FIN1047MTCX [ONSEMI]

3.3V LVDS 4 位通流式高速差分驱动器;
FIN1047MTCX
型号: FIN1047MTCX
厂家: ONSEMI    ONSEMI
描述:

3.3V LVDS 4 位通流式高速差分驱动器

驱动 光电二极管 接口集成电路 驱动器
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s  
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
June 2001  
Revised August 2003  
FIN1047  
3.3V LVDS 4-Bit Flow-Through  
High Speed Differential Driver  
General Description  
Features  
Greater than 400Mbs data rate  
This quad driver is designed for high speed interconnects  
utilizing Low Voltage Differential Signaling (LVDS) technol-  
ogy. The driver translates LVTTL signal levels to LVDS lev-  
els with a typical differential output swing of 350mV which  
provides low EMI at ultra low power dissipation even at  
high frequencies. This device is ideal for high speed trans-  
fer of clock and data.  
Flow-through pinout simplifies PCB layout  
3.3V power supply operation  
0.4 ns maximum differential pulse skew  
1.7 ns maximum propagation delay  
Low power dissipation  
The FIN1047 can be paired with its companion receiver,  
the FIN1048, or any other LVDS receiver.  
Power-Off protection  
Meets or exceeds the TIA/EIA-644 LVDS standard  
Pin compatible with equivalent RS-422 and LVPECL  
devices  
16-Lead SOIC and TSSOP packages save space  
Ordering Code:  
Order Number Package Number  
Package Description  
FIN1047M  
M16A  
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
FIN1047MTC  
MTC16  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Connection Diagram  
Pin Descriptions  
Pin Name  
Description  
DIN1, DIN2, DIN3, DIN4  
LVTTL Data Inputs  
DOUT1+, DOUT2+, DOUT3+, DOUT4+ Non-Inverting  
Driver Outputs  
DOUT1, DOUT2, DOUT3, DOUT4Inverting  
Driver Outputs  
EN  
EN  
Driver Enable Pin  
Inverting Driver  
Enable Pin  
VCC  
Power Supply  
Ground  
GND  
Truth Table  
Inputs  
Outputs  
DIN  
DOUT+  
DOUT−  
EN  
EN  
L or OPEN  
L or OPEN  
L or OPEN  
H
H
H
H
L
L
Z
Z
L
H
H
Z
Z
H
L
OPEN  
X
H
X
L or OPEN  
X
X
H = HIGH Logic Level L = LOW Logic Level  
X = Don’t Care Z = High Impedance  
© 2003 Fairchild Semiconductor Corporation  
DS500589  
www.fairchildsemi.com  
Absolute Maximum Ratings(Note 1)  
Recommended Operating  
Conditions  
Supply Voltage (VCC  
DC Input Voltage (VIN  
DC Input Voltage (VOUT  
Driver Short Circuit Current (IOSD  
)
0.5V to +4.6V  
0.5V to +6V  
0.5V to 4.6V  
Continuous  
65°C to +150°C  
150°C  
)
Supply Voltage (VCC  
Input Voltage (VIN  
Operating Temperature (TA)  
)
3.0V to 3.6V  
0 to VCC  
)
)
)
40°C to +85°C  
Storage Temperature Range (TSTG  
Max Junction Temperature (TJ)  
Lead Temperature (TL)  
)
260°C  
Note 1: The Absolute Maximum Ratings: are those values beyond which  
damage to the device may occur. The databook specifications should be  
met, without exception, to ensure that the system design is reliable over its  
power supply, temperature and output/input loading variables. Fairchild  
does not recommend operation of circuits outside databook specification.  
(Soldering, 10 seconds)  
ESD (Human Body Model)  
ESD (Machine Model)  
9000V  
1200V  
DC Electrical Characteristics  
Over supply voltage and operating temperature ranges, unless otherwise specified  
Min  
Typ  
(Note 2)  
340  
Max  
Symbol  
VOD  
Parameter  
Test Conditions  
Units  
mV  
mV  
V
Output Differential Voltage  
VOD Magnitude Change from  
Differential LOW-to-HIGH  
Offset Voltage  
250  
450  
25  
VOD  
1.4  
1.25  
1.2  
R
L = 100, Driver Enabled,  
VOS  
See Figure 1  
1.125  
1.375  
25  
VOS  
Offset Magnitude Change from  
Differential LOW-to-HIGH  
HIGH Output Voltage  
mV  
VOH  
VOL  
IOFF  
IOS  
V
V
V
V
V
IN = VCC  
1.4  
1.6  
V
V
LOW Output Voltage  
IN = 0V  
0.9  
1.05  
Power Off Output Current  
Short Circuit Output Current  
CC = 0V, VOUT = 0V or 3.6V  
OUT = 0V, Driver Enabled  
OD = 0V, Driver Enabled  
20  
20  
6  
µA  
3  
mA  
3.5  
6  
VIH  
VIL  
Input HIGH Voltage  
2.0  
GND  
20  
VCC + 1.0  
0.8  
V
V
Input LOW Voltage (Note 3)  
Input Current  
IIN  
V
V
V
IN = 0V or VCC  
20  
µA  
µA  
µA  
V
IOZ  
Disabled Output Leakage Current  
Power-Off Input Current  
Input Clamp Voltage  
OUT = 0V or 4.6V  
20  
20  
II(OFF)  
VIK  
ICC  
CC = 0V, VIN = 0V or 3.6V  
20  
20  
IIK = −18 mA  
1.5  
0.7  
5
Power Supply Current  
No Load, VIN = 0V or VCC, Driver Enabled  
8
4
R
