FGA6530WDF [ONSEMI]
650 V、30 A 场截止沟道 IGBT;型号: | FGA6530WDF |
厂家: | ONSEMI |
描述: | 650 V、30 A 场截止沟道 IGBT 双极性晶体管 |
文件: | 总10页 (文件大小:496K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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August 2015
FGA6530WDF
650 V, 30 A Field Stop Trench IGBT
Features
General Description
•
•
•
•
•
•
•
•
•
Maximum Junction Temperature : TJ = 175oC
Positive Temperaure Co-efficient for Easy Parallel Operating
High Current Capability
Using novel field stop IGBT technology, Fairchild’s new series of
field stop 3rd generation IGBTs offer the optimum performance
for welder and industial applications where low conduction and
switching losses are essential.
Low Saturation Voltage: VCE(sat) = 1.8 V(Typ.) @ IC = 30 A
100% of the Parts Tested for ILM(1)
High Input Impedance
Applications
•
Welder and Industrial Application
Fast Switching
•
Power Factor Correction
Tighten Parameter Distribution
RoHS Compliant
C
G
G
C
TO-3PN
E
E
Absolute Maximum Ratings
T
= 25°C unless otherwise noted
C
Symbol
Description
FGA6530WDF
Unit
V
VCES
Collector to Emitter Voltage
650
Gate to Emitter Voltage
20
V
VGES
Transient Gate to Emitter Voltage
Collector Current
30
V
@ TC = 25oC
@ TC = 100oC
@ TC = 25oC
60
A
IC
Collector Current
30
A
ILM (1)
ICM (2)
Pulsed Collector Current
Pulsed Collector Current
Diode Forward Current
90
A
90
A
@ TC = 25oC
@ TC = 100oC
30
15
A
IF
Diode Forward Current
A
IFM
PD
Pulsed Diode Maximum Forward Current
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature Range
60
A
@ TC = 25oC
@ TC = 100oC
176
W
W
oC
oC
88
TJ
-55 to +175
-55 to +175
Tstg
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
oC
TL
300
Notes:
1. V = 400 V, V = 15 V, I = 90 A, R = 55.9 Inductive Load
CC
GE
C
G
2. Repetitive rating: Pulse width limited by max. junction temperature
©2015 Fairchild Semiconductor Corporation
FGA6530WDF Rev. 1.1
1
www.fairchildsemi.com
Thermal Characteristics
Symbol
Parameter
FGA6530WDF
Unit
oC/W
oC/W
oC/W
RJC(IGBT)
RJC(Diode)
RJA
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
0.85
3.5
40
Package Marking and Ordering Information
Part Number
Top Mark
Package Packing Method Reel Size Tape Width Quantity
FGA6530WDF
FGA6530WDF
TO-3PN
Tube
-
-
30
Electrical Characteristics of the IGBT
T
= 25°C unless otherwise noted
C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage VGE = 0 V, IC = 1 mA
Temperature Coefficient of Breakdown
650
-
-
-
-
V
BVCES
TJ
V/oC
I
C = 1 mA, Reference to 25oC
0.52
Voltage
ICES
IGES
Collector Cut-Off Current
G-E Leakage Current
VCE = VCES, VGE = 0 V
VGE = VGES, VCE = 0 V
-
-
-
-
250
A
±400
nA
On Characteristics
VGE(th)
G-E Threshold Voltage
IC = 30 mA, VCE = VGE
IC = 30 A, VGE = 15 V
IC = 30 A, VGE = 15 V,
4.1
-
5.6
1.8
7.6
2.3
V
V
VCE(sat)
Collector to Emitter Saturation Voltage
-
2.4
-
V
T
C = 175oC
Dynamic Characteristics
Cies
Coes
Cres
Input Capacitance
-
-
-
1072
36
-
-
-
pF
pF
pF
V
CE = 30 V VGE = 0 V,
,
Output Capacitance
f = 1MHz
Reverse Transfer Capacitance
13
Switching Characteristics
td(on) Turn-On Delay Time
tr
td(off)
tf
-
-
-
-
-
-
-
-
-
-
-
-
-
-
12
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
uJ
uJ
uJ
ns
ns
ns
ns
uJ
uJ
uJ
Rise Time
19.2
42.4
7.2
Turn-Off Delay Time
Fall Time
VCC = 400 V, IC = 30 A,
R
G = 6 , VGE = 15 V,
Inductive Load, TC = 25oC
Eon
Eoff
Ets
td(on)
tr
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
960
162
1122
12.8
27.2
46.4
12.8
1430
310
td(off)
tf
Turn-Off Delay Time
Fall Time
VCC = 400 V, IC = 30 A,
R
G = 6 , VGE = 15 V,
Inductive Load, TC = 175oC
Eon
Eoff
Ets
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
1740
©2015 Fairchild Semiconductor Corporation
FGA6530WDF Rev. 1.1
2
www.fairchildsemi.com
Electrical Characteristics of the IGBT (Continued)
Symbol
Qg
Parameter
Test Conditions
Min.
