Dimensions
Product
D
E
X
Y
FDZ2040L
0.8 ± 0.03 mm
0.8 ± 0.03 mm
0.21 mm
0.21 mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
10
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDZ2040L • Rev. B3
11
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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