L = 100 , Driver Disabled  
1.7  
16  
mA  
R
L = 100 , VIN = 0V or VCC, Driver Enabled  
22  
IPU/PD  
Output Power Up/Power Down  
High Z Leakage Current  
VCC = 0V or 1.5V  
20  
20  
µA  
Note 2: All typical values are at TA = 25°C and with VCC = 3.3V.  
Note 3: For transient conditions when t 5ns and IIN ≤ −100 mA, VILmin = −1.0V.  
www.fairchildsemi.com  
2
AC Electrical Characteristics  
Over supply voltage and operating temperature ranges, unless otherwise specified  
Min  
Typ  
Max  
Symbol  
tPLHD  
Parameter  
Test Conditions  
Units  
ns  
(Note 4)  
Differential Propagation Delay  
LOW-to-HIGH  
0.6  
0.6  
1.1  
1.2  
1.7  
1.7  
tPHLD  
Differential Propagation Delay  
HIGH-to-LOW  
ns  
tTLHD  
tTHLD  
tSK(P)  
tSK(LH)  
tSK(HL)  
tSK(PP)  
fMAX  
Differential Output Rise Time (20% to 80%)  
Differential Output Fall Time (80% to 20%)  
R
L = 100 , CL = 10 pF,  
0.4  
0.4  
1.2  
1.2  
0.4  
ns  
ns  
ns  
See Figure 2 (Note 8), and Figure 3  
Pulse Skew |tPLH - tPHL  
|
Channel-to-Channel Skew  
0.05  
0.3  
1.0  
ns  
(Note 5)  
Part-to-Part Skew (Note 6)  
ns  
MHz  
ns  
Maximum Frequency (Note 7)  
Differential Output Enable Time from Z to HIGH  
Differential Output Enable Time from Z to LOW  
R
L = 100, See Figure 6 (Note 8)  
L = 100, CL = 10 pF,  
200  
250  
1.7  
1.7  
2.7  
2.7  
4.2  
5.2  
tZHD  
5.0  
5.0  
5.0  
5.0  
tZLD  
R
ns  
tHZD  
Differential Output Disable Time from HIGH to Z See Figure 4 (Note 8), and Figure 5  
Differential Output Disable Time from LOW to Z  
Input Capacitance  
ns  
tLZD  
ns  
CIN  
pF  
pF  
COUT  
Output Capacitance  
Note 4: All typical values are at TA = 25°C and with VCC = 3.3V.  
Note 5: tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and are switching in the same direc-  
tion.  
Note 6: tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same direction  
(either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with the same supply voltage, same temperature, and have identical test circuits.  
Note 7: fMAX criteria: Input tR = tF < 1ns, 0V to 3V, 50% Duty Cycle; Output VOD > 250 mv, 45% to 55% Duty Cycle; all switching in phase channels.  
Note 8: Test Circuits in Figures 2, 4, 6 are simplified representations of test fixture and DUT loading.  
3
www.fairchildsemi.com  
Note A: All input pulses have frequency = 10 MHz, tR or tF = 1 ns  
Note B: CL includes all fixture and instrumentation capacitance  
FIGURE 1. Differential Driver DC Test Circuit  
FIGURE 2. Differential Driver Propagation Delay and  
Transition Time Test Circuit  
Note B: All input pulses have the frequency = 10 MHz, tR or tF = 1 ns  
Note A: CL includes all fixture and instrumentation capacitance  
FIGURE 4. Differential Driver Enable and  
Disable Test Circuit  
FIGURE 3. AC Waveforms  
FIGURE 6. fMAX Test Circuit  
FIGURE 5. Enable and Disable AC Waveforms  
www.fairchildsemi.com  
4
DC / AC Typical Performance Curves  
FIGURE 7. Output High Voltage vs.  
Power Supply Voltage  
FIGURE 8. Output Low Voltage vs.  
Power Supply Voltage  
FIGURE 9. Output Short Circuit Current vs.  
Power Supply Voltage  
FIGURE 10. Differential Output Voltage vs.  
Power Supply Voltage  
FIGURE 11. Differential Output Voltage vs.  
Load Resistor  
FIGURE 12. Offset Voltage vs.  
Power Supply Voltage  
5
www.fairchildsemi.com  
DC / AC Typical Performance Curves (Continued)  
FIGURE 13. Power Supply Current vs.  
Frequency  
FIGURE 14. Power Supply Current vs.  
Power Supply Voltage  
FIGURE 15. Power Supply Current vs.  
Ambient Temperature  
FIGURE 16. Differential Propagation Delay vs.  
Power Supply Voltage  
FIGURE 18. Differential Pulse Skew (tPLH - tPHL) vs.  
Power Supply Voltage  
FIGURE 17. Differential Propagation Delay vs.  
Ambient Temperature  
www.fairchildsemi.com  
6
DC / AC Typical Performance Curves (Continued)  
FIGURE 19. Differential Pulse Skew (tPLH - tPHL) vs.  
Ambient Temperature  
FIGURE 20. Transition Time vs.  
Power Supply Voltage  
FIGURE 21. Transition Time vs.  
Ambient Temperature  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
Package Number M16A  
www.fairchildsemi.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC16  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
9
www.fairchildsemi.com  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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