Typ.
37.4
7.2
Max Unit
Total Gate Charge
-
-
-
-
-
-
nC
nC
nC
V
V
CE = 400 V, IC = 30 A,
GE = 15 V
Qge
Gate to Emitter Charge
Gate to Collector Charge
Qgc
15
Electrical Characteristics of the Diode
T = 25°C unless otherwise noted
C
Symbol
Parameter
Test Conditions
Min.
Typ.
1.7
Max Unit
T
T
T
T
C = 25oC
C = 175oC
C = 175oC
C = 25oC
C = 175oC
C = 25oC
-
-
-
-
-
-
-
2.6
VFM
Diode Forward Voltage
IF = 15 A
V
1.62
76
-
Erec
trr
Reverse Recovery Energy
-
-
-
-
-
uJ
ns
81
Diode Reverse Recovery Time
IF = 15 A, dIF/dt = 200 A/s
T
T
257
254
1189
Qrr
Diode Reverse Recovery Charge
nC
TC = 175oC
©2015 Fairchild Semiconductor Corporation
FGA6530WDF Rev. 1.1
3
www.fairchildsemi.com
Typical Performance Characteristics
Figure 1. Typical Output Characteristics
Figure 2. Typical Output Characteristics
90
90
TC = 25oC
20V
TC = 175oC
20V
15V
15V
10V
75
60
45
30
15
0
75
12V
10V
12V
60
45
VGE = 8V
VGE = 8V
30
15
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
Figure 3. Typical Saturation Voltage
Characteristics
Figure 4. Saturation Voltage vs. Case
Temperature at Variant Current Level
4
3
2
1
90
Common Emitter
VGE = 15V
Common Emitter
VGE = 15V
TC = 25oC
TC = 175oC
75
60
60A
30A
45
30
15
0
IC = 15A
-100
-50
0
50
100
150
200
0
1
2
3
4
5
Collector-Emitter Case Temperature, TC [oC]
Collector-Emitter Voltage, VCE [V]
Figure 5. Saturation Voltage vs. V
Figure 6. Saturation Voltage vs. V
GE
GE
20
20
Common Emitter
TC = 25oC
Common Emitter
TC = 175oC
16
12
8
16
12
8
30A
60A
30A
60A
IC = 15A
IC = 15A
4
4
0
0
4
8
12
16
20
4
8
12
16
20
Gate-Emitter Voltage, VGE [V]
Gate-Emitter Voltage, VGE [V]
©2015 Fairchild Semiconductor Corporation
FGA6530WDF Rev. 1.1
4
www.fairchildsemi.com
Typical Performance Characteristics
Figure 7. Capacitance Characteristics
Figure 8. Gate charge Characteristics
15
10000
Common Emitter
TC = 25oC
12
300V
Cies
1000
VCC = 200V
400V
9
6
3
0
100
10
Coes
Common Emitter
VGE = 0V, f = 1MHz
TC = 25oC
Cres
0
8
16
24
32
40
1
10
Collector-Emitter Voltage, VCE [V]
30
Gate Charge, Qg [nC]
Figure 9. Turn-on Characteristics vs.
Gate Resistance
Figure 10. Turn-off Characteristics vs.
Gate Resistance
1000
100
tr
td(off)
100
tf
Common Emitter
10
Common Emitter
td(on)
VCC = 400V, VGE = 15V
IC = 30A
VCC = 400V, VGE = 15V
IC = 30A
10
5
TC = 25oC
TC = 175oC
TC = 25oC
TC = 175oC
1
0
10
20
30
40
50
60
70
80
0
10
20
30
40
50
60
70
80
Gate Resistance, RG []
Gate Resistance, RG []
Figure 11. Switching Loss vs.
Gate Resistance
Figure 12. Turn-on Characteristics vs.
