FIN1028MX_技术文档

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Is Now

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November 2018

FIN1028 — 3.3V LVDS 2-Bit High-Speed Differential

Receiver

Features

Description

This dual receiver is designed for high-speed

interconnects utilizing Low Voltage Differential Signaling

(LVDS) technology. The receiver translates LVDS

levels, with a typical differential input threshold of

100mV, to LVTTL signal levels. LVDS provides low EMI

at ultra-low power dissipation, even at high frequencies.

This device is ideal for high-speed transfer of clock and

data signals.

Greater than 400Mbs Data Rate

Power Supply Operation: 3.3V

Maximum Differential Pulse Skew: 0.4ns

Maximum Propagation Delay: 2.5ns

Low-Power Dissipation

Power-Off Protection

The FIN1028 can be paired with its companion driver,

the FIN1027, or any other LVDS driver.

Fail-Safe Protection for Open-Circuit, Shorted, and

Terminated Conditions

Meets or Exceeds the TIA/EIA-644 LVDS Standard

Flow-through Pinout Simplifies PCB Layout

Ordering Information

Operating

Temperature Range

Packing

Part Number

Package

Method

Eco Status

RoHS

8-Lead Small Outline Package (SOIC)

Tube

FIN1028M

-40 to +85°C

JEDEC MS-012, 0.150 inch Narrow

8-Lead Small Outline Package (SOIC)

Tape and Reel

FIN1028MX

-40 to +85°C

RoHS

JEDEC MS-012, 0.150 inch Narrow

For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.

www.onsemi.com

FI1028 • Rev. 2

Pin Configuration

Figure 1. SOIC Pin Assignments (Top View)

Pin Definitions

Pin #

Name

R_IN1-

Description

1

2

3

4

5

6

7

8

Inverting LVDS Input

Non-Inverting LVDS Input

Inverting LVDS Input

Ground

R_IN1+

R_IN2+

R_IN2-

GND

R_OUT2

R_OUT1

V_CC

LVTTL Data Output

Power Supply

Function Table

Inputs

Outputs

R_IN+

LOW

HIGH

R_IN-

R_OUT

LOW

HIGH

LOW

Fail-Safe Conditions⁽¹⁾

Note:

1. Fail-safe=open, shorted, terminated.

www.onsemi.com

FIN1028 • Rev. 2

2

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device

reliability. The absolute maximum ratings are stress ratings only.

Symbol

V_CC

Parameter

Supply Voltage

Min.

-0.5

Max.

4.6

Unit

V

R_INx+, R_INx-

R_OUTx

I_O

DC Input Voltage

4.7

V

DC Output Voltage

6.0

V

DC Output Current

16

mA

°C

T_STG

Storage Temperature Range

Maximum Junction Temperature

Lead Temperature, Soldering 10 Seconds

Human Body Model, JESD22-A114

Machine Model, JESD22-A115

-65

+150

+260

≥6500

≥300

T_J

T_L

ESD

V

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol

V_CC

Parameter

Min.

3.0

Max.

3.6

Unit

V

Supply Voltage

Input Voltage

V_IN

0

V_CC

V

Magnitude of Differential Voltage

Common-Mode Input Voltage

Operating Temperature

100

0.05

-40

V_CC

mV

V

⏐V_ID⏐

V_IC

2.35

+85

T_A

°C

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FIN1028 • Rev. 2

3

DC Electrical Characteristics

Typical values are at T_A=25°C and with V_CC=3.3V. Over-supply voltage and operating temperature ranges, unless

otherwise noted.

Symbol

V_TH

Parameter

Conditions

Min.

Typ. Max. Units

Differential Input Threshold HIGH Figure 2, Table 1

100

mV

µA

V_TL

Differential Input Threshold LOW

Input Current

Figure 2, Table 1

V_IN=0V or V_CC

-100

I_IN

±20

I_I(OFF)

Power-off Input Current

V_CC=0V, V_IN=0V or 3.6V

I_OH=-100µA

µA

V_CC-0.2

2.4

V_OH

V_OL

Output HIGH Voltage

Output LOW Voltage

V

I

_OH=-8mA

I_OL=100µA

_OL=8mA

0.2

0.5

I

V_IK

I_CC

Input Clamp Voltage

Power Supply Current

I_IK=-18mA

-1.5

V

R_IN+=1V and R_IN-=1.4V or

9

mA

R_IN+=1.4V and R_IN-=1V

C_IN

Input Capacitance

Output Capacitance

4

6

pF

C_OUT

DC Electrical Characteristics

Typical values are at T_A=25°C and with V_CC=3.3V. Over-supply voltage and operating temperature ranges, unless

otherwise noted.

Symbol

Parameter

Conditions

Min.

