FFSD1065B-F085 [ONSEMI]

汽车碳化硅 (SiC) 肖特基二极管,650 V;
FFSD1065B-F085
型号: FFSD1065B-F085
厂家: ONSEMI    ONSEMI
描述:

汽车碳化硅 (SiC) 肖特基二极管,650 V

肖特基二极管
文件: 总6页 (文件大小:410K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
Schottky Diode – EliteSiC,  
10 A, 650 V, D2, DPAK  
1, 3 Cathode  
2 Anode  
Schottky Diode  
FFSD1065B-F085  
3
Description  
Silicon Carbide (SiC) Schottky Diodes use a completely new  
technology that provides superior switching performance and higher  
reliability compared to Silicon. No reverse recovery current,  
temperature independent switching characteristics, and excellent  
thermal performance sets Silicon Carbide as the next generation of  
power semiconductor. System benefits include highest efficiency,  
faster operating frequency, increased power density, reduced EMI, and  
reduced system size & cost.  
1
2
DPAK  
CASE 369AS  
MARKING DIAGRAM  
Features  
Max Junction Temperature 175°C  
Avalanche Rated 49 mJ  
High Surge Current Capacity  
Positive Temperature Coefficient  
Ease of Paralleling  
FFS  
D1065B  
AYWWZZ  
No Reverse Recovery / No Forward Recovery  
AECQ101 Qualified and PPAP Capable  
FFSD1065B  
A
Y
WW  
ZZ  
= Specific Device Code  
= Assembly Location  
= Year  
= Work Week  
= Assembly Lot Code  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
Applications  
Automotive HEVEV Onboard Chargers  
Automotive HEVEV DCDC Converters  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
February, 2023 Rev. 6  
FFSD1065BF085/D  
FFSD1065BF085  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Value  
650  
49  
Unit  
V
V
RRM  
Peak Repetitive Reverse Voltage  
E
AS  
Single Pulse Avalanche Energy (Note 1)  
Continuous Rectified Forward Current @ T < 150°C  
mJ  
A
I
F
10  
C
Continuous Rectified Forward Current @ T < 135°C  
13.5  
650  
570  
45  
C
I
Non-Repetitive Peak Forward Surge Current  
A
A
A
T
= 25°C, 10 ms  
= 150°C, 10 ms  
F, Max  
C
C
T
I
Non-Repetitive Forward Surge Current  
C
Half-Sine Pulse, t = 8.3 ms  
p
F,SM  
T
= 25°C  
Ptot  
Power Dissipation  
T
T
= 25°C  
98  
16  
W
W
C
= 150°C  
C
T , T  
Operating and Storage Temperature Range  
55 to +175  
60  
°C  
J
STG  
TO247 Mounting Torque, M3 Screw  
Ncm  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. E of 49 mJ is based on starting T = 25°C, L = 0.5 mH, I = 14 A, V = 50 V.  
AS  
J
AS  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
Unit  
R
Thermal Resistance, Junction to Case, Max  
1.53  
°C/W  
q
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Forward Voltage  
Test Condition  
I = 10 A, T = 25°C  
Min  
Typ  
1.38  
1.6  
1.72  
0.5  
1
Max  
1.7  
2.0  
2.4  
40  
80  
160  
Unit  
V
F
V
F
C
I = 10 A, T = 125°C  
F
C
I = 10 A, T = 175°C  
F
C
I
R
Reverse Current  
V
R
V
R
V
R
= 650 V, T = 25°C  
mA  
C
= 650 V, T = 125°C  
C
= 650 V, T = 175°C  
2
C
Q
Total Capacitive Charge  
Total Capacitance  
V = 400 V  
25  
nC  
pF  
C
C
V
R
V
R
V
R
= 1 V, f = 100 kHz  
= 300 V, f = 100 kHz  
= 600 V, f = 100 kHz  
424  
39  
35  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Shipping*  
FFSD1065BF085  
FFSD1065B  
DPAK  
2500 / Tape & Reel  
(Pb-Free / Halogen Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D  
www.onsemi.com  
2
 
FFSD1065BF085  
TYPICAL CHARACTERISTICS  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
105  
106  
107  
108  
109  
20  
16  
12  
8
T
= 175 o  
C
J
T
= 125 oC  
TJ = 25 o  
J = 75 o  
TJ = 125 o  
C
J
T
= 75 o  
C
J
T
C
4
T
J
= 25 o  
C
C
TJ = 175 o  
C
= 55oC  
T
J = 55oC  
T
J
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
200  
300  
400  
500  
600 650  
VR, REVERSE VOLTAGE (V)  
V , FORWARD VOLTAGE (V)  
F
Figure 1. Forward Characteristics  
Figure 2. Reverse Characteristics  
100  
80  
60  
40  
20  
0
120  
100 D = 0.1  
80  
D = 0.2  
60  
40  
D = 0.3  
D = 0.5  
20 D = 0.7  
D = 1  
0
25  
25  
50  
75  
100  
125  
150  
175  
50  
75  
100  
125  
150  
175  
C, CASE TEMPERATURE (oC)  
o
T
C, CASE TEMPERATURE (C)  
T
Figure 3. Current Derating  
Figure 4. Power Derating  
40  
30  
20  
10  
0
1000  
100  
10  
0
100  
200  
300  
400  
500 600 650  
0.1  
1
10  
100  
650  
VR, REVERSE VOLTAGE (V)  
VR, REVERSE VOLTAGE (V)  
Figure 6. Capacitance vs. Reverse Voltage  
Figure 5. Capacitive Charge vs. Reverse  
Voltage  
www.onsemi.com  
3
FFSD1065BF085  
TYPICAL CHARACTERISTICS (CONTINUED)  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
10  
8
6
4
2
0
0
100  
200  
300  
400  
500  
600 650  
VR, REVERSE VOLTAGE (V)  
Figure 7. Capacitance Stored Energy  
2
1
DUTY CYCLEDESCENDING ORDER  
0.1  
0.01  
PDM  
D=0.5  
D=0.2  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
t1  
t2  
NOTES:  
Z
q
JC  
(t) = r(t) x R  
q
JC  
= 1.53 5C/W  
1E3  
R
q
JC  
Peak T = P  
Duty Cycle, D = t /t  
1
x Z (t) + T  
q
JC C  
J
DM  
SINGLE PULSE  
105  
2
1E4  
106  
104  
t, RECTANGULAR PULSE DURATION (sec)  
103  
102  
101  
1
Figure 8. Junction-to-Case Transient Thermal Response Curve  
TEST CIRCUIT AND WAVEFORMS  
L = 0.5 mH  
R < 0.1 W  
V
DD  
= 50 V  
EAVL = 1/2LI2 [V  
/ (V V )]  
R(AVL) DD  
R(AVL)  
Q1 = IGBT (BV  
> DUT V  
)
CES  
R(AVL)  
V
AVL  
L
R
+
V
CURRENT  
SENSE  
DD  
I
L
I
L
Q1  
I V  
DUT  
V
DD  
t
0
t
1
t
2
t
Figure 9. Unclamped Inductive Switching Test Circuit & Waveform  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DPAK3 (TO252 3 LD)  
CASE 369AS  
ISSUE A  
DATE 28 SEP 2022  
GENERIC  
MARKING DIAGRAM*  
XXXXXX  
XXXXXX  
AYWWZZ  
XXXX = Specific Device Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ  
= Assembly Lot Code  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
98AON13810G  
DPAK3 (TO252 3 LD)  
PAGE 1 OF 1  
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