Collector Current
300
5000
100
tr
Eon
1000
10
td(on)
Common Emitter
VCC = 400V, VGE = 15V
Eoff
Common Emitter
VGE = 15V, RG = 6
TC = 25oC
TC = 175oC
IC = 30A
TC = 25oC
TC = 175oC
100
50
1
0
15
30
45
60
75
90
0
10
20
30
40
50
60
70
80
Collector Current, IC [A]
Gate Resistance, RG []
©2015 Fairchild Semiconductor Corporation
FGA6530WDF Rev. 1.1
5
www.fairchildsemi.com
Typical Performance Characteristics
Figure 13. Turn-off Characteristics vs.
Collector Current
Figure 14. Switching Loss vs.
Collector Current
10000
300
Eon
100
td(off)
1000
100
10
Eoff
tf
10
Common Emitter
VGE = 15V, RG = 6
TC = 25oC
TC = 175oC
Common Emitter
VGE = 15V, RG = 6
TC = 25oC
TC = 175oC
1
0
15
30
45
60
75
90
0
15
30
45
60
75
90
Collector Current, IC [A]
Collector Current, IC [A]
Figure 15. Load Current Vs. Frequency
Figure 16. SOA Characteristic s
100
150
Square Wave
TJ <= 175oC, D = 0.5, VCE = 400V
10s
VGE = 15/0V, RG = 6
100s
10
100
1ms
TC = 25oC
10 ms
DC
TC = 75oC
1
50
TC = 100oC
*Notes:
1. TC = 25oC
2. TJ = 175oC
3. Single Pulse
0.1
0
1k
1
10
100
1000
10k
100k
1M
Collector-Emitter Voltage, VCE [V]
Switching Frequency, f[Hz]
Figure 17. Forward Characteristics
Figure 18. Reverse Recovery Current
12
90
di/dt = 200A/s
9
di/dt = 200A/s
TC = 175oC
10
6
di/dt = 100A/s
TC = 75oC
TC = 25oC
di/dt = 100A/s
3
0
TC = 25oC
TC = 25oC
TC = 75oC
TC = 175oC
4
TC = 175oC ---
1
0
10
20
30
40
50
60
70
80
0
1
2
3
5
Forward Voltage, VF [V]
Forward Current, IF [A]
©2015 Fairchild Semiconductor Corporation
FGA6530WDF Rev. 1.1
6
www.fairchildsemi.com
Typical Performance Characteristics
Figure 19. Reverse Recovery Time
Figure 20. Stored Charge
500
2500
TC = 25oC
TC = 25oC
TC = 175oC - - -
400
TC = 175oC - - -
2000
300
1500
di/dt = 100A/s
di/dt = 200A/s
di/dt = 200A/s
200
1000
di/dt = 100A/s
100
0
500
0
0
10
20
30
40
50
60
70
80
0
10
20
30
40
50
60
70
80
Forward Current, IF [A]
Forward Current, IF [A]
Figure 21.Transient Thermal Impedance of IGBT
1
0.5
0.2
0.1
0.1
0.05
PDM
0.02
0.01
t1
t2
Duty Factor, D = t1/t2
single pulse
Peak Tj = Pdm x Zthjc + TC
0.01
10-5
10-4
10-3
10-2
10-1 100
Rectangular Pulse Duration [sec]
Figure 22.Transient Thermal Impedance of Diode
4
1
0.5
0.2
0.1
0.05
0.02
0.1
PDM
0.01
t1
t2
single pulse
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
0.01
10-5
10-4
10-3
10-2
10-1
100
Rectangular Pulse Duration [sec]
©2015 Fairchild Semiconductor Corporation
FGA6530WDF Rev. 1.1
7
www.fairchildsemi.com
5.00
4.60
13.80
13.40
1.65
1.45
3.30
3.10
16.20
15.40
5.20
4.80
R0.50
3°
16.96
16.56
20.10
19.70
18.90
18.50
7.20
6.80
3°
4°
1
3
2.00
1.60
3.70
3.30
1.85
2.60
2.20
20.30
19.70
2.20
1.80
3.20
2.80
1.20
0.80
M
0.55
0.75
0.55
5.45
5.45
NOTES: UNLESS OTHERW ISE SPECIFIED
A) THIS PACKAGE CONFORMS TO EIAJ
SC-65 PACKAGING STANDARD.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSION AND TOLERANCING PER
ASME14.5-2009.
D) DIMENSIONS ARE EXCLUSSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSSIONS.
E) DRAW ING FILE NAME: TO3PN03AREV2.
F) FAIRCHILD SEMICONDUCTOR.
R0.50
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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