Typ. Max. Units

Differential Propagation Delay,

LOW-to-HIGH

t_PLH

0.9

2.5

ns

Differential Propagation Delay,

HIGH-to-LOW

t_PHL

0.9

⏐V_ID⏐=400mV,

C_L=10pF

Figure 2, Figure 3

t_TLH

t_THL

Output Rise Time (20% to 80%)

Output Fall Time (80% to 20%)

0.5

ns

t_SK(P)

0.4

0.3

1.0

Pulse Skew ⏐t_{PLH -}t_PHL

⏐

t_SK(LH),t_SK(HL)Channel-to-Channel Skew⁽²⁾

t_SK(PP)

Part-to-Part Skew⁽³⁾

Notes:

2. t_SK(LH), t_SK(HL)is the skew between specified outputs of a single device when the outputs have identical loads and

are switching in the same direction.

3.

t_SK(PP)is the magnitude of the difference in propagation delay times between any specified terminals of two

devices switching in the same direction (either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with

the same supply voltage, same temperature, and have identical test circuits.

www.onsemi.com

FIN1028 • Rev. 2

4

Figure 2. Differential Driver Propagation Delay and Transition Time Test Circuit

Notes:

4. C_Lincludes all probe and fixture capacitances.

5. All input pulses have frequency = 10MHz, t_Ror t_F=1ns.

Table 1. Receiver Minimum and Maximum Input Threshold Test Voltages

Resulting Differential

Input Voltage (mV)

Resulting Common

Mode Input Voltage (V)

Applied Voltages (V)

V_IA

1.25

1.15

2.4

2.3

0.1

0

V_IB

1.15

1.25

2.3

2.4

0

V_ID

V_IC

1.2

100

-100

100

-100

100

-100

600

-600

600

-600

600

-600

1.2

2.35

0.05

1.2

0.1

0.9

1.5

1.8

2.4

0

1.5

0.9

2.4

1.8

0.6

0

1.2

2.1

0.3

0.6

0.3

Figure 3. AC Waveforms

www.onsemi.com

FIN1028 • Rev. 2

5

Typical Performance Characteristics

Figure 4. Output High Voltage

vs. Power Supply Voltage

Figure 5. Output Low Voltage

vs. Power Supply Voltage

Figure 6. Output Short Circuit Current

vs. Power Supply Voltage

Figure 7. Power Supply Current vs. Frequency

Figure 8. Power Supply Current

vs. Ambient Temperature

Figure 9. Differential Propagation Delay

vs. Power Supply Voltage

www.onsemi.com

FIN1028 • Rev. 2

6

Typical Performance Characteristics (Continued)

Figure 10.Differential Propagation Delay

vs. Ambient Temperature

Figure 11.Differential Skew (t_PLH-t_PHL)

vs. Power Supply Voltage

Figure 12.Differential Skew (t_PHL-t_PHL

vs. Ambient Temperature

)

Figure 13.Differential Propagation Delay

vs. Differential Input Voltage

Figure 14.Differential Propagation Delay

vs. Common-Mode Voltage

Figure 15.Transition Time vs. Power Supply Voltage

FIN1028 • Rev. 2

www.onsemi.com

7

Typical Performance Characteristics (Continued)

Figure 16.Transition Time vs. Ambient Temperature

Figure 18.Differential Propagation Delay vs. Load

Figure 20.Transition Time vs. Load

Figure 17.Differential Propagation Delay vs. Load

Figure 19.Transition Time vs. Load

Figure 21.Power Supply Current

vs. Power Supply Voltage

www.onsemi.com

FIN1028 • Rev. 2

8

Physical Dimensions

5.00

4.80

A

0.65

3.81

8

5

B

1.75

6.20

5.80

4.00

3.80

5.60

1

4

PIN ONE

INDICATOR

1.27

(0.33)

M

0.25

C B A

LAND PATTERN RECOMMENDATION

SEE DETAIL A

0.25

0.10

0.25

0.19

C

1.75 MAX

0.10

C

0.51

0.33

OPTION A - BEVEL EDGE

0.50

0.25

x 45°

R0.10

GAGE PLANE

OPTION B - NO BEVEL EDGE

0.36

NOTES: UNLESS OTHERWISE SPECIFIED

8°

0°

0.90

A) THIS PACKAGE CONFORMS TO JEDEC

MS-012, VARIATION AA, ISSUE C,

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C) DIMENSIONS DO NOT INCLUDE MOLD

FLASH OR BURRS.

SEATING PLANE

(1.04)

0.406

D) LANDPATTERN STANDARD: SOIC127P600X175-8M.

E) DRAWING FILENAME: M08AREV13

DETAIL A

SCALE: 2:1

Figure 22. 8-Lead, Small Outline Package (SOIC), JEDEC MS-012, 0.150-inch, Narrow Body

Click here for tape and reel specifications, available at:

http://www.fairchildsemi.com/products/discrete/pdf/soic8_tr.pdf

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify

or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically

the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

www.onsemi.com

FIN1028 • Rev. 2

9

www.onsemi.com

FIN1028 • Rev. 2

10

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

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1


型号：	FIN1028MX
厂家：	ONSEMI
描述：	3.3V LVDS 2 位高速差分接收器光电二极管接口集成电路
文件：	总13页 (文件大小：897K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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